Processing device and processing method suitable for heat dissipation cover in surface mounting process

Abstract

The invention relates to the technical field of heat dissipation cover mounting processes, in particular to a heat dissipation cover processing device and method suitable for the mounting process, and mainly relates to a heat dissipation cover processing device suitable for the mounting process. A cleaning platform is arranged between the incoming material platform and the feeding platform, the cleaning platform is provided with a processing plane used for processing the combination surface of the heat dissipation cover, and the processing plane is kept to be arranged in the forward direction; the LED lamp further comprises a carrying module, and the carrying module keeps the combination face of the heat dissipation cover to be arranged in the negative direction. The device has the following beneficial effects that the bonding surface of the heat dissipation cover is bombarded through jet type plasma flame, the hydrophilicity of the heat dissipation sheet is improved through chemical and physical reactions, meanwhile, after treatment is completed, the bonding surface is always kept in a downward state, the possibility of secondary pollution in the carrying process is reduced as much as possible, and the heat dissipation sheet is placed on a feeding carrier.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation cover mounting technology, and in particular to a processing device and a processing method suitable for heat dissipation covers in mounting technology. Background Art

[0002] The incoming heat sink cover materials are packaged on transparent trays. The packaging carriers do not support the loading of the cover sticking machine in the factory. During the transportation stage, the packaging carriers of the incoming heat sink cover materials must be replaced with specific carriers supported by the cover sticking machine.

[0003] Specifically, at present, it is necessary to manually use a suction pen or wear rubber gloves to manually place it in a specific carrier supported by the cap-applying machine to achieve carrier replacement to ensure the operation of the production line. However, during the replacement process, the manual conversion process is prone to contamination and scratches on the heat sink cover joint surface, which can easily lead to damage to the heat sink cover joint surface. In the subsequent processing process, the heat sink cover and the glue are easily separated, resulting in defective scrapping of the product. Summary of the invention

[0004] In order to effectively clean the bonding surface of the heat dissipation cover so as to improve the chemical properties of the bonding surface of the heat dissipation cover and enhance the surface adhesion and bonding force, the present application provides a processing device and a processing method for the heat dissipation cover in a mounting process.

[0005] In the first aspect, the present application provides a processing device for a heat sink cover in a mounting process, which adopts the following technical solution: a processing device for a heat sink cover in a mounting process, comprising an incoming material platform and a feeding platform, a cleaning platform is provided between the incoming material platform and the feeding platform, the cleaning platform has a processing plane for processing the bonding surface of the heat sink cover, and the processing plane is kept facing the positive direction; and also includes a conveying module, the conveying module is used to convey the heat sink cover to the incoming material platform, the cleaning platform, and the feeding platform in sequence, and the conveying module keeps the bonding surface of the heat sink cover facing the negative direction.

[0006] By adopting the above technical solution, the heat sink cover placed on the incoming material carrier is transported to the incoming material platform through the production line, and the heat sink cover is placed on the cleaning platform through the transport module. The bonding surface of the heat sink cover is bombarded by a jet plasma flame, and the hydrophilicity of the heat sink is improved through chemical and physical reactions to reduce the contact angle. At the same time, after the processing is completed, the bonding surface is always kept facing downward to minimize the possibility of re-contamination during the transportation process, and the heat sink is placed on the feeding carrier.

[0007] Preferably, the feeding platform comprises a feeding rack and a feeding carrier, and the feeding rack is provided with a plurality of feeding limit grooves for placing the feeding carrier.

[0008] Preferably, the incoming material platform includes an incoming material rack and an incoming material carrier, and the incoming material rack is provided with a plurality of incoming material limiting grooves for placing the incoming material carrier.

[0009] Preferably, a barrier frame is provided on the upper cover of the feeding frame, and an air inlet and an air outlet are provided in the barrier frame in a horizontal direction, and gas flows from the air inlet to the air outlet to form an air barrier surface covering the upper side of the feeding limit groove.

[0010] By adopting the above technical solution, the upper parallel surface of the feeding carrier on the feeding rack becomes an air barrier surface while waiting for the heat dissipation cover to be placed, which can reduce the possibility of impurities or pollutants falling on the upper side, and the existence of the air barrier surface can discharge impurities through the air outlet.

[0011] Preferably, the barrier frame has a first air duct and a second air duct inside, the first air duct is connected to the air inlet duct, the second air duct is connected to the air outlet duct through a third air duct, and the flowing gas in the second air duct forms a pressure difference at both ends of the third air duct, so that the air outlet duct exhausts air.

