Laser module

Abstract

The utility model discloses a laser module, which comprises at least two laser modules and a bottom plate, and is characterized in that the at least two laser modules are located on one bottom plate; the laser module comprises a light-emitting element, a tube shell, a light-transmitting part and a pin, wherein the tube shell is located on one side of the bottom plate; the light-transmitting component is located on the side, away from the bottom plate, of the tube shell, and the tube shell, the light-transmitting component and the bottom plate jointly form an enclosed space. The light-emitting chip is installed on the bottom plate and located in the enclosed space. The pins are located on at least one side, away from the light-emitting element, of the tube shell and electrically connected with the light-emitting element. According to the laser module, modularization and arraying of the laser are achieved by packaging the multiple laser modules on the base plate, the laser has the high integration level, and meanwhile, due to the fact that each laser module is provided with the independent packaging tube shell, the reliability of the overall structure of the laser module can be guaranteed. Moreover, the light-emitting element is directly arranged on the bottom plate, so that the light-emitting element can effectively dissipate heat, and the light-emitting efficiency of the laser module is ensured.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a laser module. Background Art

[0002] Laser as a light source can meet the high efficiency and wide color gamut image quality requirements of laser TVs, projectors and smart projectors. As a carrier of laser semiconductor chips, laser is an important tool for the practical application of lasers. The packaging method of lasers can affect the performance of lasers. How to improve the performance of lasers through packaging has become one of the important links in laser design.

[0003] In order to improve the integration of lasers, related technologies will try to package more light-emitting elements together, but due to limitations in material properties, large-size packaging structures have low reliability and poor heat dissipation performance. Utility Model Content

[0004] In order to solve the problems of low laser integration and poor heat dissipation performance, the present application provides a laser module, including a laser module and a base plate, wherein: at least two of the laser modules are located on one of the base plates; the laser module includes a light-emitting element, a tube shell, a light-transmitting component and a pin, wherein: the tube shell is located on one side of the base plate; the light-transmitting component is located on a side of the tube shell away from the base plate, and the tube shell, the light-transmitting component and the base plate together constitute an enclosed space; the light-emitting chip is mounted on the base plate and is located in the enclosed space; the pin is located on at least one side of the tube shell away from the light-emitting element and is electrically connected to the light-emitting element.

[0005] The present application realizes laser modularization and arraying by packaging multiple laser modules on a base plate, so that the laser has a high degree of integration. At the same time, since each laser module has a separate package, the reliability of the overall structure of the laser module can be guaranteed. In addition, the light-emitting element is directly arranged on the base plate, which can effectively dissipate heat from the light-emitting element and ensure the light-emitting efficiency of the laser module. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a schematic diagram of a planar structure of a laser module according to one or more embodiments of the present application;

[0007] Figure 2 is a schematic diagram of a cross-sectional structure of a laser module according to one or more embodiments of the present application;

[0008] Figure 3 is a schematic diagram of a planar structure of a laser module according to one or more other embodiments of the present application;

[0009] Figure 4is a schematic diagram of a planar structure of a laser module according to one or more other embodiments of the present application;

[0010] Figure 5 is a schematic diagram of a planar structure of a laser module according to one or more other embodiments of the present application;

[0011] Figure 6 is a schematic diagram of a planar structure of a portion of a laser module according to one or more other embodiments of the present application;

[0012] Figure 7 is a schematic diagram of a cross-sectional structure of a portion of a laser module according to one or more other embodiments of the present application;

[0013] Figure 8 is a schematic diagram of a cross-sectional structure of a portion of a laser module according to one or more other embodiments of the present application;

[0014] Fig. 9 A schematic diagram of the 3D structure of a portion of a laser module according to one or more embodiments of the present application;

[0015] Fig.10 is a schematic diagram of a planar structure of a portion of a laser module according to one or more other embodiments of the present application;

[0016] Fig.11 is a schematic diagram of a planar structure of a portion of a laser module according to one or more other embodiments of the present application;

[0017] Fig.12 is a schematic diagram of a planar structure of a portion of a laser module according to one or more other embodiments of the present application;

[0018] Fig.13 is a schematic diagram of a cross-sectional structure of a portion of a laser module according to one or more other embodiments of the present application;

[0019] Fig.14 is a schematic diagram of a cross-sectional structure of a portion of a laser module according to one or more other embodiments of the present application;

[0020] Fig.15 is a schematic diagram of a planar structure of a portion of a laser module according to one or more other embodiments of the present application;

[0021] Fig.16 is a schematic diagram of a cross-sectional structure of a portion of a laser module according to one or more other embodiments of the present application;

[0022] Fig.17 is a schematic diagram of a planar structure of a laser module according to one or more other embodiments of the present application;

[0023] Fig.18is a schematic diagram of a planar structure of a laser module according to one or more other embodiments of the present application;

[0024] Fig.19 is a schematic diagram of a planar structure of a laser module according to one or more other embodiments of the present application;

[0025] Fig. 20 It is a schematic diagram of the planar structure of a laser module according to one or more other embodiments of the present application. DETAILED DESCRIPTION

