Mobile phone middle frame with efficient heat dissipation and high-strength impact resistance

Abstract

The invention discloses a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance, which comprises a frame and a middle plate, the middle plate comprises a bottom plate layer, a transition layer and a panel layer which are sequentially laminated from bottom to top, the middle plate is arranged in the frame and is connected with the frame to form an integrated structure, and the surface of the middle plate is also provided with an accommodating cavity; wherein the bottom plate layer and the panel layer are both made of metal materials, the transition layer is formed by compounding a heat conduction material and a metal material, and the heat conduction material is formed by mixing ceramic fibers and metal fibers or carbon fibers. According to the mobile phone middle frame, the bottom plate layer, the transition layer and the panel layer which are sequentially laminated are adopted, the purpose of efficient heat dissipation is achieved, meanwhile, the shock resistance of the middle plate can be enhanced, the strength of the middle plate can be improved, the purpose of reducing the weight of the middle plate can be achieved, and therefore the purposes of efficient heat dissipation, high strength, high hardness and excellent toughening performance are achieved; and the use requirements of mobile phone products can be met.

Description

Technical Field

[0001] The present invention relates to the technical field of mobile phone middle frames, and in particular to a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance. Background Art

[0002] In recent years, with the acceleration of technological innovation of electronic products, mobile phones have become an indispensable communication tool for people. People have higher and higher requirements for mobile phones. They are not just electronic devices for communication purposes, but multimedia mobile phones that integrate music, video, photography, Internet access and other functions, referred to as smart phones. With the continuous development of the mobile phone industry, mobile phone performance is becoming more and more powerful, especially the resolution and size of processors and screens are constantly improving. As smart phones gradually move towards large screens, thinness and multi-functions, the mainstream screen size continues to grow, and larger screens require stronger mobile phone frames to support them. Currently, the commonly used smart phones will have serious heating during long-term use, among which the CPU and battery parts heat up the most. The main reasons for the heating of mobile phones are as follows: one is the heating of the CPU, and the other is that when the mobile phone is charging, there is resistance in the power circuit when it is running, which is mainly reflected in the competition between the resistance and current on the battery and the internal PCB motherboard.

[0003] The aesthetics of the mobile phone middle frame largely determines the consumer's desire to buy. Due to the advantages of metal such as high strength, good texture and good heat dissipation, traditional plastic mobile phones have been gradually replaced by metal mobile phones such as aluminum alloy. The metalized middle frame not only has a beautiful appearance, but also has the characteristics of wear resistance, drop resistance and corrosion resistance. The existing mobile phone middle frame has the problem of poor heat dissipation. When the temperature of the mobile phone is too high and the heat cannot be dissipated, it will affect the service life and performance of the internal parts of the mobile phone.

[0004] The mobile phone middle frame currently in use is generally processed with 7075 aviation aluminum, which not only leads to high cost, but also requires solution treatment to achieve its performance. If titanium alloy materials are used for processing, due to the low thermal conductivity of titanium alloy, it is easy to generate heat during use, resulting in poor heat dissipation. After searching, the patent document with the authorization announcement number CN109743425B discloses a mobile phone middle frame with high efficiency heat dissipation, the patent document with the application publication number CN117651087A discloses a carbon fiber mobile phone middle frame and its preparation method, and the patent document with the application publication number CN104068595A discloses a ceramic shell structure and its preparation method and a mobile phone. It can be seen from the three retrieved patent documents that the problem of poor heat dissipation performance is solved from different angles. Since the mobile phone middle frame is an important component of the mobile phone, the mobile phone middle frame is the skeleton of the mobile phone and is used to support the entire mobile phone. On the premise of improving its heat dissipation effect, it also needs to have certain anti-fall performance. At the same time, it should also be a low-cost and easy-to-prepare product, so that the processed product can meet the user's use needs during the later use. Therefore, it is very necessary to provide a mobile phone middle frame with efficient heat dissipation and impact resistance to solve the above problems. Summary of the invention

[0005] In order to solve the above problems and improve its heat dissipation effect and anti-fall performance, a mobile phone middle frame that meets the needs of smart phones is provided. The bottom plate layer, transition layer and panel layer are pressed together in sequence, which can enhance the high thermal conductivity of the middle plate. The collected heat is transferred to the bottom plate layer or the panel layer through the middle transition layer, which is beneficial to the dissipation of heat generated by the CPU inside the mobile phone, thereby achieving efficient heat dissipation. At the same time, the composite structure formed by hot pressing and curing can enhance the impact resistance of the middle plate and improve its strength. Specifically, it is a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance, including a frame and a middle plate, the middle plate including a bottom plate layer, a transition layer and a panel layer pressed together from bottom to top, the bottom plate layer, the transition layer and the panel layer are formed into a composite structure by hot pressing and curing, the middle plate is arranged inside the frame and connected to the frame into an integral structure, and a plurality of accommodating cavities are also provided on the surface of the middle plate; wherein the bottom plate layer and the panel layer are both made of metal material, and the transition layer is composited by a thermal conductive material and a metal material; the thermal conductive material is composed of a mixture of ceramic fiber and metal fiber or carbon fiber.

