Automatic silicon wafer separating and transferring equipment

Abstract

The invention discloses automatic silicon wafer separating and transferring equipment, which is characterized in that cut silicon wafers are separated from a top support by using a silicon wafer separating assembly, independent silicon wafers are screened and loaded into a second silicon wafer basket by using a silicon wafer feeding assembly, and the silicon wafers are separated from the top support by using a silicon wafer feeding assembly. According to the silicon wafer cleaning, separating, screening, loading and transferring device, the second silicon wafer basket loaded with the silicon wafers is transferred to the next processing procedure, in the production process of the silicon wafers, automatic treatment is used in the whole process, the silicon wafers are cleaned, separated, screened, loaded and transferred, the automation degree is high, manpower resources are saved, and the production efficiency of the silicon wafers is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production, and in particular to an automatic silicon wafer separation and transportation device. Background Art

[0002] With the development of semiconductor technology, the demand for silicon wafers is increasing. In the current silicon wafer production method, silicon wafers are usually obtained by cutting silicon rods. The silicon rods need to be glued together with the top support and placed in the silicon wafer basket, and then the silicon rods need to be cut. After the cutting is completed, the silicon wafers need to be separated from the top support so that the silicon wafers obtained by cutting can be processed in the next step. Therefore, there are many processing steps, and silicon wafer production is usually loaded using silicon wafer baskets, so high-intensity handling is required. If manual handling is used, it will consume a lot of manpower. Summary of the invention

[0003] In order to overcome the above-mentioned shortcomings, the purpose of the present invention is to provide an automatic silicon wafer separation and transfer equipment, which separates the cut silicon wafer from the top support by using a silicon wafer separation component, and uses a silicon wafer loading component to screen and load the individual silicon wafers into a second silicon wafer basket, and uses the basket loading component to transfer the second silicon wafer basket loaded with silicon wafers to the next processing step. In the production process of silicon wafers, automated processing is used throughout the entire process to complete the cleaning, separation, screening, loading and transfer of silicon wafers. It has a high degree of automation, saves human resources, and greatly improves the production efficiency of silicon wafers.

[0004] In order to achieve the above purpose, the technical solution adopted by the present invention is: an automatic silicon wafer separation and transportation device, comprising: A silicon wafer separation assembly, the silicon wafer separation assembly comprising a spray pool, a degumming pool and a cleaning pool arranged side by side along a second direction; A silicon wafer loading assembly, wherein the silicon wafer loading assembly and the silicon wafer separation assembly are arranged side by side along a first direction, the silicon wafer loading assembly comprises a silicon wafer transport device and a silicon wafer loading device, the silicon wafer transport device and the silicon wafer loading device are arranged side by side along the first direction, the silicon wafer transport device is arranged at one end of the silicon wafer loading device close to the silicon wafer separation assembly, the silicon wafer transport device comprises a first conveyor belt extending along the first direction, and the silicon wafer loading device comprises a screening element, and the screening element is connected to the first conveyor belt; A flower basket loading assembly, wherein the flower basket loading assembly is connected to the silicon wafer loading assembly, and the flower basket loading assembly comprises a first guide beam, a second guide beam and a third guide beam, wherein the first guide beam extends along a first direction, the second guide beam extends along a second direction, the second guide beam is arranged on the first guide beam, the third guide beam extends along a third direction, and the third guide beam is arranged on the second guide beam.

[0005] In this technical solution, the silicon wafer separation component cleans the silicon wafer basket by using a spray tank to remove dust generated by cutting the silicon wafers, separates the silicon wafers from the top support by using a degumming tank, and cleans the degummed silicon wafers by using a cleaning tank; the silicon wafer loading component transports the loose silicon wafers to the silicon wafer processing device by using a first conveyor belt, and removes the defective silicon wafers by using a screening element; the basket loading component uses a first guide beam to enable the second silicon wafer basket loaded with silicon wafers to move along the length direction of the first guide beam, the second guide beam facilitates the movement of the second silicon wafer basket along the length direction of the second guide beam, and the third guide beam is used to lift and put down the second silicon wafer basket to complete the transfer processing of the second silicon wafer basket.

[0006] In some embodiments, the automatic silicon wafer separation and transfer equipment also includes a basket drive assembly, which is arranged on the upper side of the silicon wafer separation assembly and the silicon wafer loading assembly, and the basket drive assembly includes a first crossbeam, a second crossbeam and a vertical beam, the first crossbeam extends along a first direction, the second crossbeam extends along a second direction, the vertical beam extends along a third direction, the second crossbeam is arranged on the first crossbeam, and the vertical beam connects the second crossbeam.

