Solder wire processing and forming device and forming method

Abstract

The invention relates to the technical field of tin wire machining, in particular to a tin wire machining forming device and method. The method comprises the steps that the actual temperature of each area of a heating plate in the solder wire machining process is obtained; whether the heating temperature of the heating plate is adjusted or not is judged according to the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature; if the temperature is adjusted, the difference between the actual temperature and the preset optimal fusion temperature and the heating temperature are combined, and the temperature to be adjusted is obtained and adjusted; integrating the temperature distribution condition of each image block in the infrared image of the tin liquid surface, the discrete condition of the actual temperature of different areas of the heating plate and the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box to obtain a tin liquid temperature overall uniform value, and then judging whether the temperature meets the requirement or not; if not, continuously adjusting the heating temperature of the heating plate. Intelligent adjustment of the temperature of the tin liquid in the tin wire machining process is achieved, and the machining quality of the tin wire is improved.

Description

Technical Field

[0001] The invention relates to the technical field of solder wire processing, and in particular to a solder wire processing and molding device and a molding method. Background Art

[0002] Solder wire is a hardware material used for electronic welding, mainly composed of tin alloy and additives. It has a wide range of applications in electronic manufacturing, home appliance repair, automobile manufacturing and other fields. Solder wire is usually used for welding electronic components, such as resistors, capacitors, integrated circuits, etc., which can effectively achieve lossless connection between components and ensure the stability and performance of the equipment.

[0003] The existing utility model patent with publication number CN217991218U provides a tin melting furnace structure for solder wire, which is used for preparing molten tin so that the molten tin flows into a casting trough; however, the device has the following problems: the heating of the molten tin by the heating tube is affected by the position, and the temperature of the molten tin at different positions and heights is inconsistent, resulting in a large difference in the temperature of the molten tin used for casting, resulting in poor quality of the obtained tin wire, reducing the strength and toughness of the solder wire, and causing deformation. Summary of the invention

[0004] In order to solve the problem that the temperature of different positions of the existing solder wire melting furnace structure is inconsistent during the solder wire processing and forming process, which affects the quality of the formed solder wire, the purpose of the present invention is to provide a solder wire processing and forming device and a forming method, and the technical scheme adopted is as follows: In a first aspect, the present invention provides a method for processing and forming a solder wire, the method comprising the following steps: Obtain the heating temperature of the heating plate and the actual temperature of each area during solder wire processing; Determine whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature; if adjusted, obtain the temperature to be adjusted of the heating plate in combination with the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature and the heating temperature, and adjust the temperature; Acquire an infrared image of the tin liquid surface, and obtain a tin liquid temperature consistency index for each image block based on the temperature distribution of each image block in the infrared image; comprehensively consider the discreteness of the actual temperature in different areas of the heating plate, the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box, and the tin liquid temperature consistency index, and obtain the overall uniform value of the tin liquid temperature; The overall uniform value of the tin liquid temperature is used to determine whether the temperature meets the requirements. If not, the heating temperature of the heating plate is further adjusted.

[0005] Preferably, judging whether the temperature meets the requirements by using the overall uniform value of the tin liquid temperature includes: If the overall average value of the tin liquid temperature is greater than a preset consistency threshold, it is determined that the temperature meets the requirements; If the overall average value of the tin liquid temperature is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements.

[0006] Preferably, judging whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature includes: Calculating the difference between the actual temperature of the candidate area and the preset optimal fusion temperature; determining the ratio of the absolute value of the difference to the preset optimal fusion temperature as the difference factor of the candidate area; the candidate area is any area of ​​the heating plate; If the difference factors of all regions of the heating plate are smaller than the preset difference threshold, the heating temperature of the candidate region is not adjusted; otherwise, the heating temperature of the heating plate is adjusted.

[0007] Preferably, the temperature to be adjusted of the heating plate is obtained by combining the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature and the heating temperature, including: The product of the preset temperature adjustment factor and the difference is calculated, and the difference between the heating temperature of the heating plate and the product is determined as the temperature to be adjusted of the heating plate.

[0008] Preferably, the step of obtaining a consistent index of the molten tin temperature of each image block based on the temperature distribution of each image block in the infrared image includes: Performing curve fitting on the temperature values ​​of all pixels in the image block to be analyzed to obtain a fitting curve, wherein the abscissa of the fitting curve is the order of the pixels and the ordinate is the temperature value; the area enclosed by the curve segment in the neighborhood of the maximum value of the fitting curve and the abscissa is taken as the consistent index of the tin liquid temperature of the image block to be analyzed; The image block to be analyzed is any image block in the infrared image.