[0007] Furthermore, in the mobile phone middle frame with efficient heat dissipation and high-strength impact resistance described in the present invention, the bottom plate layer and the panel layer are both made of metal materials through molding, and the transition layer is made of heat-conducting material and the metal materials in the bottom plate layer and the panel layer through hot pressing composite processing.

[0008] Furthermore, in the mobile phone middle frame with efficient heat dissipation and high-strength impact resistance described in the present invention, the metal material is any one of titanium alloy material, zirconium alloy material or aluminum alloy material; and the thermal conductive material is composed of ceramic fiber and metal fiber or carbon fiber mixed in a weight ratio of 1:2 to 4, wherein the ceramic fiber is any one of aluminum silicate fiber, alumina fiber, mullite fiber, silicon carbide fiber or quartz fiber; the metal fiber is copper fiber with high thermal conductivity; and the carbon fiber is thermal conductive carbon fiber.

[0009] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in the present invention is adopted, and the middle plate is stacked in sequence from bottom to top through a bottom plate layer, a transition layer and a panel layer to form a green body, and is formed into a composite structure through hot pressing and curing. The preparation method includes preparing a bottom plate layer and a panel layer, and then placing a heat-conducting material on the bottom plate layer, and then placing a panel layer on the heat-conducting material, so that the bottom plate layer, the heat-conducting material and the panel layer are stacked in sequence from bottom to top to form a green body; then the green body is encapsulated, and the encapsulated green body is hot-pressed and cured, and finally the metal sheath is removed to obtain the middle plate composite.

[0010] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance according to the present invention is used, and a method for preparing the middle plate specifically comprises the following steps: S1. First, according to the shape and size of the middle plate to be prepared, select the corresponding metal sheath, and require that the outer size of the metal sheath is 0.5 to 2.5 mm larger than the size of the middle plate; S2. Select the bottom plate layer and the panel layer made of metal materials by forming and prepare them for use; S3. First, the bottom plate layer is placed in the metal sheath, and then the thermal conductive material is evenly placed on the bottom plate layer, and then the panel layer is placed on the thermal conductive material in an overlapping state to form a green body, and finally the green body is encapsulated; S4. The encapsulated metal sheath is heated and vacuumed during the heating process; S5. The vacuum-treated metal sheath is placed in a hot pressing device for hot pressing, and the thermally conductive material is fused with the bottom plate layer and the panel layer by hot pressing and curing to form an integrally formed composite structure; S6. The metal sheath after hot isostatic pressing or electromagnetic induction heating is taken out from the hot isostatic press or electromagnetic induction heater, and after cooling to room temperature, the metal sheath is removed to obtain a middle plate composite of the desired shape and size. Finally, a plurality of accommodating cavities are processed on the surface of the middle plate composite according to the design requirements by conventional methods to obtain the middle plate.

[0011] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in the present invention is adopted. In the step S3, before the bottom plate layer is placed in the metal sheath, a release agent is provided in advance in the metal sheath. The release agent is graphite, and the release agent is placed with a thickness of 0.5 to 1.5 mm.

[0012] Furthermore, the mobile phone middle frame with efficient heat dissipation and high-strength impact resistance described in the present invention is adopted, and the encapsulation process in step S3 is to put the stacked green bodies into a metal sheath for vacuum sealing.

[0013] Furthermore, the mobile phone middle frame with high heat dissipation and high strength impact resistance described in the present invention is used, and the specific process conditions of the heating and vacuuming treatment in step S4 are: the heating temperature is 250-450°C, the vacuum degree is 1X10 -1 ~1x10 -3 Pa, and the degassing time is 8 to 12 hours.