[0007] In this technical solution, the flower basket driving assembly is used to drive the first silicon wafer flower basket loaded with the top support, the first crossbeam is used to guide the movement of the first silicon wafer flower basket along the first direction, the second crossbeam is used to guide the movement of the first silicon wafer flower basket along the second direction, and the third crossbeam is used to guide the movement of the second silicon wafer flower basket along the third direction.

[0008] In some embodiments, the flower basket drive assembly also includes a first drive device, a second drive device and a third drive device, the second drive device is fixedly connected to the third drive device, the second crossbeam is arranged on the first crossbeam through the first drive device, and the vertical beam is arranged on the second crossbeam through the second drive device and the third drive device.

[0009] In this technical solution, the first driving device is used to drive the second crossbeam to move along the length direction of the first crossbeam, the second driving device is used to drive the vertical beam to move along the length direction of the second crossbeam, and the third driving device is used to drive the vertical beam to move along the third direction.

[0010] In some embodiments, the first driving device includes a first driving ruler extending along the length direction of the first horizontal beam and a first driving gear engaged with the first driving ruler, the second driving device includes a second driving ruler extending along the length direction of the second horizontal beam and a second driving gear engaged with the second driving ruler, the third driving device includes a third driving ruler extending along the length direction of the vertical beam and a second driving gear engaged with the third driving ruler, the first driving ruler is fixed to the first horizontal beam, the second driving ruler is fixed to the second horizontal beam, and the third driving ruler is fixed to the vertical beam.

[0011] In this technical solution, the first driving ruler and the first driving gear move along the length direction of the first driving ruler through the movement of the first driving gear, the second driving ruler and the second driving gear move along the length direction of the second driving ruler through the movement of the second driving gear, and the third driving ruler and the third driving gear move along the length direction of the third driving ruler through the movement of the third driving gear.

[0012] In some embodiments, the silicon wafer transport device further includes a loading box, and the first conveyor belt is disposed in the loading box.

[0013] In this technical solution, the loading box is used to load and remove the first silicon wafer basket of the top support, so as to place the silicon wafer on the first conveyor belt, and use the first conveyor belt to transport the silicon wafer to the silicon wafer loading device.

[0014] In some embodiments, the silicon wafer loading device further includes a flower basket lifting assembly, wherein the flower basket lifting assembly is disposed at a lower side of the flower basket loading assembly, and the flower basket lifting assembly is disposed at an end of the screening element away from the first conveyor belt.

[0015] In this technical solution, the basket lifting assembly is used to lift the second silicon wafer basket, so as to cooperate with the screening component to load the silicon wafers with qualified quality after inspection into the second silicon wafer basket.

[0016] In some embodiments, the flower basket loading assembly further includes a fourth drive device, a fifth drive device and a sixth drive device, the second guide beam is arranged on the first guide beam through the fourth drive device, and the third guide beam is arranged on the second guide beam through the fifth drive device and the sixth drive device.

[0017] In this technical solution, the fourth driving device is used to drive the second guide beam to move along the length direction of the first guide beam, the fifth driving device is used to drive the third guide beam to move along the length direction of the second guide beam, and the sixth driving device is used to drive the third guide beam to move along its length direction.

[0018] In some embodiments, the fourth driving device includes a guide rod and a driving wheel extending in a first direction, the driving wheel is provided with a groove body extending in the direction of its circumference, the guide rod is clamped with the driving wheel, the fifth driving device includes a fifth driving ruler extending in the length direction of the second beam body and a fifth driving gear clamped with the fifth driving ruler, the sixth driving device includes a driving track, and one end of the driving track is fixed to the fifth driving device.

[0019] In this technical solution, the guide rod is used to guide the movement of the driving wheel, the driving wheel drives the second guide beam to move, the fifth driving device is used to drive the third guide beam to move along the length direction of the second guide beam, and the sixth driving device is used to drive the third guide beam to move along the third direction.

[0020] In some embodiments, the automatic silicon wafer separation and transfer equipment further includes a lifting and transporting assembly, which is disposed on a side of the silicon wafer separation assembly away from the silicon wafer loading assembly, and the lifting and transporting assembly includes a plurality of rails extending along a first direction.

[0021] In this technical solution, after the silicon wafer is separated from the top support, the top support is transported and processed using a top support transport assembly.

