High-temperature alloy workpiece forging device and method
By designing a high-temperature alloy workpiece forging device including positioning components, cylinders, disassembly and assembly components and cooling components, the problem of reducing forging efficiency caused by multiple transfers of high-temperature alloy workpieces during forging is solved, and more efficient forging and cooling effects are achieved.
Patent Information
- Application Number
- CN202411657681.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-02-25
AI Technical Summary
During the forging process, high-temperature alloy workpieces require the transfer of different forging devices multiple times, resulting in a reduction in forging efficiency.
A high-temperature alloy workpiece forging device is designed, including a base, a guide rod, a positioning assembly, a cylinder, a disassembly assembly assembly and a cooling assembly. The mold is positioned through the positioning assembly, and the cylinder adjusts the mold height. The disassembly and assemble the assembly makes it easier to disassemble and assemble the mold, and the cooling assembly improves the cooling efficiency.
It improves the efficiency and effectiveness of forging high-temperature alloy workpieces, reduces the number of mold replacement and high-temperature alloy transfers, and improves cooling efficiency.
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Figure CN119500949A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of high-temperature alloys, and in particular to a high-temperature alloy workpiece forging device and method. Background Art
[0002] High-temperature alloy refers to a type of metal material based on iron, nickel and cobalt, which can work for a long time at high temperatures above 600°C and under certain stresses. It has excellent high-temperature strength, good oxidation resistance and thermal corrosion resistance, good fatigue performance, fracture toughness and other comprehensive properties. It is also called "superalloy." It is mainly used in the aerospace and energy fields. The workpiece refers to a product component in the manufacturing process.
[0003] At present, high-temperature alloy workpieces are used in many fields. During the processing of high-temperature alloy workpieces, it is necessary to forge the high-temperature alloy workpieces according to actual needs. During the forging process, multiple molds are required to forge the high-temperature alloy workpieces. However, some existing forging devices need to replace their molds according to the processing steps when in use. Some molds are integrated with the forging table, and the high-temperature alloy workpiece needs to be transferred multiple times, affecting the forging efficiency of the high-temperature alloy. Summary of the invention
[0004] The object of the present invention is to provide a high-temperature alloy workpiece forging device and method to solve the problem that the high-temperature alloy needs to be forged multiple times between different forging devices during the forging process, resulting in reduced forging efficiency.
[0005] To achieve the above object, the present invention provides the following technical solution: a high temperature alloy workpiece forging device and method, comprising a base, and also comprising:
[0006] A guide rod disposed on the top of the base;
[0007] A placement rack is arranged inside the base, and a cylinder is arranged on the top of the base;
[0008] A positioning assembly is arranged inside the base, the positioning assembly comprises a first positioning plate arranged inside the base, a first spring is welded inside the base, and a second positioning plate is welded to one end of the first spring;
[0009] A disassembly assembly is arranged on the piston rod of the cylinder, wherein the piston rod of the cylinder is fixedly connected with a movable plate, a slide groove is provided inside the movable plate, and a clamping plate is provided at the bottom of the movable plate;
[0010] A cooling component is arranged inside the base, the cooling component includes heat dissipation plates arranged on both sides of the base, a semiconductor refrigeration sheet is arranged inside the base, a fan is fixedly connected to the inside of the base, and a partition is fixedly connected to the inner wall of the base.
[0011] Preferably, a second spring is welded inside the base, a connecting column is welded to one end of the second spring, and one end of the connecting column away from the second spring is fixedly connected to one side of the first positioning plate.
[0012] Preferably, a ventilation hole is opened inside the base, and a fixing column is fixedly connected to the bottom of the inner cavity of the base.
[0013] Preferably, a delivery pipe is provided inside the partition, the outer side of the delivery pipe is connected to a nozzle, the bottom of the inner cavity of the base is fixedly connected to a motor, the output end of the motor is fixedly connected to a rotating tube, the internal thread of the rotating tube is connected to a transmission rod, and the top of the transmission rod is fixedly connected to the bottom of the placement rack.
[0014] Preferably, a fixing rod is fixedly connected to one side of the inner wall of the slide groove, a third spring is sleeved on the outer side of the fixing rod, and a connecting block is slidably connected to the outer side of the fixing rod.
[0015] Preferably, an inner circle of the clamping plate is fixedly connected to an elastic column, and one end of the elastic column is fixedly connected to a soft plate.
[0016] Preferably, the bottom of the movable plate is fixedly connected to a fixed plate, and one side of the fixed plate is rotatably connected to a transmission tube.