[0014] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in the present invention is adopted, and the hot pressing treatment in step S5 is hot isostatic pressing treatment or electromagnetic induction heating treatment, wherein the hot isostatic pressing treatment method is to place the metal sheath after vacuum treatment in a hot isostatic press for hot isostatic pressing treatment; and the electromagnetic induction heating treatment method is to place the metal sheath after vacuum treatment in an electromagnetic induction heater for electromagnetic induction heating treatment; wherein, during the hot isostatic pressing treatment process, the specific process conditions are: the hot isostatic pressing temperature is 400-1350°C, the pressure is 100-150MPa, and the heat preservation and pressure holding time is 3-5 hours; and during the electromagnetic induction heating treatment process, the specific process conditions are: the heating temperature is 450-1250°C, the pressure is 150-200MPa, and the heat preservation and pressure holding time is 2-4 hours.

[0015] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in the present invention is adopted, the thickness of the bottom plate layer is 10-15 mm, the thickness of the transition layer is 5-10 mm, and the thickness of the panel layer is 1-5 mm; the middle plate and the frame are connected to form an integrated structure by welding, wherein the welding method adopts laser welding.

[0016] The mobile phone middle frame with efficient heat dissipation and high-strength impact resistance described in the present invention is adopted. Since the thermal conductive material is composed of a mixture of ceramic fiber and metal fiber or carbon fiber, the ceramic fiber has the advantages of light weight, high temperature resistance, thermal stability, low thermal conductivity and small specific heat. Applying it to the mobile phone middle frame can not only reduce its weight but also enhance its strength.

[0017] Carbon fiber uses thermally conductive carbon fiber, which is a high thermal conductivity carbon fiber material developed for thermal engineering design. The thermal conductivity of this carbon fiber in the fiber direction can exceed that of copper, up to 700W / mk, and has good mechanical properties, electrical conductivity, and excellent thermal conductivity and radiation heat dissipation capabilities. The fibrous high thermal conductivity carbon powder made of this carbon fiber is fibrous in itself, and the thermal orientation can be designed. This is the biggest difference and advantage from previous carbon powders and other thermal conductive materials. It can be used to fill polymer composite materials, develop heat dissipation materials for electronic appliances, and solve the heat dissipation problems of high-density integrated electronic components and LEDs. Applying it to the mobile phone frame can reduce its weight while enhancing its heat dissipation performance.

[0018] Metal fiber refers to a fiber-shaped material with a high metal content, continuous distribution of metal materials, and a lateral size of micrometers. Fibers that disperse metal powder discontinuously in organic polymers do not belong to metal fibers. Metal fibers are generally micrometer-level. Metal fibers have good mechanical properties. They not only have high specific strength at break and tensile modulus, but are also resistant to bending and have good toughness. Metal fibers have irregular cross-sections and regular surface areas, which give them a very large specific surface area. Metals with high thermal conductivity mainly include copper and silver. However, using silver to prepare them will greatly increase their cost. Therefore, metal fibers use copper fibers with high thermal conductivity. While reducing their weight, they can also greatly improve their heat dissipation performance and reduce production costs.

[0019] In addition, the bottom plate layer and the panel layer, in addition to titanium alloy materials, zirconium alloy materials or aluminum alloy materials, can also adopt common metal materials in the prior art. There is no need to use special 7075 aviation aluminum materials or special titanium alloy materials. This can not only greatly reduce the production cost, but also realize large-scale batch processing.

[0020] Compared with the prior art, the mobile phone middle frame with efficient heat dissipation and high-strength impact resistance described in the present invention has the following beneficial effects: since the middle plate adopts a three-layer structure of a bottom plate layer, a transition layer and a panel layer which are pressed together in sequence, and the bottom plate layer and the panel layer can be formed by forming common metal materials, the collected heat is transported to the bottom plate layer or the panel layer through the intermediate transition layer, which can enhance the high thermal conductivity of the middle plate, thereby facilitating the dissipation of heat generated by the CPU inside the mobile phone and achieving the purpose of efficient heat dissipation; at the same time, a heat-conducting material is provided between the bottom plate layer and the panel layer, and the heat-conducting material and the metal material are combined into an integrated structure through hot pressing, which can not only eliminate the internal stress between the bottom plate layer and the panel layer, but also reduce its overall weight, and has the advantages of high strength, good corrosion resistance and high heat resistance, is easy to process and manufacture, and can effectively reduce the processing cost.

