Immersed evaporator

Abstract

The immersed evaporator comprises a base, a flow channel structure and a liquid supplementing structure are arranged on the surface of the base, the liquid supplementing structure is communicated with the flow channel structure, and the flow channel structure is covered with a film covering layer which is made of a porous medium material and is communicated in a one-way mode. According to the immersed evaporator, liquid is supplemented in time, cooling liquid is kept in the flow channel structure, the heat dissipation effect of the evaporator is improved, and the problem that in the prior art, heat dissipation of high heat flux of a data center is difficult to meet is solved.

Description

Technical Field

[0001] The invention relates to the technical field of refrigeration, and in particular to an immersed evaporator. Background Art

[0002] Since the data center immersion liquid cooling has been favored by the industry, its market share has been rising steadily. In view of the current heat generation power of data centers, almost all of the systems used in the market are single-phase immersion liquid cooling systems. However, as data centers develop towards high power density in the future, single-phase immersion liquid cooling systems are gradually approaching their heat dissipation limits. Phase change immersion liquid cooling systems, due to their boiling heat transfer characteristics and other characteristics, can achieve a larger heat transfer coefficient and a higher heat dissipation limit, making them a new trend in data center heat dissipation in the future. However, as the computing power of chips in data centers increases, the heat generation increases. If the heat is not dissipated in time, the heat accumulation will cause the temperature to rise, which will cause the chip to fail. The key to the phase change immersion liquid cooling system lies in the evaporator, and the performance of the evaporator directly determines the performance and reliability of the data center. The evaporator fits the chip of the data center, and the heat generated by the chip is transferred to the evaporator. The evaporator is immersed in the immersion liquid, and the immersion liquid enters the evaporator. After the immersion liquid absorbs heat inside the evaporator, it generates steam, forming a large number of bubbles that take away the heat through physical phase change, thereby taking away the heat transferred from the chip in the data center. However, the evaporator of the current phase change immersion liquid cooling system has internal immersion liquid evaporated under high heat flux density, and the liquid is not replenished in time, which makes it difficult to meet the heat dissipation problem of high heat flux density in the data center. The heat dissipation effect is not ideal, which will cause the data center to run at high temperature for a long time. Summary of the invention

[0003] The purpose of the present invention is to provide an immersed evaporator. After the evaporator is immersed in the coolant, the coolant enters the flow channel structure from the liquid replenishing structure, keeping the coolant inside the evaporator, thereby improving the heat dissipation and cooling effect of the evaporator, taking away the heat generated by the high-power devices attached to the evaporator, and having a good heat dissipation effect, meeting the heat dissipation of the high heat flux density of the data center.

[0004] To solve the above technical problems, the technical solution provided by the present invention is: an immersed evaporator, comprising a base, a flow channel structure and a liquid replenishing structure are provided on the surface of the base, the liquid replenishing structure is connected to the flow channel structure, and the flow channel structure is covered with a unidirectional conductive coating layer made of a porous medium material.

[0005] The present invention adopts the above technical solution, and the base is used to contact the high-power devices in the data center, and the heat generated by the high-power devices is transferred to the base. The base is placed in the coolant, and the coolant enters the flow channel structure through the liquid replenishment structure. The coolant absorbs the heat on the base in the flow channel structure. The steam formed by the temperature rise of the coolant in the heat exchange can penetrate through the unidirectional conductive coating layer and overflow to the outside. The coolant can be replenished from the liquid replenishment structure into the flow channel structure in time, taking away the heat transferred from the high-power devices, effectively improving the heat dissipation effect of the evaporator, and can meet the heat dissipation requirements of the high heat flux density of the data center. And when the evaporator is immersed in the coolant, the flow channel structure inside the evaporator can always keep the coolant replenished, which improves the heat dissipation limit.

[0006] The above-mentioned submerged evaporator has a channel structure formed by opening groove microchannels or sinking fins or etching channels on the surface of the base. The channel structure is set as a groove microchannel structure, which increases the contact area with the coolant compared to the grooves of the smooth surface structure. The channel structure can also be processed into sinking fins or etched on the surface of the base to form an etched channel, which can achieve the effect of expanding the contact area between the base and the coolant and improve the efficiency of heat exchange.

