Integrated circuit chip protection system and method

Abstract

The invention belongs to the technical field of integrated circuits, and particularly relates to an integrated circuit chip protection system and method. According to the integrated circuit chip protection system and method, an integrated circuit chip enters a stage needing to be protected, the protection system is firstly started to prepare for state detection and environment control, the system comprehensively checks the state of the chip through an integrated sensor or external detection equipment, and based on the result of state detection, the chip is protected. The system automatically adjusts the environmental condition of the chip or according to a preset rule, on the basis of environmental control, the system can also implement a series of specific protection measures, the system can continuously monitor the state of the chip and the effect of the protection measures, and once an abnormal condition is found, the system automatically adjusts the chip or adjusts the chip according to a user instruction. By adjusting environment control parameters, replacing damaged protection equipment and other remedial measures, the safety and reliability of the integrated circuit chip are better guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to an integrated circuit chip protection system and method. Background Art

[0002] With the rapid development of information technology, the complexity and integration of integrated circuit chips are constantly improving. Modern chips integrate a large number of transistors, logic gates and other electronic components, making the functions of chips increasingly powerful, but also bringing more potential security risks.

[0003] At present, in order to realize an integrated circuit chip protection system and method with the advantages of preventive protection, targeted protection, dynamic monitoring and adjustment, improving chip reliability and life, reducing costs and improving efficiency, we propose an integrated circuit chip protection system and method. Summary of the invention

[0004] The main purpose of the present invention is to provide an integrated circuit chip protection system and method, which can solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the method for using the integrated circuit chip protection system proposed by the present invention comprises the following steps: S1, Start: Identifies the starting point of the protection system; S2. Chip status detection: detect the status of the integrated circuit chip, including whether it is damaged or contaminated; S3, Environmental control: According to the test results, adjust the storage or working environment, such as temperature, humidity, etc., to ensure that the chip is not damaged; S4. Implementation of protective measures: Implement specific protective measures according to the needs of environmental control, such as using anti-static packaging, controlling air circulation, etc.; S5, monitoring and adjustment: continuously monitor the status of the chip and the effectiveness of the protection measures, and make adjustments when necessary; S6, End: marks the end point of the protection process.

[0006] At the beginning, the chip starts up, obtains historical attack information, and then detects the trigger conditions. If the trigger conditions are met, it enters the safe mode; if not, the chip runs in the normal mode. In the chip status detection phase, the chip status detection process is started, and then initialized and configured. The chip is initialized and the test environment is set up to ensure that the temperature, humidity, static electricity and other conditions of the test environment meet the test requirements. The chip appearance is checked through visual inspection, and then the electrical connection is checked. Pre-testing and configuration are then carried out, and functional testing, performance testing, and reliability testing are performed. Finally, failure analysis and recording are carried out, and the results are evaluated and feedback is received. According to the test results, corresponding improvements and optimizations are made.

[0007] In the environmental control phase, we start with environmental assessment and planning, then formulate environmental control standards, select and install equipment, conduct environmental monitoring and adjustment, conduct personnel training and operating specifications, and formulate emergency response and prevention measures; The protection measures implementation phase triggers the implementation of protection measures, conducts risk identification and assessment, selects protection measures, implements protection measures, and finally conducts verification and testing, coupled with continuous optimization and improvement, to complete the implementation of protection measures; In the monitoring and adjustment phase, monitoring begins, the monitoring function of the chip protection system is activated, data collection is performed, the collected data is processed and analyzed, status judgment is made, adjustment measures are formulated, adjustment measures are implemented, and finally, effect evaluation, recording and reporting are performed. Based on the requirements of the monitoring task and the actual situation, a decision is made to end the current monitoring cycle or continue continuous monitoring.

[0008] Preferably, at the start of the chip, the system accesses the non-volatile storage unit inside the chip to read the previously recorded historical attack information therefrom. The data stored in the non-volatile storage unit EEPROM remains unchanged after the device is powered off, and is suitable for storing data that needs to be preserved for a long time, such as configuration parameters, calibration data or historical attack information. Compared with EPROM, EEPROM can be erased and rewritten by electrical signals, and the operation is more convenient. When the chip starts, the system will access the storage unit in the EEPROM to read the previously recorded historical attack information to help the system evaluate the security status of the chip.