[0022] In some embodiments, the automatic silicon wafer separation and transfer equipment further includes a silicon wafer impact assembly, which is disposed between the jacking and transporting assembly and the silicon wafer separation assembly, and includes an impact end with an upper end and a side opening.

[0023] In this technical solution, when the silicon wafer and the top support are not fully separated, the silicon wafer impact assembly is used to impact with the first silicon wafer basket loaded with the silicon wafer and the top support to separate the silicon wafer and the top support.

[0024] The beneficial effects of the present invention are that the silicon wafers after cutting are separated from the top support by using a silicon wafer separation component, and the individual silicon wafers are screened and loaded into a second silicon wafer basket by using a silicon wafer loading component, and the second silicon wafer basket loaded with silicon wafers is transferred to the next processing step by using the basket loading component. In the production process of silicon wafers, automated processing is used throughout the entire process to complete the cleaning, separation, screening, loading and transportation of silicon wafers, with a high degree of automation, saving human resources, and greatly improving the production efficiency of silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is an overall schematic diagram of an automatic silicon wafer separation and transportation device according to an embodiment of the present invention; Figure 2 It is a schematic top view of an automatic silicon wafer separation and transportation device according to an embodiment of the present invention; Figure 3A schematic top view of a silicon wafer separation component of an automatic silicon wafer separation and transportation device according to an embodiment of the present invention; Figure 4 A schematic diagram of a silicon wafer loading assembly of a silicon wafer automatic separation and transfer device according to an embodiment of the present invention; Figure 5 A schematic top view of a silicon wafer loading device of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention; Figure 6 It is a schematic diagram of a basket loading component of a silicon wafer automatic separation and transportation device according to an embodiment of the present invention; Figure 7 A schematic diagram of the connection relationship of the basket loading components of the silicon wafer automatic separation and transportation equipment according to an embodiment of the present invention; Figure 8 A schematic diagram of a basket driving assembly of a silicon wafer automatic separation and transportation device according to an embodiment of the present invention; Fig. 9 A schematic diagram of the connection relationship of the basket drive components of the silicon wafer automatic separation and transportation equipment according to an embodiment of the present invention; Fig.10 A schematic diagram of a silicon wafer impact assembly of a silicon wafer automatic separation and transfer device according to an embodiment of the present invention; In the figure: 1, silicon wafer separation assembly; 11, spray tank; 12, degumming tank; 13, cleaning tank; 2. Silicon wafer loading assembly; 21. Silicon wafer transport device; 211. First conveyor belt; 212. Loading box; 22. Silicon wafer loading device; 221. Screening element; 2211. Arched transmission device; 2212. Second conveyor belt; 2213. Ejection device; 2214. Detection sensor; 2215. Ejection section; 222. Flower basket lifting assembly; 3. Flower basket loading assembly; 31. First guide beam; 32. Second guide beam; 33. Third guide beam; 341. Guide rod; 342. Driving wheel; 351. Fifth driving ruler; 352. Fifth driving gear; 361. Driving crawler; 4. Flower basket driving assembly; 41. first crossbeam; 42. second crossbeam; 43. vertical beam; 441. first driving ruler; 442. first driving gear; 451. second driving ruler; 461. third driving ruler; 462. second driving gear; 5. Jacking and handling assembly; 51. Track; 6. Silicon wafer impact assembly; 61. Impact end; 62. Collection end; 63. Support frame; x, first direction; y, second direction; z, third direction. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0027] Combined with Figure 1 To Attachment Figure 6 As shown, the present invention provides a silicon wafer automatic separation and transportation device, comprising: A silicon wafer separation component 1, wherein the silicon wafer separation component 1 comprises a spray pool 11, a degumming pool 12 and a cleaning pool 13 arranged side by side along a second direction y, wherein a spray pipe is arranged in the spray pool 11, and a heating plate is arranged in the degumming pool 12 for heating the liquid in the degumming pool 12 to improve the degumming efficiency; A silicon wafer loading assembly, wherein the silicon wafer loading assembly and the silicon wafer separation assembly are arranged side by side along a first direction x, the silicon wafer loading assembly 2 comprises a silicon wafer transporting device 21 and a silicon wafer loading device 22, the silicon wafer transporting device 21 and the silicon wafer loading device 22 are arranged side by side along the first direction x, the silicon wafer transporting device 21 is arranged at one end of the silicon wafer loading device 22 close to the silicon wafer separation assembly 1, the silicon wafer transporting device 21 comprises a first conveyor belt 211 extending along the first direction x, the silicon wafer loading device 22 comprises a screening member 221, and the screening member 221 comprises a An arched transmission device 2211, a second conveyor belt 2212, an ejection device 2213, a detection sensor 2214 and an ejection section 2215, the upper end of the arched transmission component is connected to the second conveyor belt 2212, the ejection section 2215 is arranged between the two second conveyor belts 2212, the ejection section 2215 and the second conveyor belt 2212 are arranged side by side along the first direction x, the ejection device 2213 is arranged at the lower side of the ejection section 2215, the detection sensor 2214 is communicatively connected with the ejection device 2213, and the lower end of the arched transmission device 2211 of the screening element 221 is connected to the first conveyor belt 211; A flower basket loading assembly 3, wherein the flower basket loading assembly 3 is connected to the silicon wafer loading assembly, and the flower basket loading assembly 3 comprises a first guide beam 31, a second guide beam 32 and a third guide beam 33, wherein the first guide beam 31 extends along a first direction x, the second guide beam 32 extends along a second direction y, the second guide beam 32 is arranged on the first guide beam 31, the third guide beam 33 extends along a third direction z, and the third guide beam 33 is arranged on the second guide beam 32.

