A semiconductor refrigeration structure and condenser

Abstract

The present invention is applicable to the field of semiconductor refrigeration, and provides a semiconductor refrigeration structure and a condenser. The semiconductor refrigeration structure includes a refrigeration structure body, and the refrigeration structure body includes a first substrate seat and a second substrate seat, and a semiconductor refrigeration plate is arranged between the first substrate seat and the second substrate seat; the first substrate seat has a cold effect ceramic substrate; the second substrate seat has a thermal effect ceramic substrate; the back of the second substrate seat is fixedly provided with a heat dissipation base, and the heat dissipation base is in contact with and connected to the thermal effect ceramic substrate; the condenser includes the semiconductor refrigeration structure provided by the above embodiment, and the condenser includes a condensation base, and the condensation base is fixed on the cold effect ceramic substrate. The multiple guide plates in the airflow channel of the present invention can be staggered with each other, which to a certain extent prolongs the flow path of the airflow in the airflow channel, improves the heat dissipation effect on the thermal effect ceramic substrate, and ensures the refrigeration effect of the cold effect side of the semiconductor refrigeration structure.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor refrigeration, and in particular relates to a semiconductor refrigeration structure and a condenser. Background Art

[0002] The working principle of semiconductor refrigerators is based on the thermoelectric effect, that is, when direct current passes through a thermocouple composed of an N-type semiconductor and a P-type semiconductor, a temperature difference will be generated at both ends; the temperature at one junction decreases, becoming the cold end, absorbing heat; the temperature at the other junction increases, becoming the hot end, releasing heat.

[0003] As people's requirements for environmental protection and energy conservation increase, semiconductor refrigerators, as a pollution-free, low-energy refrigeration method, will be applied and promoted in more fields. For example, semiconductor refrigeration structures are also widely used in air water extraction technology. Condensers made of semiconductor refrigeration structures can work in humid air environments. Condensers are prone to produce condensed water droplets, thereby achieving the purpose of extracting water in humid air.

[0004] In the related technologies of semiconductor refrigeration structures, the refrigeration efficiency of semiconductor refrigeration structures also depends on the heat dissipation efficiency of the heat effect surface. The better the heat conduction speed and heat dissipation effect of the heat effect surface, the better the refrigeration effect of the cold effect surface. Since the heat effect surface and the cold effect surface of the semiconductor refrigeration structure are relatively close, heat exchange between them is easy to occur during operation, thereby affecting the refrigeration efficiency. Summary of the invention

[0005] The purpose of the embodiments of the present invention is to provide a semiconductor refrigeration structure and a condenser, aiming to solve the technical problem that when the traditional semiconductor refrigeration structure is working, the heat effect surface and the cold effect surface are prone to heat exchange with each other, thereby affecting the refrigeration efficiency.

[0006] To solve the above problem, the present invention provides the following technical solution.

[0007] An embodiment of the present invention provides a semiconductor refrigeration structure, including a refrigeration structure body, the refrigeration structure body includes a first substrate seat and a second substrate seat, a semiconductor refrigeration sheet is arranged between the first substrate seat and the second substrate seat, and the semiconductor refrigeration sheet adopts an N-type and P-type semiconductor structure;

[0008] The first substrate seat has a cooling effect ceramic substrate;

[0009] The second substrate holder has a thermal effect ceramic substrate;

[0010] A heat dissipation base is fixedly arranged on the back of the second substrate seat, the heat dissipation base is in contact with the thermal effect ceramic substrate, a plurality of air flow channels are opened on the heat dissipation base, the bottom opening of the air flow channel is covered on the thermal effect ceramic substrate, and the air flow passing through the air flow channel directly generates heat exchange with the thermal effect ceramic substrate;

[0011] A plurality of cavities are provided on one side of the heat dissipation base, and a cavity sealing cover is provided on a thermal effect ceramic substrate. The upper layer of the cavity has a sliding cavity, and a piston slider is provided in the sliding cavity for sealing and sliding. One side of the piston slider is fixedly connected to one end of a rack, and the side of the rack has a tooth surface structure. A rotating cylinder is rotatably provided on the inner wall of the air flow channel, and a tooth ring structure meshing with the tooth surface structure of the rack is provided on the rotating cylinder. When the gas in the cavity expands due to heat, the piston slider is pushed to move, so that the rack moves. Due to the meshing relationship between the rack and the rotating cylinder, the rotating cylinder rotates a certain angle.