[0007] The surface of the flow channel structure of the above-mentioned submerged evaporator is processed by micro-nano structure technology. The micro-nano structure technology further increases the surface area of ​​the flow channel structure and the contact area between the flow channel structure and the coolant, thereby further increasing the heat exchange surface area and improving the heat exchange efficiency.

[0008] The above-mentioned submerged evaporator, the liquid replenishing structure includes a liquid inlet channel, the liquid inlet channels are arranged side by side on the base, and the liquid inlet channel is connected to the flow channel structure. The liquid inlet channel is used to pass the coolant and is immersed in the coolant to ensure that the coolant can be replenished in the flow channel structure in time for heat exchange.

[0009] The above-mentioned immersed evaporator has grooves arranged evenly on the surface of the base, the bottom of the liquid inlet channel is close to the groove, and the gap between them forms a groove microchannel, and the liquid inlet channel introduces the coolant into the groove microchannel. The flow channel structure is formed by the cooperation between the liquid inlet channel and the groove. The cross-section of the bottom of the groove of the flow channel structure can be set to a rectangular or arc shape. The even arrangement of the grooves can expand the surface area of ​​the flow channel structure, thereby improving the heat exchange efficiency and the heat dissipation and absorption effect.

[0010] In the above-mentioned submerged evaporator, the groove microchannels are evenly distributed on the surface of the base, and a plurality of notches adapted to the groove sidewalls of the groove are provided at the bottom of the liquid inlet channel, and the notches are plugged in with the grooves, and there is a gap between the notches and the groove bottom wall of the groove. The bottom of the liquid inlet channel is plugged in with the grooves through the notches, so that the liquid inlet channel is closely connected with the groove microchannels, and there is a gap between the notches and the grooves, and the gap can pass the coolant, so that the coolant has high fluidity in the groove microchannel, effectively avoiding the influence of poor fluidity on the heat dissipation effect.

[0011] In the above-mentioned submerged evaporator, the coating layer includes a microporous film and a fixed film covering the microporous film, the microporous film is made of an AAO film or a copper mesh or a foam layer, and the fixed film is made of a polytetrafluoroethylene film or a PE film or a PVA film. The steam generated by the overflow of the coolant from the AAO film or the copper mesh of different meshes or the foam copper structure during the heat exchange process is covered on the surface of the coating layer by a polytetrafluoroethylene film or a PE film or a PVA film to prevent the external coolant from entering the flow channel structure through the AAO film or the foam copper to hinder the dissipation of the steam and affect the heat dissipation effect. The fixed film not only fixes the AAO film but also has a unidirectional conduction function, which can only pass the gas in one direction and prevent the liquid from passing through the surface of the fixed film. By setting the unidirectional conduction fixed film, it is realized that only the overflowing steam and the liquid cannot flow back into the flow channel structure from the outside, so that the coolant flows into the flow channel structure from the liquid replenishment structure, and the steam is generated from the flow channel structure and overflows from the coating layer and the fixed film in a unidirectional manner to the outside of the evaporator, thereby improving the heat dissipation effect.

[0012] The above-mentioned immersion evaporator has a fixing frame on the base, and the liquid inlet channel is embedded and installed on the fixing frame; the fixing frame includes a horizontal fixing plate and vertical fixing plates arranged at both ends of the horizontal fixing plate, the relative inner sides of the horizontal fixing plate are provided with a first embedding groove, and the vertical fixing plate is provided with a second embedding groove, and the horizontal fixing plate and the vertical fixing plate are fixed and installed with the liquid inlet channel through the first embedding groove and the second embedding groove. Through the arrangement of the first embedding groove and the second embedding groove, the top end of the liquid inlet channel is embedded in the second embedding groove, and the bottom end is embedded in the first embedding groove, so that the installation of the liquid inlet channel is completed, and the installation and fixing are convenient.

[0013] In the above-mentioned submerged evaporator, a liquid wick and / or a support column may be arranged in the hollow cavity of the liquid inlet channel. The liquid wick plays a role in absorbing liquid, and the support column can play a role in supporting the liquid inlet channel and strengthening the structural firmness; the liquid wick and / or the support column can guide the coolant to flow into the flow channel structure.

