Hole machining device and method

Abstract

The invention discloses a hole channel machining device and method, and the hole channel machining device is used for machining a hole channel (HP) in a workpiece (WP), and comprises a machining head (10) which is used for carrying out material removal on the workpiece (WP); at least two support mechanisms (20), each support mechanism (20) being used for supporting the inner wall of the hole channel (HP) of the workpiece (WP) or releasing the support of the inner wall of the hole channel (HP) of the workpiece (WP), the support mechanism (20) of the at least two support mechanisms (20) closest to the processing head (10) being defined as a first support mechanism (21); the first driving mechanism (30) is connected between the machining head (10) and the first supporting mechanism (21) and used for driving the machining head (10) to adjust the steering angle relative to the first supporting mechanism (21); and the at least one second driving mechanism (40) is connected between the at least one group of two adjacent supporting mechanisms (20) and is used for driving the two adjacent supporting mechanisms (20) to move in the same direction or in the opposite directions.

Description

Technical Field

[0001] The invention relates to processing technology, and in particular to a hole processing device and method. Background Art

[0002] In the field of mechanical processing, in order to reduce the oil circuit resistance of hydraulic components and reduce the energy loss during the flow of hydraulic oil, processing curved channels is an effective solution. In addition, in the fields of aviation industry, mold cooling, fluid transmission and high-precision equipment, curved channels and other complex internal channel structures are also needed.

[0003] However, due to its complexity, this type of hole structure poses a great challenge to processing. It is difficult to achieve accurate processing of these holes using traditional cutting processing technology. Especially for the hole processing of workpieces made of high-strength materials such as titanium alloy, the processing technology is more complicated and the processing difficulty is greater.

[0004] In some related technologies, the drill bit of the drilling machine adopts a soft connection or a spring connection to realize the bending hole operation. In other related technologies, the electrochemical machining device realizes the bending hole processing through the motion cooperation between the tool and the workpiece blank. Summary of the invention

[0005] Research has found that these related technologies are difficult to achieve high-precision curved hole processing and are difficult to apply to complex channels.

[0006] In view of this, the embodiments of the present disclosure provide a hole processing device and method, which can achieve better hole processing capabilities.

[0007] In one aspect of the present disclosure, a hole processing device is provided, for processing a hole in a workpiece, comprising:

[0008] A processing head, used for removing material from the workpiece;

[0009] At least two supporting mechanisms, each supporting mechanism is used to support the inner wall of the hole of the workpiece or release the support for the inner wall of the hole of the workpiece, wherein the supporting mechanism of the at least two supporting mechanisms that is closest to the processing head is defined as a first supporting mechanism;

[0010] A first driving mechanism, connected between the processing head and the first supporting mechanism, and used for driving the processing head to adjust a steering angle relative to the first supporting mechanism; and

[0011] At least one second driving mechanism is connected between at least one group of two adjacent supporting mechanisms among the at least two supporting mechanisms, and is used to drive the two adjacent supporting mechanisms to move toward or in opposite directions.

[0012] In some embodiments, the first driving mechanism is further used to drive the processing head to approach or move away from the first supporting mechanism.

[0013] In some embodiments, the first driving mechanism comprises:

[0014] A plurality of first linear drive elements, each of which has one end connected to the first support mechanism and the other end rotatably connected to the processing head;

[0015] Each first linear drive element independently adjusts its length by extending or retracting.

[0016] In some embodiments, at least some of the multiple first linear drive elements are configured to extend or retract different strokes so that the processing head can adjust the steering angle relative to the first support mechanism; and / or, the multiple first linear drive elements are configured to extend or retract the same stroke so that the processing head can move away from or approach the first support mechanism.

[0017] In some embodiments, the second driving mechanism is further used to adjust the relative angle between the two adjacent supporting mechanisms.

[0018] In some embodiments, the second driving mechanism comprises:

[0019] A plurality of second linear drive elements, each of which has one end rotatably connected to a support mechanism adjacent to a front side of the second linear drive element and the other end connected to a support mechanism adjacent to a rear side of the second linear drive element;

[0020] The second linear drive elements adjust their lengths independently or uniformly by extending or retracting.

[0021] In some embodiments, the plurality of second linear drive elements are configured to retract or extend the same stroke so that the two adjacent support mechanisms move toward or in opposite directions; and / or, at least some of the plurality of second linear drive elements are configured to extend or retract different strokes so that the plurality of second linear drive elements adjust the relative angle of the two adjacent support mechanisms.

[0022] In some embodiments, the support mechanism comprises:

[0023] A support body; and

[0024] At least two telescopic components are connected to the support base and arranged in the circumferential direction of the support base.

[0025] Among them, each telescopic component can extend radially relative to the support seat body so that the support mechanism can be supported and fixed relative to the inner wall of the hole of the workpiece, and can retract radially relative to the support seat body so that the support mechanism can release the support and fixation of the inner wall of the hole of the workpiece, thereby making the support mechanism movable relative to the inner wall of the hole of the workpiece.

[0026] In some embodiments, the machining head comprises a machining electrode.

[0027] In some embodiments, the machining electrode comprises an electrospark machining electrode or an electrochemical machining electrode.

[0028] In some embodiments, the hole processing device further comprises:

[0029] a power system, including a power circuit connected to the machining electrode, configured to provide and control electrical energy to the machining electrode; and

[0030] a working fluid circulation system, comprising a working fluid pipeline connected to the machining electrode, configured to achieve continuous circulation of the working fluid relative to the machining electrode,

[0031] Among them, the processing electrode has a liquid outlet and a liquid return port, the liquid outlet is connected to the working fluid pipeline so that the processing electrode discharges the working fluid outward through the liquid outlet, and the liquid return port is connected to the working fluid pipeline so that the processing electrode recovers the working fluid through the liquid return port.

[0032] In some embodiments, the working fluid pipeline and the power line pass through hollow areas of the at least two supporting mechanisms, the first driving mechanism, and at least one second driving mechanism.

[0033] In some embodiments, the hole processing device further comprises:

[0034] The controller is signal-connected to the at least two supporting mechanisms, the first driving mechanism and the at least one second driving mechanism, and is configured to achieve processing of at least one of the straight channel section, curved channel section and forked channel section of the workpiece through the cooperation of the at least two supporting mechanisms, the first driving mechanism and the at least one second driving mechanism.