[0017] Preferably, the transmission tube is internally threadedly connected to a screw rod, and one end of the screw rod is fixedly connected to a top plate.
[0018] Preferably, a soft block is provided on one side of the top plate, a fourth spring is welded inside the top plate, and an L-shaped plate is welded at the bottom of the fourth spring.
[0019] The present invention also provides a high-temperature alloy workpiece forging method, comprising the following steps:
[0020] S1. Positioning the mold by the positioning assembly: placing the lower mold into the base, and then positioning the lower mold by the first positioning plate and the second positioning plate, while placing the upper mold or the forging mechanism at the bottom of the moving plate, and positioning the upper mold by the clamping plate and the L-shaped plate;
[0021] S2. Forging of high-temperature alloys: Place the high-temperature alloy to be forged into the lower die, adjust the height of the upper die or forging mechanism through the cylinder, and perform forging operations on the high-temperature alloy;
[0022] S3, cooling after forging: start the fan to extract the outside air, cool the air through the semiconductor refrigeration sheet, spray the cooled air through the nozzle, and cool the alloy;
[0023] S4. Taking out the lower mold and the alloy: After cooling, start the motor and take out the lower mold and the high-temperature alloy through the placement rack.
[0024] Compared with the prior art, the present invention has the following beneficial effects:
[0025] 1. The present invention provides a positioning assembly, and under the action of the first positioning plate and the second positioning plate, the lower die can be positioned and fixed, thereby facilitating the staff to position and use the lower dies of different sizes, thereby improving the forging efficiency;
[0026] 2. The present invention provides a disassembly and assembly assembly, which facilitates the staff to position and place the upper die and the forging mechanism under the action of the clamping plate and the top plate, thereby enabling the forging operation of the high-temperature alloy to be performed, and at the same time can improve the forging efficiency to a certain extent;
[0027] 3. The present invention can extract external air through the cooling component under the action of the fan. The extracted air is cooled down under the action of the semiconductor refrigeration plate, and then sprayed out through the nozzle to cool the forged high-temperature alloy, thereby improving the cooling efficiency of the high-temperature alloy after forging. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 A schematic structural diagram of a preferred embodiment of a high-temperature alloy workpiece forging device and method provided by the present invention;
[0029] Figure 2 A schematic diagram of the structure of the positioning assembly provided by the present invention;
[0030] Figure 3 The present invention provides Figure 2 An enlarged schematic diagram of the structure at A is shown;
[0031] Figure 4 A schematic diagram of the cooling assembly structure provided by the present invention;
[0032] Figure 5 A schematic diagram of the disassembly and assembly structure provided by the present invention;
[0033] Figure 6 The fixing plate and L-shaped plate structure provided by the present invention are schematically connected;
[0034] Figure 7 A structural flow chart of a preferred embodiment of the high-temperature alloy workpiece forging method provided by the present invention.
[0035] In the figure: 1. base; 2. guide rod; 3. positioning assembly; 301. first positioning plate; 302. first spring; 303. second positioning plate; 4. placement rack; 5. disassembly assembly; 501. moving plate; 502. slide groove; 503. clamping plate; 6. cooling assembly; 601. heat sink; 602. semiconductor refrigeration plate; 603. fan; 604. partition; 7. cylinder; 8. second spring; 9. connecting column; 10. ventilation hole; 11. fixed column; 12. delivery pipe; 13. nozzle; 14. motor; 15. rotating pipe; 16. transmission rod; 17. fixed rod; 18. third spring; 19. connecting block; 20. elastic column; 21. soft plate; 22. fixed plate; 23. transmission pipe; 24. screw; 25. soft block; 26. top plate; 27. fourth spring; 28. L-shaped plate. DETAILED DESCRIPTION
[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0037] See also Figure 1-6 As shown, a high-temperature alloy workpiece forging device includes a base 1, and also includes: a guide rod 2 arranged on the top of the base 1, under the action of the guide rod 2, the movable plate 501 can move and maintain a certain direction; a placement rack 4 arranged inside the base 1, under the action of the placement rack 4, the height of the mold and the high-temperature alloy can be adjusted by adjusting the position of the placement rack 4, and then the high-temperature alloy that has completed the forging operation can be taken out, and a cylinder 7 arranged on the top of the base 1, under the action of the cylinder 7, it is convenient for the staff to adjust the position of the movable plate 501; a positioning component 3 arranged inside the base 1, under the action of the positioning component 3, different molds can be positioned and placed, so as to meet the high-temperature alloy In order to meet the needs of different molds during the forging process, the positioning component 3 includes a first positioning plate 301 arranged inside the base 1. Under the action of the first positioning plate 301 and the second positioning plate 303, the mold can be clamped and positioned. At the same time, the positioning plate 303 can support different molds, which is convenient for the staff to disassemble and place different molds. A first spring 302 is welded inside the base 1. Under the action of the first spring 302, it is convenient for the staff to adjust the position of the second positioning plate 303 according to the size of different molds. At the same time, under the action of the first spring 302, the second positioning plate 303 can be used to position different molds. One end of the first spring 302 is welded with the second positioning plate 303;
[0038] The disassembly and assembly component 5 arranged on the piston rod of the cylinder 7, under the action of the disassembly and assembly component 5, is convenient for the staff to disassemble and position the forging die. The piston rod of the cylinder 7 is fixedly connected with the movable plate 501. When the cylinder 7 is started, the movable plate 501 can be driven to move under the action of the cylinder 7, so that the movable plate 501 can move to the specified position. A slide groove 502 is provided inside the movable plate 501. Under the action of the slide groove 502, the clamping plate 503 can move stably inside the slide groove 502. A clamping plate 503 is provided at the bottom of the movable plate 501. Under the action of the two clamping plates 503, different molds can be positioned and clamped.