[0009] Preferably, the discreteness of the actual temperature of different areas of the comprehensive heating plate, the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box, and the tin liquid temperature consistency index are used to obtain the overall uniform value of the tin liquid temperature, including: Counting the number of pixel points corresponding to each temperature value in each image block in the infrared image, and taking the temperature value corresponding to the maximum value of the number as the target temperature value of the corresponding image block; A temperature similarity index is obtained according to the overall temperature distribution difference of all pixels in every two image blocks in the infrared image, the sum of the tin liquid temperature consistency index of every two image blocks and the difference of the target temperature value of every two image blocks, wherein the overall temperature distribution difference and the difference of the target temperature values ​​of the two image blocks are both negatively correlated with the temperature similarity index, and the sum is positively correlated with the temperature similarity index; According to the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box, the discrete degree of the actual temperature in different areas of the heating plate and the temperature similarity index, the overall uniform value of the tin liquid temperature is obtained, the overall difference and the discrete degree are negatively correlated with the overall uniform value of the tin liquid temperature, and the temperature similarity index is positively correlated with the overall uniform value of the tin liquid temperature.

[0010] Preferably, obtaining the overall temperature distribution difference of pixels in every two image blocks includes: The DTW distance between the temperature sequences corresponding to the two image blocks is taken as the overall temperature distribution difference of the pixels in the two image blocks, and the temperature sequence is composed of the temperature values ​​of all the pixels in the image blocks.

[0011] Preferably, before continuing to adjust the heating temperature of the heating plate, the method further includes: Stir the tin solution and let it stand for a preset time; Obtain a new infrared image of the tin liquid surface, and obtain a new tin liquid temperature consistency index between each two image blocks based on the temperature distribution of each two image blocks in the new infrared image; obtain a new actual temperature of each area of ​​the heating plate; comprehensively consider the discrete conditions of the new actual temperatures of different areas of the heating plate, the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box, and the new tin liquid temperature consistency index, and obtain a new overall uniform value of the tin liquid temperature; If the overall average value of the new tin liquid temperature is greater than the preset consistency threshold, it is determined that the temperature meets the requirements; If the overall average value of the new tin liquid temperature is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements.

[0012] Preferably, obtaining the stirring frequency when the tin liquid is stirred includes: The difference between the constant 1 and the new overall average value of the tin liquid temperature is used as the adjustment coefficient, and the product of the adjustment coefficient and the preset maximum stirring frequency of the tin liquid is determined as the stirring frequency.

[0013] In a second aspect, the present invention provides a solder wire processing and forming device, the device comprising a heating plate, a stirring component, a thermal imager, a temperature acquisition module and a control center, the heating plate being used to heat the tin liquid, the stirring component being used to stir the tin liquid, the thermal imager being used to collect infrared images of the tin liquid surface, the temperature acquisition module being used to collect the actual temperature of each area of ​​the heating plate (120) during the solder wire processing process, and the control center being used to convert the calculation results into instructions and make corresponding adjustments.

[0014] The present invention has at least the following beneficial effects: The present invention first collects the actual temperature of each area of ​​the heating plate during the solder wire processing. Since there is a certain difference between the heating temperature and the actual temperature during the heating of the molten tin, and there is also a certain difference between the actual temperatures of different areas, the uneven temperature of the molten tin affects the forming of the solder wire during the casting process and the quality of the solder wire. Therefore, the present invention first determines whether the heating temperature of the heating plate needs to be adjusted according to the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature. If adjustment is required, the temperature to be adjusted is obtained and adjusted in combination with the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature and the heating temperature; based on the infrared image of the molten tin surface The temperature distribution of each two image blocks in the image, the discreteness of the actual temperature of different areas of the heating plate, and the overall difference in the temperature distribution of the tin liquid at the bottom of the tin box and the top of the tin box are used to evaluate the uniformity of the overall temperature of the tin liquid, and the overall uniform value of the tin liquid temperature is obtained. The overall uniform value of the tin liquid temperature is further used to judge whether the temperature meets the requirements, that is, whether it needs to be adjusted, thereby ensuring the temperature consistency at different positions during the heating process of the tin liquid. The present invention takes into account the uniformity of the tin liquid temperature during the preparation process of the tin liquid, prevents the quality of the solder wire due to the uneven temperature of the prepared tin liquid, realizes the intelligent control of the heating temperature of the tin liquid, and can improve the processing quality of the solder wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 An internal mechanical structure diagram of a solder wire processing and forming device provided by an embodiment of the present invention; Figure 2 A cross-sectional view of a solder wire processing and forming device provided by an embodiment of the present invention; Figure 3 A flow chart of a solder wire processing and forming method provided by an embodiment of the present invention; Among them, 120 is a heating plate; 610 is a stirring assembly; 620 is a thermal imager; and 630 is a through-hole valve. DETAILED DESCRIPTION