[0035] In one aspect of the present disclosure, a hole processing method of the aforementioned hole processing device is provided, comprising:

[0036] Through the cooperation of the at least two supporting mechanisms, the first driving mechanism and the at least one second driving mechanism, processing of at least one of the straight channel section, the curved channel section and the bifurcated channel section of the workpiece is achieved.

[0037] In some embodiments, the processing of the straight channel section of the workpiece includes at least one linear feed process of the processing head; and / or, the processing of the curved channel section of the workpiece includes at least one turning feed process of the processing head; and / or, the processing of the forked channel section of the workpiece includes at least one retracting process and at least one turning feed process of the processing head.

[0038] In some embodiments, the at least two supporting mechanisms include the first supporting mechanism and the second supporting mechanism, the second supporting mechanism is located at a side of the first supporting mechanism away from the processing head, and the second driving mechanism is connected between the first supporting mechanism and the second supporting mechanism;

[0039] Wherein, the linear feeding process includes:

[0040] The second supporting mechanism supports the inner wall of the hole of the workpiece, and the first supporting mechanism releases the support for the inner wall of the hole of the workpiece;

[0041] The second driving mechanism drives the first supporting mechanism to move in the opposite direction relative to the second supporting mechanism by a preset distance, so as to drive the processing head forward to process the hole;

[0042] The first supporting mechanism supports the inner wall of the hole of the workpiece, and the second supporting mechanism releases the support for the inner wall of the hole of the workpiece;

[0043] The second driving mechanism drives the second supporting mechanism to move toward the second supporting mechanism by a preset distance.

[0044] In some embodiments, the at least two supporting mechanisms include the first supporting mechanism and the second supporting mechanism, the second supporting mechanism is located at a side of the first supporting mechanism away from the processing head, and the second driving mechanism is connected between the first supporting mechanism and the second supporting mechanism;

[0045] Wherein, the steering feeding process includes:

[0046] enabling the first driving mechanism to drive the processing head to adjust a steering angle relative to the first supporting mechanism;

[0047] The second supporting mechanism supports the inner wall of the hole of the workpiece, and the first supporting mechanism releases the support for the inner wall of the hole of the workpiece;

[0048] The second driving mechanism drives the first supporting mechanism to move in the opposite direction relative to the second supporting mechanism by a preset distance, so as to drive the processing head to process the hole according to the steering angle;

[0049] The first supporting mechanism supports the inner wall of the hole of the workpiece, and the second supporting mechanism releases the support for the inner wall of the hole of the workpiece;

[0050] The second driving mechanism drives the second supporting mechanism to move toward the first supporting mechanism by a preset distance.

[0051] In some embodiments, the steering feeding process further includes:

[0052] When the second driving mechanism drives the first supporting mechanism to move in the opposite direction relative to the second supporting mechanism by a preset distance, the relative angle between the first supporting mechanism and the second supporting mechanism is also adjusted.

[0053] In some embodiments, the at least two supporting mechanisms include the first supporting mechanism and the second supporting mechanism, the second supporting mechanism is located at a side of the first supporting mechanism away from the processing head, and the second driving mechanism is connected between the first supporting mechanism and the second supporting mechanism;

[0054] The return process includes:

[0055] The first supporting mechanism supports the inner wall of the hole of the workpiece, and the second supporting mechanism releases the support for the inner wall of the hole of the workpiece;

[0056] The second driving mechanism drives the second supporting mechanism to move in the opposite direction relative to the first supporting mechanism by a preset distance according to the hole of the workpiece;

[0057] The second supporting mechanism supports the inner wall of the hole of the workpiece, and the first supporting mechanism releases the support for the inner wall of the hole of the workpiece;

[0058] The second driving mechanism drives the first supporting mechanism to move toward the second supporting mechanism by a preset distance according to the hole of the workpiece, so as to drive the processing head to retreat.

[0059] According to the disclosed embodiment, at least two supporting mechanisms can alternately support the inner wall of the hole, fix the hole processing device through the support, and provide a reaction force basis when the second driving mechanism is driven, so as to realize forward or backward step-by-step movement, and cooperate with the first driving mechanism to adjust the steering angle of the processing head relative to the first supporting mechanism, so as to realize straight forward or backward to complete the straight hole section's straight processing feed and straight line withdrawal, and also realize the steering processing feed and curve withdrawal of the curved hole section. In this way, the processing of complex holes such as curved holes, multi-section curved holes, deep holes, and bifurcated holes in the workpiece can be realized, which is conducive to ensuring the processing accuracy of the curved holes by accurately adjusting the steering angle. In this way, for the internal oil circuit of the workpiece such as the hydraulic component, the loss along the fluid transmission can be effectively reduced, and the energy loss can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0061] The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0062] Figure 1 is a schematic structural diagram of some embodiments of the hole processing device disclosed in the present invention;

[0063] Figure 2 is a schematic diagram of control signal connections according to an embodiment of the hole processing device disclosed in the present invention;

[0064] Figure 3 is a schematic structural diagram of a support mechanism according to an embodiment of a hole processing device disclosed herein;

[0065] Figure 4 It is a partial structural schematic diagram of an embodiment of the hole processing device disclosed in the present invention;

[0066] Figure 5 (a)-(d) are Figure 4 Schematic diagram of the AA section and three other cross-section examples;

[0067] Figure 6-Figure 9 They are schematic diagrams of machining holes HP of different shapes in a workpiece WP according to an embodiment of the hole machining device disclosed herein.

[0068] Fig.10 (a)-(d) are schematic diagrams of the linear feeding process of the hole processing device embodiment of the present disclosure;

[0069] Fig.11 (a)-(d) are schematic diagrams of the feeding back process of the hole processing device embodiment of the present disclosure;

[0070] Fig.12(a)-(b) are schematic diagrams of the hole processing device embodiment of the present disclosure performing small-amplitude turns in different directions;

[0071] Fig.13 (a)-(b) are schematic diagrams of the embodiment of the hole processing device disclosed in the present invention performing large-scale turns in different directions.

