Thin film capacitor, motor controller assembly and driving motor

By designing a capacitor housing and a cooling housing with a water channel cavity in a film capacitor, direct heat exchange is achieved, and the problems of low heat dissipation efficiency and high weight of film capacitors in the prior art are solved, which improves capacitance performance and reduces Production cost.

CN222146002UActive Publication Date: 2024-12-10IAT AUTOMOBILE TECH
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Patent Information

Application Number
CN202323403453.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-13
Publication Date
2024-12-10
Estimated Expiration
2033-12-13

AI Technical Summary

Technical Problem

In the prior art, the film capacitor has low heat dissipation efficiency and poor capacitance performance, and the overall weight of the inverter and the production cost are increased due to the design of additional heat dissipation components.

Method used

A film capacitor is designed, including a capacitor housing and a cooling housing. The cooling housing is surrounded by a water channel cavity. A heat exchange medium is provided in the water channel cavity. The capacitor housing is arranged on the water channel cavity and is connected to the cooling housing. The film capacitor is arranged in the capacitor housing and fits with one end of the capacitor housing close to the water channel cavity to achieve direct heat exchange and avoid the use of additional heat dissipation pads and plates.

Benefits of technology

It significantly improves the heat dissipation efficiency of film capacitors, extends the service life of the capacitors, and reduces the overall weight and production cost of the inverter.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a film capacitor, a motor controller assembly and a driving motor, and belongs to the field of motor design and manufacturing. The thin film capacitor provided by the utility model comprises a capacitor shell, a cooling shell and a thin film capacitor, a water channel cavity is defined by the cooling shell, and a heat exchange medium is arranged in the water channel cavity. The capacitor shell is arranged on the water channel cavity and is connected with the cooling shell; the thin film capacitor is arranged in the capacitor shell and attached to the end, close to the water channel cavity, of the capacitor shell so as to exchange heat with the heat exchange medium through the capacitor shell. According to the thin-film capacitor, the motor controller assembly and the driving motor provided by the utility model, the thin-film capacitor can directly realize heat exchange with the heat exchange medium through the capacitor shell, and an additional heat dissipation structure does not need to be additionally arranged outside the thin-film capacitor, so that the heat dissipation efficiency is remarkably improved, the capacitor performance is enhanced, and the service life of the capacitor is prolonged; and the overall weight of the inverter is effectively reduced, so that the production cost is reduced.
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Description

Technical Field

[0001] The utility model relates to the field of motor design and manufacturing, in particular to a film capacitor, a motor controller assembly and a drive motor. Background Art

[0002] The motor controller assembly is a key device for controlling the operation of the drive motor. The motor controller assembly is mainly composed of a control chip, an inverter, an interface component, etc. Among them, the inverter can convert DC power (such as a battery) into AC power for use in the drive motor.

[0003] As a component responsible for filtering and energy storage in the inverter, the film capacitor's internal capacitor core will generate heat when working. When the temperature is too high, it will affect the working efficiency and service life of the film capacitor. Therefore, in the prior art, a thermal pad is usually designed outside the shell of the film capacitor. The thermal pad serves as a heat-conducting medium, one side of which fits the shell of the film capacitor and the other side fits the heat sink to achieve heat dissipation of the film capacitor. However, during heat transfer, the capacitor core needs to pass through multiple layers of media such as the shell and the thermal pad to achieve heat interaction with the heat sink, resulting in low heat dissipation efficiency and poor capacitance performance of the film capacitor; and the design of additional heat sinks and heat dissipation components such as thermal pads will also lead to a higher overall weight of the inverter and increased production costs.

[0004] In view of the above, the present utility model is proposed. Utility Model Content

[0005] The utility model provides a film capacitor, a motor controller assembly and a drive motor, aiming to solve the problems of low heat dissipation efficiency, poor capacitance performance, high weight and high production cost of the film capacitor in the prior art.

[0006] The first aspect of the utility model provides a film capacitor, comprising a capacitor housing, a cooling housing and a film capacitor; the cooling housing is surrounded by a water channel cavity, and a heat exchange medium is arranged in the water channel cavity; the capacitor housing is arranged on the water channel cavity and connected to the cooling housing; the film capacitor is arranged in the capacitor housing and fits with one end of the capacitor housing close to the water channel cavity, so as to perform heat exchange with the heat exchange medium through the capacitor housing.