[0017] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, a solder wire processing and forming device and forming method proposed in accordance with the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0018] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0019] The specific scheme of a solder wire processing and forming device and forming method provided by the present invention is described in detail below with reference to the accompanying drawings.

[0020] An embodiment of a solder wire processing and forming device: This embodiment provides a solder wire processing and forming device, such as Figure 1 and Figure 2 As shown, Figure 1 A cross-sectional view of the internal mechanical structure of a solder wire processing and forming device is shown. Figure 2 A cross-sectional view of a solder wire processing and forming device is shown.

[0021] The solder wire processing and forming device proposed in this embodiment is an improvement on the existing solder wire melting furnace structure (publication number CN217991218U). The newly added components of the solder wire processing and forming device in this embodiment include: a control center, a heating plate 120, a thermal imager 620, a stirring assembly 610, a through-hole valve 630 and a temperature acquisition module, wherein the control center realizes the storage of data and the calculation of related parameters, and converts the calculation results into instructions to complete the relevant adjustments of the cylinder, temperature, stirring, etc.; the heating plate 120 is installed at the bottom of the tin tank to heat the tin liquid, and the temperature control of the heating plate 120 is completed through the instructions of the control center; the thermal imager 620 is installed on the top of the tin box to collect infrared images of the tin liquid; the stirring assembly 610 is installed in the tin box to stir the tin liquid; the through-hole valve 630 is used to control the outflow of the tin liquid to prevent it from entering the guide plate when it is not necessary.

[0022] A solder wire processing and forming method embodiment: This embodiment provides a solder wire processing and forming method, such as Figure 3 As shown, a solder wire processing and forming method of this embodiment includes the following steps: Step S1, obtaining the heating temperature of the heating plate 120 and the actual temperature of each area during the solder wire processing.

[0023] First, close the through-hole valve 630, start the furnace, preheat the device, obtain the metal material to be prepared, melt the metal raw material, add the metal material into the furnace in a certain proportion and order according to the chemical composition of the solder wire to be prepared, set the heating temperature of the metal fusion through the temperature controller, and heat the tin liquid through the heating plate 120, thereby completing the initial operation of the tin liquid preparation device in the solder wire preparation process. It should be noted that the heating temperature of the metal fusion is set by the implementer according to the specific situation.

[0024] Since the area of ​​the heating plate 120 is large, although a heating temperature is set as a whole for heating treatment, the actual temperatures at different positions are also different. The actual temperature close to the heating component is first higher, and the actual temperature at a farther position or at the edge of the heating plate 120 is lower. Therefore, the actual temperatures at different positions are different. After heating the tin liquid for a certain period of time, the temperature acquisition module collects the actual temperature of each area of ​​the heating plate 120 during the solder wire processing, and collects an actual temperature for each area. The temperature of each area collected in this embodiment is the actual temperature of the center point of each area. The actual temperature collection frequency is set to once every 10 seconds in this embodiment. As other implementation methods, the location selection and the actual temperature collection frequency can be carried out according to the specific situation. The area of ​​the heating plate 120 is obtained by evenly dividing according to the size of the heating plate 120, that is, the entire heating plate 120 is divided into a plurality of equal-sized areas, and the size of each area is set according to the specific situation. The collected data is stored in the calculation module of the control center, and the relevant parameters are obtained through the calculation module. The obtained parameters are passed to the instruction module, and the control of the components such as the heating plate 120 and the stirring component 610 is completed through the instruction module.

[0025] Step S2, judging whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of ​​the heating plate 120 and the preset optimal fusion temperature; if adjusted, the temperature to be adjusted of the heating plate 120 is obtained and adjusted in combination with the difference between the actual temperature of each area of ​​the heating plate 120 and the preset optimal fusion temperature and the heating temperature.