[0014] In the above-mentioned submerged evaporator, the covering film layer and the fixed film are provided with liquid replenishment structural holes adapted to the liquid inlet channel. The covering film layer and the fixed film are provided with liquid replenishment structural holes adapted to the installation of the liquid inlet channel.

[0015] The beneficial effects achieved by the present invention are as follows: a simplified structure is adopted to allow the flow channel to be replenished through the replenishment structure, so that the coolant is maintained, thereby preventing the coolant from being evaporated when the evaporator dissipates heat to the high-power device; the coating layer made of the porous medium material realizes enhanced heat exchange, and cooperates with the fixed membrane to only allow gas to overflow, while not allowing external liquid to penetrate from the fixed membrane into the evaporator, thereby ensuring the effectiveness of the one-way gas-liquid inlet and outlet channel; due to the connection between the liquid inlet structure and the flow channel structure, the liquid inlet structure can always introduce the coolant into the flow channel structure, and take away the heat of the high-power device mainly generated by the CPU through heat exchange, thereby having a good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of an immersed evaporator according to an embodiment of the present invention; Figure 2 is a schematic cross-sectional structure diagram of an immersed evaporator according to an embodiment of the present invention; Figure 3 yes Figure 2 An enlarged structural diagram of a position A in a cross-sectional structural diagram of an immersed evaporator according to an embodiment of the present invention; Figure 4 is a top view of the structure of an embodiment of the present invention when no fixed film is provided; Figure 5 yes Figure 4 Schematic diagram of the cross-sectional structure in the AA direction; Figure 6 yes Figure 4 Schematic diagram of the cross-sectional structure in the BB direction; Figure 7 is a schematic structural diagram of a base in an embodiment of the present invention; Figure 8 yes Figure 7 An enlarged view of the local structure of the middle base at position B; Fig. 9 It is a cross-sectional view of the assembly structure of a liquid replenishment structure and a flow channel structure of an immersed evaporator implemented in the present invention; Fig.10 yes Fig. 9 Schematic diagram of the enlarged structure at the C position in the middle; Fig.11 is a schematic structural diagram of a coating layer in an embodiment of the present invention; Fig.12 is a schematic structural diagram of a fixed membrane in an embodiment of the present invention; Fig.13 is a schematic structural diagram of a liquid inlet channel in an embodiment of the present invention; Fig.14 2 is a schematic diagram of the structure of a fixing frame in an embodiment of the present invention.

[0017] Explanation of the reference numerals: base 1, fixing frame 11, horizontal fixing plate 111, vertical fixing plate 112, first embedding groove 113, second embedding groove 114, partition plate 115, flow channel structure 2, groove microchannel 21, groove 22, liquid replenishment structure 3, liquid inlet channel 31, notch 32, coating layer 4, fixed membrane 5, liquid replenishment structure hole 6, high-power device 7. DETAILED DESCRIPTION

[0018] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0019] Reference Figures 1 to 14 As shown, an immersed evaporator includes a base 1, wherein the back of the base 1 is in contact with a high-power device 7 of a data center, and the heat generated by the high-power device 7 during operation is transferred to the base 1. The contact surface of the base 1 and the high-power device 7 is indirectly in contact through thermal conductive silicone grease, and the heat generated by the high-power device 7 is better transferred to the base 1 by using the thermal conductive silicone grease. During use, the evaporator is placed in the coolant so that the base 1 is immersed in the coolant. A flow channel structure 2 and a liquid replenishment structure 3 are provided on the surface of the base 1. The liquid replenishment structure 3 is connected to the flow channel structure 2 and the coolant immerses the liquid replenishment structure 3. The coolant can enter the flow channel structure 2 from the liquid replenishment structure 3, so that the coolant can flow into the flow channel structure 2 on the base 1 in a timely manner. The flow channel structure 2 is covered with a unidirectional conductive coating layer 4 made of a porous medium material. The coolant enters the flow channel structure 2 to cool the base 1 , and the coolant absorbs heat to form steam, which then overflows from the coating layer 4 to the evaporator, thereby taking away the heat conducted from the high-power device 7 to the base 1 .