[0007] In some embodiments, the capacitor housing includes a heat-conducting bottom plate, a top plate and an enclosure; the heat-conducting bottom plate cover is disposed on the water channel cavity and is connected to the cooling shell; one end of the enclosure is connected to an end of the heat-conducting bottom plate facing away from the cooling shell, and the other end of the enclosure is connected to the top plate, and the enclosure, the heat-conducting bottom plate and the top plate together form a receiving chamber; the thin film capacitor is received in the receiving chamber and is disposed on the heat-conducting bottom plate.

[0008] In some embodiments, a guide portion is provided on the thermal conductive bottom plate, the guide portion protrudes from the thermal conductive bottom plate and is located in the water channel cavity for guiding the heat exchange medium; an insulating layer is also provided on the thermal conductive bottom plate, and the film capacitor is provided on the insulating layer.

[0009] In some embodiments, the enclosure includes a first enclosed plate, a second enclosed plate, a third enclosed plate and a fourth enclosed plate; the first enclosed plate and the third enclosed plate are arranged at intervals; the second enclosed plate and the fourth enclosed plate are arranged at intervals between the first enclosed plate and the third enclosed plate, and the two ends of the second enclosed plate and the fourth enclosed plate are respectively connected to the corresponding first enclosed plate and the third enclosed plate; the first enclosed plate, the second enclosed plate, the third enclosed plate and the fourth enclosed plate are all connected between the heat-conducting bottom plate and the top plate to jointly form a receiving chamber.

[0010] In some embodiments, the cooling shell includes a main body and a sealing member; the main body forms a water channel cavity, and the main body is connected to the heat conductive bottom plate; a water channel inlet and outlet are also provided in the main body, and the water channel inlet and outlet are connected to the water channel cavity to allow heat exchange medium to enter and exit the water channel cavity to achieve circulating heat dissipation; an installation groove is provided on the main body, and the installation groove is arranged on the circumference of the water channel cavity; the sealing member is arranged in the installation groove, and the end facing away from the installation groove is abutted against the heat conductive bottom plate.

[0011] In some embodiments, the heat-conducting base plate is provided with a plurality of connection holes arranged at intervals on the circumference; the main body is provided with a corresponding plurality of matching holes, and a connecting piece is provided in each connection hole and the corresponding matching hole, and the connecting piece is used to connect the heat-conducting base plate and the main body.

[0012] In some embodiments, the film capacitor includes a capacitor core and a core copper bar; the core copper bar is fixed on the thermal conductive base plate and fits with the thermal conductive base plate; the capacitor core is arranged on the core copper bar and connected to the core copper bar.

[0013] In some embodiments, the core copper bar includes an input copper bar and an output copper bar; the input copper bar is attached to the heat-conducting bottom plate, and the end of the input copper bar facing away from the heat-conducting bottom plate is connected to the capacitor core; at least part of the input copper bar extends toward the top plate and extends outside the top plate; a plurality of output copper bars are also provided at one end of the first enclosure plate facing away from the receiving chamber, and the plurality of output copper bars are arranged at intervals along the length direction of the first enclosure plate and connected to the capacitor core.

[0014] A second aspect of the utility model provides a motor controller assembly, comprising the above-mentioned film capacitor.

[0015] A third aspect of the present invention is a driving motor, comprising the above-mentioned motor controller assembly.

[0016] Compared with the prior art, the film capacitor, motor controller assembly and drive motor provided by the utility model have at least the following beneficial effects:

[0017] By optimizing the structure of the film capacitor, the film capacitor includes a capacitor housing, a cooling housing and a film capacitor; wherein the cooling housing is surrounded by a water channel cavity, a heat exchange medium is arranged in the water channel cavity, and the capacitor housing is arranged on the water channel cavity and connected to the cooling housing, and the film capacitor is arranged in the capacitor housing and fits with one end of the capacitor housing close to the water channel cavity, so that the heat exchange medium in the water channel cavity can directly exchange heat with the film capacitor through the capacitor housing, thereby greatly enhancing the heat dissipation efficiency of the film capacitor, thereby effectively improving the capacitor performance and extending the service life of the capacitor; and, the film capacitor only needs to exchange heat with the heat exchange medium through the capacitor housing in the film capacitor, and no additional components such as thermal pads and heat sinks are required outside the film capacitor, thereby effectively reducing the overall weight of the inverter and saving production costs.