[0026] Since the actual temperature of different positions of the heating plate 120 is different, the temperature of the tin liquid at different positions is inconsistent, and the uneven temperature of the tin liquid affects the forming of the solder wire during the casting process and the quality of the solder wire. Therefore, it is necessary to adjust the temperature of the heating plate 120 to ensure that the actual heating temperature of the tin liquid is consistent.

[0027] Next, an area of ​​the heating plate 120 is taken as an example for description. The gas area of ​​the heating plate 120 can be processed by the method provided in this embodiment.

[0028] Any area of ​​the heating plate 120 is recorded as a candidate area, and the difference between the actual temperature of the candidate area and the preset optimal fusion temperature is calculated; the ratio of the absolute value of the difference to the preset optimal fusion temperature is determined as the difference factor of the candidate area.

[0029] In this embodiment, a specific calculation formula of the difference factor is given, and the difference factor of the candidate region can be expressed as: in, represents the difference factor of the candidate region, represents the actual temperature of the candidate area, Indicates the preset optimal fusion temperature. Indicates the absolute value sign.

[0030] It is used to characterize the difference between the actual temperature of the candidate area and the preset optimal fusion temperature. The larger the difference is, the greater the difference between the temperature distribution difference of the candidate area and the optimal temperature distribution standard is, that is, the larger the difference factor of the candidate area is.

[0031] By adopting the above method, the difference factor of each area of ​​the heating plate 120 can be obtained. If the difference factors of all areas of the heating plate 120 are less than the preset difference threshold, the heating temperature of the candidate area is not adjusted; otherwise, the heating temperature of the heating plate 120 is adjusted. In this embodiment, the preset difference threshold is 0.2, and in specific applications, the implementer can set it according to specific circumstances.

[0032] Next, the temperature to be adjusted of the heating plate 120 is determined by combining the difference between the actual temperature of each area of ​​the heating plate 120 and the preset optimal fusion temperature and the heating temperature.

[0033] Specifically, the product of the preset temperature adjustment factor and the difference is calculated, and the difference between the heating temperature of the heating plate 120 and the product is determined as the temperature to be adjusted of the heating plate 120. The temperature to be adjusted of the heating plate 120 can be expressed as: in, represents the temperature to be adjusted of the heating plate 120, represents the heating temperature of the heating plate 120, represents the actual temperature of the candidate area, Indicates the preset optimal fusion temperature. Indicates the preset temperature adjustment factor.

[0034] The value of is between 0 and 1. In this embodiment, the preset temperature adjustment factor is 0.5. In specific applications, the implementer can set it according to the specific situation.

[0035] After determining the temperature to be adjusted of the heating plate 120, the control center adjusts it to achieve the adjustment of the heating temperature.

[0036] Step S3, obtaining an infrared image of the tin liquid surface, and obtaining a tin liquid temperature consistency index for each image block based on the temperature distribution of each image block in the infrared image; comprehensively considering the discreteness of the actual temperatures in different areas of the heating plate 120, the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box, and the tin liquid temperature consistency index, to obtain an overall uniform value of the tin liquid temperature.

[0037] Since the tin liquid in the tin box is at a certain height, and the heating of the tin liquid is transferred from the bottom of the tin box to the upper layer, the temperature of the tin liquid at different heights is also different. In order to ensure the forming effect of the solder wire, it is necessary to ensure that all temperatures in the tin box remain consistent.

[0038] The thermal imager 620 collects infrared images of the surface of the tin liquid. Different colors in the infrared image represent different temperatures. Each pixel in the infrared image has a corresponding temperature value. The infrared image is divided into a number of image blocks of equal size. In specific applications, the implementer can set the size of each image block according to the specific situation.

[0039] The more concentrated the temperature distribution in the same image block is, the more consistent and uniform the tin liquid temperature is in the area corresponding to the image block. In different image blocks, the higher the similarity of the temperature distribution between image blocks, the more consistent the temperature distribution is on the entire tin liquid surface.

[0040] Next, an image block in an infrared image is taken as an example for description. The method provided in this embodiment can be used to process other image blocks in the infrared image.