[0028] The silicon wafer separation component 1 cleans the silicon wafer basket by using the spray pool 11 to remove the dust generated by the cutting of the silicon wafer, separates the silicon wafer from the top support by using the degumming pool 12, and cleans the degummed silicon wafer by using the cleaning pool 13; the silicon wafer loading component transports the loose silicon wafers to the silicon wafer processing device by using the first conveyor belt 211, and removes the defective silicon wafers by using the screening element 221; the basket loading component 3 uses the first guide beam 31 to enable the second silicon wafer basket loaded with silicon wafers to move along the length direction of the first guide beam 31, the second guide beam 32 facilitates the second silicon wafer basket to move along the length direction of the second guide beam 32, and the third guide beam 33 is used to lift and put down the second silicon wafer basket to complete the transportation processing of the second silicon wafer basket.

[0029] Continue to combine Figure 8 As shown, in some embodiments, the automatic silicon wafer separation and transportation equipment also includes a basket drive assembly 4, which is arranged on the upper side of the silicon wafer separation assembly 1 and the silicon wafer loading assembly, and the basket drive assembly 4 includes a first crossbeam 41, a second crossbeam 42 and a vertical beam 43, the first crossbeam 41 extends along a first direction x, the second crossbeam 42 extends along a second direction y, the vertical beam 43 extends along a third direction z, the second crossbeam 42 is arranged on the first crossbeam 41, and the vertical beam 43 connects the second crossbeam 42.

[0030] The flower basket driving assembly 4 is used to drive the first silicon wafer flower basket loaded with the top support, the first crossbeam 41 is used to guide the movement of the first silicon wafer flower basket along the first direction x, the second crossbeam 42 is used to guide the movement of the first silicon wafer flower basket along the second direction y, and the third crossbeam is used to guide the movement of the second silicon wafer flower basket along the third direction z.

[0031] In some embodiments, the flower basket drive assembly 4 also includes a first drive device, a second drive device and a third drive device, the second drive device is fixedly connected to the third drive device, the second crossbeam 42 is arranged on the first crossbeam 41 through the first drive device, and the vertical beam 43 is arranged on the second crossbeam 42 through the second drive device and the third drive device.

[0032] The first driving device is used to drive the second cross beam 42 to move along the length direction of the first cross beam 41 , the second driving device is used to drive the vertical beam 43 to move along the length direction of the second cross beam 42 , and the third driving device is used to drive the vertical beam 43 to move along the third direction z.

[0033] Continue to combine Fig. 9As shown, in some embodiments, the first driving device includes a first driving ruler 441 extending along the length direction of the first cross beam 41 and a first driving gear 442 engaged with the first driving ruler 441, the second driving device includes a second driving ruler 451 extending along the length direction of the second cross beam 42 and a second driving gear 462 engaged with the second driving ruler 451, the third driving device includes a track, a third driving ruler 461 extending along the length direction of the vertical beam 43 and a second driving gear 462 engaged with the third driving ruler 461, the first driving ruler 441 is fixed to the first cross beam 41, the second driving ruler 451 is fixed to the second cross beam 42, the third driving ruler 461 is fixed to the vertical beam 43, one end of the track is fixed to the third driving device, and the other end of the track is arranged at the lower end of the vertical beam 43.