[0021] It can be seen that the mobile phone middle frame described in the present invention adopts the bottom plate layer, transition layer and panel layer that are pressed together in sequence, so that the high thermal conductivity of the middle plate can be enhanced, and the collected heat can be transported to the bottom plate layer or the panel layer through the middle transition layer, which is beneficial to the dissipation of heat generated by the CPU inside the mobile phone, thereby achieving the purpose of efficient heat dissipation. At the same time, the composite structure formed by hot pressing and curing can enhance the impact resistance of the middle plate, improve its strength, and achieve the purpose of reducing its weight. It has the advantages of good molding, can be used to manufacture complex structural parts, and has low processing costs, thereby achieving the purposes of efficient heat dissipation, high strength, high hardness and excellent toughening performance, and can meet the use requirements of mobile phone products. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a structural schematic diagram of the middle plate described in the present invention.

[0024] As shown in the figure: 1-frame, 2-middle plate, 21-bottom plate layer, 22-transition layer, 23-panel layer. DETAILED DESCRIPTION

[0025] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0026] It should be noted that the structures, proportions, sizes, etc. drawn in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", etc. quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "provided with" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] It should be noted that the term "comprise" or any other variation is intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus. Example 1

[0029] like Figure 1 to Figure 2 As shown, the present embodiment provides a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance, including a frame 1 and a middle plate 2, wherein the middle plate 2 includes a bottom plate layer 21, a transition layer 22 and a panel layer 23 pressed together from bottom to top, wherein the bottom plate layer 21, the transition layer 22 and the panel layer 23 are formed into a composite structure by hot pressing and curing, wherein the middle plate 2 is arranged inside the frame 1 and connected to the frame 1 to form an integral structure, and a plurality of accommodating cavities are also provided on the surface of the middle plate 2; wherein the bottom plate layer 21 and the panel layer 23 are both made of aluminum alloy material, and the transition layer 22 is composited with a thermally conductive material and an aluminum alloy material; and the thermally conductive material is composed of a mixture of ceramic fiber and metal fiber in a weight ratio of 1:2, wherein the ceramic fiber is aluminum silicate fiber, and the metal fiber is copper fiber with high thermal conductivity.

[0030] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in this embodiment is adopted, the middle plate 2 is stacked from bottom to top through the bottom plate layer 21, the transition layer 22 and the panel layer 23 to form a green body, and is formed into a composite structure through hot pressing and curing. The preparation method includes preparing the bottom plate layer 21 and the panel layer 23, and then placing a heat-conducting material on the bottom plate layer 21, and then placing the panel layer 23 on the heat-conducting material, so that the bottom plate layer 21, the heat-conducting material and the panel layer 23 are stacked from bottom to top to form a green body; then the green body is encapsulated, and the encapsulated green body is hot-pressed and cured, and finally the metal sheath is removed, that is, the middle plate composite is obtained, which specifically includes the following steps: S1. First, according to the shape and size of the middle plate 2 to be prepared, select the corresponding metal sheath, and require that the outer size of the metal sheath is 0.5 to 2.5 mm larger than the size of the middle plate 2; S2 selects the bottom plate layer 21 and the panel layer 23 formed by forming a metal material, and sets aside; S3. First, the bottom plate layer 21 is placed in the metal sheath. Before the bottom plate layer 21 is placed in the metal sheath, a release agent is provided in the metal sheath in advance. The release agent is graphite and the release agent is placed with a thickness of 0.5 to 1.5 mm. Then, the thermal conductive material is evenly placed on the bottom plate layer 21, and then the panel layer 23 is placed on the thermal conductive material in an overlapping state to form a green body. Finally, the green body is encapsulated. The encapsulation process is to place the stacked green bodies into the metal sheath for vacuum sealing. S4. The metal sheath after encapsulation is heated and vacuumized during the heating process. The specific process conditions are: heating temperature is 250°C, vacuum degree is 1X10 -1 Pa, degassing time is 8 hours; S5. Place the vacuum-treated metal sheath in a hot pressing device for hot pressing treatment, and fuse the heat-conducting material with the bottom plate layer 21 and the panel layer 23 into one through hot pressing curing to form an integrated composite structure; the hot pressing treatment is hot isostatic pressing treatment, and the hot isostatic pressing treatment method is to place the vacuum-treated metal sheath in a hot isostatic press for hot isostatic pressing treatment, and the specific process conditions of the hot isostatic pressing treatment are: hot isostatic pressing temperature of 400°C, pressure of 100MPa, and heat preservation and pressure holding time of 3 hours; S6. The metal sheath after hot isostatic pressing or electromagnetic induction heating is taken out from the hot isostatic press or electromagnetic induction heater, and after cooling to room temperature, the metal sheath is removed to obtain a middle plate composite of the desired shape and size. Finally, a plurality of accommodating cavities are processed on the surface of the middle plate composite according to the conventional method and the design requirements to obtain the middle plate 2.