[0041] Any image block in the infrared image is recorded as the image block to be analyzed, and the temperature values ​​of all pixels in the image block to be analyzed are curve fitted to obtain a fitting curve, wherein the horizontal coordinate of the fitting curve is the order of the pixels, and the vertical coordinate is the temperature value; it should be noted that: in this embodiment, the order of the pixels is sorted from left to right and from top to bottom. In specific applications, the implementer can also set the order of the pixels by himself. Curve fitting is a prior art and will not be described in detail here. The area enclosed by the curve segment in the neighborhood of the maximum value of the fitting curve and the horizontal axis is used as the consistency index of the tin liquid temperature of the image block to be analyzed. The larger the area enclosed by the curve segment in the neighborhood of the maximum value of the fitting curve and the horizontal axis, the more concentrated the temperature distribution of the pixels in the image block, that is, the more consistent the temperature of the tin liquid at each position in the image block. In this embodiment, the process of obtaining the neighborhood range of the maximum value of the fitting curve is: taking the maximum value of the fitting curve as the center point, a preset length interval adjacent to the maximum value of the fitting curve and located on the left side of the maximum value of the fitting curve, and a preset length interval located on the right side of the maximum value of the fitting curve as the neighborhood range of the maximum value of the fitting curve. In specific applications, the implementer can set the neighborhood range according to the specific situation.

[0042] The number of pixels corresponding to each temperature value in each image block in the infrared image is counted respectively, and the temperature value corresponding to the maximum value of the number is used as the target temperature value of the corresponding image block. Each image block in the infrared image has a target temperature value. It should be noted that if there are two or more temperature values ​​in an image block with the same number of pixels and they are all maximum values, the average of these temperature values ​​is used as the target temperature value of the pixel block.

[0043] According to the overall temperature distribution difference of all pixels in every two image blocks in the infrared image, the sum of the tin liquid temperature consistency index of every two image blocks and the difference in the target temperature values ​​of every two image blocks, a temperature similarity index is obtained. The overall temperature distribution difference and the difference in the target temperature values ​​of the two image blocks are negatively correlated with the temperature similarity index, and the sum is positively correlated with the temperature similarity index.

[0044] Among them, a positive correlation means that the dependent variable will increase as the independent variable increases, and the dependent variable will decrease as the independent variable decreases. It can be an additive relationship, a multiplicative relationship, etc., which is determined by actual application; a negative correlation means that the dependent variable will decrease as the independent variable increases, and the dependent variable will increase as the independent variable decreases. It can be a subtractive relationship, a division relationship, etc., which is determined by actual application.

[0045] The process of obtaining the overall temperature distribution difference of pixels in each two image blocks is as follows: the dynamic time warping (DTW) distance between the temperature sequences corresponding to the two image blocks is used as the overall temperature distribution difference of pixels in the two image blocks, and the temperature sequence is composed of the temperature values ​​of all pixels in the image blocks.

[0046] The process of obtaining the DTW distance between two sequences is a prior art and will not be described in detail here.

[0047] In this embodiment, a specific calculation formula of the temperature similarity index is given, and the temperature similarity index can be expressed as: Where A represents the temperature similarity index, N represents the number of image blocks in the infrared image, It represents the consistent index of the tin liquid temperature of the i-th image block in the infrared image. It represents the consistent index of the tin liquid temperature of the jth image block in the infrared image. represents the target temperature value of the i-th image block in the infrared image, represents the target temperature value of the jth image block in the infrared image, represents the temperature sequence corresponding to the i-th image block in the infrared image, represents the temperature sequence corresponding to the jth image block in the infrared image, Indicates the DTW distance. represents the DTW distance between the temperature sequence corresponding to the i-th image block and the temperature sequence corresponding to the j-th image block in the infrared image, represents the normalization function, Indicates the preset first adjustment parameter, represents the normalization function, Indicates the absolute value sign.

[0048] In this embodiment, the preset first adjustment parameter is introduced into the calculation formula of the temperature similarity index to prevent the denominator from being 0. The preset first adjustment parameter in this embodiment is 0.01. In specific applications, the implementer can set it according to specific circumstances.

[0049] Characterizes the difference between the target temperature values ​​of the i-th image block and the j-th image block. The smaller the value, the smaller the difference between the two. The concentrated temperatures of the temperature distributions of different image blocks are similar, and thus the consistency of the tin liquid temperature is stronger. The greater the similarity of the tin liquid temperature between different positions, the greater the consistency of the overall temperature distribution of the tin liquid, that is, When the overall temperature distribution difference of different pixel blocks in the infrared image is smaller, the temperature consistency index of the tin liquid is larger, and the DTW distance between the temperature sequences corresponding to different image blocks is smaller, it means that the temperature at different positions of the tin liquid is more similar, that is, the temperature similarity index is larger.