[0009] Preferably, historical attack information is captured and stored through a security monitoring mechanism to assess the security risks currently faced by the chip. The chip protection system performs security analysis on the historical attack information. The security policy includes the upper limit of the number of attacks, the sensitivity of specific attack types, and the limitation of the attack time window. The system will analyze the acquired historical attack information according to the preset security policy and security threshold. If the historical attack information meets or exceeds these preset trigger conditions, the system will consider the chip to be in a high-risk state. Based on the detection results, the system will make a decision on whether to enter the safe mode. If the trigger conditions are met, the system will start the safe mode to reduce the security risk by limiting some functions of the chip or performing specific security operations. If the trigger conditions are not met, the chip will continue to run in normal mode.

[0010] Preferably, the electrical connection check in the chip status detection stage includes probe contact and connection test. The probe contact ensures normal electrical connection by contacting the pads or pins on the chip with the probe. The connection test verifies whether the connection between the chip and the external circuit is stable and reliable through a simple electrical connection test.

[0011] Preferably, the performance test in the chip status detection phase includes measuring performance parameters, speed testing, throughput testing and signal integrity testing. The measuring performance parameters are used to measure the key performance parameters of the chip. The speed test is used to evaluate the processing speed of the chip. The throughput test is used to test the data processing capability of the chip. The signal integrity test is used to check the integrity and stability of the chip signal transmission.

[0012] Preferably, the environmental control standards established in the environmental control stage include air cleanliness level, temperature and humidity range, and electrostatic protection requirements. The air cleanliness level is an important indicator for evaluating the concentration of particulate matter in the air, which is particularly critical for the production environment of integrated circuit chips. The commonly used international standard is ISO 14644, in which the clean room levels are ISO 1 to ISO 9 from high to low. In semiconductor chip production, commonly used clean room levels include level ten. The optimal temperature for chip storage should be between 0°C and 10°C, and the humidity should be maintained at a relative humidity of no more than 60%. The anti-static ability of the chip is enhanced by designing ESD protection circuits or using ESD protection devices, thereby reducing the probability of ESD damage to electronic devices.

[0013] Preferably, the protection measures implemented include electrostatic discharge protection, surge overcurrent protection, overcurrent protection, overvoltage protection, reverse polarity protection, temperature protection and packaging protection. Electrostatic discharge protection uses ESD protection devices to absorb and disperse electrostatic discharge energy. Surge overcurrent protection uses TVS protection devices to prevent circuit surge overcurrent damage. Overcurrent protection uses fuses, fuses, current limiters and other devices to limit the current in the electrical circuit. Overvoltage protection uses overvoltage protection devices to prevent damage caused by excessive voltage. Reverse polarity protection uses diodes or reverse polarity protection circuits to prevent reverse polarity connection. Temperature protection uses temperature sensors and protection circuits to monitor and adjust the chip temperature. Packaging protection adopts a suitable packaging method to seal the chip in a protective casing to prevent mechanical impact or contamination.

[0014] Preferably, the data acquisition for monitoring and adjustment collects key parameters of the chip during operation, such as temperature, voltage, current, power consumption and frequency, in real time. The temperature data of the chip during operation is collected in real time through the temperature sensor integrated inside the chip. When the chip temperature is monitored to exceed the preset safety threshold, the system can reduce the chip operating frequency and increase heat dissipation measures to reduce the temperature and prevent the chip from overheating.