[0012] A guide plate is connected to the tangential side of the rotating cylinder, and the guide plate is located in the air flow channel.

[0013] Furthermore, the bottom end of each air flow channel is an air inlet, and the top end of each air flow channel is an air outlet. The air inlet is connected to one end of the connecting elbow, and the other end of the connecting elbow extends to the bottom of the cooling effect side of the refrigeration structure body.

[0014] Furthermore, the sliding cavity and the air flow channel are also connected through an air pressure balance hole, so that when the piston slider moves, the air pressure balance hole can balance the air pressure in the sliding cavity, ensuring that the piston slider can slide smoothly in the sliding cavity;

[0015] The air pressure balance hole is arranged obliquely, and the inclination direction of the air pressure balance hole tends to the air flow direction in the air flow channel, that is, the angle between the inclination direction of the air pressure balance hole and the air flow direction of the air flow channel is less than ninety degrees.

[0016] Furthermore, a bottom plate is provided at the bottom of the outer frame, and a plurality of vents are provided on the bottom plate, and each vent is connected to the end of a corresponding connecting elbow.

[0017] Another embodiment of the present invention provides a condenser, which includes the semiconductor refrigeration structure provided in the above embodiment, and the condenser includes a condensing base, which is fixed on a cooling effect ceramic substrate; a plurality of T-shaped grooves are evenly spaced on the surface of the condensing base, and a plurality of T-shaped blocks are evenly spaced and fixed on the surface of the condensing base, and the plurality of T-shaped grooves and the plurality of T-shaped blocks are alternately arranged, so that the airflow flowing through the surface of the condensing base can fully contact the surface of the condensing base, thereby improving the condensation effect on water vapor in the airflow.

[0018] Furthermore, a limiting groove is provided on the surface of the condensing base, a limiting pressure rod is tightly arranged on the limiting groove, and the limiting pressure rod is fixedly connected to the refrigeration structure body by screws.

[0019] Furthermore, the condenser also includes an outer frame, and a clamping limit frame is fixedly arranged on the inner side wall of the outer frame; the outer end surfaces of the first substrate seat and the second substrate seat are provided with clamping limit ring grooves matching with the clamping limit frame, and when the refrigeration structure body is fixed on the outer frame, the clamping limit frame is fixed on the clamping limit ring groove to fix the refrigeration structure body.

[0020] Furthermore, a second connection part is fixedly provided on an outer wall on one side of the outer frame, and a first connection part is provided on an outer wall on the other side of the outer frame. When adjacent condensers are connected to each other, the second connection part of one condenser is abutted against the first connection part of another condenser, and the two are hingedly connected using a connecting rod.

[0021] Compared with the prior art, the semiconductor refrigeration structure and condenser of the present invention have the following beneficial effects:

[0022] First, in the semiconductor refrigeration structure provided by the present invention, a plurality of cavities are opened on one side of the heat dissipation base, the cavity sealing cover is arranged on the thermal effect ceramic substrate, the upper layer of the cavity has a sliding cavity, and a piston slider is provided in the sliding cavity for sealing and sliding. When the gas in the cavity expands due to heat, the piston slider is pushed to move, so that the rack moves. Due to the meshing relationship between the rack and the rotating cylinder, the rotating cylinder rotates a certain angle; when the rotating cylinder rotates, the angle of the guide plate in the airflow channel changes, and the interlaced state of multiple guide plates in the airflow channel can be realized. The interlaced guide plates play a role in disturbing the airflow in the airflow channel, which prolongs the flow path of the airflow in the airflow channel to a certain extent, increases the heat exchange time between the cold airflow and the thermal effect ceramic substrate, improves the heat dissipation effect of the thermal effect ceramic substrate, and ensures the refrigeration effect of the cold effect side of the semiconductor refrigeration structure;

[0023] Second, the condenser provided by the present invention is used to condense the airflow when it passes through the cold effect side of the semiconductor refrigeration structure, so that the water vapor in the airflow is condensed and liquefied, and the airflow itself will also produce a certain degree of cooling due to flowing through the cold effect side of the semiconductor refrigeration structure, forming a low-temperature airflow. The low-temperature airflow further enters the airflow channel through the connecting elbow, which helps to quickly dissipate the heat of the thermal effect ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention.