[0050] For the uniformity of temperature distribution at different heights, the temperature distribution of the tin liquid at different heights in the tin box is consistent, and the temperature at the bottom of the tin liquid is the same as the temperature on the top surface. Therefore, the consistency between the temperature at the bottom and the top is poor, and the greater the temperature difference at the bottom and the temperature difference at the top, the worse the temperature consistency of the tin liquid inside the tin box.

[0051] Therefore, next, based on the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box, the discrete degree of the actual temperature in different areas of the heating plate 120 and the temperature similarity index, the overall uniform value of the tin liquid temperature is obtained. The overall difference and the discrete degree are negatively correlated with the overall uniform value of the tin liquid temperature, and the temperature similarity index is positively correlated with the overall uniform value of the tin liquid temperature.

[0052] Among them, a positive correlation means that the dependent variable will increase as the independent variable increases, and the dependent variable will decrease as the independent variable decreases. It can be an additive relationship, a multiplicative relationship, etc., which is determined by actual application; a negative correlation means that the dependent variable will decrease as the independent variable increases, and the dependent variable will increase as the independent variable decreases. It can be a subtractive relationship, a division relationship, etc., which is determined by actual application.

[0053] The process of obtaining the discrete degree of the actual temperature of different regions of the heating plate 120 is as follows: according to the actual temperature of each region of the heating plate 120, the standard deviation of the actual temperature of all regions of the heating plate 120 is calculated, and the normalized result of the standard deviation is used as the discrete degree of the actual temperature of different regions of the heating plate 120. When normalizing the standard deviation, a linear normalization method can be used for processing, which will not be described in detail here.

[0054] In this embodiment, a specific calculation formula for the overall uniform value of the tin liquid temperature is given, and the overall uniform value of the tin liquid temperature can be expressed as: Wherein, Q represents the overall average value of the tin liquid temperature, A represents the temperature similarity index, and B represents the degree of dispersion of the actual temperature of different areas of the heating plate 120. It represents the average temperature of the tin liquid at all locations on the bottom of the tin box. It represents the average temperature of the tin liquid at all positions on the top of the tin box. Indicates the preset second adjustment parameter. represents the normalization function, It represents the absolute value sign, and e is a natural constant.

[0055] The purpose of introducing a preset first adjustment parameter into the calculation formula of the overall uniform value of the tin liquid temperature in this embodiment is to prevent the denominator from being 0. The preset first adjustment parameter in this embodiment is 0.01. In specific applications, the implementer can set it according to specific circumstances.

[0056] It is used to characterize the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box. The smaller the value, the smaller the temperature difference between the top and the bottom. When the discrete degree of the actual temperature in different areas of the heating plate 120 is smaller, the temperature similarity index is larger, and the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box is smaller, it means that the consistency of the tin liquid temperature in the tin box is stronger, that is, the overall uniform value of the tin liquid temperature is larger.

[0057] At this point, the overall average value of the tin liquid temperature is obtained.

[0058] Step S4, using the overall uniform value of the tin liquid temperature to determine whether the temperature meets the requirements, if not, continue to adjust the heating temperature of the heating plate 120.

[0059] The larger the overall uniform value of the tin liquid temperature, the better the heating effect of the tin liquid. Therefore, if the overall uniform value of the tin liquid temperature is greater than the preset consistency threshold, it is determined that the temperature meets the requirements, and the tin liquid is no longer stirred at this time; if the overall uniform value of the tin liquid temperature is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements, and the tin liquid is stirred and left to stand for a preset time. In this embodiment, the stirring time and the standing time of the tin liquid are both 1 minute. In specific applications, the implementer can set them according to specific circumstances. The preset consistency threshold in this embodiment is 0.9. In specific applications, the implementer can set it according to specific circumstances.

[0060] Among them, the process of obtaining the stirring frequency of the stirring component 610 when stirring the tin liquid is: taking the difference between the constant 1 and the new overall consistent value of the tin liquid temperature as the adjustment coefficient, and determining the product of the adjustment coefficient and the preset maximum stirring frequency of the tin liquid as the stirring frequency.

[0061] Use the thermal imager 620 to collect a new infrared image of the tin liquid surface after stirring and standing for a preset period of time, and obtain a new tin liquid temperature consistency index between each two image blocks based on the temperature distribution of each two image blocks in the new infrared image; obtain the new actual temperature of each area of ​​the heating plate 120; and obtain a new overall uniform value of the tin liquid temperature by combining the discreteness of the new actual temperatures of different areas of the heating plate 120, the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box, and the new tin liquid temperature consistency index. It should be noted that the method for obtaining the new overall uniform value of the tin liquid temperature is the same as the method for obtaining the overall uniform value of the tin liquid temperature in step S3, except that the corresponding temperature values ​​are replaced, so the process of obtaining the new overall uniform value of the tin liquid temperature will not be described in detail here.