[0039] A cooling component 6 is arranged inside the base 1. Under the action of the cooling component 6, the high-temperature alloy being forged can be cooled. The cooling component 6 includes heat sinks 601 arranged on both sides of the base 1. Under the action of the heat sink 601, the heat generated by the semiconductor refrigeration sheet 602 during operation can be dissipated. The base 1 is provided with a semiconductor refrigeration sheet 602 inside. Under the action of the semiconductor refrigeration sheet 602, the air drawn by the fan 603 can be cooled. The base 1 is fixedly connected to the inside of the fan 603. By starting the fan 603, the outside air can be drawn and then transported. The inner wall of the base 1 is fixedly connected to a partition 604. Under the action of the partition 604, the inside of the base 1 can be sealed to prevent the temperature of the air after refrigeration from rising too quickly.
[0040] refer to Figure 2 and Figure 3 As shown, a second spring 8 is welded inside the base 1. Under the elastic force of the second spring 8, the connecting column 9 can be moved to the specified position, and then the first positioning plate 301 is driven to move through the connecting column 9. A connecting column 9 is welded at one end of the second spring 8, and the connecting column 9 can enter the groove where the second spring 8 is located, so that the movement of the first positioning plate 301 can remain stable, and the end of the connecting column 9 away from the second spring 8 is fixedly connected to one side of the first positioning plate 301.
[0041] A ventilation hole 10 is opened inside the base 1. Under the action of the ventilation hole 10, low-temperature air can flow out through the nozzle 13 and enter the position of the mold, thereby cooling the forged high-temperature alloy. A fixed column 11 is fixedly connected to the bottom of the inner cavity of the base 1. Under the action of the fixed column 11, the pressure on the placement rack 4 can be dispersed to prevent the placement rack 4 from being subjected to excessive pressure.
[0042] refer to Figure 4As shown, a delivery pipe 12 is provided inside the partition 604. Under the action of the delivery pipe 12, the cooled air can be delivered, and then the air with a lower temperature can be ejected through the nozzle 13. The outer side of the delivery pipe 12 is connected to the nozzle 13. Under the action of multiple nozzles 13, the air with a lower temperature can cool and reduce the temperature of the high-temperature alloy. A motor 14 is fixedly connected to the bottom of the inner cavity of the base 1. When the motor 14 is started, the rotating tube 15 can be driven to rotate under the action of the motor 14, so that the transmission rod 16 moves, so that the height of the placement rack 4 can be adjusted, and then the mold and the high-temperature alloy after forging can be ejected together. The output end of the motor 14 is fixedly connected to the rotating tube 15. When the motor 14 is working normally, it can drive the rotating tube 15 to rotate. The internal thread of the rotating tube 15 is connected to the transmission rod 16. When the rotating tube 15 rotates, the transmission rod 16 can move inside the rotating tube 15, so as to adjust the height of the placement rack 4. The top of the transmission rod 16 is fixedly connected to the bottom of the placement rack 4.