[0025] Figure 1 This is a structural diagram of a condenser of the present invention;

[0026] Figure 2 for Figure 1 A schematic diagram of another perspective of the condenser provided;

[0027] Figure 3 for Figure 1 A top view of the condenser is provided;

[0028] Figure 4 for Figure 1 A front view of the condenser is provided;

[0029] Figure 5 A schematic diagram of the outer frame structure of the condenser provided by the present invention;

[0030] Figure 6 A schematic diagram of the structure of the semiconductor refrigeration structure provided by the present invention;

[0031] Figure 7 for Figure 6 A top view of the semiconductor refrigeration structure provided;

[0032] Figure 8 for Figure 7 The enlarged schematic diagram of point A in the middle;

[0033] Fig. 9 A partial schematic diagram of a semiconductor refrigeration structure provided by the present invention;

[0034] Fig.10 A schematic diagram of the structure of a heat dissipation base in a semiconductor refrigeration structure provided by the present invention;

[0035] Fig.11 for Fig.10 A right side view of the provided heat sink;

[0036] Fig.12 A schematic diagram of the internal structure of the heat dissipation base provided by the present invention;

[0037] Fig.13 for Fig.12 The enlarged schematic diagram of point B in the middle;

[0038] Fig.14 A schematic diagram of the coordination between the rack and the guide plate provided by the present invention;

[0039] Fig.15 A schematic diagram of the internal structure of the cavity provided by the present invention;

[0040] Fig.16 It is a schematic diagram of the guide plate in the heat dissipation base of the present invention in another state.

[0041] The reference numerals are as follows:

[0042] 100, refrigeration structure body; 101, first substrate seat; 1011, cooling effect ceramic substrate; 102, second substrate seat; 1021, thermal effect ceramic substrate; 103, semiconductor refrigeration sheet; 104, clamping limit ring groove;

[0043] 200, outer frame; 201, first connecting portion; 202, second connecting portion; 203, bottom plate; 204, vent; 205, pressing limit frame;

[0044] 300, heat dissipation base; 301, air outlet; 302, air inlet; 303, air flow channel; 304, cavity; 305, piston slider; 306, rotating cylinder; 307, guide plate; 308, rack; 309, air pressure balance hole; 310, sliding cavity;

[0045] 400, connecting elbow;

[0046] 500, condensation base; 501, limiting groove; 502, limiting pressure rod; 503, T-shaped groove; 504, T-shaped block. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0048] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0049] like Figure 1-Figure 4 As shown, in one embodiment provided by the present invention, a semiconductor refrigeration structure is provided, the semiconductor refrigeration structure includes a refrigeration structure body 100, the refrigeration structure body 100 includes a first substrate base 101 and a second substrate base 102, a semiconductor refrigeration sheet 103 is arranged between the first substrate base 101 and the second substrate base 102, and the semiconductor refrigeration sheet 103 adopts an N-type and P-type semiconductor structure;

[0050] Among them, the semiconductor cooling sheet 103 is a device that uses the thermoelectric properties of semiconductor materials to achieve cooling or heating. The core principle is that a thermocouple pair composed of N-type and P-type semiconductor materials is used to achieve heat transfer through the specific combination of these materials and the control of current; N-type semiconductors are made by doping intrinsic semiconductors (such as silicon or germanium) with pentavalent elements (such as phosphorus, arsenic or antimony); P-type semiconductors are made by doping intrinsic semiconductors with trivalent elements (such as boron, aluminum or gallium).

[0051] Furthermore, the first substrate holder 101 has a cooling effect ceramic substrate 1011 , and the second substrate holder 102 has a heating effect ceramic substrate 1021 .

[0052] In order to improve the heat dissipation efficiency of the thermal effect ceramic substrate 1021 and ensure the cooling effect of the refrigeration structure main body 100, in an embodiment of the present invention, a heat dissipation base 300 is fixedly arranged on the back side of the second substrate seat 102, and the heat dissipation base 300 is in contact with the thermal effect ceramic substrate 1021 to accelerate heat conduction and improve the heat dissipation effect of the thermal effect ceramic substrate 1021.

