Double-sided boss metal PCB (Printed Circuit Board) resin plug rubber
By using the double-sided boss metal PCB resin plugging process during the processing of metal PCB boards, combined with the reaction of vacuum plug resin and copper-deposited chemical potion, the problems of uneven working plate surfaces and no copper in the holes in the traditional process are solved, and efficient and low-cost metal PCB board processing is achieved.
Patent Information
- Application Number
- CN202311074179.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-24
- Publication Date
- 2025-03-04
AI Technical Summary
During the processing of metal PCB boards, the traditional resin plugging process leads to uneven working plate surfaces, which increases processing costs and reduces the pass rate of finished products. At the same time, inadequate control of the reaction of copper deposited chemical potion may lead to the problem of not having copper on the pores and the resin layer.
The double-sided boss metal PCB resin plugging process is adopted. Through the vacuum plug resin method of pressing first and then drilling, combined with the reaction of copper deposited chemical potion, the resin hole wall, the resin hole disk and the copper foil on the surface of the substrate are connected.
Improve production efficiency, reduce production costs, avoid uneven working boards and CNC processing of protruding resins, and ensure high quality and pass rate of finished products.
Smart Images
Figure CN119562442A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of metal PCB board processing, in particular to a double-sided boss metal PCB resin plug. Background Art
[0002] PCB, Chinese name for printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called a "printed" circuit board. Due to the continuous development towards high precision, high density and high reliability, the continuous reduction in size, reduction in cost and improvement in performance, the printed circuit board still maintains a strong vitality in the development of future electronic equipment. In the process of metal PCB board processing, a resin plugging process is required to connect the resin hole wall with the resin surface and the substrate copper foil together.
[0003] The traditional processing method is to vacuum plug the resin and then etch it. The resin will bulge out and need to be processed by CNC before pressing. The resin bulges out and the working board is uneven. In the CNC process, it is uneven and wavy. After pressing, the working board surface will be uneven, which will increase the processing cost and reduce the qualified rate of finished products. If it is not properly controlled, it will easily lead to poor product quality. In addition, through the vacuum plugging tree finger process, a copper deposition chemical solution reaction method is carried out on the resin surface to connect the resin hole wall with the resin surface and the substrate copper foil. If the copper deposition chemical solution reaction method is not properly controlled, it may cause the hole and the resin layer to not be coppered. For this reason, we propose a double-sided boss metal PCB resin plug. Summary of the invention
[0004] In view of the deficiencies in the prior art, the present invention provides a double-sided boss metal PCB resin plugging glue, which solves the problems raised in the above background technology.
[0005] To achieve the above objectives, the present invention is implemented by the following technical scheme: a double-sided boss metal PCB resin plugging, the double-sided boss metal PCB resin plugging comprising the following specific steps: (1) Cutting of metal substrate The process of cutting and dividing the large metal substrate sheet of uniform specifications into the actual use size according to the actual drawing size, that is, the PCB copper plate; (2) One-time drilling Use an automatic positioning drilling machine to drill a hole in the PCB copper plate, i.e., the alignment hole, to facilitate the subsequent secondary drilling; (3) Plug hole and fill with glue Then, the plugging and filling operation is carried out, and insulating resin glue is poured into the inside of the alignment hole. The vacuum plugging and filling resin process is used during the plugging. (4) Boss processing Process the double-sided bosses on the PCB copper plate, i.e., the front bosses and the back bosses. First, process the boss graphics, and then operate according to the double-sided boss etching process parameters; (5) Drying and glue removal Then the baking plate is dried and the surface glue is removed. After drying, the surface of the insulating resin glue is grinded by a brush roller to remove burrs and remove the insulating resin glue protruding from the hole. (6) Browning Processing Check the double-sided bosses, and after passing the inspection, perform browning on the PCB copper plate, and operate according to the browning process parameters; (7) Pressing process The PCB copper plate is pressed according to the pressing process parameters. During the pressing operation, a high-conductivity adhesive insulation layer is first pasted on the upper and lower sides of the PCB copper plate in the same direction, and then the PCB copper plate to be pressed is pasted with the prepared front and back copper foil panels and pressed together; (8) Quality inspection After the lamination is completed, the inspection is carried out to screen out unqualified products, so that the lamination materials can not have the bad quality of bump delamination pinhole bubble, and the copper foil panel has no bad phenomenon of delamination, blistering, pinhole, hole notch crack; (9) Secondary drilling After the inspection is qualified, the secondary drilling is carried out to drill the via hole. After the second drilling, the via hole is polished and inspected to ensure that there are no burrs in the hole. Then the insulating resin glue of the via hole is checked to ensure that the insulating resin glue on the via hole mouth on the metal substrate surface is ground clean, flat and uniform, and ensure that the insulating resin glue in the via hole is free of bubbles, pinholes, and cracks.