[0043] refer to Figure 6 As shown, a fixing rod 17 is fixedly connected to one side of the inner wall of the slide groove 502, and a third spring 18 is sleeved on the outer side of the fixing rod 17. Under the elastic force of the third spring 18, the connecting block 19 can slide on the outer side of the fixing rod 17, so that the connecting block 19 and the splint 503 can move to the specified position. The outer side of the fixing rod 17 is slidably connected with the connecting block 19, and under the action of the fixing rod 17, the movement of the connecting block 19 can be kept stable.
[0044] The inner circle of the splint 503 is fixedly connected with an elastic column 20. Under the action of the elastic column 20 and the soft board 21, the mold positioned by the splint 503 can be protected to prevent the mold from being damaged or scratched. One end of the elastic column 20 is fixedly connected with a soft board 21. Under the action of the soft board 21, the outer side of the mold can be protected.
[0045] The bottom of the movable plate 501 is fixedly connected to a fixed plate 22 , and one side of the fixed plate 22 is rotatably connected to a transmission tube 23 . Under the action of the fixed plate 22 , the transmission tube 23 can remain stable when rotating.
[0046] The internal thread of the transmission tube 23 is connected to a screw rod 24. When the transmission tube 23 rotates, it can drive the screw rod 24 inside it to move, thereby adjusting the extension length of the screw rod 24. One end of the screw rod 24 is fixedly connected to a top plate 26. When the screw rod 24 moves, the position of the top plate 26 can be adjusted.
[0047] A soft block 25 is provided on one side of the top plate 26. Under the action of the soft block 25, the contact position between the top plate 26 and the mold can be protected to prevent the mold from being damaged by the top plate 26. A fourth spring 27 is welded inside the top plate 26. Under the action of the fourth spring 27, the position of the L-shaped plate 28 can be adjusted, thereby supporting and positioning the mold. An L-shaped plate 28 is welded to the bottom of the fourth spring 27.
[0048] refer to Figure 7 As shown, the present invention also provides a high temperature alloy workpiece forging method, comprising the following steps:
[0049] S1. Positioning the mold by the positioning assembly 3: placing the lower mold into the base 1, and then positioning the lower mold by the first positioning plate 301 and the second positioning plate 303, while placing the upper mold or the forging mechanism at the bottom of the moving plate 501, and positioning the upper mold by the clamping plate 503 and the L-shaped plate 28;
[0050] S2. Forging of high-temperature alloy: placing the high-temperature alloy to be forged into the lower die, adjusting the height of the upper die or the forging mechanism by the cylinder 7, and performing forging operation on the high-temperature alloy;
[0051] S3, cooling after forging: start the fan 603 to extract the outside air, cool the air through the semiconductor cooling sheet 602, and spray the cooled air through the nozzle 13 to cool the alloy;
[0052] S4, taking out the lower mold and the alloy: after cooling is completed, the motor 14 is started, and the lower mold and the high-temperature alloy are taken out through the placement rack 4.
[0053] Working principle: When the staff needs to perform forging operation on the high-temperature alloy, they first push the first positioning plate 301 and the second positioning plate 303 to make the first spring 302 and the second spring 8 move to the specified position, and then place the lower mold at the specified position inside the base 1, and then under the action of the second positioning plate 303, the lower mold can be supported, and at the same time, under the elastic force of the first spring 302 and the second spring 8, the lower mold can be positioned and clamped, and then the position of the movable plate 501 is adjusted by the cylinder 7, and the clamping plate 503 is pushed to compress the third spring 18, and then the transmission tube 23 is rotated to make the top plate 26 move to the specified position, and the upper mold is placed at the specified position at the bottom of the movable plate 501. Under the elastic force of the third spring 18, the clamping plate 503 can be moved to the specified position, and then under the action of the two clamping plates 503, the front surface and the rear surface of the upper mold can be clamped, and the two transmission tubes 23 are rotated at the same time. When the transmission tube 23 rotates, it can drive the screw 24 to move. Under the action of, under the action of the top plate 26, the two sides of the upper mold can be clamped and positioned, and at the same time, under the action of the fourth spring 27, the position of the L-shaped plate 28 can be adjusted, and then the upper mold can be supported by the L-shaped plate 28. After the upper mold and the lower mold are installed, the staff places the high-temperature alloy inside the lower mold, and continues to twist and forge the high-temperature alloy by starting the cylinder 7. When the high-temperature alloy needs to be cooled after forging, start the fan 603. Under the action of the fan 603, the outside air can be extracted and then transported to the inside of the base 1. Under the action of the semiconductor refrigeration plate 602, the air is cooled and cooled, so that the air with lower temperature can be ejected through the nozzle 13 to cool the high-temperature alloy. After the cooling operation is completed, the first positioning plate 301 and the second positioning plate 303 are pushed, and the motor 14 is started. Under the action of the motor 14, the height of the placement rack 4 can be adjusted, and then the lower mold and the forged high-temperature alloy are ejected.