[0031] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in this embodiment is used, the thickness of the bottom plate layer is 15 mm, the thickness of the transition layer is 10 mm, and the thickness of the panel layer is 5 mm; the middle plate 2 and the frame 1 are connected to form an integrated structure by laser welding. Example 2

[0032] The present embodiment provides a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance, including a frame 1 and a middle plate 2, wherein the middle plate 2 includes a bottom plate layer 21, a transition layer 22 and a panel layer 23 pressed together from bottom to top, wherein the bottom plate layer 21, the transition layer 22 and the panel layer 23 are formed into a composite structure through hot pressing and curing, wherein the middle plate 2 is arranged inside the frame 1 and connected with the frame 1 to form an integral structure, and a plurality of accommodating cavities are also provided on the surface of the middle plate 2; wherein the bottom plate layer 21 and the panel layer 23 are both made of titanium alloy material, and the transition layer 22 is composited with a thermally conductive material and a titanium alloy material; and the thermally conductive material is composed of a mixture of ceramic fiber and metal fiber in a weight ratio of 1:3, wherein the ceramic fiber is aluminum silicate fiber, and the metal fiber is copper fiber with high thermal conductivity.

[0033] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in this embodiment is adopted, the middle plate 2 is stacked from bottom to top through the bottom plate layer 21, the transition layer 22 and the panel layer 23 to form a green body, and is formed into a composite structure through hot pressing and curing. The preparation method includes preparing the bottom plate layer 21 and the panel layer 23, and then placing a heat-conducting material on the bottom plate layer 21, and then placing the panel layer 23 on the heat-conducting material, so that the bottom plate layer 21, the heat-conducting material and the panel layer 23 are stacked from bottom to top to form a green body; then the green body is encapsulated, and the encapsulated green body is hot-pressed and cured, and finally the metal sheath is removed, that is, the middle plate composite is obtained, which specifically includes the following steps: S1. First, according to the shape and size of the middle plate 2 to be prepared, select the corresponding metal sheath, and require that the outer size of the metal sheath is 0.5 to 2.5 mm larger than the size of the middle plate 2; S2 selects the bottom plate layer 21 and the panel layer 23 formed by forming a metal material, and sets aside; S3. First, the bottom plate layer 21 is placed in the metal sheath. Before the bottom plate layer 21 is placed in the metal sheath, a release agent is provided in the metal sheath in advance. The release agent is graphite and the release agent is placed with a thickness of 0.5 to 1.5 mm. Then, the thermal conductive material is evenly placed on the bottom plate layer 21, and then the panel layer 23 is placed on the thermal conductive material in an overlapping state to form a green body. Finally, the green body is encapsulated. The encapsulation process is to place the stacked green bodies into the metal sheath for vacuum sealing. S4. The metal sheath after encapsulation is heated and vacuumized during the heating process. The specific process conditions are: heating temperature is 300°C, vacuum degree is 1X10 -2 Pa, degassing time is 10 hours; S5. Place the vacuum-treated metal sheath in a hot pressing device for hot pressing treatment, and fuse the heat-conductive material with the bottom plate layer 21 and the panel layer 23 into one through hot pressing curing to form an integrated composite structure; the hot pressing treatment is electromagnetic induction heating treatment, wherein the electromagnetic induction heating treatment method is to place the vacuum-treated metal sheath in an electromagnetic induction heater for electromagnetic induction heating treatment; the specific process conditions of the electromagnetic induction heating treatment are: heating temperature of 1050°C, pressure of 180MPa, and heat preservation and pressure holding time of 3 hours.

[0034] S6. The metal sheath after hot isostatic pressing or electromagnetic induction heating is taken out from the hot isostatic press or electromagnetic induction heater, and after cooling to room temperature, the metal sheath is removed to obtain a middle plate composite of the desired shape and size. Finally, a plurality of accommodating cavities are processed on the surface of the middle plate composite according to the conventional method and the design requirements to obtain the middle plate 2.