[0006] Furthermore, the double-sided boss metal PCB resin plugging also includes the following specific steps: (10) PCB pre-processing After the secondary drilling, the copper plating process is started. First, the metal substrate is cleaned, and then copper plating is performed on the hole wall of the via hole to ensure that there is copper at the hole mouth and the resin surface. (11) PCB post-processing Finally, the post-processing PCB is produced, and the top circuit board and the bottom circuit board are added to complete the processing of the resin plug hole of the double-layer boss metal PCB board.
[0007] Furthermore, in the process of plugging the holes with glue in step (3), the weight of the insulating resin glue is 3 g, the viscosity of the insulating resin glue is 830, the vacuum pressure of the vacuum plugging is 30 par, the scraper speed during the vacuum plugging resin process is 300 mm / s, the scraper thickness is 15 mm, and the mesh spacing is 5 mm.
[0008] Furthermore, in the process of processing the boss in step (4), the boss height is equal to the thickness of the panel core (PCB copper plate and high-conductivity adhesive insulation layer) plus the thickness of the copper foil.
[0009] Furthermore, in the process of drying and degumming in step (5), the drying of the baking plate is divided into three processing processes. The drying temperature of the baking plate in the first stage is 90°C and the drying time is 30 minutes. The drying temperature of the baking plate in the second stage is 120°C and the drying time is 30 minutes. The drying temperature of the baking plate in the third stage is 160°C and the drying time is 40 minutes.
[0010] Furthermore, during the pressing process of step (7), the high-conductivity adhesive insulating layer must be adhered tightly without wrinkles, bubbles, or inadequate adhesion.
[0011] Furthermore, in the process of the secondary drilling in step (9), the drilling speed is controlled at 10-90 thousand tons.
[0012] Furthermore, in the step (10), during the PCB pre-processing, the copper thickness of the inner wall of the via hole after copper electroplating is 8-10 microns or more.