[0018] Other features and advantages of the film capacitor, motor controller assembly and drive motor provided by the utility model will be further described in subsequent specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific implementation or the prior art description. Obviously, the drawings described below are some implementations of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic diagram of the overall structure of a thin film capacitor provided in an embodiment of the present application;

[0021] Figure 2 An exploded diagram of a thin film capacitor provided in an embodiment of the present application;

[0022] Figure 3 A top view of a thin film capacitor provided in an embodiment of the present application;

[0023] Figure 4 A schematic diagram of the structure of a capacitor housing and a film capacitor provided in an embodiment of the present application;

[0024] Figure 5 A bottom view of a capacitor housing and a film capacitor provided in an embodiment of the present application;

[0025] Figure 6 A front view of a capacitor housing and a film capacitor provided in an embodiment of the present application;

[0026] Figure 7 A side view of a capacitor housing and a film capacitor provided in an embodiment of the present application;

[0027] Figure 8 A schematic diagram of a module of a motor controller assembly provided in an embodiment of the present application;

[0028] Fig. 9 A schematic diagram of a module of a drive motor provided in an embodiment of the present application.

[0029] The reference numerals are as follows:

[0030] 100. Film capacitors;

[0031] 110, capacitor housing; 111, heat-conducting bottom plate; 1111, flow guide; 1112, insulating layer; 1113, connecting hole; 112, top plate; 113, enclosure; 1131, first enclosure plate; 1132, second enclosure plate; 1133, third enclosure plate; 1134, fourth enclosure plate; 114, receiving chamber;

[0032] 120, cooling shell; 121, body; 1211, water channel cavity; 1212, mounting groove; 1213, water channel inlet and outlet; 122, sealing element;

[0033] 130, film capacitor; 131, capacitor core; 132, core copper bar; 1321, input copper bar; 1322, output copper bar;

[0034] 140. Connectors;

[0035] 10. Motor controller assembly;

[0036] 1000. Driving motor. DETAILED DESCRIPTION

[0037] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear to indicate the orientation or position relationship, unless otherwise specified, they are understood to be based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application.

[0038] In addition, if there is a feature defined as "first" or "second", it is only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Features defined as "first" or "second" may explicitly or implicitly include at least one of the defined features. If there is a description of "plurality", the general meaning is to include at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed" and so on should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection, it can be a direct connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0040] In the description of this specification, if the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0041] It should be noted that the film capacitor 130 in the present invention is a common type of capacitor, which is composed of one or more layers of thin film material, and its basic structure includes a thin film dielectric layer between two electrodes. The film capacitor 100 has a relatively small volume and weight, and is widely used in electronic equipment, communication equipment, power management and other fields.

[0042] Based on the above, the general concept of the embodiment of the utility model is to provide a film capacitor 100, which mainly includes three major components: a capacitor housing 110, a cooling housing 120 and a film capacitor 130; wherein the cooling housing 120 is surrounded by a water channel cavity 1211, and a cooling water channel of any shape can be designed in the water channel cavity 1211 to allow a heat exchange medium to flow in the cooling water channel, the capacitor housing 110 is arranged on the water channel cavity 1211, so that the heat exchange medium can directly contact the bottom of the capacitor housing 110, and the film capacitor 130 is arranged in the capacitor housing and close to the water channel cavity of the capacitor housing 110. One end of 1211 is in contact with each other, so that the heat exchange medium can take away the heat of the film capacitor 130 through the capacitor housing 110, thereby greatly improving the heat dissipation efficiency of the film capacitor 100 and avoiding the degradation of the capacitance performance of the film capacitor 130 due to excessive temperature; and, different from the heat dissipation method of designing a thermal pad or a heat sink outside the film capacitor 100 in the prior art, the film capacitor 100 provided in this embodiment does not need to add additional heat dissipation components, and the heat dissipation of the film capacitor 130 can be achieved through the cooling housing 120 inside itself, thereby reducing the overall weight of the inverter and reducing the production cost.