[0072] It should be understood that the size of each part shown in the accompanying drawings is not drawn according to the actual proportional relationship. In addition, the same or similar reference numerals represent the same or similar components. Description of reference numerals:

[0073] 10-processing head; 11-liquid outlet; 12-liquid return port;

[0074] 20-support mechanism; 201-support seat; 202-telescopic assembly; 21-first support mechanism; 22-second support mechanism;

[0075] 30-first driving mechanism; 31-first linear driving element;

[0076] 40 - second driving mechanism; 41 - second linear driving element;

[0077] 50-power system; 51-power line;

[0078] 60-working fluid circulation system; 61-working fluid pipeline;

[0079] 70-controller;

[0080] HP-hole; WP-workpiece. DETAILED DESCRIPTION

[0081] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the present disclosure and its application or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary and not as limiting.

[0082] The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprise" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of also including other elements.

[0083] Unless otherwise specified, in the description of the embodiments of the present disclosure, technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present disclosure.

[0084] In the present disclosure, when a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other device without an intermediate device, or may not be directly connected to the other device but have an intermediate device.

[0085] All terms (including technical terms or scientific terms) used in the present disclosure have the same meanings as those understood by ordinary technicians in the field to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0086] In the description of the embodiments of the present disclosure, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, if the character " / " appears in the present disclosure, it generally indicates that the associated objects before and after are in an "or" relationship.

[0087] In the description of the embodiments of the present disclosure, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0088] In the description of the embodiments of the present disclosure, the term "at least one" refers to one or more than two (including two), similarly, "at least one group" refers to one group or more than two (including two), and "at least one piece" refers to one piece or more than two (including two). In the description of the embodiments of the present disclosure, the term "at least part" refers to part or all.

[0089] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0090] In some related technologies, the drill bit of the drilling machine adopts a soft connection or a spring connection to realize the bending hole operation. In other related technologies, the electrochemical machining device realizes the bending hole processing through the motion cooperation between the tool and the workpiece blank.

[0091] Research has found that these related technologies are difficult to achieve high-precision curved hole processing and are difficult to apply to complex channels.

[0092] In view of this, the embodiments of the present disclosure provide a hole processing device and method, which can achieve better hole processing capabilities.

[0093] Figure 1 Schematic diagram of the structure of some embodiments of the hole processing device according to the present disclosure. Figure 1 The embodiment of the present disclosure provides a hole processing device for processing a hole HP in a workpiece WP. The hole processing device includes: a processing head 10, at least two support mechanisms 20, a first drive mechanism 30 and at least one second drive mechanism 40.

[0094] The processing head 10 is used to remove material from the workpiece WP. Each support mechanism 20 is used to support the inner wall of the hole HP of the workpiece WP or release the support for the inner wall of the hole HP of the workpiece WP, wherein the support mechanism 20 closest to the processing head 10 among the at least two support mechanisms 20 is defined as a first support mechanism 21. A first drive mechanism 30 is connected between the processing head 10 and the first support mechanism 21, and is used to drive the processing head 10 to adjust the steering angle relative to the first support mechanism 21. At least one second drive mechanism 40 is connected between at least one group of two adjacent support mechanisms 20 among the at least two support mechanisms 20, and is used to drive the two adjacent support mechanisms 20 to move toward or in opposite directions.

[0095] In this embodiment, at least two support mechanisms can alternately support the inner wall of the channel, fix the channel processing device through support, and provide a reaction force basis when the second drive mechanism is driven, so as to realize forward or backward step-by-step movement, and cooperate with the first drive mechanism to adjust the steering angle of the processing head relative to the first support mechanism, so as to realize straight forward or backward to complete the straight hole section's straight processing feed and straight line withdrawal, and also realize the steering processing feed and curve withdrawal of the curved hole section. In this way, the processing of complex channels such as curved holes, multi-section curved holes, deep holes, bifurcated holes, etc. in the workpiece can be realized, which is conducive to ensuring the processing accuracy of the curved channel by accurately adjusting the steering angle. In this way, for the internal oil circuit of the workpiece such as the hydraulic component, the loss along the fluid transmission can be effectively reduced, and the energy loss can be reduced.

[0096] The hole HP of the workpiece WP can be completely or partially processed by the hole processing device. In other words, the hole processing device can gradually process the required hole HP from the outside of the workpiece with the help of the reaction support, or an initial hole section can be formed in advance by other tools to accommodate the hole processing device, and then the hole processing device can process the other parts of the hole HP. The hole processing device can be used independently or in conjunction with other tools.

[0097] The processing head 10 can remove material from the workpiece WP. The processing head 10 can implement a contact or non-contact material removal process on the workpiece WP. The contact material removal process is, for example, mechanical cutting or grinding of materials. For example, the processing head 10 includes a drill bit or a grinding head. The non-contact material removal process may include electrical discharge machining (EDM) or electrochemical machining (ECM), and may also include laser processing. In some embodiments, the processing head 10 includes a processing electrode, the material of which is a conductive material with good conductivity, such as metal, alloy or graphite, which can be used for electrical discharge machining (EDM) or electrochemical machining (ECM). Correspondingly, the material of the workpiece WP here is a conductive material, usually a metal or alloy material, and may also be a non-metallic material, such as a graphite material.

[0098] The support mechanism 20 is used to support the inner wall of the hole HP of the workpiece WP or to release the support for the inner wall of the hole HP of the workpiece WP. Here, the support of the inner wall of the hole HP by the support mechanism 20 can achieve the fixation of the support mechanism 20 relative to the inner wall of the hole HP, and the friction between the support mechanism 20 and the inner wall of the hole HP provides a reaction force basis for the driving action of the first drive mechanism or the second drive mechanism. The friction force can also enable the hole processing device to maintain its position in the inclined or vertical hole HP, reducing the risk of unexpected sliding.

[0099] When the support mechanism 20 releases the support for the inner wall of the hole HP of the workpiece WP, there is no longer any friction between the support mechanism 20 and the inner wall, and thus the support mechanism 20 can be driven by the first drive mechanism or the second drive mechanism.

[0100] The first driving mechanism 30 is connected between the processing head 10 and the first supporting mechanism 21, and can drive the processing head 10 to adjust the steering angle relative to the first supporting mechanism 21. For a processing head and a first supporting mechanism with regular cross-sections, the center line of each cross section of the processing head is the center line of the processing head, and the center line of each cross section of the first supporting mechanism is the center line of the first supporting mechanism.

[0101] Accordingly, the steering angle here can be defined as the angle between the center line of the machining head 10 and the center line of the first support mechanism 21. In other embodiments, it can also be defined according to other reference objects. Generally speaking, if the steering angle of the machining head 10 relative to the first support mechanism 21 is 0°, the center line of the machining head 10 is parallel to or coincides with the center line of the first support mechanism 21.