[0015] The present invention proposes an integrated circuit chip protection system, including packaging protection, anti-electrostatic discharge (ESD) protection, overvoltage and overcurrent protection, temperature protection, security authentication and data encryption, redundant design and fault-tolerant mechanism, and anti-tampering and authority management. The packaging protection adopts a sealed packaging technology to isolate the chip from the external environment to prevent physical tampering, moisture, dust and other external factors from invading. For overvoltage and overcurrent protection, a voltage limiting and current limiting circuit is designed inside or outside the chip. When the power supply voltage or current exceeds the set threshold, the power supply is automatically cut off or the current is limited to prevent the chip from being damaged due to overvoltage or overcurrent. The temperature protection adopts thermal shutdown protection and heat dissipation design. Security authentication and data encryption use encryption algorithms for security authentication to ensure the identity of both parties in communication and the security of data transmission. Sensitive data stored on the chip is encrypted to prevent data leakage or illegal reading. Redundant design and fault-tolerant mechanism prevent errors from spreading and causing chip failure.

[0016] Preferably, the anti-electrostatic discharge (ESD) protection integrates an ESD clamp protection circuit inside the chip. When the chip pins are impacted by electrostatic discharge, the circuit can quickly discharge the electrostatic charge to the ground. The circuit adopts new processes and circuit structures such as Silicide-Block technology to improve the ESD resistance of a single input and output unit.

[0017] The present invention provides an integrated circuit chip protection system and method. It has the following beneficial effects: (1) The integrated circuit chip protection system and method have a chip status detection step set up. The electrical connection check in the chip status detection stage includes probe contact and connection test. The probe contact ensures that the electrical connection is normal by contacting the pads or pins on the chip with the probe. The connection test verifies whether the connection between the chip and the external circuit is stable and reliable through a simple electrical connection test. The performance parameter measurement is used to measure the key performance parameters of the chip. The speed test evaluates the processing speed of the chip. The throughput test tests the data processing capability of the chip. The signal integrity test checks the integrity and stability of the chip signal transmission. It can timely discover possible damage or contamination problems of the chip, so as to take preventive measures to avoid further expansion of the problem.

[0018] (2) The integrated circuit chip protection system and method are implemented by setting up protection measures. For electrostatic discharge protection, ESD protection devices are used to absorb and disperse electrostatic discharge energy. For surge overcurrent protection, TVS protection devices are used to prevent circuit surge overcurrent damage. For overcurrent protection, fuses, fuses, current limiters and other devices are used to limit the current in the electrical circuit. For overvoltage protection, overvoltage protection devices are used to prevent damage caused by excessive voltage. For reverse polarity protection, diodes or reverse polarity protection circuits are used to prevent reverse polarity connection. For temperature protection, temperature sensors and protection circuits are used to monitor and adjust chip temperature. For packaging protection, a suitable packaging method is used to seal the chip in a protective housing to prevent mechanical impact or contamination.

[0019] (3) The integrated circuit chip protection system and method includes multiple aspects, including packaging protection, anti-electrostatic discharge (ESD) protection, overvoltage and overcurrent protection, temperature protection, security authentication and data encryption, redundant design and fault-tolerant mechanism, and anti-tampering and authority management. These protection measures work together to provide all-round protection for the integrated circuit chip, ensuring its stable operation in various complex environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the integrated circuit chip protection method of the present invention; Figure 2 This is a schematic diagram of the process of the starting link of the present invention; Figure 3 This is a schematic diagram of the chip status detection process of the present invention; Figure 4 This is a schematic diagram of the environmental control process of the present invention; Figure 5 This is a flow chart of the monitoring and adjustment process of the present invention; Figure 6 It is a schematic diagram of the structure of the circuit chip protection system of the present invention.

[0022] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] See also Figure 1-6 The present invention provides a method for using an integrated circuit chip protection system, the protection method comprising the following steps: S1, Start: Identifies the starting point of the protection system; S2. Chip status detection: detect the status of the integrated circuit chip, including whether it is damaged or contaminated; S3, Environmental control: According to the test results, adjust the storage or working environment, such as temperature, humidity, etc., to ensure that the chip is not damaged; S4. Implementation of protective measures: Implement specific protective measures according to the needs of environmental control, such as using anti-static packaging, controlling air circulation, etc.; S5, monitoring and adjustment: continuously monitor the status of the chip and the effectiveness of the protection measures, and make adjustments when necessary; S6, End: marks the end point of the protection process.