[0012] By adopting the above technical solution, the gas flow can be achieved through the same gas source, and on the other hand, the gas outlet on the opposite side will absorb the gas on the opposite side through negative pressure to achieve a barrier effect.

[0013] Preferably, a reinforcement is provided on the barrier frame, and the reinforcement includes a suction cup arranged in the barrier frame, one end of the suction cup is used to contact and adsorb the feeding carrier, the other end of the suction cup is connected to the second air duct, and the end of the suction cup close to the second air duct is a negative pressure point.

[0014] By adopting the above technical solution, since the feeding carrier may be offset or shaken during the gas flow, the existence of the suction cylinder and the same gas source can achieve a better stabilization effect on the surrounding side of the feeding carrier.

[0015] Preferably, the thickness of the feeding carrier is greater than the thickness of the feeding rack.

[0016] By adopting the above technical solution, when the suction cylinder is under negative pressure, the thickness of the feeding carrier can completely cover the end of the suction cylinder.

[0017] Preferably, the feeding platform has a horizontal movement stroke toward the handling module.

[0018] Preferably, it also includes an incoming material suction and release module and a feeding material suction and release module, and also includes an incoming material carrier slide and a feeding material carrier slide, the incoming material suction and release module is used to transport the incoming material carrier from the incoming material carrier slide to the incoming material rack, and the feeding material suction and release module is used to transport the feeding material carrier from the feeding carrier slide to the feeding rack.

[0019] On the other hand, based on the above-mentioned processing device, the present application also provides a processing method for a heat sink cover in a mounting process, which adopts the following technical solution: a processing method for a heat sink cover in a mounting process, comprising the following steps: an incoming material suction and release module transports an incoming material carrier with a heat sink cover from an incoming material carrier slide to an incoming material rack; a transport module places the heat sink cover on a cleaning platform with the bonding surface kept in the negative direction; a transport module places the heat sink cover on a feeding carrier with the bonding surface kept in the negative direction; a feeding material suction and release module places the feeding carrier and the heat sink cover on the feeding carrier slide simultaneously.

[0020] In summary, the present application includes at least one of the following beneficial technical effects: 1. Through the production line transportation, the heat sink placed on the incoming material carrier is transported to the incoming material platform. The heat sink is placed on the cleaning platform through the transportation module. The bonding surface of the heat sink is bombarded by the jet plasma flame. The hydrophilicity of the heat sink is improved through chemical and physical reactions, and the contact angle is reduced. At the same time, after the treatment is completed, the bonding surface is always kept facing down to minimize the possibility of re-contamination during the transportation process, and it is placed on the feeding carrier; 2. The glue spreading area is increased, which increases the tensile force of the heat dissipation cover of the product, realizes a more effective combination of the heat dissipation cover and the substrate, and reduces the possibility of delamination of the heat dissipation cover; 3. Reduce the scrapping of heat dissipation covers, reduce costs and improve product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of the structure of Example 1 of the present application; Figure 2 It is a schematic diagram of the structure of the heat dissipation cover, which is used to show the joint surface; Figure 3 is a top view of Example 1 of the present application, used to show the direction of movement; Figure 4 It is a schematic diagram of the structure of the incoming material rack and the incoming material carrier in Example 1 of the present application; Figure 5 It is a structural schematic diagram of the feeding rack and the feeding carrier in Example 1 of the present application; Figure 6 It is a schematic diagram of the structure of the feeding rack and the blocking rack in Example 2 of the present application; Figure 7 It is a partial vertical cross-sectional schematic diagram of the feeding rack and the barrier rack in Example 2 of the present application, used to show the air barrier surface; Figure 8 is a partial cross-sectional view of the barrier frame in Example 2 of the present application; Fig. 9is a cross-sectional view of the feeding rack and the barrier rack in Example 2 of the present application, used to show the gas flow direction; Fig.10 It is another cross-sectional view of the feeding rack and the barrier rack in Example 2 of the present application, used to show the suction cylinder.

[0022] Explanation of the reference numerals in the accompanying drawings: 100, heat dissipation cover; 110, bonding surface; 111, incoming material platform; 112, feeding material platform; 113, incoming material suction and release module; 114, feeding material suction and release module; 115, incoming material carrier slide; 116, feeding material carrier slide; 117, processing limit groove; 120, handling module; 130, cleaning platform; 131, processing plane; 141, incoming material rack; 142, incoming material carrier; 143, incoming material limit groove; 144, feeding material rack; 145, feeding material carrier; 146, feeding limit groove; 150, barrier rack; 151, air inlet; 152, air outlet; 153, air barrier surface; 154, first air duct; 155, second air duct; 156, third air duct; 158, suction cylinder. DETAILED DESCRIPTION

[0023] The present application is further described in detail below in conjunction with the accompanying drawings.