[0053] Among them, Figure 9-13 As shown, in the embodiment of the present invention, a plurality of airflow channels 303 are provided on the heat dissipation base 300, and the bottom opening of the airflow channel 303 is covered on the thermal effect ceramic substrate 1021, that is, the airflow passing through the airflow channel 303 directly exchanges heat with the thermal effect ceramic substrate 1021;

[0054] The bottom end of each air flow channel 303 is an air inlet 302, and the top end of each air flow channel 303 is an air outlet 301, that is, the air enters the air flow channel 303 through the air inlet 302, flows along the air flow channel 303 and is finally discharged through the air outlet 301; the air inlet 302 is connected to one end of the connecting elbow 400, and the other end of the connecting elbow 400 extends to the bottom of the cold effect side of the refrigeration structure body 100; after the air flow flows downward along the cold effect side of the refrigeration structure body 100, the water vapor of the air flow condenses and cools the air flow to a certain extent to form a low-temperature gas below the ambient temperature, and the low-temperature gas enters the air flow channel 303 through the connecting elbow 400 to accelerate the heat dissipation effect on the thermal effect ceramic substrate 1021; preferably, in an embodiment of the present invention, a wind induction device can be provided at the other end of the connecting elbow 400, for example, the wind induction device can be used for a micro fan for guiding the air flow, which is not specifically limited.

[0055] Further, such as Figure 10-Figure 15 As shown, a plurality of cavities 304 are provided on one side of the heat dissipation base 300 of the embodiment of the present invention. The sealing cover of the cavity 304 is provided on the thermal effect ceramic substrate 1021. When the thermal effect ceramic substrate 1021 generates heat, the air pressure inside the cavity 304 increases due to the relationship between thermal expansion and contraction.

[0056] The upper layer of the cavity 304 has a sliding cavity 310, and a piston slider 305 is sealed and slidably arranged in the sliding cavity 310. One side of the piston slider 305 of the embodiment of the present disclosure is fixedly connected to one end of the rack 308, and the side surface of the rack 308 has a tooth surface structure;

[0057] A rotating cylinder 306 is rotatably provided on the inner wall of the air flow channel 303 of the embodiment of the present invention. The rotating cylinder 306 has a tooth ring structure meshing with the tooth surface structure of the rack 308. When the gas in the cavity 304 expands due to heat, it pushes the piston slider 305 to move, so that the rack 308 moves. Due to the meshing relationship between the rack 308 and the rotating cylinder 306, the rotating cylinder 306 rotates a certain angle.

[0058] The rotating cylinder 306 is connected to a guide plate 307 along the tangential side. The guide plate 307 is located in the air flow channel 303. When the rotating cylinder 306 rotates, the angle of the guide plate 307 in the air flow channel 303 changes. Fig.16 As shown, a plurality of guide plates 307 can be staggered in the airflow channel 303. The staggered guide plates 307 disturb the airflow in the airflow channel 303, thereby extending the flow path of the airflow in the airflow channel 303 to a certain extent, increasing the heat exchange time between the cold airflow and the thermal effect ceramic substrate 1021, and improving the heat dissipation effect of the thermal effect ceramic substrate 1021.

[0059] In addition, it can be understood that the extension angle of the guide plate 307 of the present invention is related to the degree of thermal expansion and contraction of the gas in the cavity 304. When the thermal effect ceramic substrate 1021 is not overheated, the guide plate 307 will tend to stick to the inner wall of the airflow channel 303, reducing its disturbing effect on the airflow in the airflow channel 303, so that the airflow in the airflow channel 303 can pass quickly.

[0060] As a preference, Fig.13 As shown, in the embodiment of the present invention, the sliding cavity 310 and the air flow channel 303 are also connected through the air pressure balance hole 309, so that when the piston slider 305 moves, the air pressure balance hole 309 can balance the air pressure in the sliding cavity 310, thereby ensuring that the piston slider 305 can slide smoothly in the sliding cavity 310; further, the air pressure balance hole 309 is arranged obliquely, and the inclination direction of the air pressure balance hole 309 tends to the air flow direction in the air flow channel 303, that is, the angle between the inclination direction of the air pressure balance hole 309 and the air flow direction of the air flow channel 303 is less than ninety degrees.