[0062] If the overall consistent value of the new tin liquid temperature is greater than the preset consistent threshold, it is determined that the temperature meets the requirements; if the overall consistent value of the new tin liquid temperature is less than or equal to the preset consistent threshold, it is determined that the temperature does not meet the requirements, and the temperature to be adjusted of the heating plate 120 is recalculated and adjusted to complete the subsequent processing technology.

[0063] When the prepared tin liquid meets the requirements, the through-hole valve is opened to allow the prepared tin liquid to enter the guide plate through the through-hole. The height of the guide plate is adjusted by the cylinder to make the flow rate of the tin liquid at the tin outlet moderate. After the pouring is completed, the through-hole valve 630 is closed and the signal is transmitted to the damping shaft to move the collection box forward, and the excess tin liquid enters the collection box. When the next solder wire needs to be poured, the through-hole valve 630 is opened.

[0064] So far, the method provided in this embodiment has been used to adjust the temperature of the solder wire during the processing and forming process, and the processing of the solder wire has been completed.

[0065] This embodiment first collects the actual temperature of each area of ​​the heating plate 120 during the solder wire processing. Since there is a certain difference between the heating temperature and the actual temperature during the heating of the molten tin, and there is also a certain difference between the actual temperatures of different areas, the uneven temperature of the molten tin affects the forming of the solder wire during the casting process and the quality of the solder wire. Therefore, this embodiment first determines whether the heating temperature of the heating plate 120 needs to be adjusted according to the difference between the actual temperature of each area of ​​the heating plate 120 and the preset optimal fusion temperature. If adjustment is required, the temperature to be adjusted is obtained and adjusted in combination with the difference between the actual temperature of each area of ​​the heating plate 120 and the preset optimal fusion temperature and the heating temperature; based on the molten tin table, the actual temperature of each area of ​​the heating plate 120 is adjusted to the preset optimal fusion temperature. The temperature distribution of each two image blocks in the infrared image of the surface, the discreteness of the actual temperature of different areas of the heating plate 120, and the overall difference in the temperature distribution of the tin liquid at the bottom of the tin box and the top of the tin box are used to evaluate the uniformity of the overall temperature of the tin liquid, and the overall uniform value of the tin liquid temperature is obtained. The overall uniform value of the tin liquid temperature is further used to judge whether the temperature meets the requirements, that is, whether it needs to be adjusted, thereby ensuring the temperature consistency at different positions during the heating process of the tin liquid. This embodiment takes into account the uniformity of the tin liquid temperature during the preparation process of the tin liquid, prevents the quality of the solder wire due to the uneven temperature of the prepared tin liquid, realizes the intelligent control of the heating temperature of the tin liquid, and can improve the processing quality of the solder wire.

[0066] It should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A solder wire processing and forming method, characterized in that: The method comprises the following steps: Obtain the heating temperature of the heating plate and the actual temperature of each area during solder wire processing; Determine whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature; if adjusted, obtain the temperature to be adjusted of the heating plate in combination with the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature and the heating temperature, and adjust the temperature; Acquire an infrared image of the tin liquid surface, and obtain a tin liquid temperature consistency index for each image block based on the temperature distribution of each image block in the infrared image; comprehensively consider the discreteness of the actual temperature in different areas of the heating plate, the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box, and the tin liquid temperature consistency index, and obtain the overall uniform value of the tin liquid temperature; The overall uniform value of the tin liquid temperature is used to determine whether the temperature meets the requirements. If not, the heating temperature of the heating plate is further adjusted.

2. A solder wire processing and forming method according to claim 1, characterized in that: Using the overall uniform value of the tin liquid temperature to judge whether the temperature meets the requirements includes: If the overall average value of the tin liquid temperature is greater than a preset consistency threshold, it is determined that the temperature meets the requirements; If the overall average value of the tin liquid temperature is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements.

3. A solder wire processing and forming method according to claim 1, characterized in that: The step of determining whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature includes: Calculating the difference between the actual temperature of the candidate area and the preset optimal fusion temperature; determining the ratio of the absolute value of the difference to the preset optimal fusion temperature as the difference factor of the candidate area; the candidate area is any area of ​​the heating plate; If the difference factors of all regions of the heating plate are smaller than the preset difference threshold, the heating temperature of the candidate region is not adjusted; otherwise, the heating temperature of the heating plate is adjusted.