[0043] Based on the above general concept, reference Figure 1 to Figure 7 The embodiment of the utility model provides a film capacitor 100, including a capacitor housing 110, a cooling housing 120 and a film capacitor 130; the cooling housing 120 is surrounded by a water channel cavity 1211, and a heat exchange medium is arranged in the water channel cavity 1211; the capacitor housing 110 is arranged on the water channel cavity 1211 and connected to the cooling housing 120; the film capacitor 130 is arranged in the capacitor housing 110, and fits with one end of the capacitor housing 110 close to the water channel cavity 1211, so as to perform heat exchange with the heat exchange medium through the capacitor housing 110.

[0044] It can be understood that in this embodiment, a receiving chamber 114 is formed in the capacitor housing 110, the thin film capacitor 130 is located in the receiving chamber 114 and is in contact with the bottom of the capacitor housing 110, and the receiving chamber 114 is arranged on the water channel cavity 1211, so that the thin film capacitor 130 and the heat exchange medium are separated only by the capacitor housing 110. Therefore, the heat exchange medium in the water channel cavity 1211 can exchange heat with the thin film capacitor 130 through the capacitor housing 110, thereby significantly improving the heat dissipation efficiency of the thin film capacitor 100.

[0045] It should be noted that a circulating water channel (not shown) is arranged in the water channel cavity 1211 so that the heat exchange medium can circulate through the circulating water channel in the water channel cavity 1211, thereby taking away the heat of the film capacitor 130, thereby significantly improving the heat dissipation efficiency of the film capacitor 100.

[0046] refer to Figure 2 As shown, in a specific embodiment, the capacitor housing 110 includes a heat-conducting bottom plate 111, a top plate 112 and an enclosure 113; the heat-conducting bottom plate 111 is covered on the water channel cavity 1211 and is connected to the cooling housing 120; one end of the enclosure 113 is connected to the end of the heat-conducting bottom plate 111 away from the cooling housing 120, and the other end of the enclosure 113 is connected to the top plate 112, and the enclosure 113, the heat-conducting bottom plate 111 and the top plate 112 together form a receiving chamber 114; the thin film capacitor 130 is received in the receiving chamber 114 and is arranged on the heat-conducting bottom plate 111.

[0047] In this embodiment, the capacitor housing 110 includes a heat-conducting bottom plate 111, a top plate 112 and an enclosure 113; the heat-conducting bottom plate 111 is covered on the water channel cavity 1211 and is sealed and connected to the cooling housing 120 to prevent leakage of the heat exchange medium; the thin film capacitor 130 is attached to the top of the heat-conducting bottom plate 111, and the bottom of the heat-conducting bottom plate 111 can directly contact the heat exchange medium, so that the heat exchange medium can directly exchange heat through the heat-conducting bottom plate 111; and one end of the enclosure 113 is connected to the top of the heat-conducting bottom plate 111, and the other end is connected to the bottom of the top plate 112, so that the heat-conducting bottom plate 111, the top plate 112 and the enclosure 113 can together form a receiving chamber 114 to provide a layout space for the thin film capacitor 130.

[0048] refer to Figures 5 to 7 As shown, in order to further improve the heat dissipation efficiency, a plurality of guide parts 1111 are arranged on the heat conductive bottom plate 111, and the plurality of guide parts 1111 protrude from the heat conductive bottom plate 111 and are located in the water channel cavity 1211, so as to be used for heat exchange medium; in order to realize the electrical isolation of the thin film capacitor 130, an insulating layer 1112 is also arranged on the top of the heat conductive bottom plate 111, and the thin film capacitor 130 is arranged on the insulating layer 1112 to avoid being affected by the heat exchange medium and reducing the capacitance performance.

[0049] It should be noted that in actual application scenarios, professional software simulation results can be used to determine which locations on the heat-conducting base plate 111 have higher temperatures, and the guide part 1111 can be set at the location with higher temperatures, so that the heat exchange medium can be guided to this location, thereby quickly taking away the heat on the heat-conducting base plate 111, thereby further improving the heat dissipation efficiency.