[0102] The first driving mechanism 30 drives the machining head 10 to adjust a steering angle relative to the first supporting mechanism 21 . The steering angle here includes both a steering angle value and a steering direction.

[0103] In order to adjust the steering angle, the first drive mechanism 30 may adopt various structural forms, such as a gear transmission mechanism driven by a power element such as a motor, a connecting rod transmission mechanism, a cam transmission mechanism or a flexible shaft transmission mechanism.

[0104] The machining head 10 and the first supporting mechanism 21 are connected via a swing frame, or via a plurality of hydraulic cylinders with different telescopic strokes.

[0105] At least one second driving mechanism 40 is connected between at least one group of two adjacent supporting mechanisms 20 among the at least two supporting mechanisms 20, wherein the number of second driving mechanisms 40 is related to the number of supporting mechanisms. For two supporting mechanisms, one second driving mechanism 40 is arranged between the two supporting mechanisms. For three or more supporting mechanisms, more than two second driving mechanisms 40 may be arranged.

[0106] For more than three supporting mechanisms, a second driving mechanism 40 is disposed between two adjacent supporting mechanisms in one group, and a second driving mechanism 40 can be disposed between two adjacent supporting mechanisms in another group, or other structures, such as a fixing frame, etc. Moreover, for more than two second driving mechanisms 40, the structures and sizes of the second driving mechanisms 40 can be the same or different.

[0107] The second driving mechanism 40 drives the two adjacent supporting mechanisms 20 to move toward or in the opposite direction. The movement toward each other here means that the two adjacent supporting mechanisms 20 are close to each other, and when one supporting mechanism 20 is supported on the inner wall of the hole HP, the other supporting mechanism 20 moves toward the supporting mechanism 20. The opposite movement here means that the two adjacent supporting mechanisms 20 are away from each other, and when one supporting mechanism 20 is supported on the inner wall of the hole HP, the other supporting mechanism 20 moves in a direction away from the supporting mechanism 20.

[0108] In order to realize the above-mentioned driving of the opposite or reverse motion, the second driving mechanism 40 can adopt various structural forms, such as an electric push rod, a hydraulic cylinder, a magnetostrictive driver, a screw-nut mechanism or a gear rack mechanism driven by a power element such as a motor, etc.

[0109] refer to Figure 1 In some embodiments, the first driving mechanism 30 is also used to drive the processing head 10 to approach or move away from the first supporting mechanism 21. In addition to achieving steering, the first driving mechanism 30 can also drive the processing head 10 to approach or move away from the first supporting mechanism 21, so that multiple functions can be achieved according to processing needs.

[0110] The overall length from the machining head 10 to the first support mechanism 21 can be adjusted by driving the machining head 10 to approach or move away from the first support mechanism 21 through the first drive mechanism 30 to meet the machining requirements of different channels. For example, if the overall length from the machining head 10 to the first support mechanism 21 is longer, the machining stability of the machining head 10 is enhanced, while if the overall length is shorter, it is conducive to achieving a larger steering angle.

[0111] In addition, the first driving mechanism 30 drives the processing head 10 to approach or move away from the first supporting mechanism 21, which can also be used for feeding and retracting during the hole processing process.

[0112] In order to achieve this function, Figure 1 FIG. 3 shows a specific structure of the first driving mechanism 30. Figure 1In some embodiments, the first driving mechanism 30 includes a plurality of first linear driving elements 31, one end of each first linear driving element 31 is connected to the first supporting mechanism 21, and the other end is rotatably connected to the processing head 10. Each first linear driving element 31 independently adjusts its own length by extending or retracting.

[0113] Here, the first linear drive element 31 may include an electric push rod, a cylinder or a hydraulic cylinder, etc. A plurality of first linear drive elements 31 may be arranged at intervals along the circumference, for example, at equal angles along the circumference, which is conducive to effective steering in all directions.

[0114] The first linear drive element 31 may be fixedly connected or rotatably connected to the first support mechanism 21. The rotatable connection between the first linear drive element 31 and the processing head 10 may include a direct hinge connection, or may be indirectly rotatably connected to the processing head 10 via an intermediate structure.

[0115] Accordingly, in some embodiments, at least some of the plurality of first linear drive elements 31 are configured to extend or retract different strokes, so that the machining head 10 can adjust the steering angle relative to the first support mechanism 21. For example, when the machining head 10 needs to turn downward, some of the first linear drive elements 31 located on the upper side of the plurality of first linear drive elements 31 are extended, or some of the first linear drive elements 31 located on the upper side are retracted, thereby driving the machining head 10 to deflect downward relative to the first support mechanism 21.

[0116] The plurality of first linear drive elements 31 may also be configured to extend or retract the same stroke to move the machining head 10 away from or closer to the first support mechanism 21. For example, when the length from the machining head 10 to the first support mechanism 21 needs to be increased, all the first linear drive elements 31 are extended by the same stroke to move the machining head 10 away from the first support mechanism 21.

[0117] In some embodiments, the second driving mechanism 40 is also used to adjust the relative angle of the two adjacent supporting mechanisms 20. In addition to driving the two adjacent supporting mechanisms to move toward or in the opposite direction, the angle can also be adjusted to turn the processing head 10 or cooperate with the first driving mechanism 30 to turn the processing head 10, thereby achieving a larger turning angle.

[0118] In order to achieve this function, Figure 1 FIG. 4 shows a specific structure of the second driving mechanism 40. Figure 1In some embodiments, the second driving mechanism 40 includes a plurality of second linear driving elements 41, one end of each second linear driving element 41 is rotatably connected to the supporting mechanism 20 adjacent to the front side of the second linear driving element 41, and the other end is connected to the supporting mechanism 20 adjacent to the rear side of the second linear driving element 41. Each second linear driving element 41 adjusts its length independently or uniformly by extending or retracting.

[0119] Here, the second linear drive element 41 may include an electric push rod, a cylinder or a hydraulic cylinder, etc. A plurality of second linear drive elements 41 may be arranged at intervals along the circumference, for example, at equal angles along the circumference, which is conducive to effective steering in all directions.

[0120] The second linear drive element 41 may be fixedly connected to the support mechanism 20 adjacent to the rear side of the second linear drive element 41, or may be rotatably connected. The rotatable connection between the second linear drive element 41 and the support mechanism 20 adjacent to the front side of the second linear drive element 41 may include a direct hinge connection, or may be indirectly rotatably connected to the support mechanism 20 via an intermediate structure.