[0024] Example 1: Reference Figure 1 , Figure 2 Embodiment 1 of the present application discloses a processing device suitable for a heat sink cover in a mounting process, including an incoming material platform 111 and a feeding material platform 112, an incoming material suction and release module 113 and a feeding material suction and release module 114, an incoming material carrier slide 115 and a feeding material carrier slide 116, and a transport module 120. A cleaning platform 130 is provided between the incoming material platform 111 and the feeding material platform 112, and the cleaning platform 130 has a processing plane 131 for processing the bonding surface 110 of the heat sink cover 100.

[0025] Specifically, the cleaning method in this embodiment is plasma cleaning. During the replacement of the carrier on the lower side of the heat dissipation cover 100, a radio frequency plasma cleaning machine is used for operation. The plasma cleaning machine bombards the bonding surface 110 of the heat dissipation cover 100 with a jet plasma flame to process the bonding surface 110 of the heat dissipation cover 100.

[0026] After the chemical reaction and physical reaction of the plasma, the bonding surface 110 of the heat dissipation cover 100 can achieve the effect of removing pollutants by etching, thereby achieving excellent hydrophilicity.

[0027] The cleaning function is mainly to remove weak bonds, CH-based organic contaminants and oxides. The characteristics of this operation are: it only acts on the surface without corroding the inside, obtaining an ultra-high clean surface and preparing for the next process.

[0028] The activation effect is mainly to form carbonyl, carboxyl and hydroxyl groups on the surface. This group has a stable function and has a positive effect on hydrophilic bonding to replace weak bonds. The operation characteristics are: increasing the surface energy. For polymers, the low surface energy leads to poor bonding performance. Then plasma increases the surface energy and changes the chemical properties of the surface to enhance the surface adhesion and bonding force.

[0029] Among them, etching, part of the treatment is also called roughening. Etching is to use a typical gas combination to form a gas-phase plasma with strong etching properties to react chemically with the organic matrix on the surface of the object to generate other gases such as C0, C02, H20, etc., so as to achieve the purpose of concave etching. Roughening usually uses inert gas to bombard the surface of the material to achieve the roughening effect. The characteristics of etching are uniform etching, no damage to the workpiece matrix, and effective removal of surface dirt to achieve an ideal etching degree.

[0030] In this embodiment, the vertical upward direction is defined as the positive direction, and the vertical downward direction is defined as the negative direction. The processing plane 131 is kept facing the positive direction. The transport module 120 is used to transport the heat dissipation cover 100 to the incoming material platform 111, the cleaning platform 130, and the feeding platform 112 in sequence, and the transport module 120 keeps the heat dissipation cover 100 The bonding surface 110 is set in the negative direction.

[0031] Figure 3 In this embodiment, the transport module 120 is a suction cup module that slides horizontally along the frame, and its movement path direction is X, and its travel passes through the incoming material platform 111, the cleaning platform 130, and the feeding platform 112. The incoming material suction and release module 113 and the feeding material suction and release module 114 are also suction cup modules that slide horizontally along the frame, and their movement path direction is X. The incoming material platform 111 and the feeding platform 112 are along the movement path direction Y on the frame, and the Y direction is perpendicular to X. Among them, the suction cup module can be lifted and lowered in the vertical direction and rotated in the horizontal direction, which will not be repeated here.

[0032] Reference Figure 1 , Figure 4 , Figure 5 The feeding platform 112 includes a feeding rack 144 and a feeding carrier 145. The feeding rack 144 is provided with a plurality of feeding limit slots 146 for placing the feeding carrier 145. The incoming material platform 111 includes an incoming material rack 141 and an incoming material carrier 142. The incoming material rack 141 is provided with a plurality of incoming material limit slots 143 for placing the incoming material carrier 142. In this embodiment, there are four feeding limit slots 146 and four incoming material limit slots 143.

[0033] Reference Figure 1After the transport module 120 absorbs the heat dissipation cover 100, it moves to the upper side of the cleaning platform 130 and is embedded in the cleaning platform 130 in the vertical direction. Specifically, the cleaning platform 130 has a processing limit groove 117, and the front end of the transport module 120 is located in the processing limit groove 117. Then the cleaning platform 130 cleans the bonding surface 110 of the heat dissipation cover 100 located in the processing platform. The processing process is located inside the cleaning platform 130. At the same time, the cleaning platform 130 will move inside according to the specific position of the heat dissipation cover 100 to achieve a uniform processing effect.