[0061] like Figure 1-Figure 4 As shown, in another embodiment provided by the present invention, a condenser is provided, which includes the semiconductor refrigeration structure provided in the above embodiment, and is used to condense the airflow when the airflow passes through the cold effect side of the semiconductor refrigeration structure, so that the water vapor in the airflow is condensed and liquefied, and the airflow itself will also produce a certain degree of cooling due to passing through the cold effect side of the semiconductor refrigeration structure, forming a low-temperature airflow, and the low-temperature airflow further enters the airflow channel 303 through the connecting elbow 400, which is helpful for the rapid heat dissipation of the thermal effect ceramic substrate 1021;

[0062] The condenser of the embodiment of the present invention includes a condensing base 500, which is fixed on the cooling effect ceramic substrate 1011, so that the low temperature state of the cooling effect ceramic substrate 1011 is conducted to the condensing base 500, so that the condensing base 500 is in a low temperature state;

[0063] like Figure 7 and Figure 8 As shown, a plurality of T-shaped grooves 503 are evenly spaced apart on the surface of the condensing base 500, and a plurality of T-shaped blocks 504 are evenly spaced apart and fixedly arranged on the surface of the condensing base 500. The plurality of T-shaped grooves 503 and the plurality of T-shaped blocks 504 are alternately arranged, so that the airflow flowing through the surface of the condensing base 500 can fully contact the surface of the condensing base 500, thereby improving the condensation effect on water vapor in the airflow.

[0064] A limiting groove 501 is provided on the surface of the condensing base 500 , and a limiting pressure rod 502 is tightly arranged on the limiting groove 501 . The limiting pressure rod 502 is fixedly connected to the refrigeration structure body 100 by screws.

[0065] Further, such as Figure 5 and Figure 6 As shown, in an embodiment of the present invention, the condenser also includes an outer frame 200, and a clamping limit frame 205 is fixedly arranged on the inner wall of the outer frame 200; a clamping limit ring groove 104 matching with the clamping limit frame 205 is opened on the outer end surface of the first substrate seat 101 and the second substrate seat 102. When the refrigeration structure body 100 is fixed on the outer frame 200, the clamping limit frame 205 is fixed on the clamping limit ring groove 104 to fix the refrigeration structure body 100.

[0066] Preferably, a bottom plate 203 is provided at the bottom of the outer frame 200 , and a plurality of vents 204 are provided on the bottom plate 203 , and each vent 204 is connected to an end of a corresponding connecting elbow 400 .

[0067] Please continue reading Figure 1 A second connection part 202 is fixedly provided on the outer wall of one side of the outer frame 200, and a first connection part 201 is provided on the outer wall of the other side of the outer frame 200. When adjacent condensers are connected to each other, the second connection part 202 of one condenser is abutted against the first connection part 201 of another condenser, and they are hingedly connected by a connecting rod. In this way, when there are multiple condensers provided by the present invention, the multiple condensers are connected end to end to form a ring structure, so that the airflow passes through the formed condensation ring, and the condenser is used to condense and liquefy the water vapor in the airflow.

[0068] The above solutions are only an illustration of a preferred example, but are not limited thereto. When implementing the present invention, appropriate replacement and / or modification can be performed according to user needs.

[0069] The number of devices and processing scales described here are used to simplify the description of the present invention. Applications, modifications and variations of the present invention will be obvious to those skilled in the art.

[0070] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and the embodiments. It can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily realized. Therefore, without departing from the general concept defined by the claims and equivalent scope, the present invention is not limited to the specific details and the illustrations shown and described here.