[0034] The first driving ruler 441 and the first driving gear 442 move along the length direction of the first driving ruler 441 through the movement of the first driving gear 442, the second driving ruler 451 and the second driving gear 462 move along the length direction of the second driving ruler through the movement of the second driving gear 462, and the third driving ruler 461 and the third driving gear move along the length direction of the third driving ruler 461 through the movement of the third driving gear.

[0035] Continue to combine Figure 4 and attached Figure 5 As shown, in some embodiments, the silicon wafer transport device 21 also includes a loading box 212, and the first conveyor belt 211 is arranged in the loading box 212. The loading box 212 is used to load and remove the first silicon wafer basket of the top support, so as to place the silicon wafer on the first conveyor belt 211, and use the first conveyor belt 211 to transport the silicon wafer to the silicon wafer loading device 22.

[0036] In some embodiments, the silicon wafer loading device 22 also includes a basket lifting assembly 222, which is disposed on the lower side of the basket loading assembly 3, and the basket lifting assembly 222 is disposed at an end of the screening element 221 away from the first conveyor belt 211. The basket lifting assembly 222 is used to lift the second silicon wafer basket, thereby cooperating with the screening element 221 to load the qualified silicon wafers after inspection into the second silicon wafer basket.

[0037] In some embodiments, the flower basket loading assembly 3 also includes a fourth drive device, a fifth drive device and a sixth drive device, the second guide beam 32 is arranged on the first guide beam 31 through the fourth drive device, and the third guide beam 33 is arranged on the second guide beam 32 through the fifth drive device and the sixth drive device.

[0038] The fourth driving device is used to drive the second guide beam 32 to move along the length direction of the first guide beam 31, the fifth driving device is used to drive the third guide beam 33 to move along the length direction of the second guide beam 32, and the sixth driving device is used to drive the third guide beam 33 to move along its length direction.

[0039] Continue to combine Figure 7 As shown, in some embodiments, the fourth driving device includes a guide rod 341 and a driving wheel 342 extending along the first direction x, the driving wheel 342 is provided with a groove extending along its circumference direction, the guide rod 341 is clamped with the driving wheel 342, the fifth driving device includes a fifth driving ruler 351 extending along the length direction of the second beam body and a fifth driving gear 352 clamped with the fifth driving ruler 351, the sixth driving device includes a driving track 361, and one end of the driving track 361 is fixed to the fifth driving device.

[0040] The guide rod 341 is used to guide the movement of the driving wheel 342, the driving wheel 342 drives the second guide beam 32 to move, the fifth driving device is used to drive the third guide beam 33 to move along the length direction of the second guide beam 32, and the sixth driving device is used to drive the third guide beam 33 to move along the third direction z.

[0041] Continue to combine Figure 1 and attached Figure 2 As shown, in some embodiments, the automatic silicon wafer separation and transfer equipment also includes a jacking support transport assembly 5, which is arranged on a side of the silicon wafer separation assembly 1 away from the silicon wafer loading assembly, and the jacking support transport assembly 5 includes a plurality of rails 51 extending along a first direction x, and the cart can move along the rails 51. After the silicon wafer is separated from the jacking support, the jacking support transport assembly 5 is used to transport the jacking support.

[0042] Continue to combine Figure 1 and attached Fig.10 As shown, in some embodiments, the automatic silicon wafer separation and transportation equipment also includes a silicon wafer impact assembly 6, which is arranged between the top support conveying assembly 5 and the silicon wafer separation assembly 1, and the silicon wafer impact assembly 6 includes an impact end 61 with upper and side openings. When the silicon wafer and the top support are not fully separated, the silicon wafer impact assembly 6 is used to collide with the first silicon wafer basket loaded with the silicon wafer and the top support to separate the silicon wafer from the top support. The silicon wafer impact assembly 6 also includes a collecting end 62 and a supporting frame 63. The collecting end 62 is arranged on the lower side of the impact end 61, and the collecting end 62 is connected to the collecting end 62, and the collecting end 62 is arranged in the supporting frame 63.

[0043] In summary, the present invention provides an automatic silicon wafer separation and transfer equipment, which uses a silicon wafer separation component to separate the cut silicon wafer from the top support, and uses a silicon wafer loading component to screen and load the individual silicon wafers into a second silicon wafer basket, and uses the basket loading component to transfer the second silicon wafer basket loaded with silicon wafers to the next processing step. In the production process of silicon wafers, automated processing is used throughout the entire process to complete the cleaning, separation, screening, loading and transfer of silicon wafers, with a high degree of automation, saving human resources, and greatly improving the production efficiency of silicon wafers.