[0035] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in this embodiment is used, the thickness of the bottom plate layer is 12 mm, the thickness of the transition layer is 8 mm, and the thickness of the panel layer is 3 mm; the middle plate 2 and the frame 1 are connected to form an integrated structure by laser welding. Example 3

[0036] The present embodiment provides a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance, including a frame 1 and a middle plate 2, wherein the middle plate 2 includes a bottom plate layer 21, a transition layer 22 and a panel layer 23 pressed together from bottom to top, wherein the bottom plate layer 21, the transition layer 22 and the panel layer 23 are formed into a composite structure through hot pressing and curing, wherein the middle plate 2 is arranged inside the frame 1 and connected with the frame 1 to form an integral structure, and a plurality of accommodating cavities are also provided on the surface of the middle plate 2; wherein the bottom plate layer 21 and the panel layer 23 are both made of zirconium alloy material, and the transition layer 22 is composited with a thermally conductive material and a zirconium alloy material; and the thermally conductive material is composed of a mixture of ceramic fiber and metal fiber in a weight ratio of 1:4, wherein the ceramic fiber is aluminum silicate fiber, and the metal fiber is copper fiber with high thermal conductivity.

[0037] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in this embodiment is adopted, the middle plate 2 is stacked from bottom to top through the bottom plate layer 21, the transition layer 22 and the panel layer 23 to form a green body, and is formed into a composite structure through hot pressing and curing. The preparation method includes preparing the bottom plate layer 21 and the panel layer 23, and then placing a heat-conducting material on the bottom plate layer 21, and then placing the panel layer 23 on the heat-conducting material, so that the bottom plate layer 21, the heat-conducting material and the panel layer 23 are stacked from bottom to top to form a green body; then the green body is encapsulated, and the encapsulated green body is hot-pressed and cured, and finally the metal sheath is removed, that is, the middle plate composite is obtained, which specifically includes the following steps: S1. First, according to the shape and size of the middle plate 2 to be prepared, select the corresponding metal sheath, and require that the outer size of the metal sheath is 0.5 to 2.5 mm larger than the size of the middle plate 2; S2 selects the bottom plate layer 21 and the panel layer 23 formed by forming a metal material, and sets aside; S3. First, the bottom plate layer 21 is placed in the metal sheath. Before the bottom plate layer 21 is placed in the metal sheath, a release agent is provided in the metal sheath in advance. The release agent is graphite and the release agent is placed with a thickness of 0.5 to 1.5 mm. Then, the thermal conductive material is evenly placed on the bottom plate layer 21, and then the panel layer 23 is placed on the thermal conductive material in an overlapping state to form a green body. Finally, the green body is encapsulated. The encapsulation process is to place the stacked green bodies into the metal sheath for vacuum sealing. S4. The metal sheath after encapsulation is heated and vacuumized during the heating process. The specific process conditions are: heating temperature is 450°C, vacuum degree is 1X10 -3 Pa, degassing time is 12 hours; S5. Place the vacuum-treated metal sheath in a hot pressing device for hot pressing treatment, and fuse the heat-conducting material with the bottom plate layer 21 and the panel layer 23 into one through hot pressing curing to form an integrated composite structure; the hot pressing treatment is hot isostatic pressing treatment, and the hot isostatic pressing treatment method is to place the vacuum-treated metal sheath in a hot isostatic press for hot isostatic pressing treatment; the specific process conditions of the hot isostatic pressing treatment are: hot isostatic pressing temperature of 1350°C, pressure of 150MPa, and heat preservation and pressure holding time of 5 hours; S6. The metal sheath after hot isostatic pressing or electromagnetic induction heating is taken out from the hot isostatic press or electromagnetic induction heater, and after cooling to room temperature, the metal sheath is removed to obtain a middle plate composite of the desired shape and size. Finally, a plurality of accommodating cavities are processed on the surface of the middle plate composite according to the conventional method and the design requirements to obtain the middle plate 2.

[0038] Furthermore, a mobile phone middle frame with efficient heat dissipation and high-strength impact resistance as described in this embodiment is used, the thickness of the bottom plate layer is 10 mm, the thickness of the transition layer is 5 mm, and the thickness of the panel layer is 1 mm; the middle plate 2 and the frame 1 are connected to form an integrated structure by laser welding. Example 4

[0039] The difference between this embodiment and embodiment 1 is that: first, the bottom plate layer 21 and the panel layer 23 are both made of titanium alloy material, and the transition layer 22 is composited by thermal conductive material and titanium alloy material; second, the thermal conductive material is composed of ceramic fiber and carbon fiber mixed in a weight ratio of 1:3, wherein the ceramic fiber is alumina fiber; third, the preparation method of the middle plate 2 is the same as that of embodiment 2. Example 5

[0040] The difference between this embodiment and embodiment 2 is that: first, the bottom plate layer 21 and the panel layer 23 are both made of zirconium alloy material, and the transition layer 22 is composited by thermal conductive material and zirconium alloy material; second, the thermal conductive material is composed of ceramic fiber and carbon fiber mixed in a weight ratio of 1:4, wherein the ceramic fiber is silicon carbide fiber; third, the preparation method of the middle plate 2 is the same as that of embodiment 3. Example 6