[0121] Accordingly, in some embodiments, the plurality of second linear drive elements 41 are configured to retract or extend the same stroke to make the two adjacent support mechanisms 20 move toward or in the opposite direction. For example, during linear feeding, all the second linear drive elements 41 are extended to the same stroke, so that the machining head 10 moves forward to remove the workpiece material in front.

[0122] At least part of the plurality of second linear drive elements 41 can also extend or retract different strokes, so that the plurality of second linear drive elements 41 can adjust the relative angle of the two adjacent support mechanisms 20. For example, when the processing head 10 needs to turn left, the first drive mechanism 30 drives the processing head 10 to deflect to the left, and the second linear drive elements 41 on the right side of the plurality of second linear drive elements 41 are extended, or the second linear drive elements 41 on the left side are retracted, so as to cooperate with the leftward deflection of the processing head 10, so as to make the first support mechanism 21 also deflect to the left, thereby achieving a larger steering angle.

[0123] Taking the machining head including machining electrodes as an example, for EDM or ECM, the machining electrodes may include EDM electrodes or ECM electrodes accordingly. For machining heads 10 with different machining principles, corresponding matching systems are required.

[0124] refer to Figure 1In some embodiments, the hole processing device further includes: a power supply system 50 and a working fluid circulation system 60. The power supply system 50 includes a power supply line 51 connected to the processing electrode, and is configured to provide and control electrical energy to the processing electrode. The working fluid circulation system 60 includes a working fluid pipeline 61 connected to the processing electrode, and is configured to achieve continuous circulation of the working fluid relative to the processing electrode.

[0125] The machining electrode has a liquid outlet 11 and a liquid return port 12. The liquid outlet 11 is connected to the working fluid pipeline 61 so that the machining electrode discharges the working fluid outward through the liquid outlet 11. The liquid return port 12 is connected to the working fluid pipeline 61 so that the machining electrode recovers the working fluid through the liquid return port 12.

[0126] Taking the EDM electrode as an example, its working fluid is generally an insulating liquid medium, such as kerosene, emulsion, distilled water, etc. For the electrochemical machining electrode, its working fluid is an electrolyte, such as NaCl solution, NaNO3 solution, NaClO3 solution, etc.

[0127] The working fluid circulation system 60 can drive the working fluid to flow to the processing electrode through components such as pumps and valves, and flow out from the liquid outlet 11 of the processing electrode. The processed working fluid returns from the liquid return port 12 of the processing electrode for subsequent processing or recycling.

[0128] The processing electrode may have one or more liquid outlets 11 and one or more liquid return ports 12. The positions of the liquid outlets 11 and liquid return ports 12 may be set according to processing requirements, for example, liquid outlet on one side and liquid return on the other side, or liquid outlet in the middle and liquid return on all sides.

[0129] In order to prevent the power supply line 51 and the working fluid pipeline 61 from interfering with the support mechanism 20, the first drive mechanism 30 and the second drive mechanism 40, in some embodiments, the working fluid pipeline 61 and the power supply line 51 pass through the hollow areas of the at least two support mechanisms 20, the first drive mechanism 30 and at least one second drive mechanism 40. In this way, the support mechanism 20, the first drive mechanism 30 and the second drive mechanism 40 can also form a protective effect on the power supply line 51 and the working fluid pipeline 61. In addition, the power supply line 51 and the working fluid pipeline 61 can be centrally stored in the pipeline passing through the hollow area for centralized protection.

[0130] For other types of machining heads 10 , one or more channels may be provided on the machining head 10 for introducing or discharging working fluid, or for discharging chips, etc.

[0131] Figure 2 Schematic diagram of control signal connection according to an embodiment of the hole processing device disclosed in the present invention. Figure 1and Figure 2 In some embodiments, the hole processing device further includes a controller 70. The controller 70 is connected to the at least two supporting mechanisms 20, the first driving mechanism 30 and the at least one second driving mechanism 40 by signal, and is configured to realize the processing of at least one of the straight hole section, the curved hole section and the bifurcated hole section of the workpiece WP through the cooperation of the at least two supporting mechanisms 20, the first driving mechanism 30 and the at least one second driving mechanism 40.

[0132] The controller 70 may include one or more control units, which may be general-purpose processors, such as CPUs, microcontrollers, microprocessors, digital signal processors, application-specific integrated circuits, field programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, and may implement or execute the various methods, steps, and logic block diagrams disclosed in this embodiment. The controller 70 may communicate with at least two support mechanisms 20, the first drive mechanism 30, and the at least one second drive mechanism 40 by wired or wireless means to receive data and send instructions, etc.

[0133] The controller 70 may also be signal-connected to the power supply system 50 and the working fluid circulation system 60 so as to control the processing process of the processing head 10 and the circulation of the working fluid.

[0134] Figure 3 Schematic diagram of the structure of the support mechanism in the embodiment of the hole processing device disclosed in the present invention. Figure 3 In some embodiments, the support mechanism 20 includes: a support seat 201 and at least two telescopic components 202. At least two telescopic components 202 are connected to the support seat 201 and arranged in the circumferential direction of the support seat 201. Each telescopic component 202 can extend radially relative to the support seat 201 so that the support mechanism 20 is supported and fixed relative to the inner wall of the hole HP of the workpiece WP, and can retract radially relative to the support seat 201 so that the support mechanism 20 releases the support and fixation to the inner wall of the hole HP of the workpiece WP, thereby making the support mechanism 20 movable relative to the inner wall of the hole HP of the workpiece WP.

[0135] The support base 201 may have a hollow area to allow the working fluid pipeline 61 and the power line 51 to pass through. The support base 201 may be connected to the first drive mechanism 30 or the second drive mechanism 40. For the first support mechanism 21, its support base 201 is connected to both the first drive mechanism 30 and the second drive mechanism 40.

[0136] The telescopic component 202 can adopt a mechanism that can realize telescopic action, such as a hydraulic cylinder, a pneumatic cylinder, an electric push rod, etc. It obtains a larger friction force by extending radially and pressing against the inner wall of the hole HP, and when retracting radially, it breaks away from the contact with the inner wall of the hole HP, so that it can move relative to the hole HP.