[0034] Before the plasma treatment, the contact angle of the bonding surface 110 of the heat dissipation cover 100 is large and the surface free energy is small, which has poor hydrophilicity. After the plasma treatment, the contact angle will increase, and the surface free energy will increase, which will have good hydrophilicity. After the heat dissipation cover 100 is plasma cleaned by the processing platform, the chemical properties of the bonding surface 110 of the heat dissipation cover 100 can be changed to enhance the surface adhesion and bonding force, while the heat dissipation cover 100 substrate will not be damaged, and the surface dirt can be effectively removed.

[0035] In the subsequent process of attaching the cover, the glue spreading area is increased, so that the heat sink tension of the product is increased, and the heat sink 100 is more effectively combined with the substrate to avoid the heat sink from being delaminated. By transporting and replacing the carrier by the transport module 120, the possibility of scrapping the heat sink 100 can be effectively reduced, the cost can be reduced, and the product yield can be improved.

[0036] Embodiment 2 is different from Embodiment 1 in that, referring to Figure 6 , Figure 7 A barrier frame 150 is provided on the upper side cover of the feeding frame 144, and there is only one feeding limit groove 146 on the feeding frame 144. The barrier frame 150 is frame-mounted, and an air inlet 151 and an air outlet 152 are provided in the barrier frame 150 in the horizontal direction. The air inlet 151 and the air outlet 152 are on the opposite sides, and the gas flows from the air inlet 151 to the air outlet 152 to form an air barrier surface 153 covering the upper side of the feeding limit groove 146.

[0037] In the second embodiment, the thickness of the feed carrier 145 is greater than the thickness of the feed rack 144, but the thickness of the feed carrier 145 is less than the overall thickness of the feed rack 144 and the barrier rack 150, and the air inlet 151 and the air outlet 152 are located on the upper side of the feed carrier 145, so that the air blocking surface 153 is located on the upper side of the feed carrier 145. During the air flow, the air sealing effect on the upper side of the feed carrier 145 is formed to reduce the possibility of impurities falling. At the same time, when the processed heat dissipation cover 100 moves toward the feed carrier 145, the air blocking surface 153 will not have any effect. When the cover is closed on the feed carrier 145, the air in the air inlet 151 stops flowing.

[0038] Reference Figure 8 , Fig. 9 Specifically, the barrier frame 150 has a first air channel 154 and a second air channel 155 inside, wherein the first air channel 154 takes in air through a hose and can also slide with the feeding frame 144, the first air channel 154 is connected to the air inlet 151, and the second air channel 155 is connected to the air outlet 152 through the third air channel 156. The flowing gas in the second air channel 155 forms a pressure difference at both ends of the third air channel 156, so that the air outlet 152 is exhausted. Finally, the air is exhausted to the outside through the second air channel 155.

[0039] Reference Figure 8 , Fig.10 , a reinforcement is provided on the barrier frame 150, and the reinforcement includes a suction cylinder 158 provided in the barrier frame 150, one end of the suction cylinder 158 is used to contact and absorb the feeding carrier 145, and the other end of the suction cylinder 158 is connected to the second air channel 155, and the end of the suction cylinder 158 close to the second air channel 155 is a negative pressure point. The height of the feeding carrier 145 is higher than the feeding frame 144, so it will extend to the suction cylinder 158, and the suction cylinder 158 is located at the lower side of the air blocking surface 153. The diameter of the second air channel 155 can cover one side of the suction cylinder 158 and the third air channel 156, so that the same air source can form the effect of fixing the feeding carrier 145 and forming the air blocking surface 153.

[0040] Based on Example 2, the present application also discloses a processing method suitable for a heat sink cover in a mounting process, comprising the following steps: Step 1, the incoming material suction and placement module 113 transports the incoming material carrier 142 with the heat sink cover 100 from the incoming material carrier slide 115 to the incoming material rack 141; Step 2, the conveying module 120 places the heat sink cover 100 on the cleaning platform 130 with the bonding surface 110 in the negative direction; Step 3, the conveying module 120 places the heat sink cover 100 on the feeding carrier 145 with the bonding surface 110 in the negative direction; Step 4, the feeding suction and placement module 114 places the feeding carrier 145 and the heat sink cover 100 on the feeding carrier slide 116 simultaneously.

[0041] Before step 3, you also have: Step 2.1, the feeding platform 112 moves along the Y direction to the bottom of the feeding suction and placement module 114, and the feeding suction and placement module 114 places the feeding carrier 145 on the feeding platform 112.