4. A solder wire processing and forming method according to claim 3, characterized in that: Combining the difference between the actual temperature of each area of ​​the heating plate and the preset optimal fusion temperature and the heating temperature, the temperature to be adjusted of the heating plate is obtained, including: The product of the preset temperature adjustment factor and the difference is calculated, and the difference between the heating temperature of the heating plate and the product is determined as the temperature to be adjusted of the heating plate.

5. A solder wire processing and forming method according to claim 1, characterized in that: The step of obtaining a consistent index of the molten tin temperature of each image block based on the temperature distribution of each image block in the infrared image includes: Performing curve fitting on the temperature values ​​of all pixels in the image block to be analyzed to obtain a fitting curve, wherein the abscissa of the fitting curve is the order of the pixels and the ordinate is the temperature value; the area enclosed by the curve segment in the neighborhood of the maximum value of the fitting curve and the abscissa is taken as the consistent index of the tin liquid temperature of the image block to be analyzed; The image block to be analyzed is any image block in the infrared image.

6. A solder wire processing and forming method according to claim 1, characterized in that: The discreteness of the actual temperature of different areas of the comprehensive heating plate, the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box, and the tin liquid temperature consistency index are used to obtain the overall uniform value of the tin liquid temperature, including: Counting the number of pixel points corresponding to each temperature value in each image block in the infrared image, and taking the temperature value corresponding to the maximum value of the number as the target temperature value of the corresponding image block; A temperature similarity index is obtained according to the overall temperature distribution difference of all pixels in every two image blocks in the infrared image, the sum of the tin liquid temperature consistency index of every two image blocks and the difference of the target temperature value of every two image blocks, wherein the overall temperature distribution difference and the difference of the target temperature values ​​of the two image blocks are both negatively correlated with the temperature similarity index, and the sum is positively correlated with the temperature similarity index; According to the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box, the discrete degree of the actual temperature in different areas of the heating plate and the temperature similarity index, the overall uniform value of the tin liquid temperature is obtained, the overall difference and the discrete degree are negatively correlated with the overall uniform value of the tin liquid temperature, and the temperature similarity index is positively correlated with the overall uniform value of the tin liquid temperature.

7. A solder wire processing and forming method according to claim 6, characterized in that: The acquisition of the overall temperature distribution difference of the pixels in each two image blocks includes: The DTW distance between the temperature sequences corresponding to the two image blocks is taken as the overall temperature distribution difference of the pixels in the two image blocks, and the temperature sequence is composed of the temperature values ​​of all the pixels in the image blocks.

8. The method for processing and forming solder wire according to claim 1, characterized in that: Before continuing to adjust the heating temperature of the heating plate, also include: Stir the tin solution and let it stand for a preset time; Obtain a new infrared image of the tin liquid surface, and obtain a new tin liquid temperature consistency index between each two image blocks based on the temperature distribution of each two image blocks in the new infrared image; obtain a new actual temperature of each area of ​​the heating plate; comprehensively consider the discrete conditions of the new actual temperatures of different areas of the heating plate, the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box, and the new tin liquid temperature consistency index, and obtain a new overall uniform value of the tin liquid temperature; If the overall average value of the new tin liquid temperature is greater than the preset consistency threshold, it is determined that the temperature meets the requirements; If the overall average value of the new tin liquid temperature is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements.

9. A solder wire processing and forming method according to claim 8, characterized in that: The acquisition of the stirring frequency when the tin liquid is stirred includes: The difference between the constant 1 and the new overall average value of the tin liquid temperature is used as the adjustment coefficient, and the product of the adjustment coefficient and the preset maximum stirring frequency of the tin liquid is determined as the stirring frequency.

10. A solder wire processing and forming device, characterized in that: The device comprises a heating plate (120), a stirring assembly (610), a thermal imager (620), a temperature acquisition module and a control center, wherein the heating plate (120) is used to heat the tin liquid, the stirring assembly (610) is used to stir the tin liquid, the thermal imager (620) is used to collect infrared images of the surface of the tin liquid, the temperature acquisition module is used to collect the actual temperature of each area of ​​the heating plate (120) during the solder wire processing process, and the control center is used to convert the calculation results into instructions and make corresponding adjustments.

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