Claims

1. A semiconductor refrigeration structure, comprising a refrigeration structure main body (100), the refrigeration structure main body (100) comprising a first substrate seat (101) and a second substrate seat (102), a semiconductor refrigeration sheet (103) being arranged between the first substrate seat (101) and the second substrate seat (102), the semiconductor refrigeration sheet (103) adopting an N-type and a P-type semiconductor structure; Features: The first substrate seat (101) is provided with a cooling effect ceramic substrate (1011); The second substrate seat (102) has a thermal effect ceramic substrate (1021); A heat dissipation base (300) is fixedly arranged on the back of the second substrate seat (102); the heat dissipation base (300) is in contact with and connected to the thermal effect ceramic substrate (1021); a plurality of airflow channels (303) are provided on the heat dissipation base (300); the bottom openings of the airflow channels (303) are covered on the thermal effect ceramic substrate (1021); and the airflow passing through the airflow channels (303) directly exchanges heat with the thermal effect ceramic substrate (1021); A plurality of cavities (304) are provided on one side of the heat dissipation base (300); a sealing cover of the cavity (304) is provided on a thermal effect ceramic substrate (1021); an upper layer of the cavity (304) has a sliding cavity (310); a piston slider (305) is provided in a sealing and sliding manner in the sliding cavity (310); one side of the piston slider (305) is fixedly connected to one end of a rack (308); and a side surface of the rack (308) has a tooth surface structure; A rotating cylinder (306) is rotatably provided on the inner wall of the airflow channel (303), and the rotating cylinder (306) has a tooth ring structure meshing with the tooth surface structure of the rack (308); a guide plate (307) is connected to the rotating cylinder (306) along the tangential side, and the guide plate (307) is located in the airflow channel (303).

2. A semiconductor refrigeration structure according to claim 1, characterized in that: The bottom end of each air flow channel (303) is an air inlet (302), and the top end of each air flow channel (303) is an air outlet (301). The air inlet (302) is connected to one end of a connecting elbow (400), and the other end of the connecting elbow (400) extends to the bottom of the cooling effect side of the refrigeration structure body (100).

3. A semiconductor refrigeration structure according to claim 2, characterized in that: The sliding cavity (310) and the air flow channel (303) are also connected via an air pressure balance hole (309); The air pressure balance holes (309) are arranged in an inclined manner, and the inclination direction of the air pressure balance holes (309) tends to be in the direction of the air flow in the air flow channel (303); The angle between the inclined direction of the air pressure balance hole (309) and the air flow direction of the air flow channel (303) is less than ninety degrees.

4. A semiconductor refrigeration structure according to claim 3, characterized in that: It also comprises an outer frame (200), wherein a bottom plate (203) is provided at the bottom of the outer frame (200), a plurality of vents (204) are provided on the bottom plate (203), and each vent (204) is connected to the end of a corresponding connecting elbow (400).

5. A condenser, characterized in that: The condenser comprises a semiconductor refrigeration structure as claimed in any one of claims 1 to 4, wherein the condenser comprises a condensation base (500), and the condensation base (500) is fixedly attached to a cooling effect ceramic substrate (1011); The surface of the condensation base (500) is provided with a plurality of T-shaped grooves (503) at equal intervals, and the surface of the condensation base (500) is fixedly provided with a plurality of T-shaped blocks (504) at equal intervals, and the plurality of T-shaped grooves (503) and the plurality of T-shaped blocks (504) are alternately arranged.

6. A condenser according to claim 5, characterized in that: A limiting groove (501) is provided on the surface of the condensing base (500), a limiting pressure rod (502) is tightly arranged on the limiting groove (501), and the limiting pressure rod (502) is fixedly connected to the refrigeration structure body (100) by means of screws.

7. A condenser according to claim 6, characterized in that: The condenser further comprises an outer frame (200), and a clamping limit frame (205) is fixedly arranged on the inner side wall of the outer frame (200); a clamping limit ring groove (104) matching with the clamping limit frame (205) is provided on the outer end surfaces of the first substrate seat (101) and the second substrate seat (102); when the refrigeration structure body (100) is fixed on the outer frame (200), the clamping limit frame (205) is fixedly pressed against the clamping limit ring groove (104).

8. A condenser according to claim 7, characterized in that: A second connection portion (202) is fixedly provided on an outer wall on one side of the outer frame (200), and a first connection portion (201) is provided on an outer wall on the other side of the outer frame (200); when adjacent condensers are connected to each other, the second connection portion (202) of one condenser is abutted against the first connection portion (201) of another condenser, and the condensers are hingedly connected using a connecting rod.

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