[0026] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0027] An embodiment of the present application provides a laser module, such as Figures 1 to 3 As shown ( Figure 1 This is a top view of the laser module. Figure 2 for Figure 1 The laser module includes a laser module 1 and a base plate 2, and at least two laser modules 1 are located on one base plate 2, wherein:

[0028] The laser module includes a light-emitting element 11, a tube shell 12, a pin 13 and a light-transmitting component 14. The tube shell 12 is located on one side of the bottom plate 2, and the light-transmitting component 14 is located on the side of the tube shell 12 away from the bottom plate 2. The tube shell 12, the light-transmitting component 14 and the bottom plate 2 together constitute an enclosed space; the light-emitting chip 11 is mounted on the bottom plate 2 and is located in the enclosed space, and the pin 13 is located on at least one side of the tube shell 12 away from the light-emitting element 11 and is electrically connected to the light-emitting element 11. Specifically, the light-emitting element 11 can be electrically connected to an external circuit through the pin 13, and emit light using an electrical signal provided by the external circuit through the pin 13.

[0029] Specifically, the light-emitting element 11 is directly arranged on the base plate 2, so that the bottom of the light-emitting element 11 can dissipate heat directly through the base plate 2. At the same time, the tube shell 12 and the base plate 2 are directly sintered by brazing, so that the heat around the light-emitting element 11 can directly reach the base plate 2 from the tube shell 12, thereby achieving better heat dissipation effect and ensuring the luminous efficiency of the laser module.

[0030] The present application realizes the modularization and arraying of lasers by encapsulating multiple laser modules on a base plate, so that the laser has a high degree of integration. Since each laser module has a separate frame packaging structure, the reliability of the overall structure of the laser module can be guaranteed; at the same time, when a certain light-emitting element is damaged, only the laser module corresponding to the light-emitting element can be adjusted, which is convenient for maintenance and avoids damage to other laser modules during maintenance, thereby ensuring the overall stability, reliability, availability and service life of the laser module; and, in the actual production test process, each laser module can be debugged separately, and the module where the light-emitting element with problems is located can be determined more efficiently, simplifying the production and manufacturing process; on the other hand, compared with manufacturing each laser module separately, the laser module provided by the present application can also save manufacturing costs.

[0031] It should be noted that in order to embody the main utility model concept of this application, Figure 2 The laser module 1 shown only includes structures such as the light-emitting element 11, the tube shell 12, the pins 13 and the light-transmitting component 14, but it does not mean that the laser module 1 does not include other external packaging structures. The specific structure will be further explained in the following embodiments. The same applies to the drawings of other embodiments and will not be repeated.

[0032] Optionally, the light emitting element 11 is a semiconductor light emitting element, including a light emitting element, which receives an electrical signal from the outside and emits a laser to the outside, and its final light emitting direction is a direction away from the base plate 2.

[0033] In some embodiments, Figures 3 to 5 As shown, at least two laser modules 1 are arranged in an array along a first direction X and / or a second direction Y on a base plate 2 , and the first direction X and the second direction Y intersect.

[0034] Specifically, the first direction X and the second direction Y are perpendicular to each other. Figure 3 As shown, at least two laser modules 1 can be arranged in an array on the base plate 2 along the first direction X and the second direction Y at the same time; or Figure 4 As shown, at least two laser modules 1 can be arranged on the base plate 2 only along the first direction X; or Figure 5 As shown, at least two laser modules 1 may be arranged only along the second direction Y on the base plate 2 .

[0035] Alternatively, if Figures 1 to 5 As shown, the tube shells 12 can all be in a square ring shape. The orthographic projection of each tube shell 12 on the bottom plate 2 can be a rectangle or a substantially rectangle. For example, the orthographic projection can be a rounded rectangle or a chamfered rectangle. A rounded rectangle is a shape obtained by changing the corners of a rectangle into rounded corners, and a chamfered rectangle is a shape obtained by changing the corners of a rectangle into chamfers.

[0036] Alternatively, if Figures 1 to 5 As shown, the overall structure of each laser module 1 can be in the shape of a long strip, and the orthographic projection of each laser module 1 on the bottom plate 2 can be roughly in the shape of a rectangle. The width direction of the rectangle can be parallel to the first direction X, and the length direction can be parallel to the second direction Y. Alternatively, the width direction of the rectangle can be parallel to the second direction Y, and the width direction can be parallel to the first direction X.

[0037] It should be noted that this application Figures 1 to 5 In the embodiment shown, one laser module 1 includes two light emitting elements 11, but in specific implementation, each laser module 1 may include one or more light emitting elements 11, and the multiple light emitting elements 11 may be arranged in sequence along the second direction Y. Those skilled in the art can implement the embodiment in which each laser module 1 includes one or more light emitting elements 11 based on the contents disclosed in the embodiment of the present application without creative work, which is within the protection scope of the present application. The same is true for other drawings of the present application, which will not be repeated.