[0025] At the beginning, the chip starts up, obtains historical attack information, and then detects the trigger conditions. If the trigger conditions are met, it enters the safe mode; if not, the chip runs in the normal mode. In the chip status detection phase, the chip status detection process is started, and then initialized and configured. The chip is initialized and the test environment is set up to ensure that the temperature, humidity, static electricity and other conditions of the test environment meet the test requirements. The chip appearance is checked through visual inspection, and then the electrical connection is checked. Pre-testing and configuration are then carried out, and functional testing, performance testing, and reliability testing are performed. Finally, failure analysis and recording are carried out, and the results are evaluated and feedback is received. According to the test results, corresponding improvements and optimizations are made.

[0026] In the environmental control phase, we start with environmental assessment and planning, then formulate environmental control standards, select and install equipment, conduct environmental monitoring and adjustment, conduct personnel training and operating specifications, and formulate emergency response and prevention measures; The protection measures implementation phase triggers the implementation of protection measures, conducts risk identification and assessment, selects protection measures, implements protection measures, and finally conducts verification and testing, coupled with continuous optimization and improvement, to complete the implementation of protection measures; In the monitoring and adjustment phase, monitoring begins, the monitoring function of the chip protection system is activated, data collection is performed, the collected data is processed and analyzed, status judgment is made, adjustment measures are formulated, adjustment measures are implemented, and finally, effect evaluation, recording and reporting are performed. Based on the requirements of the monitoring task and the actual situation, a decision is made to end the current monitoring cycle or continue continuous monitoring.

[0027] In the embodiment of the present invention, in order to realize the specific implementation of the integrated circuit chip protection method, specifically, at the beginning of the chip, the system accesses the non-volatile storage unit inside the chip to read the previously recorded historical attack information from it. The non-volatile storage unit EEPROM remains unchanged after the device is powered off, which is suitable for storing data that needs to be stored for a long time, such as configuration parameters, calibration data or historical attack information. Compared with EPROM, EEPROM can be erased and rewritten by electrical signals, and the operation is more convenient. When the chip starts, the system will access the storage unit in the EEPROM to read the previously recorded historical attack information to help the system evaluate the security status of the chip. The historical attack information is captured and stored through the security monitoring mechanism to evaluate the security risks faced by the current chip. The chip protection system performs security analysis on the historical attack information. The security strategy includes the upper limit of the number of attacks, the sensitivity of a specific attack type, and the limitation of the attack time window. The system will analyze the acquired historical attack information according to the preset security strategy and security threshold. These. If the historical attack information meets or exceeds these preset trigger conditions, the system will consider that the chip is currently in a high-risk state. According to the detection results, the system will make a decision whether to enter the safe mode. If the trigger conditions are met, the system will start the safety mode to reduce security risks by limiting some functions of the chip or performing specific safety operations. If the trigger conditions are not met, the chip will continue to run in normal mode. The electrical connection check in the chip status detection phase includes probe contact and connection test. The probe contact ensures that the electrical connection is normal by contacting the pads or pins on the chip with the probe. The connection test verifies whether the connection between the chip and the external circuit is stable and reliable through a simple electrical connection test. The performance test in the chip status detection phase includes measuring performance parameters, speed test, throughput test and signal integrity test. The measurement of performance parameters is used to measure the key performance parameters of the chip. The speed test evaluates the processing speed of the chip. The throughput test tests the data processing capability of the chip. The signal integrity test checks the integrity and stability of the chip signal transmission. The environmental control stage establishes environmental control standards including air cleanliness level, temperature and humidity range, and electrostatic protection requirements. The air cleanliness level is an important indicator for evaluating the concentration of particulate matter in the air, which is particularly critical for the production environment of integrated circuit chips. The internationally commonly used standard is ISO 14644, in which the clean room levels are from ISO 1 to ISO 14644 from high to low. Level 9. In semiconductor chip production, commonly used clean room levels include Level 10. The optimal temperature for chip storage should be between 0°C and 10°C, and the humidity should be kept at a relative humidity of no more than 60%. The anti-static ability of the chip can be enhanced by designing ESD protection circuits or using ESD protection devices. The probability of ESD damaging electronic devices can be reduced by the above.Selection of protection measures for implementation Protection measures include electrostatic discharge protection, surge overcurrent protection, overcurrent protection, overvoltage protection, reverse polarity protection, temperature protection and packaging protection. Electrostatic discharge protection uses ESD protection devices to absorb and disperse electrostatic discharge energy. Surge overcurrent protection uses TVS protection devices to prevent circuit surge overcurrent damage. Overcurrent protection uses fuses, fuses, current limiters and other devices to limit the current in the electrical circuit. Overvoltage protection uses overvoltage protection devices to prevent damage caused by excessive voltage. Reverse polarity protection uses diodes or reverse polarity protection circuits to prevent reverse polarity connection. Temperature protection uses temperature sensors and protection circuits to monitor and adjust chip temperature. Package protection uses appropriate packaging methods to seal the chip in a protective casing to prevent mechanical impact or contamination. Monitoring and adjustment data acquisition collects key parameters in real time during chip operation, such as Temperature, voltage, current, power consumption and frequency. The temperature sensor integrated inside the chip collects the temperature data of the chip in real time when it is running. When the chip temperature is detected to exceed the preset safety threshold, the system can reduce the chip operating frequency and increase heat dissipation measures to reduce the temperature and prevent the chip from overheating. Then use the analog-to-digital converter (ADC) to convert the chip power supply voltage into a digital signal for monitoring in real time. When the voltage is abnormal, the system can adjust the output voltage of the power management circuit to ensure that the chip obtains a stable power supply voltage. Use (ADC) again to collect the current data of the chip in real time when it is working. When the current is abnormal, the system takes measures such as shutting down some non-critical circuits and reducing the chip operating frequency to prevent chip damage. When the chip's operating speed needs to be adjusted, the system can adjust the input frequency of the clock circuit or change the chip's operating mode to achieve this.