[0020] In this embodiment, when the pore size of the porous medium material of the coating layer 4 is smaller than a certain degree, it is difficult for the liquid to freely pass through the small holes due to the surface tension of the liquid. For water media, the pore size of the porous medium material is generally 5-10 μm (micrometers), which can make the coating layer 4 have a unidirectional conduction function, and can only pass gas but not liquid water. When the coolant is deionized water, the porous medium material can use a copper mesh with a mesh size of 200 or more, which can achieve the unidirectional conduction function of the coating layer 4.

[0021] The base 1 of this embodiment can be made of copper material, with the flow channel structure 2 on its surface, and reserved with screw holes for matching with the high-power device 7, and the base 1 and the high-power device 7 can be connected and fixed by screws. In other embodiments, the base 1 and the high-power device 7 can also be connected and fixed by other means, such as snap connection, bonding or welding.

[0022] like Figure 7 and 8As shown, in this embodiment, a groove microchannel 21 or a sinking fin or an etched flow channel is opened on the surface of the base 1 to form a flow channel structure 2. The groove microchannel 21 is opened on the surface of the base 1 to increase the surface area of ​​the base 1 so that a plurality of interlaced and parallel grooves are formed on the surface of the base 1. The sinking fin is a sheet structure processed on the surface of the base 1, arranged side by side, which can increase the surface area of ​​the base 1 and expand the contact area with the coolant. The etched flow channel is a structure with an uneven surface formed on the surface of the base 1 by chemical reaction or physical impact, which can increase the surface area of ​​the base 1 and thus expand the area of ​​the coolant contacting the surface of the base 1. The flow channel structure 2 can increase the contact area between the base 1 and the coolant, thereby achieving a better heat dissipation effect.

[0023] Furthermore, the surface of the flow channel structure 2 is processed by micro-nano structure technology. Among them, the depth and width of the groove microchannel 21, the sunken fin or the etched flow channel opened on the surface of the base 1 can be reasonably designed according to the actual heat dissipation requirements. When the heat dissipation efficiency is required to be high, the depth and width can be increased. The surface of the flow channel structure 2 is processed by micro-nano structure technology to further increase the surface area of ​​the flow channel structure 2. After contacting the coolant, it can better complete the heat exchange, take away more heat, improve the heat conversion efficiency, and improve the heat dissipation effect. The flow channel structure 2 includes but is not limited to micro-structures such as microchannels, sunken fins, and etched flow channels. Combined Figure 3 As shown, the flow channel structure 2 is opened on the surface of the base 1, the bottom of the liquid replenishing structure 3 is connected to the flow channel structure 2 and maintains a certain gap, and multiple liquid replenishing structures 3 arranged side by side are connected to each other through the flow channel structure 2 to form a channel for the coolant to flow in, thereby improving the fluidity and flow area of ​​the coolant on the surface of the flow channel structure 2.

[0024] like Figure 2As shown, the coating layer 4 includes a microporous film and a fixed film 5 covering the microporous film, the microporous film is made of an AAO film or a copper mesh or a foam layer, and the fixed film 5 is made of a polytetrafluoroethylene film or a PE film or a PVA film. Specifically, the porous medium material of the coating layer 4 is made of an AAO film or a copper mesh or a foam copper structure with different mesh sizes, and a fixed film 5 made of a polytetrafluoroethylene film or a PE film or a PVA film is covered on the coating layer 4. Among them, the AAO membrane is an inorganic aluminum oxide filter membrane, which can pass gas and liquid on its surface; the mesh size of the copper mesh or the foam copper can be freely selected. When used in a fluorinated liquid, the mesh size of the copper mesh or the foam copper can be selected to be 300 mesh, and gas and liquid can also pass on the surface of the copper mesh or the foam copper. In the specific use of the embodiment of the present invention, the steam generated by the coolant needs to be discharged from the outside of the base 1 to take away the heat to avoid heat accumulation and affect the heat dissipation effect. The coating layer 4 made of AAO film can pass gas, and the steam can overflow from the inside of the coating layer 4 to the outside of the evaporator. The heat transferred by the high-power device 7 on the base 1 is absorbed by the coolant. After the steam is generated, the steam overflows from the outside of the base 1 and takes away the heat exchanged when the coolant contacts the base 1. In order to prevent the coolant from penetrating into the flow channel structure 2 from the outside of the coating layer 4 and hindering the evaporation of steam, a fixed film 5 made of polytetrafluoroethylene film, PE film or PVA film is provided on the coating layer 4, so that the coolant cannot penetrate from the coating layer 4 into the inside of the flow channel structure 2, and can only unidirectionally conduct steam to the outside of the coating layer 4 to take away the heat generated and transferred by the high-power device 7. The material of the fixed film 5 includes but is not limited to polytetrafluoroethylene film, PE film, and PVA film.