[0042] Step 2.2, the feeding platform 112 moves toward the transport module 120 along the Y direction and moves to the bottom of the transport module 120. During the movement, the air barrier surface 153 remains in place, and the system fixes the feeding carrier 145. When the heat sink 100 is placed on the feeding carrier 145, the gas in the first air channel 154 stops being transported. When the feeding carrier 145 is facing the bonding surface 110 of the heat sink 100, it can be kept clean through the air barrier surface 153 during the movement, and the distance that the processed heat sink 100 moves in the air can be shortened, thereby further reducing the possibility of secondary contamination.

[0043] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A processing device for a heat dissipation cover in a mounting process, characterized in that: The invention comprises a material incoming platform (111) and a material feeding platform (112), wherein a cleaning platform (130) is arranged between the material incoming platform (111) and the material feeding platform (112), wherein the cleaning platform (130) has a processing plane (131) for processing a bonding surface (110) of a heat dissipation cover (100), wherein the processing plane (131) is arranged in a positive direction; and further comprises a transport module (120), wherein the transport module (120) is arranged to transport the heat dissipation cover (100) to the material incoming platform (111), the cleaning platform (130), and the material feeding platform (112) in sequence, wherein the transport module (120) keeps the bonding surface (110) of the heat dissipation cover (100) arranged in a negative direction.

2. A processing device for heat dissipation cover in mounting process according to claim 1, characterized in that: The feeding platform (112) comprises a feeding frame (144) and a feeding carrier (145), and the feeding frame (144) is provided with a plurality of feeding limit slots (146) for the feeding carrier (145) to be placed.

3. A processing device for heat dissipation cover in mounting process according to claim 2, characterized in that: The incoming material platform (111) comprises an incoming material rack (141) and an incoming material carrier (142), and the incoming material rack (141) is provided with a plurality of incoming material limiting grooves (143) for the incoming material carrier (142) to be placed.

4. The processing device for heat dissipation cover in mounting process according to claim 3, characterized in that: The upper cover of the feeding frame (144) is provided with a barrier frame (150), and an air inlet (151) and an air outlet (152) are provided in the barrier frame (150) in a horizontal direction, and gas flows from the air inlet (151) to the air outlet (152) to form an air barrier surface (153) covering the upper side of the feeding limit groove (146).

5. The processing device for heat dissipation cover in mounting process according to claim 4, characterized in that: The barrier frame (150) has a first air duct (154) and a second air duct (155) inside, the first air duct (154) is connected to the air inlet duct (151), the second air duct (155) is connected to the air outlet duct (152) via a third air duct (156), and the flowing gas in the second air duct (155) forms a pressure difference at both ends of the third air duct (156), so that the air outlet duct (152) is exhausted.

6. The device for processing a heat dissipation cover in a mounting process according to claim 5, characterized in that: The barrier frame (150) is provided with a reinforcement member, and the reinforcement member includes a suction cylinder (158) arranged in the barrier frame (150), one end of the suction cylinder (158) is used to contact and absorb the feeding carrier (145), and the other end of the suction cylinder (158) is connected to the second air channel (155), and the end of the suction cylinder (158) close to the second air channel (155) is a negative pressure point.

7. The processing device for heat dissipation cover in mounting process according to claim 6, characterized in that: The thickness of the feeding carrier (145) is greater than the thickness of the feeding rack (144).

8. The device for processing a heat dissipation cover in a mounting process according to claim 7, characterized in that: The feeding platform (112) has a horizontal movement stroke towards the transport module (120).

9. The device for processing a heat dissipation cover in a mounting process according to claim 8, characterized in that: It also includes an incoming material suction and placement module (113) and a feeding material suction and placement module (114), and also includes an incoming material carrier slide (115) and a feeding material carrier slide (116). The incoming material suction and placement module (113) is used to transport the incoming material carrier (142) from the incoming material carrier slide (115) to the incoming material rack (141), and the feeding material suction and placement module (114) is used to transport the feeding material carrier (145) from the feeding material carrier slide (116) to the feeding rack (144).

10. A processing method for the heat dissipation cover processing device in the mounting process according to claim 9, characterized in that: The following steps are involved: The incoming material suction and placement module (113) transports the incoming material carrier (142) with the heat dissipation cover (100) from the incoming material carrier slide (115) to the incoming material rack (141); the transport module (120) places the heat dissipation cover (100) on the cleaning platform (130) while keeping the bonding surface (110) in the negative direction; the transport module (120) places the heat dissipation cover (100) on the feeding carrier (145) while keeping the bonding surface (110) in the negative direction; and the feeding material suction and placement module (114) synchronously places the feeding carrier (145) and the heat dissipation cover (100) on the feeding carrier slide (116).

Images