[0028] The present invention proposes an integrated circuit chip protection system. Specifically, it provides all-round protection for the integrated circuit chip to ensure that it can run stably in various complex environments. The integrated circuit chip protection system includes packaging protection, anti-electrostatic discharge (ESD) protection, overvoltage and overcurrent protection, temperature protection, security authentication and data encryption, redundant design and fault-tolerant mechanism, anti-tampering and authority management. The packaging protection adopts a sealed packaging technology to isolate the chip from the external environment to prevent physical tampering, moisture, dust and other external factors from invading, and can also improve the chip's anti-electrostatic discharge (ESD) capability. The anti-electrostatic discharge (ESD) protection integrates an ESD clamping protection circuit inside the chip. When the chip pin is impacted by electrostatic discharge, the circuit can quickly discharge the electrostatic charge to the ground. The circuit adopts new processes and circuit structures such as Silicide-Block technology to improve the ESD resistance of a single input and output unit. For overvoltage and overcurrent protection, a voltage limiting and current limiting circuit is designed inside or outside the chip. When the power supply voltage or current exceeds the set threshold, the power supply is automatically cut off or the current is limited to prevent the chip from being damaged due to overvoltage or overcurrent. The temperature protection adopts thermal shutdown protection and heat dissipation design, and integrates thermal shutdown protection circuit. When the chip temperature exceeds the set threshold, it automatically cuts off the power supply or reduces the power consumption to prevent the chip from being damaged due to overheating. Heat sinks, fans and other heat dissipation components are used to ensure that the chip can maintain a stable temperature under long-term high-load work. Security authentication and data encryption use encryption algorithms for security authentication to ensure the identity of both parties in communication and the security of data transmission. Sensitive data stored on the chip is encrypted to prevent data leakage or illegal reading. Redundancy design and fault-tolerant mechanism adopt redundant design technology, such as dual-channel power supply and dual-chip backup, to ensure that the chip can still work normally when part of the circuit is damaged. Fault-tolerant mechanism is designed. When an error occurs inside the chip, it can automatically detect and correct the error, and take other remedial measures to prevent the error from spreading and causing chip failure. Anti-tampering and permission management integrates anti-tampering sensors. Once the chip is illegally opened or tampered with, the sensor will be triggered and cause the chip data to self-destruct or fail. Different permission levels are set for different users and operations to limit access to key parts of the chip to prevent unauthorized operations from causing chip damage or data leakage.