[0025] like Fig.11 and 12 As shown, the coating layer 4 is provided with a liquid replenishment structure hole 6 adapted to the liquid inlet channel 31. Suitably, the liquid inlet channel 31 passes through the liquid replenishment structure hole 6 and communicates with the flow channel structure 2.

[0026] In this embodiment, the fixed membrane 5 is made of polytetrafluoroethylene membrane, and a liquid replenishment structure hole 6 is reserved on the surface. The polytetrafluoroethylene membrane selected for the fixed membrane 5 has 1.4 billion micropores / cm 2 Above, the pore size range is 0.1 μm-0.5 μm.

[0027] The liquid replenishing structure 3 includes a hollow liquid inlet channel 31, which is arranged side by side on the base 1 and communicates with the flow channel structure 2. Fig.13As shown, the liquid inlet channel 31 in this embodiment is a hollow flat rectangular parallelepiped structure, with openings at both ends in the coolant flow direction, and forming a liquid inlet channel 31 for the coolant to pass through the hollow cavity, and the liquid inlet channel 31 is connected by square plates around it to form a hollow rectangular parallelepiped structure. In other embodiments, the liquid inlet channel 31 can also be set to other shapes, and its function is that when the evaporator is immersed in the coolant, the coolant can enter the evaporator through the liquid inlet channel 31 to achieve heat exchange, wherein the liquid inlet channel 31 in other embodiments can be in the shape of a round tube, an elliptical tube, a square tube, etc.

[0028] like Fig. 9 and Fig.10 As shown, the surface of the base 1 is provided with evenly arranged grooves 22, the bottom of the liquid inlet channel 31 is close to the groove 22, and the gap therebetween forms a groove microchannel 21, the liquid inlet channel 31 introduces the coolant into the groove microchannel 21, and the cross-section of the groove bottom of the flow channel structure 2 is rectangular or arc-shaped.

[0029] The groove microchannels 21 are evenly distributed on the surface of the base 1 , and a plurality of notches 32 adapted to the groove side walls of the groove 22 are provided at the bottom of the liquid inlet channel 31 . The notches 32 are plugged into the groove 22 , and there is a gap between the notches 32 and the groove bottom wall of the groove 22 .

[0030] The notch 32 at the bottom of the liquid inlet channel 31 is used to fit in the groove 22, and the groove side walls of the notch 32 are engaged with the groove side walls of the groove 22. A gap is retained between the notch 32 and the bottom wall of the groove 22, so that the coolant entering from the liquid inlet channel 31 can flow in the groove microchannel 21, and can also flow in the gap between the groove 22 and the notch 32, thereby improving fluidity, heat exchange efficiency and heat dissipation effect.

[0031] like Figure 1 As shown, a fixing frame 11 is provided on the base 1 , and a liquid inlet channel 31 is embeddedly mounted on the fixing frame 11 .

[0032] See also Fig.14The fixing frame 11 includes a horizontal fixing plate 111 and vertical fixing plates 112 arranged at both ends of the horizontal fixing plate 111. The relative inner sides of the horizontal fixing plate 111 are provided with a first embedding groove 113, and the vertical fixing plate 112 is provided with a second embedding groove 114. The horizontal fixing plate 111 and the vertical fixing plate 112 are installed and fixed to the liquid inlet channel 31 through the first embedding groove 113 and the second embedding groove 114. The fixing frame 11 is fixed on the base 1, and the horizontal fixing plate 111 is arranged on the surface of the base 1. A first embedding groove 113 is arranged on the inner side of the relative horizontal fixing plate 111, and the bottom end of the liquid inlet channel 31 of the liquid replenishing structure 3 is inserted into the first embedding groove 113; the vertical fixing plate 112 is assembled, and the vertical fixing plate 112 is provided with a second embedding groove 114, and the second embedding groove 114 is embedded in the top of the liquid inlet channel 31. Connecting plates can be extended at both ends of the vertical fixing plate 112, and through holes are arranged on the connecting plates. The vertical fixing plate 112 and the horizontal fixing plate 111 can be connected and fixed by using screws to pass through the through holes and then be threadedly connected to the horizontal fixing plate 111.