[0041] The difference between this embodiment and embodiment 3 is that: first, the bottom plate layer 21 and the panel layer 23 are both made of aluminum alloy material, and the transition layer 22 is composited by thermal conductive material and aluminum alloy material; second, the thermal conductive material is composed of ceramic fiber and carbon fiber mixed in a weight ratio of 1:2, wherein the ceramic fiber is mullite fiber; third, the preparation method of the middle plate 2 is the same as that of embodiment 1.

[0042] In order to illustrate the heat dissipation performance of the mobile phone middle frame of the present invention, the middle plate 2 prepared by the processing method described in Examples 1 to 6 is applied to the mobile phone middle frame, and the heat dissipation test is performed on the mobile phone middle frame. The test method is as follows: the mobile phone middle frame corresponding to the embodiment is tested by using a temperature probe before use and after continuous use for 2 hours and 4 hours (room temperature 24°C). The specific test results are shown in Table 1 below.

[0043] Table 1

[0044] By comparison, it can be seen that the bottom plate layer 21, transition layer 22 and panel layer 23 pressed in sequence are selected as the middle plate 2, and the transition layer 22 composed of a thermally conductive material and a metal material is formed into a composite structure with the bottom plate layer 21 and the panel layer 23 through hot pressing and curing. This can not only enhance the high thermal conductivity of the middle plate 2, but also transfer the collected heat to the bottom plate layer or the panel layer through the middle transition layer, thereby facilitating the dissipation of heat generated by the CPU inside the mobile phone, thereby achieving efficient heat dissipation. At the same time, the composite structure formed by hot pressing and curing can enhance the impact resistance of the middle plate 2, improve its strength, and reduce its weight. It has the advantages of good molding, can be used to manufacture complex structural parts, and has low processing costs, thereby achieving the purposes of efficient heat dissipation, high strength, high hardness and excellent toughening performance, and can meet the use requirements of mobile phone products.

[0045] In addition, the middle plate 2 prepared by the method described in Examples 1 to 6 was subjected to destructive analysis. Since a transition layer 22 formed by heat-conducting material cured by hot pressing was provided between the bottom plate layer 21 and the panel layer 23, the intermediate transition layer 22 did not separate from the layer through the bending and extrusion test. The intermediate transition layer is used to transfer the collected heat to the bottom plate layer or the panel layer, which is beneficial to the dissipation of the heat generated by the CPU inside the mobile phone, achieving the purpose of efficient heat dissipation. At the same time, the composite structure formed by hot pressing curing can enhance the impact resistance of the middle plate, improve its strength, and also achieve the purpose of reducing its weight.

[0046] Other aspects of the present invention that are not described in detail are all conventional techniques known to those skilled in the art.

[0047] The protection scope of the present invention is not limited to the technical solutions disclosed in the specific implementation methods. The above description is only a preferred implementation method of the present invention and does not limit the present invention. Any minor modifications, equivalent substitutions and improvements made according to the technical solutions of the present invention should be included in the protection scope of the technical solutions of the present invention.

Claims

1. A mobile phone middle frame with high efficiency heat dissipation and high strength impact resistance, comprising a frame and a middle plate, characterized in that: The middle plate includes a bottom plate layer, a transition layer and a panel layer which are pressed together in sequence from bottom to top. The bottom plate layer, the transition layer and the panel layer are formed into a composite structure through hot pressing and curing. The middle plate is arranged inside the frame and connected to the frame to form an integrated structure. A plurality of accommodating cavities are also provided on the surface of the middle plate. The bottom plate layer and the panel layer are both made of metal materials, and the transition layer is composited with a heat-conducting material and a metal material. The heat-conducting material is composed of a mixture of ceramic fiber and metal fiber or carbon fiber.

2. According to claim 1, a mobile phone middle frame with high heat dissipation and high strength impact resistance is characterized in that: The bottom plate layer and the panel layer are both made of metal materials through molding, and the transition layer is made of heat-conducting material and the metal materials in the bottom plate layer and the panel layer through hot pressing composite processing.