[0050] In some embodiments, the thermally conductive base plate 111 is directly made of a material with high thermal conductivity and insulation properties, such as aluminum nitride, so that there is no need to arrange an insulation layer 1112, which helps reduce costs.

[0051] Furthermore, refer to Figure 4As shown, the enclosure 113 includes a first enclosure plate 1131, a second enclosure plate 1132, a third enclosure plate 1133 and a fourth enclosure plate 1134; the first enclosure plate 1131 and the third enclosure plate 1133 are arranged at intervals; the second enclosure plate 1132 and the fourth enclosure plate 1134 are arranged at intervals between the first enclosure plate 1131 and the third enclosure plate 1133, and the two ends of the second enclosure plate 1132 and the fourth enclosure plate 1134 are respectively connected to the corresponding first enclosure plate 1131 and the third enclosure plate 1133; the first enclosure plate 1131, the second enclosure plate 1132, the third enclosure plate 1133 and the fourth enclosure plate 1134 are all connected between the heat-conducting bottom plate 111 and the top plate 112 to jointly form a receiving chamber 114.

[0052] In this embodiment, the first enclosing plate 1131, the second enclosing plate 1132, the third enclosing plate 1133 and the fourth enclosing plate 1134 are arranged in the vertical direction, and the bottoms of the first enclosing plate 1131, the second enclosing plate 1132, the third enclosing plate 1133 and the fourth enclosing plate 1134 are connected to the top of the thermal conductive bottom plate 111, and the tops of the first enclosing plate 1131, the second enclosing plate 1132, the third enclosing plate 1133 and the fourth enclosing plate 1134 are connected to the bottom of the top plate 112, thereby jointly enclosing a receiving chamber 114 to ensure the isolation of the capacitor core of the thin film capacitor 130 from the outside world.

[0053] Please continue to refer to Figure 2 As shown, the cooling shell 120 in this embodiment includes a main body 121 and a sealing member 122; the main body 121 is surrounded by a water channel cavity 1211, and the main body 121 is connected to the heat-conducting bottom plate 111; a water channel inlet and outlet 1213 is also provided in the main body 121, and the water channel inlet and outlet 1213 is communicated with the water channel cavity 1211 to allow heat exchange medium to enter and exit the water channel cavity 1211 to achieve circulating heat dissipation; a mounting groove 1212 is provided on the main body 121, and the mounting groove 1212 is arranged in the circumference of the water channel cavity 1211; the sealing member 122 is arranged in the mounting groove 1212, and the end facing away from the mounting groove 1212 abuts against the heat-conducting bottom plate 111.

[0054] It should be understood that the seal 122 in this embodiment is made of elastic material, and the seal 122 is arranged in the installation groove 1212 and is arranged in a ring around the water channel cavity 1211. When the main body 121 is connected to the heat-conducting bottom plate 111, the bottom of the heat-conducting bottom plate 111 presses the seal 122 in the installation groove 1212, so that the seal 122 can isolate the water channel cavity 1211 from the external environment, effectively improving the airtightness of the water channel cavity 1211, thereby avoiding leakage and dissipation of the heat exchange medium; in addition, a water channel inlet and outlet 1213 is also designed in the main body 121, and the water channel inlet and outlet 1213 is connected to the water channel cavity 1211 to facilitate the heat exchange medium to flow into or out of the water channel cavity 1211, thereby realizing effective heat exchange of the film capacitor 100.

[0055] In order to achieve effective connection between the heat-conducting base plate 111 and the main body 121, a plurality of connection holes 1113 arranged at intervals are provided on the circumference of the heat-conducting base plate 111; the main body 121 is provided with a corresponding plurality of matching holes (not shown), and each connection hole 1113 and the corresponding matching hole are provided with a connecting member 140, and the connecting member 140 can be a bolt, a rivet or other component, and the connecting member 140 is used to connect the heat-conducting base plate 111 and the main body 121.

[0056] In some embodiments, sealant can also be applied on the circumference of the bottom of the thermal conductive base plate 111 to glue and fix the thermal conductive base plate 111 to the top of the main body 121, thereby reducing the arrangement of the connector 140 and reducing the overall weight of the inverter; it should be noted that when using glue connection, the sealant should not cover the area on the thermal conductive base plate 111 that is aligned with the water channel cavity 1211 to avoid contamination of the heat exchange medium, thereby affecting the heat exchange efficiency.