[0033] Furthermore, a plurality of partition plates 115 are provided on the inner side of the horizontal fixed plate 111, and the partition plates 115 are arranged parallel to the liquid inlet channel 31. The partition plates can play the role of structural reinforcement ribs and separate the parallel arranged liquid inlet channels, so that a distance is maintained between the liquid inlet channels, and steam overflows from the gaps between the liquid inlet channels, and when taking away heat, it can avoid the influence of heat dissipation due to the small gap of the liquid inlet channel. A liquid absorbent core and / or a support column can be arranged in the hollow cavity of the liquid inlet channel 31. The liquid absorbent core is provided to absorb the coolant, and when the evaporator is immersed in the coolant, the coolant enters the flow channel structure 2 through the liquid absorbent core. Among them, the height, wall thickness, width and other parameters of the liquid inlet channel 31 can be determined according to simulation and measured data.

[0034] Combination Figures 2 to 5 As shown, in the specific implementation of the present invention, the evaporator and the high-power device 7 can be connected by screw fixing, and the evaporator and the high-power device 7 are in contact with each other through thermal conductive silicone grease. The heat generated by the high-power device 7 during operation is transferred to the base 1 of the evaporator. The evaporator is placed in the coolant, and the coolant enters the flow channel structure 2 through the liquid replenishing structure 3. Figure 3 As shown in the enlarged view, the arrows marked inside the liquid replenishing structure 3 and the flow channel structure 2 are the flow directions of the coolant. The coolant enters the flow channel structure 2 to cool the base 1. The coolant absorbs heat to generate steam, which overflows and evaporates through the coating layer 4 and the fixed film 5. Figure 3 As shown, the bar arrow located outside the fixed film 5 indicates the evaporation flow direction of the steam generated by the coolant.

[0035] When the coating layer 4 is made of a material that can only pass steam in one direction, such as when the coolant is deionized water, a copper mesh with a mesh size of 200 or above is selected; for water media, the pore size of the porous medium material is generally 5-10μm (micrometers), which can make the coating layer 4 have a unidirectional conduction function, and can only pass gas but not liquid water. It is not necessary to use a fixed membrane 5, such as Figure 4 and Figure 5 As shown, the steam directly overflows through the coating layer 4.

[0036] The coolant performs heat exchange inside the base 1, generates steam which is promptly discharged to the outside for evaporation, and effectively takes away the heat generated by the high-power device 7 and transferred to the base 1, achieving a good cooling and heat dissipation effect.

[0037] The invention is reasonably designed to keep the coolant inside the evaporator at all times to prevent the coolant from being evaporated and ensure the heat dissipation effect. The steam can be discharged outward in time, and the evaporation heat exchange is enhanced through the porous medium material to achieve a heat flux density of 120W / cm 2 As mentioned above, the coating layer 4 cooperates with the fixed film 5 to allow gas to overflow, thereby ensuring the effectiveness of the gas-liquid inlet and outlet channels and having a good cooling and heat dissipation effect.