[0029] During use, when the integrated circuit chip enters the stage where protection is required, the protection system is first started. The startup process includes loading preset protection parameters, initializing sensors and monitoring equipment, etc., in preparation for status detection and environmental control. The system conducts a comprehensive inspection of the chip status through integrated sensors or external detection equipment, and promptly discovers any potential problems that may affect the performance or life of the chip. Based on the results of the status detection, the system will automatically or according to preset rules adjust the environmental conditions of the chip to provide a stable environment that is conducive to the long-term storage and operation of the chip. On the basis of environmental control, the system will also implement a series of specific protection measures to further enhance the chip's ability to resist damage. The system will continue to monitor the chip status and the effectiveness of the protection measures. Once an abnormal situation is found (such as environmental parameters exceeding the safety range, chip performance degradation, etc.), the system will automatically or according to user instructions Adjust by adjusting environmental control parameters, replacing damaged protection equipment and other remedial measures. During the entire protection process, the system will also collect and analyze data to evaluate the protection effect and optimize the protection strategy, so as to better ensure the safety and reliability of the integrated circuit chip.

[0030] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for using an integrated circuit chip protection system, characterized in that: The following steps are involved: S1, Start: Identifies the starting point of the protection system; S2. Chip status detection: detect the status of the integrated circuit chip, including whether it is damaged or contaminated; S3, Environmental control: According to the test results, adjust the storage or working environment, such as temperature, humidity, etc., to ensure that the chip is not damaged; S4. Implementation of protective measures: Implement specific protective measures according to the needs of environmental control, such as using anti-static packaging, controlling air circulation, etc.; S5, monitoring and adjustment: continuously monitor the status of the chip and the effectiveness of the protection measures, and make adjustments when necessary; S6, End: marks the end point of the protection process.

2. The method for using the integrated circuit chip protection system according to claim 1, characterized in that: At the beginning of the chip, the system accesses the non-volatile storage unit inside the chip and reads the previously recorded historical attack information from it.

3. The method for using the integrated circuit chip protection system according to claim 2, characterized in that: Historical attack information is captured and stored through a security monitoring mechanism and is used to assess the security risks currently faced by the chip. The chip protection system performs security analysis on historical attack information. The security strategy includes an upper limit on the number of attacks, sensitivity to specific attack types, and limitations on attack time windows.

4. The method for using the integrated circuit chip protection system according to claim 1, characterized in that: The electrical connection check during the chip status detection phase includes probe contact and connection testing.

5. The method for using the integrated circuit chip protection system according to claim 1, characterized in that: The performance tests in the chip status detection phase include measuring performance parameters, speed testing, throughput testing and signal integrity testing.

6. The method for using the integrated circuit chip protection system according to claim 1, characterized in that: The environmental control standards established during the environmental control stage include air cleanliness level, temperature and humidity range, and electrostatic protection requirements.

7. The method for using the integrated circuit chip protection system according to claim 1, characterized in that: The protection measures include electrostatic discharge protection, surge protection, overcurrent protection, overvoltage protection, reverse polarity protection, temperature protection and packaging protection.

8. The method for using the integrated circuit chip protection system according to claim 1, characterized in that: The data acquisition for monitoring and adjustment collects key parameters of the chip operation process in real time, such as temperature, voltage, current, power consumption and frequency.

9. An integrated circuit chip protection system according to any one of claims 1 to 8, characterized in that: The components of an integrated circuit chip protection system include package protection, anti-electrostatic discharge (ESD) protection, overvoltage and overcurrent protection, temperature protection, security authentication and data encryption, redundant design and fault tolerance mechanism, and anti-tampering and permission management.

10. The integrated circuit chip protection system according to claim 9, characterized in that: Anti-electrostatic discharge (ESD) protection The chip integrates an ESD clamp protection circuit inside the chip. When the chip pins are impacted by electrostatic discharge, the circuit can quickly discharge the electrostatic charge to the ground.

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