3. According to claim 2, a mobile phone middle frame with high heat dissipation and high strength impact resistance is characterized in that: The metal material is any one of titanium alloy material, zirconium alloy material or aluminum alloy material; and the thermal conductive material is composed of ceramic fiber and metal fiber or carbon fiber mixed in a weight ratio of 1:2 to 4, wherein the ceramic fiber is any one of aluminum silicate fiber, alumina fiber, mullite fiber, silicon carbide fiber or quartz fiber; the metal fiber is copper fiber with high thermal conductivity; and the carbon fiber is thermal conductive carbon fiber.

4. A mobile phone middle frame with high heat dissipation and high strength impact resistance according to any one of claims 1 to 3, characterized in that: The middle plate is formed into a green body by stacking a bottom plate layer, a transition layer and a face plate layer in sequence from bottom to top, and is formed into a composite structure by hot pressing and curing. The preparation method includes preparing a bottom plate layer and a face plate layer, and then placing a heat conductive material on the bottom plate layer, and then placing a face plate layer on the heat conductive material, so that the bottom plate layer, the heat conductive material and the face plate layer are stacked in sequence from bottom to top to form a green body; Then, the green body is encapsulated, and the encapsulated green body is subjected to hot pressing and solidification treatment, and finally the metal sheath is removed to obtain the middle plate composite.

5. A mobile phone middle frame with high heat dissipation efficiency and high strength impact resistance according to claim 4, characterized in that: The method for preparing the middle plate specifically comprises the following steps: S1. First, according to the shape and size of the middle plate to be prepared, select the corresponding metal sheath, and require that the outer size of the metal sheath is 0.5 to 2.5 mm larger than the size of the middle plate; S2. Select the bottom plate layer and the panel layer made of metal materials by forming and prepare them for use; S3. First, the bottom plate layer is placed in the metal sheath, and then the thermal conductive material is evenly placed on the bottom plate layer, and then the panel layer is placed on the thermal conductive material in an overlapping state to form a green body, and finally the green body is encapsulated; S4. The encapsulated metal sheath is heated and vacuumed during the heating process; S5. The vacuum-treated metal sheath is placed in a hot pressing device for hot pressing, and the thermally conductive material is fused with the bottom plate layer and the panel layer by hot pressing and curing to form an integrally formed composite structure; S6. The metal sheath after hot isostatic pressing or electromagnetic induction heating is taken out from the hot isostatic press or electromagnetic induction heater, and after cooling to room temperature, the metal sheath is removed to obtain a middle plate composite of the desired shape and size. Finally, a plurality of accommodating cavities are processed on the surface of the middle plate composite according to the design requirements by conventional methods to obtain the middle plate.

6. The mobile phone middle frame with high heat dissipation efficiency and high strength impact resistance according to claim 5, characterized in that: In the step S3, before the bottom plate layer is placed in the metal sheath, a release agent is provided in advance in the metal sheath, the release agent is graphite, and the release agent is placed with a thickness of 0.5 to 1.5 mm.

7. The mobile phone middle frame with high heat dissipation efficiency and high strength impact resistance according to claim 5, characterized in that: The encapsulation process in step S3 is to place the stacked green bodies into a metal envelope for vacuum sealing.

8. The mobile phone middle frame with high heat dissipation efficiency and high strength impact resistance according to claim 5, characterized in that: The specific process conditions for the heating and vacuuming treatment in step S4 are as follows: the heating temperature is 250-450°C, the vacuum degree is 1X10 -1 ~1x10 -3 Pa, and the degassing time is 8 to 12 hours.

9. The mobile phone middle frame with high heat dissipation efficiency and high strength impact resistance according to claim 5, characterized in that: The hot pressing treatment in step S5 is hot isostatic pressing or electromagnetic induction heating, wherein the hot isostatic pressing method is to place the vacuum-treated metal sheath in a hot isostatic press for hot isostatic pressing; and the electromagnetic induction heating method is to place the vacuum-treated metal sheath in an electromagnetic induction heater for electromagnetic induction heating; wherein, during the hot isostatic pressing process, the specific process conditions are: the hot isostatic pressing temperature is 400-1350°C, the pressure is 100-150MPa, and the heat preservation and pressure holding time is 3-5 hours; and during the electromagnetic induction heating process, the specific process conditions are: the heating temperature is 450-1250°C, the pressure is 150-200MPa, and the heat preservation and pressure holding time is 2-4 hours.

10. The mobile phone middle frame with high heat dissipation efficiency and high impact resistance according to claim 1, characterized in that: The thickness of the bottom plate layer is 10-15 mm, the thickness of the transition layer is 5-10 mm, and the thickness of the panel layer is 1-5 mm; the middle plate and the frame are connected to form an integrated structure by welding, wherein the welding method is laser welding.

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