[0137] In order to increase the friction force, the portion of the telescopic component 202 that contacts the inner wall of the hole HP may be provided with a plurality of strip-shaped concave-convex structures, and the extension direction of each strip-shaped concave-convex structure may be perpendicular to the extension direction of the hole HP or at an inclined angle.

[0138] Figure 4 It is a schematic diagram of the partial structure of an embodiment of the hole processing device disclosed in the present invention. Figure 5 (a)-(d) are Figure 4 The processing surface of the processing head 10 can be designed according to the processing requirements, referring to Figure 4 and Figure 5 In some embodiments, the machining surface of the machining head 10 is one of spherical, hemispherical, ellipsoidal, prism-shaped, truncated cone-shaped, pyramidal and prism-shaped; and / or the cross-section of the machining head 10 is at least one of circular, elliptical and polygonal.

[0139] exist Figure 4 In the embodiment, the machining surface of the machining head 10 is hemispherical, and its cross section is circular (refer to Figure 5 (a)). In other embodiments, the processing surface of the processing head 10 may also be spherical, ellipsoidal, prism-shaped, truncated cone-shaped, pyramidal or prism-shaped. Figure 5 (b) to (d) respectively show embodiments in which the cross-section of the processing head 10 is elliptical, square, and octagonal.

[0140] Based on the above-mentioned embodiments of the hole processing device of the present disclosure, in one aspect of the present disclosure, a hole processing method of the hole processing device is also provided. The hole processing method comprises: through the cooperation of the at least two support mechanisms 20, the first drive mechanism 30 and the at least one second drive mechanism 40, at least one of the straight hole section, the curved hole section and the bifurcated hole section of the workpiece WP is processed.

[0141] Here, the steps of the hole processing method can be implemented by the control instructions issued by the controller 70 to the at least two support mechanisms 20, the first drive mechanism 30 and the at least one second drive mechanism 40. The hole processing method of this embodiment can realize the processing of at least one of the straight hole section, the curved hole section and the bifurcated hole section of the workpiece WP, so as to meet the processing requirements of complex holes such as curved holes, multi-section curved holes, deep holes, bifurcated holes, etc. in the workpiece.

[0142] Figure 6-Figure 9 They are schematic diagrams of the hole processing device of the present disclosure processing holes HP of different shapes in the workpiece WP. Figure 6-Figure 8 The hole processing device can realize the processing of complex holes such as straight holes, one-way curved holes, wavy curved holes, bifurcated holes, etc. within the same plane. Fig. 9 The channel processing device can also realize curved channels in a spatial range, and the various parts of this curved channel are not completely in the same plane.

[0143] For the various complex channels mentioned above, they can be composed of one or more combinations of basic straight channel segments, curved channel segments and bifurcated channel segments. Figure 6 The hole HP may include a straight hole section and a circular arc-shaped curved hole section connected in sequence. Figure 7 The hole HP may include a transverse straight hole section, an arc-shaped curved hole section and a vertical straight hole section connected in sequence. Figure 8 The hole HP may include a horizontal straight hole section, a bifurcated hole section, a vertical straight hole section and an arc-shaped curved hole section. In other words, the hole processing device disclosed in the present invention can meet the processing needs of various complex holes HP, and has a better hole processing capability for both simple holes and complex holes.

[0144] Regarding the processing of the straight channel section, curved channel section and bifurcated channel section mentioned above, in some embodiments, the processing of the straight channel section of the workpiece WP includes at least one straight feed process of the processing head 10; and / or, the processing of the curved channel section of the workpiece WP includes at least one turning feed process of the processing head 10; and / or, the processing of the bifurcated channel section of the workpiece WP includes at least one retracting process and at least one turning feed process of the processing head 10. At least one time here includes one or more times.

[0145] For the processing of the bifurcated channel section of WP, after the processing head 10 has processed a straight channel section or a curved channel section, the processing head 10 is adjusted to the position to be bifurcated through at least one retraction process. The retraction here is to move along the direction of the existing channel, which can be a straight retraction or a curved retraction. At least one turning and feeding process is performed at the position to be bifurcated so that the angle of the processing head 10 forms an angle with the extension direction of the existing channel, thereby processing another branch channel.

[0146] Fig.10 (a)-(d) are schematic diagrams of the linear feeding process of the hole processing device embodiment disclosed in the present invention. Fig.10In some embodiments, the at least two support mechanisms 20 include the first support mechanism 21 and the second support mechanism 22, the second support mechanism 22 is located on the side of the first support mechanism 21 away from the processing head 10, and the second driving mechanism 40 is connected between the first support mechanism 21 and the second support mechanism 22.

[0147] Accordingly, the linear feeding process may include the following steps.

[0148] refer to Fig.10 (a), the second supporting mechanism 22 supports the inner wall of the hole HP of the workpiece WP, and the first supporting mechanism 21 releases the support for the inner wall of the hole HP of the workpiece WP.

[0149] refer to Fig.10 (b) causes the second driving mechanism 40 to drive the first supporting mechanism 21 to move in the opposite direction relative to the second supporting mechanism 22 by a preset distance, so as to drive the processing head 10 to move forward to process the hole. The arrow in the figure shows that the front end of the processing head 10 moves forward by a preset distance.

[0150] refer to Fig.10 (c) The first supporting mechanism 21 supports the inner wall of the hole HP of the workpiece WP, and the second supporting mechanism 22 releases the support for the inner wall of the hole HP of the workpiece WP.

[0151] refer to Fig.10 (d) causes the second driving mechanism 40 to drive the second supporting mechanism 22 to move a preset distance toward the second supporting mechanism 22. The arrow in the figure shows that the rearmost end of the second supporting mechanism 22 moves forward a preset distance.

[0152] Fig.11 (a)-(d) are schematic diagrams of the feeding back process of the hole processing device embodiment of the present disclosure. Fig.11 In some embodiments, the at least two support mechanisms 20 include the first support mechanism 21 and the second support mechanism 22, the second support mechanism 22 is located on the side of the first support mechanism 21 away from the processing head 10, and the second driving mechanism 40 is connected between the first support mechanism 21 and the second support mechanism 22.

[0153] Accordingly, the return process may include the following steps.

[0154] refer to Fig.11 (a), the first supporting mechanism 21 supports the inner wall of the hole HP of the workpiece WP, and the second supporting mechanism 22 releases the support for the inner wall of the hole HP of the workpiece WP.