[0044] The above implementation modes are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon wafer automatic separation and transportation device, characterized in that: include: A silicon wafer separation assembly, the silicon wafer separation assembly comprising a spray pool, a degumming pool and a cleaning pool arranged side by side along a second direction; A silicon wafer loading assembly, wherein the silicon wafer loading assembly and the silicon wafer separation assembly are arranged side by side along a first direction, the silicon wafer loading assembly comprises a silicon wafer transport device and a silicon wafer loading device, the silicon wafer transport device and the silicon wafer loading device are arranged side by side along the first direction, the silicon wafer transport device is arranged at one end of the silicon wafer loading device close to the silicon wafer separation assembly, the silicon wafer transport device comprises a first conveyor belt extending along the first direction, and the silicon wafer loading device comprises a screening element, and the screening element is connected to the first conveyor belt; A flower basket loading assembly, wherein the flower basket loading assembly is connected to the silicon wafer loading assembly, and the flower basket loading assembly comprises a first guide beam, a second guide beam and a third guide beam, wherein the first guide beam extends along a first direction, the second guide beam extends along a second direction, the second guide beam is arranged on the first guide beam, the third guide beam extends along a third direction, and the third guide beam is arranged on the second guide beam.

2. The automatic silicon wafer separation and transportation equipment according to claim 1, characterized in that: It also includes a flower basket drive component, which is arranged on the upper side of the silicon wafer separation component and the silicon wafer loading component. The flower basket drive component includes a first crossbeam, a second crossbeam and a vertical beam. The first crossbeam extends along a first direction, the second crossbeam extends along a second direction, and the vertical beam extends along a third direction. The second crossbeam is arranged on the first crossbeam, and the vertical beam connects the second crossbeam.

3. The automatic silicon wafer separation and transportation equipment according to claim 2, characterized in that: The flower basket driving assembly also includes a first driving device, a second driving device and a third driving device, the second driving device is fixedly connected to the third driving device, the second crossbeam is arranged on the first crossbeam through the first driving device, and the vertical beam is arranged on the second crossbeam through the second driving device and the third driving device.

4. The automatic silicon wafer separation and transportation equipment according to claim 3, characterized in that: The first driving device includes a first driving ruler extending along the length direction of the first cross beam and a first driving gear engaged with the first driving ruler; the second driving device includes a second driving ruler extending along the length direction of the second cross beam and a second driving gear engaged with the second driving ruler; the third driving device includes a third driving ruler extending along the length direction of the vertical beam and a second driving gear engaged with the third driving ruler; the first driving ruler is fixed to the first cross beam, the second driving ruler is fixed to the second cross beam, and the third driving ruler is fixed to the vertical beam.

5. The automatic silicon wafer separation and transportation equipment according to claim 1, characterized in that: The silicon wafer transport device also includes a loading box, and the first conveyor belt is arranged in the loading box.

6. The automatic silicon wafer separation and transportation equipment according to claim 1, characterized in that: The silicon wafer loading device further comprises a flower basket lifting assembly, wherein the flower basket lifting assembly is arranged at the lower side of the flower basket loading assembly, and the flower basket lifting assembly is arranged at an end of the screening element away from the first conveyor belt.

7. The automatic silicon wafer separation and transportation equipment according to claim 1, characterized in that: The flower basket feeding assembly also includes a fourth driving device, a fifth driving device and a sixth driving device. The second guide beam is arranged on the first guide beam through the fourth driving device, and the third guide beam is arranged on the second guide beam through the fifth driving device and the sixth driving device.

8. The automatic silicon wafer separation and transportation equipment according to claim 7, characterized in that: The fourth driving device includes a guide rod and a driving wheel extending in a first direction, the driving wheel is provided with a groove body extending in a circumference direction thereof, the guide rod is engaged with the driving wheel, the fifth driving device includes a fifth driving ruler extending in a length direction of the second beam body and a fifth driving gear engaged with the fifth driving ruler, the sixth driving device includes a driving crawler, one end of the driving crawler is fixed to the fifth driving device.

9. The automatic silicon wafer separation and transportation equipment according to claim 1, characterized in that: It also includes a lifting and transporting assembly, which is arranged on a side of the silicon wafer separation assembly away from the silicon wafer loading assembly, and includes a plurality of rails extending along a first direction.

10. The automatic silicon wafer separation and transportation equipment according to claim 9, characterized in that: It also includes a silicon wafer impact assembly, which is arranged between the lifting and transporting assembly and the silicon wafer separation assembly, and includes an upper end and a side opening impact end.

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