[0013] The present invention provides a double-sided boss metal PCB resin plugging glue, which has the following beneficial effects: the double-sided boss metal PCB resin plugging glue adopts a vacuum resin plugging method of first pressing and then drilling, and then copper is plated on the resin surface through a copper plating chemical solution reaction, so that the resin hole wall, the resin hole plate and the copper foil on the surface of the substrate are connected, which solves the problem of complex production process, is conducive to improving production efficiency, reducing production costs, and can avoid the unevenness of the working plate and the protruding resin due to CNC processing at the same time, and the uneven pressing contact surface after CNC processing leads to the problem of increased processing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 The present invention is a schematic diagram of the overall cross-sectional structure of a PCB board with double-sided boss metal PCB resin plugging. Implementation
[0015] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0016] A double-sided boss metal PCB resin plugging method, wherein the double-sided boss metal PCB resin plugging method comprises the following specific steps: (1) Cutting of metal substrate The process of cutting and dividing the large metal substrate sheet of uniform specifications into the actual use size according to the actual drawing size, that is, the PCB copper plate; (2) One-time drilling Use an automatic positioning drilling machine to drill a hole in the PCB copper plate, i.e., the alignment hole, to facilitate the subsequent secondary drilling; (3) Plug hole and fill with glue Then, the plugging and filling operation is carried out, and insulating resin glue is poured into the inside of the alignment hole. The vacuum plugging and filling resin process is used during the plugging. (4) Boss processing Process the double-sided bosses on the PCB copper plate, i.e., the front bosses and the back bosses. First, process the boss graphics, and then operate according to the double-sided boss etching process parameters; (5) Drying and glue removal Then the baking plate is dried and the surface glue is removed. After drying, the surface of the insulating resin glue is grinded by a brush roller to remove burrs and remove the insulating resin glue protruding from the hole. (6) Browning Processing Check the double-sided bosses, and after passing the inspection, perform browning on the PCB copper plate, and operate according to the browning process parameters; (7) Pressing process The PCB copper plate is pressed according to the pressing process parameters. During the pressing operation, a high-conductivity adhesive insulation layer is first pasted on the upper and lower sides of the PCB copper plate in the same direction, and then the PCB copper plate to be pressed is pasted with the prepared front and back copper foil panels and pressed together; (8) Quality inspection After the lamination is completed, the inspection is carried out to screen out unqualified products, so that the lamination materials can not have the bad quality of bump delamination pinhole bubble, and the copper foil panel has no bad phenomenon of delamination, blistering, pinhole, hole notch crack; (9) Secondary drilling After the inspection is qualified, the secondary drilling is carried out to drill the via hole. After the second drilling, the via hole is polished and inspected to ensure that there are no burrs in the hole. Then the insulating resin glue of the via hole is checked to ensure that the insulating resin glue on the via hole mouth on the metal substrate surface is ground clean, flat and uniform, and ensure that the insulating resin glue in the via hole is free of bubbles, pinholes, and cracks.
[0017] Double-sided boss metal PCB resin plugging also includes the following specific steps: (10) PCB pre-processing After the secondary drilling, the copper plating process is started. First, the metal substrate is cleaned, and then copper plating is performed on the hole wall of the via hole to ensure that there is copper at the hole mouth and the resin surface. (11) PCB post-processing Finally, the post-processing PCB is produced, and the top circuit board and the bottom circuit board are added to complete the processing of the resin plug hole of the double-layer boss metal PCB board.
[0018] In step (3), during the process of plugging the holes with glue, the weight of the insulating resin glue is 3 g, the viscosity of the insulating resin glue is 830, the vacuum pressure of the vacuum plugging is 30 par, the scraper speed during the vacuum plugging resin process is 300 mm / s, the scraper thickness is 15 mm, and the mesh spacing is 5 mm.
[0019] During the process of step (4) boss processing, the boss height is equal to the thickness of the panel core (PCB copper plate and high-conductivity adhesive insulation layer) plus the thickness of the copper foil.
[0020] In step (5), during the drying and degumming process, the baking plate drying is divided into three processing processes. The first stage is a baking plate drying temperature of 90°C and a drying time of 30 minutes. The second stage is a baking plate drying temperature of 120°C and a drying time of 30 minutes. The third stage is a baking plate drying temperature of 160°C and a drying time of 40 minutes.
[0021] During step (7), the high-conductivity adhesive insulation layer must be adhered tightly to avoid wrinkles, bubbles, or inadequate adhesion.
[0022] In step (9), during the secondary drilling process, the drilling speed is controlled at 10-90 thousand tons.
[0023] Step (10), during the PCB pre-processing, the copper thickness of the inner wall of the via hole after copper plating is 8-10 microns or more.