[0155] refer to Fig.11 (b) causes the second driving mechanism 40 to drive the second supporting mechanism 22 to move in the opposite direction relative to the first supporting mechanism 21 by a preset distance according to the hole HP of the workpiece WP. The arrow in the figure shows that the rearmost end of the second supporting mechanism 22 moves backward by a preset distance.

[0156] refer to Fig.11 (c) The second supporting mechanism 22 supports the inner wall of the hole HP of the workpiece WP, and the first supporting mechanism 21 releases the support for the inner wall of the hole HP of the workpiece WP.

[0157] refer to Fig.11 (d) causes the second driving mechanism 40 to drive the first supporting mechanism 21 to move toward the second supporting mechanism 22 by a preset distance according to the hole HP of the workpiece WP, so as to drive the processing head 10 to retreat. The arrow in the figure shows that the front end of the processing head 10 moves backward by a preset distance.

[0158] Fig.12 (a)-(b) are schematic diagrams of the embodiment of the hole processing device disclosed in the present invention performing small-amplitude turns in different directions. Fig.12 In some embodiments, the at least two supporting mechanisms 20 include the first supporting mechanism 21 and the second supporting mechanism 22, the second supporting mechanism 22 is located on the side of the first supporting mechanism 21 away from the processing head 10, and the second driving mechanism 40 is connected between the first supporting mechanism 21 and the second supporting mechanism 22.

[0159] Accordingly, the steering feeding process includes the following steps.

[0160] The first driving mechanism 30 drives the processing head 10 to adjust the steering angle relative to the first supporting mechanism 21. Fig.12 (a) and (b) show the first driving mechanism 30 driving the machining head 10 to turn upward and downward relative to the first supporting mechanism 21.

[0161] The second supporting mechanism 22 supports the inner wall of the hole HP of the workpiece WP, and the first supporting mechanism 21 releases the support for the inner wall of the hole HP of the workpiece WP. Fig.10 In addition, this step may be performed before or after the previous step, or simultaneously with the previous step.

[0162] The second driving mechanism 40 drives the first supporting mechanism 21 to move in the opposite direction relative to the second supporting mechanism 22 by a preset distance, so as to drive the processing head 10 to process the hole according to the steering angle. Fig.10 (b).

[0163] The first supporting mechanism 21 supports the inner wall of the hole HP of the workpiece WP, and the second supporting mechanism 22 releases the support for the inner wall of the hole HP of the workpiece WP. Fig.10 (c).

[0164] The second driving mechanism 40 drives the second supporting mechanism 22 to move toward the first supporting mechanism 21 by a preset distance. Fig.10 (d).

[0165] Fig.13 (a)-(b) are schematic diagrams of the embodiment of the hole processing device disclosed in the present invention performing large-scale turning in different directions. Fig.13 In some embodiments, the steering feeding process also includes: when the second driving mechanism 40 drives the first supporting mechanism 21 to move in the opposite direction relative to the second supporting mechanism 22 by a preset distance, the relative angle between the first supporting mechanism 21 and the second supporting mechanism 22 is also adjusted.

[0166] exist Fig.13 In (a) and (b), it is shown that the second driving mechanism 40 adjusts the relative angle between the first supporting mechanism 21 and the second supporting mechanism 22 to cooperate with the upward and downward turning movements of the processing head 10 relative to the first supporting mechanism 21, so that a larger turning angle can be obtained.

[0167] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0168] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A hole processing device for processing a hole (HP) in a workpiece (WP), characterized in that: include: A machining head (10) for removing material from the workpiece (WP); At least two support mechanisms (20), each support mechanism (20) being used to support the inner wall of the hole (HP) of the workpiece (WP) or to release the support for the inner wall of the hole (HP) of the workpiece (WP), wherein the support mechanism (20) closest to the processing head (10) among the at least two support mechanisms (20) is defined as a first support mechanism (21); a first driving mechanism (30) connected between the machining head (10) and the first supporting mechanism (21), and used for driving the machining head (10) to adjust a steering angle relative to the first supporting mechanism (21); and At least one second driving mechanism (40) is connected between at least one group of two adjacent supporting mechanisms (20) among the at least two supporting mechanisms (20), and is used to drive the two adjacent supporting mechanisms (20) to move towards or in opposite directions.

2. The hole processing device according to claim 1, characterized in that: The first driving mechanism (30) is also used to drive the processing head (10) to move closer to or farther away from the first supporting mechanism (21).

3. The hole processing device according to claim 2, characterized in that: The first driving mechanism (30) comprises: a plurality of first linear drive elements (31), each of the first linear drive elements (31) having one end connected to the first support mechanism (21) and the other end rotatably connected to the processing head (10); Each first linear drive element (31) independently adjusts its own length by extending or retracting.

4. The hole processing device according to claim 3, characterized in that: At least some of the plurality of first linear drive elements (31) are configured to extend or retract different strokes so that the machining head (10) can adjust a steering angle relative to the first support mechanism (21); and / or, the plurality of first linear drive elements (31) are configured to extend or retract the same stroke so that the machining head (10) can move away from or approach the first support mechanism (21).

5. The hole processing device according to claim 1, characterized in that: The second driving mechanism (40) is also used to adjust the relative angle between the two adjacent supporting mechanisms (20).

6. The hole processing device according to claim 5, characterized in that: The second driving mechanism (40) comprises: a plurality of second linear drive elements (41), one end of each second linear drive element (41) being rotatably connected to a support mechanism (20) adjacent to the front side of the second linear drive element (41), and the other end being connected to a support mechanism (20) adjacent to the rear side of the second linear drive element (41); The lengths of the second linear drive elements (41) are adjusted independently or uniformly by extension or retraction.

7. The hole processing device according to claim 6, characterized in that: The plurality of second linear drive elements (41) are configured to retract or extend to the same stroke, so that the two adjacent support mechanisms (20) move toward or in opposite directions; and / or at least some of the plurality of second linear drive elements (41) are configured to extend or retract to different strokes, so that the plurality of second linear drive elements (41) adjust the relative angle between the two adjacent support mechanisms (20).