[0054] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high temperature alloy workpiece forging device, comprising a base (1), characterized in that: Also includes: A guide rod (2) disposed on the top of the base (1); A placement rack (4) arranged inside the base (1), and a cylinder (7) arranged on the top of the base (1); A positioning assembly (3) disposed inside the base (1), the positioning assembly (3) comprising a first positioning plate (301) disposed inside the base (1), a first spring (302) welded inside the base (1), and a second positioning plate (303) welded to one end of the first spring (302); A disassembly assembly (5) is arranged on the piston rod of the cylinder (7), wherein the piston rod of the cylinder (7) is fixedly connected to a movable plate (501), a slide groove (502) is provided inside the movable plate (501), and a clamping plate (503) is provided at the bottom of the movable plate (501); A cooling component (6) is arranged inside the base (1), the cooling component (6) comprises heat dissipation plates (601) arranged on both sides of the base (1), a semiconductor cooling plate (602) is arranged inside the base (1), a fan (603) is fixedly connected inside the base (1), and a partition (604) is fixedly connected to the inner wall of the base (1).
2. A high temperature alloy workpiece forging device according to claim 1, characterized in that: A second spring (8) is welded inside the base (1), a connecting column (9) is welded at one end of the second spring (8), and an end of the connecting column (9) away from the second spring (8) is fixedly connected to one side of the first positioning plate (301).
3. A high temperature alloy workpiece forging device according to claim 1, characterized in that: A ventilation hole (10) is provided inside the base (1), and a fixing column (11) is fixedly connected to the bottom of the inner cavity of the base (1).
4. The high temperature alloy workpiece forging device according to claim 1, characterized in that: A delivery pipe (12) is provided inside the partition (604), and the outer side of the delivery pipe (12) is connected to a nozzle (13). A motor (14) is fixedly connected to the bottom of the inner cavity of the base (1), and a rotating tube (15) is fixedly connected to the output end of the motor (14). A transmission rod (16) is connected to the internal thread of the rotating tube (15), and the top of the transmission rod (16) is fixedly connected to the bottom of the placement rack (4).
5. The high temperature alloy workpiece forging device according to claim 1, characterized in that: A fixing rod (17) is fixedly connected to one side of the inner wall of the slide groove (502), a third spring (18) is sleeved on the outer side of the fixing rod (17), and a connecting block (19) is slidably connected to the outer side of the fixing rod (17).
6. A high temperature alloy workpiece forging device according to claim 1, characterized in that: The inner circle of the clamping plate (503) is fixedly connected to an elastic column (20), and one end of the elastic column (20) is fixedly connected to a soft plate (21).
7. The high temperature alloy workpiece forging device according to claim 1, characterized in that: The bottom of the movable plate (501) is fixedly connected to a fixed plate (22), and one side of the fixed plate (22) is rotatably connected to a transmission pipe (23).
8. A high temperature alloy workpiece forging device according to claim 7, characterized in that: The transmission tube (23) is internally threadedly connected to a screw rod (24), and one end of the screw rod (24) is fixedly connected to a top plate (26).
9. A high temperature alloy workpiece forging device according to claim 8, characterized in that: A soft block (25) is provided on one side of the top plate (26), a fourth spring (27) is welded inside the top plate (26), and an L-shaped plate (28) is welded at the bottom of the fourth spring (27).
10. A method for forging a high temperature alloy workpiece according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Positioning the mold by means of the positioning assembly (3): placing the lower mold into the interior of the base (1), and then positioning the lower mold by means of the first positioning plate (301) and the second positioning plate (303), while placing the upper mold or the forging mechanism at the bottom of the movable plate (501), and positioning the upper mold by means of the clamping plate (503) and the L-shaped plate (28); S2. Forging of high-temperature alloy: placing the high-temperature alloy to be forged into the lower die, adjusting the height of the upper die or the forging mechanism by means of the cylinder (7), and performing forging operation on the high-temperature alloy; S3, cooling after forging: starting the fan (603) to extract external air, cooling the air through the semiconductor cooling sheet (602), and spraying the cooled air through the nozzle (13) to cool the alloy; S4, taking out the lower mold and the alloy: after cooling is completed, the motor (14) is started to take out the lower mold and the high-temperature alloy through the placement rack (4).