[0024] In summary, the double-sided boss metal PCB resin plugging includes the following specific steps when used: (1) Cutting of metal substrate: According to the actual drawing size, the large metal substrate sheet of uniform specifications is cut and divided into the process of meeting the actual use size, that is, PCB copper plate; (2) Primary drilling: Use an automatic positioning drilling machine to drill a hole in the PCB copper plate, i.e., a positioning hole, to facilitate subsequent secondary drilling; (3) Plug hole glue filling: Then the plug hole glue filling operation is carried out, and the insulating resin glue is poured into the inside of the alignment hole. The vacuum plug hole resin process is used when plugging the hole; the weight of the insulating resin glue is 3g, the viscosity of the insulating resin glue is 830, the vacuum pressure of the vacuum plug hole is 30par, the scraper speed during the vacuum plug hole resin process is 300mm / s, the scraper thickness is 15mm, and the mesh distance is 5mm; (4) Boss processing: Process the PCB copper plate into double-sided bosses, i.e., front bosses and back bosses. First, perform boss pattern processing, and then operate according to the double-sided boss etching process parameters; the boss height is equal to the thickness of the panel core (PCB copper plate and high-conductivity adhesive insulation layer) plus the thickness of the copper foil; (5) Drying and degumming: Then the plate is dried and the surface is degummed. The plate drying is divided into three processing processes. The first stage is a drying temperature of 90°C and a drying time of 30 minutes. The second stage is a drying temperature of 120°C and a drying time of 30 minutes. The third stage is a drying temperature of 160°C and a drying time of 40 minutes. After drying, the surface of the insulating resin glue is grinded by a brush roller to remove burrs and remove the insulating resin glue protruding from the hole. (6) Browning processing: Check the double-sided bosses, and after passing the inspection, brown the PCB copper plate according to the processing parameters of browning; (7) Lamination process: Lamination process is performed on the PCB copper plate according to the lamination process parameters. When lamination is performed, a high-conductivity adhesive insulation layer is first pasted on the upper and lower sides of the PCB copper plate in the same direction. When pasting the high-conductivity adhesive insulation layer, it must be tightly pasted without wrinkles, bubbles, or inadequate pasting. Then, the PCB copper plate to be pressed is pasted together with the prepared front and back copper foil panels and then pressed; (8) Quality inspection: After lamination, inspection is carried out to screen out unqualified products, so that the lamination materials do not have the bad quality of convex points, delamination, pinholes, bubbles, and at the same time, the copper foil panel does not have the bad phenomena of delamination, blistering, pinholes, holes, notches, cracks; (9) Secondary drilling: After the inspection is qualified, secondary drilling is carried out. The drilling speed is controlled at 100,000-90,000 tm to drill the via hole. After the second drilling, the via hole is polished and inspected to ensure that there are no burrs in the hole. Then check the insulating resin glue of the via hole to ensure that the insulating resin glue on the via hole mouth of the metal substrate is ground clean and flat, and ensure that there are no bubbles, pinholes, or cracks in the insulating resin glue in the via hole. (10) PCB pre-processing: After the secondary drilling, the copper plating process is performed. First, the metal substrate is cleaned, and then copper plating is performed on the hole wall of the via hole to ensure that there is copper on the hole mouth and the resin surface. After copper plating, the copper thickness of the inner wall of the via hole is 8-10 microns or more. (11) PCB post-processing: Finally, the post-process PCB is produced, and the top circuit board and the bottom circuit board are added to complete the processing of the resin plug hole of the double-layer boss metal PCB board.