8. The hole processing device according to claim 1, characterized in that: The supporting mechanism (20) comprises: Support seat (201); At least two telescopic components (202) are connected to the support base (201) and arranged in a circumferential direction of the support base (201). Each telescopic assembly (202) is capable of radially extending relative to the support seat (201) so that the support mechanism (20) is supported and fixed relative to the inner wall of the hole (HP) of the workpiece (WP), and is capable of radially retracting relative to the support seat (201) so that the support mechanism (20) releases the support and fixation of the inner wall of the hole (HP) of the workpiece (WP), thereby making the support mechanism (20) movable relative to the inner wall of the hole (HP) of the workpiece (WP).

9. The hole processing device according to claim 1, characterized in that: The machining head (10) comprises a machining electrode.

10. The hole processing device according to claim 9, characterized in that: The machining electrode comprises an electric spark machining electrode or an electrochemical machining electrode.

11. The hole processing device according to claim 9, characterized in that: Also includes: A power system (50), comprising a power line (51) connected to the machining electrode, configured to provide and control electrical energy to the machining electrode; and A working fluid circulation system (60) comprises a working fluid pipeline (61) connected to the machining electrode and configured to achieve continuous circulation of the working fluid relative to the machining electrode. The machining electrode comprises a liquid outlet (11) and a liquid return port (12); the liquid outlet (11) is in communication with the working liquid pipeline (61) so that the machining electrode discharges the working liquid outward through the liquid outlet (11); and the liquid return port (12) is in communication with the working liquid pipeline (61) so that the machining electrode recovers the working liquid through the liquid return port (12).

12. The hole processing device according to claim 11, characterized in that: The working fluid pipeline (61) and the power line (51) pass through the hollow areas of the at least two supporting mechanisms (20), the first driving mechanism (30) and at least one second driving mechanism (40).

13. The hole processing device according to claim 1, characterized in that: Also includes: A controller (70) is signal-connected to the at least two supporting mechanisms (20), the first driving mechanism (30) and the at least one second driving mechanism (40), and is configured to achieve processing of at least one of a straight channel section, a curved channel section and a bifurcated channel section of the workpiece (WP) through the cooperation of the at least two supporting mechanisms (20), the first driving mechanism (30) and the at least one second driving mechanism (40).

14. A method for processing a hole according to the hole processing device of any one of claims 1 to 13, characterized in that: include: Through the cooperation of the at least two supporting mechanisms (20), the first driving mechanism (30) and the at least one second driving mechanism (40), processing of at least one of a straight channel section, a curved channel section and a bifurcated channel section of the workpiece (WP) is achieved.

15. The hole processing method according to claim 14, characterized in that: The processing of the straight channel section of the workpiece (WP) includes at least one straight feed process of the processing head (10); and / or, the processing of the curved channel section of the workpiece (WP) includes at least one turning feed process of the processing head (10); and / or, the processing of the bifurcated channel section of the workpiece (WP) includes at least one retraction process and at least one turning feed process of the processing head (10).

16. The hole processing method according to claim 15, characterized in that: The at least two support mechanisms (20) include the first support mechanism (21) and the second support mechanism (22), the second support mechanism (22) is located on a side of the first support mechanism (21) away from the processing head (10), and the second drive mechanism (40) is connected between the first support mechanism (21) and the second support mechanism (22); Wherein, the linear feeding process includes: The second supporting mechanism (22) supports the inner wall of the hole (HP) of the workpiece (WP), and the first supporting mechanism (21) releases the support for the inner wall of the hole (HP) of the workpiece (WP); The second driving mechanism (40) drives the first supporting mechanism (21) to move in the opposite direction relative to the second supporting mechanism (22) by a preset distance, so as to drive the processing head (10) to move forward to process the hole; The first supporting mechanism (21) supports the inner wall of the hole (HP) of the workpiece (WP), and the second supporting mechanism (22) releases the support for the inner wall of the hole (HP) of the workpiece (WP); The second driving mechanism (40) drives the second supporting mechanism (22) to move a preset distance toward the second supporting mechanism (22).

17. The hole processing method according to claim 15, characterized in that: The at least two support mechanisms (20) include the first support mechanism (21) and the second support mechanism (22), the second support mechanism (22) is located on a side of the first support mechanism (21) away from the processing head (10), and the second drive mechanism (40) is connected between the first support mechanism (21) and the second support mechanism (22); Wherein, the steering feeding process includes: enabling the first driving mechanism (30) to drive the processing head (10) to adjust a steering angle relative to the first supporting mechanism (21); The second supporting mechanism (22) supports the inner wall of the hole (HP) of the workpiece (WP), and the first supporting mechanism (21) releases the support for the inner wall of the hole (HP) of the workpiece (WP); The second driving mechanism (40) drives the first supporting mechanism (21) to move in the opposite direction relative to the second supporting mechanism (22) by a preset distance, so as to drive the processing head (10) to process the hole according to the steering angle; The first supporting mechanism (21) supports the inner wall of the hole (HP) of the workpiece (WP), and the second supporting mechanism (22) releases the support for the inner wall of the hole (HP) of the workpiece (WP); The second driving mechanism (40) drives the second supporting mechanism (22) to move a preset distance toward the first supporting mechanism (21).

18. The hole processing method according to claim 17, characterized in that: The steering feeding process also includes: When the second driving mechanism (40) drives the first supporting mechanism (21) to move in the opposite direction by a preset distance relative to the second supporting mechanism (22), the relative angle between the first supporting mechanism (21) and the second supporting mechanism (22) is also adjusted.

19. The hole processing method according to claim 15, characterized in that: The at least two support mechanisms (20) include the first support mechanism (21) and the second support mechanism (22), the second support mechanism (22) is located on a side of the first support mechanism (21) away from the processing head (10), and the second drive mechanism (40) is connected between the first support mechanism (21) and the second support mechanism (22); The return process includes: The first supporting mechanism (21) supports the inner wall of the hole (HP) of the workpiece (WP), and the second supporting mechanism (22) releases the support for the inner wall of the hole (HP) of the workpiece (WP); The second driving mechanism (40) drives the second supporting mechanism (22) to move in the opposite direction relative to the first supporting mechanism (21) by a preset distance according to the hole (HP) of the workpiece (WP); The second supporting mechanism (22) supports the inner wall of the hole (HP) of the workpiece (WP), and the first supporting mechanism (21) releases the support for the inner wall of the hole (HP) of the workpiece (WP); The second driving mechanism (40) drives the first supporting mechanism (21) to move a preset distance toward the second supporting mechanism (22) according to the hole (HP) of the workpiece (WP), so as to drive the processing head (10) to retreat.

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