[0057] Continue to refer Figure 4 As shown, the film capacitor 130 of this embodiment includes a capacitor core 131 and a core copper bar 132; the core copper bar 132 is fixed on the heat-conducting base plate 111 and fits with the top of the heat-conducting base plate 111 to exchange heat with the heat exchange medium through the heat-conducting base plate 111; the capacitor core 131 is arranged on the core copper bar 132 and connected to the core copper bar 132, and the core copper bar 132 is mainly used to provide input and output of current on the capacitor core 131 to ensure the electrical stability of the film capacitor 100.

[0058] Specifically, the core copper bar 132 includes an input copper bar 1321 and an output copper bar 1322, and the input copper bar 1321 and the output copper bar 1322 are respectively used for the input and output of current; wherein, the input copper bar 1321 is attached to the heat-conducting bottom plate 111, and the end of the input copper bar 1321 away from the heat-conducting bottom plate 111 is connected to the capacitor core 131, so as to perform heat exchange with the heat exchange medium through the heat-conducting bottom plate 111 while transmitting current; part of the input copper bar 1321 extends toward the top plate 112 and extends outside the top plate 112 to electrically connect to the external power supply components; a plurality of output copper bars 1322 are also provided at one end of the first enclosure plate 1131 away from the receiving chamber 114, and the plurality of output copper bars 1322 are arranged at intervals along the length direction of the first enclosure plate 1131, and are connected to the capacitor core 131 after passing through the first enclosure plate 1131, so as to output the current flowing through the capacitor core 131.

[0059] Therefore, under the same application scenario, the film capacitor 100 provided in this embodiment can improve the heat dissipation efficiency by at least 10-40% and reduce the overall weight by 3-5% compared with traditional heat dissipation methods, thereby achieving efficient heat dissipation of the film capacitor 100 while reducing the overall weight of the film capacitor 100.

[0060] refer to Figure 8 As shown, another embodiment of the present invention provides a motor controller assembly 10 , including the above-mentioned film capacitor 100 .

[0061] refer to Fig. 9 As shown, another embodiment of the present invention is a driving motor 1000 , which includes the above-mentioned motor controller assembly 10 .

[0062] In summary, the film capacitor 100, the motor controller assembly 10 and the drive motor 1000 provided by the embodiment of the utility model are designed by optimizing the structure of the film capacitor 100. The film capacitor 100 includes a capacitor housing 110, a cooling housing 120 and a film capacitor 130; wherein the cooling housing 120 is surrounded by a water channel cavity 1211, and a heat exchange medium is arranged in the water channel cavity 1211, and the capacitor housing 110 is arranged on the water channel cavity 1211 and connected to the cooling housing 120, and the film capacitor 130 is arranged in the capacitor housing 110 and is close to the capacitor housing 110. The ends of the bodies 1211 are fitted together, so that the heat exchange medium in the water channel cavity 1211 can directly exchange heat with the film capacitor 130 through the capacitor housing 110, which greatly enhances the heat dissipation efficiency of the film capacitor 100, thereby effectively improving the capacitor performance and extending the service life of the capacitor; moreover, the film capacitor 130 only needs to exchange heat with the heat exchange medium through the capacitor housing 110 in the film capacitor 100, and there is no need to arrange additional components such as thermal pads and heat sinks outside the film capacitor 100, which effectively reduces the overall weight of the inverter and saves production costs.

[0063] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Those skilled in the art can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A film capacitor, characterized in that: It comprises a capacitor housing (110), a cooling housing (120) and a film capacitor (130); The cooling shell (120) is surrounded by a water channel cavity (1211), and a heat exchange medium is arranged in the water channel cavity (1211); The capacitor housing (110) is arranged on the water channel cavity (1211) and connected to the cooling housing (120); The film capacitor (130) is arranged in the capacitor housing (110) and is fitted to one end of the capacitor housing (110) close to the water channel cavity (1211) so as to perform heat exchange with a heat exchange medium through the capacitor housing (110).