[0038] When the present invention is implemented, the high-power device 7 is connected to the evaporator, and heat dissipation silicone grease is filled between the high-power device 7 and the base 1 to improve the heat conduction efficiency. The high-power device 7 and the base 1 can be connected by screws. Then the evaporator is placed in a coolant, which can be a fluorinated liquid or deionized water, or other coolants can be added. When the coolant submerges the evaporator, the coolant enters the evaporator from the top of the liquid replenishment structure 3, and the coolant flows into the flow channel structure 2 from the liquid inlet channel 31. The heat transferred from the high-power device 7 on the base 1 exchanges heat with the coolant flowing into the flow channel structure 2. The coolant is heated to form steam and permeates and overflows from the coating layer 4 to the outside to complete the evaporation process. During the evaporation process, the coolant absorbs and takes away the heat on the base 1, and the temperature of the base 1 decreases. Due to the temperature difference between the base 1 and the high-power device 7, the heat of the high-power device 7 is transferred to the base 1, thereby achieving cooling of the high-power device 7. Since the liquid replenishing structure 3 is immersed in the coolant, the coolant can be replenished to the flow channel structure 2 in a timely manner without evaporation. In addition, the generated steam penetrates through the coating layer 4 and the fixed film 5 to overflow and evaporate, and does not overflow from the liquid inlet channel 31, so that the coolant enters the flow channel structure 2 from the liquid inlet channel 31. The heat exchange causes the steam generated by the coolant to overflow and evaporate from the coating layer 4 and the fixed film 5 to the outside, forming a stable flow, improving the heat exchange efficiency and taking away more heat.

[0039] In summary, the present invention has been made into actual samples and tested for multiple times as described in the specification and the drawings. From the results of the test, it can be proved that the present invention can achieve its intended purpose, and its practical value is beyond doubt. The above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention in any form. Any person with ordinary knowledge in the technical field, if it does not depart from the scope of the technical features of the present invention, uses the equivalent embodiments of the technical content disclosed by the present invention to make partial changes or modifications, and does not depart from the technical features of the present invention, all still fall within the scope of the technical features of the present invention.

Claims

1. An immersed evaporator, comprising a base (1), characterized in that: A flow channel structure (2) and a fluid replenishment structure (3) are provided on the surface of the base (1); the fluid replenishment structure (3) is in communication with the flow channel structure (2); and the flow channel structure (2) is covered with a unidirectionally conductive coating layer (4) made of a porous medium material.

2. The submerged evaporator according to claim 1, characterized in that: A groove microchannel or a sunken fin or an etched flow channel is provided on the surface of the base (1) to form the flow channel structure (2).

3. The submerged evaporator according to claim 1 or 2, characterized in that: The surface of the flow channel structure (2) is processed by micro-nano structure technology.

4. The submerged evaporator according to claim 3, characterized in that: The liquid replenishing structure (3) comprises liquid inlet channels (31), the liquid inlet channels (31) are arranged side by side on the base (1), and the liquid inlet channels (31) are connected to the flow channel structure (2).

5. The submerged evaporator according to claim 4, characterized in that: The surface of the base (1) is provided with evenly arranged grooves (22), the bottom of the liquid inlet channel (31) is close to the grooves (22), and the gap therebetween forms a groove microchannel (21), and the liquid inlet channel (31) guides the cooling liquid into the groove microchannel (21).

6. The submerged evaporator according to claim 5, characterized in that: The groove microchannels (21) are evenly distributed on the surface of the base (1); a plurality of grooves (32) adapted to the groove side walls of the groove (22) are provided at the bottom of the liquid inlet channel (31); the grooves (32) are plugged into the grooves (22), and there is a gap between the grooves (32) and the groove bottom wall of the groove (22).

7. The submerged evaporator according to claim 3, characterized in that: The coating layer (4) comprises a microporous film and a fixed film (5) covering the microporous film, wherein the microporous film is made of an AAO film, a copper mesh or a foam layer, and the fixed film (5) is made of a polytetrafluoroethylene film, a PE film or a PVA film.

8. The submerged evaporator according to claim 4, characterized in that: A fixing frame (11) is provided on the base (1); the fixing frame (11) comprises a horizontal fixing plate (111) and vertical fixing plates (112) arranged at opposite ends of the horizontal fixing plate (111); first embedding grooves (113) are provided on opposite inner sides of the horizontal fixing plate (111); a second embedding groove (114) is provided on the vertical fixing plate (112); the horizontal fixing plate (111) and the vertical fixing plate (112) are installed and fixed to the liquid inlet channel (31) via the first embedding groove (113) and the second embedding groove (114).

9. The submerged evaporator according to claim 5, characterized in that: A liquid wick and / or a support column may be arranged in the hollow cavity of the liquid inlet channel (31).

10. The submerged evaporator according to claim 4, characterized in that: The coating layer (4) and the fixed membrane (5) are provided with liquid replenishment structural holes (6) adapted to the liquid inlet channel (31).

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