[0025] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A double-sided boss metal PCB resin plug, characterized in that: The double-sided boss metal PCB resin plugging method includes the following specific steps: (1) Cutting of metal substrate The process of cutting and dividing the large metal substrate sheet of uniform specifications into the actual use size according to the actual drawing size, that is, the PCB copper plate; (2) One-time drilling Use an automatic positioning drilling machine to drill a hole in the PCB copper plate, i.e., the alignment hole, to facilitate the subsequent secondary drilling; (3) Plug hole and fill with glue Then, the plugging and filling operation is carried out, and insulating resin glue is poured into the inside of the alignment hole. The vacuum plugging and filling resin process is used during the plugging. (4) Boss processing Process the double-sided bosses on the PCB copper plate, i.e., the front bosses and the back bosses. First, process the boss graphics, and then operate according to the double-sided boss etching process parameters; (5) Drying and glue removal Then the baking plate is dried and the surface glue is removed. After drying, the surface of the insulating resin glue is grinded by a brush roller to remove burrs and remove the insulating resin glue protruding from the hole. (6) Browning Processing Check the double-sided bosses, and after passing the inspection, perform browning on the PCB copper plate, and operate according to the browning process parameters; (7) Pressing process The PCB copper plate is pressed according to the pressing process parameters. During the pressing operation, a high-conductivity adhesive insulation layer is first pasted on the upper and lower sides of the PCB copper plate in the same direction, and then the PCB copper plate to be pressed is pasted with the prepared front and back copper foil panels and pressed together; (8) Quality inspection After the lamination is completed, the inspection is carried out to screen out unqualified products, so that the lamination materials can not have the bad quality of bump delamination pinhole bubble, and the copper foil panel has no bad phenomenon of delamination, blistering, pinhole, hole notch crack; (9) Secondary drilling After the inspection is qualified, the secondary drilling is carried out to drill the via hole. After the second drilling, the via hole is polished and inspected to ensure that there are no burrs in the hole. Then the insulating resin glue of the via hole is checked to ensure that the insulating resin glue on the via hole mouth on the metal substrate surface is ground clean, flat and uniform, and ensure that the insulating resin glue in the via hole is free of bubbles, pinholes, and cracks.
2. A double-sided boss metal PCB resin plug according to claim 1, characterized in that: The double-sided boss metal PCB resin plugging also includes the following specific steps: (10) PCB pre-processing After the secondary drilling, the copper plating process is started. First, the metal substrate is cleaned, and then copper plating is performed on the hole wall of the via hole to ensure that there is copper at the hole mouth and the resin surface. (11) PCB post-processing Finally, the post-processing PCB is produced, and the top circuit board and the bottom circuit board are added to complete the processing of the resin plug hole of the double-layer boss metal PCB board.
3. The double-sided boss metal PCB resin plug according to claim 1, characterized in that: In the process of plugging the hole with glue in step (3), the weight of the insulating resin glue is 3 g, the viscosity of the insulating resin glue is 830, the vacuum pressure of the vacuum plugging is 30 par, the scraper speed during the vacuum plugging resin process is 300 mm / s, the scraper thickness is 15 mm, and the mesh spacing is 5 mm.
4. The double-sided boss metal PCB resin plug according to claim 1, characterized in that: In the process of processing the boss in step (4), the boss height is equal to the thickness of the panel core (PCB copper plate and high-conductivity adhesive insulation layer) plus the thickness of the copper foil.
5. The double-sided boss metal PCB resin plug according to claim 1, characterized in that: In the process of drying and degumming in step (5), the drying of the baking plate is divided into three processing processes. The drying temperature of the baking plate in the first stage is 90°C and the drying time is 30 minutes. The drying temperature of the baking plate in the second stage is 120°C and the drying time is 30 minutes. The drying temperature of the baking plate in the third stage is 160°C and the drying time is 40 minutes.
6. The double-sided boss metal PCB resin plug according to claim 1, characterized in that: During the pressing process of step (7), the high-conductivity adhesive insulating layer must be adhered tightly without wrinkles, bubbles, or inadequate adhesion.
7. The double-sided boss metal PCB resin plug according to claim 1, characterized in that: During the secondary drilling process in step (9), the drilling speed is controlled at 10-90,000 tm.
8. The double-sided boss metal PCB resin plug according to claim 2, characterized in that: In the step (10), during the PCB pre-processing, the copper thickness of the inner wall of the via hole after copper plating is 8-10 microns or more.