2. The film capacitor according to claim 1, characterized in that: The capacitor housing (110) comprises a heat-conducting bottom plate (111), a top plate (112) and an enclosure (113); The heat-conducting bottom plate (111) is covered on the water channel cavity (1211) and connected to the cooling shell (120); One end of the enclosure (113) is connected to an end of the heat-conducting bottom plate (111) away from the cooling shell (120), and the other end of the enclosure (113) is connected to the top plate (112); the enclosure (113), the heat-conducting bottom plate (111) and the top plate (112) together form a receiving chamber (114); The thin film capacitor (130) is accommodated in the accommodation chamber (114) and is arranged on the heat-conducting bottom plate (111).

3. The film capacitor according to claim 2, characterized in that: The heat-conducting bottom plate (111) is provided with a flow guiding portion (1111), the flow guiding portion (1111) protrudes from the heat-conducting bottom plate (111) and is located in the water channel cavity (1211) for guiding the heat exchange medium; An insulating layer (1112) is also provided on the heat-conducting bottom plate (111), and the thin-film capacitor (130) is provided on the insulating layer (1112).

4. The film capacitor according to claim 2, characterized in that: The enclosure (113) comprises a first enclosure plate (1131), a second enclosure plate (1132), a third enclosure plate (1133) and a fourth enclosure plate (1134); The first enclosing plate (1131) and the third enclosing plate (1133) are arranged at intervals; The second enclosed plate (1132) and the fourth enclosed plate (1134) are arranged between the first enclosed plate (1131) and the third enclosed plate (1133) at intervals, and two ends of the second enclosed plate (1132) and the fourth enclosed plate (1134) are respectively connected to the corresponding first enclosed plate (1131) and the third enclosed plate (1133); The first enclosing plate (1131), the second enclosing plate (1132), the third enclosing plate (1133) and the fourth enclosing plate (1134) are all connected between the heat-conducting bottom plate (111) and the top plate (112) to jointly enclose the receiving chamber (114).

5. The film capacitor according to claim 2, characterized in that: The cooling shell (120) comprises a body (121) and a sealing member (122); The main body (121) is surrounded by the water channel cavity (1211), and the main body (121) is connected to the heat-conducting bottom plate (111); The main body (121) is provided with a mounting groove (1212), and the mounting groove (1212) is arranged in a circumferential direction of the water channel cavity (1211); The sealing member (122) is arranged in the installation groove (1212), and one end thereof facing away from the installation groove (1212) abuts against the heat-conducting bottom plate (111).

6. The film capacitor according to claim 5, characterized in that: The heat-conducting bottom plate (111) is provided with a plurality of connection holes (1113) arranged at intervals on the circumference thereof; The main body (121) is provided with a plurality of corresponding matching holes, and a connecting piece (140) is provided in each of the connecting holes (1113) and the corresponding matching hole, and the connecting piece (140) is used to connect the heat-conducting bottom plate (111) and the main body (121).

7. The film capacitor according to claim 4, characterized in that: The film capacitor (130) comprises a capacitor core (131) and a core copper bar (132); The core copper bar (132) is fixed on the heat-conducting bottom plate (111) and is in contact with the heat-conducting bottom plate (111); The capacitor core (131) is arranged on the core copper busbar (132) and connected to the core copper busbar (132).

8. The film capacitor according to claim 7, characterized in that: The core copper bar (132) comprises an input copper bar (1321) and an output copper bar (1322); The input copper bar (1321) is in contact with the heat-conducting bottom plate (111), and one end of the input copper bar (1321) that is away from the heat-conducting bottom plate (111) is connected to the capacitor core (131); At least a portion of the input copper busbar (1321) extends toward the top plate (112) and extends outside the top plate (112); A plurality of output copper bars (1322) are also provided at one end of the first enclosure plate (1131) away from the receiving chamber (114); the plurality of output copper bars (1322) are arranged at intervals along the length direction of the first enclosure plate (1131) and are connected to the capacitor core (131).

9. A motor controller assembly, characterized in that: It comprises the film capacitor (100) as claimed in any one of claims 1 to 8.

10. A driving motor, characterized in that: It comprises the motor controller assembly (10) as claimed in claim 9.

Citation Information

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