[0038] It should be noted that this application Figures 3 to 5 In the embodiment shown, one laser module includes four laser modules 1, which is only an example. In the specific implementation, each laser module can include other numbers of laser modules 1, and the multiple laser modules 1 can be arbitrarily arranged within the scope of the above embodiment. Those skilled in the art can implement the embodiment in which each laser module includes other numbers of laser modules 1 based on the content disclosed in the embodiment of the present application without creative work, which is within the protection scope of the present application. The same is true for other drawings of the present application, which will not be repeated.

[0039] Optionally, in order to consider heat dissipation, the material of the bottom plate 2 can be a high thermal conductivity material such as oxygen-free copper, red copper or diamond copper. Preferably, in some embodiments, the bottom plate 2 includes an oxygen-free copper bottom plate.

[0040] The thermal conductivity of oxygen-free copper baseboard is high, which can reach 400W / mK, and has good heat dissipation effect, which can further help the light-emitting element module to dissipate heat. Specifically, although oxygen-free copper is pure copper that does not contain oxygen or any deoxidizer residue in theory, it actually still contains very trace amounts of oxygen and some impurities. In specific implementation, the oxygen content is not more than 0.003%, the total impurity content is not more than 0.05%, and the copper purity is greater than 99.95%. All materials can be used for oxygen-free copper baseboards.

[0041] Optionally, the positions corresponding to the base plate 2 and the tube shell 12 further include a nickel plating layer or a gold plating layer, which can improve the structural strength of the brazing point between the base plate 2 and the tube shell 12 and the overall thermal conductivity of the laser module.

[0042] Optionally, the tube shell 12 includes an insulating ring frame, so that when the light emitting element 11 is electrically connected to the pin 13, there is no need to bypass the tube shell 12, and the wiring can be directly routed through the tube shell 12, thereby reducing the overall size of the device and further improving the integration of the laser.

[0043] In a specific embodiment, the tube shell 12 includes a ceramic tube shell. Specifically, the ceramic tube shell can be an aluminum oxide tube shell.

[0044] Alumina has high strength and chemical stability, and its raw material sources are abundant. Its layered generation characteristics are suitable for manufacturing tube shells of different sizes.

[0045] Optionally, the side of the tube shell 12 in contact with the base plate 2 further includes a nickel plating layer or a gold plating layer, which can improve the structural strength of the soldering point between the base plate 2 and the tube shell 12 and the overall thermal conductivity of the laser module.

[0046] In some embodiments, Figures 3 to 5 As shown, a distance D1 between at least two laser modules 1 in the first direction X and / or a distance D2 between at least two laser modules 1 in the second direction Y is greater than or equal to 1 mm.

[0047] In specific implementation, due to different material properties, the thermal expansion coefficients of the materials selected for the bottom plate 2 and the tube shell 12 are different, specifically, the thermal expansion coefficient of the tube shell 12 is greater than that of the bottom plate 2. This results in that if the tube shells 12 are arranged too densely on the bottom plate 2, after the operating temperature of the laser rises, the tube shells 12 will expand to squeeze each other, so that the structure of the laser module 1 is damaged. Therefore, the above embodiment limits the distance between the two laser modules 1 to ensure the normal operation of the laser array.

[0048] Specifically, the distance between two laser modules 1 refers to the distance between the tube shells 12 of the two laser modules 1 .

[0049] In some embodiments, Figures 3 to 5 As shown, the distance D1 between at least two laser modules 1 in the first direction X and / or the distance D2 in the second direction Y is greater than or equal to 1.5 mm and less than or equal to 2 mm.

[0050] The distance setting in the above embodiment can ensure that the tube shells 12 of the laser modules 1 will not be squeezed against each other when the temperature rises and expands, while ensuring the high-density arrangement of the laser modules 1 on the bottom plate 2.

[0051] In some embodiments, Figure 2 As shown, the thickness D3 of the laser module in the direction Z perpendicular to the plane of the base plate 2 is less than or equal to 3.5 mm.

[0052] Since the ring frame is made of insulating material, the circuit wiring connecting the light emitting element 11 to the outside does not need to bypass the ring frame and can be routed directly through the tube shell 12, thereby reducing the height of the device and further reducing the overall volume of the device, further improving the integration of the laser.

[0053] Specifically, the thickness of the laser module in the direction Z perpendicular to the plane of the base plate 2 is preferably 3.2 mm.

[0054] Alternatively, if Figure 1 As shown, the length D4 of the tube shell 12 in the first direction X is greater than or equal to 5 mm and less than or equal to 7 mm, preferably 6.2 mm; the length D5 of the tube shell 12 in the second direction Y is greater than or equal to 9 mm and less than or equal to 11 mm, preferably 10.6 mm. In another embodiment, the length D4 of the tube shell 12 in the first direction X is greater than or equal to 9 mm and less than or equal to 11 mm, preferably 10.6 mm; the length D5 of the tube shell 12 in the second direction Y is greater than or equal to 5 mm and less than or equal to 7 mm, preferably 6.2 mm.

[0055] During specific implementation, the sizes of other components of the laser module provided in the present application can be set by those skilled in the art according to actual conditions and are not further limited herein.

[0056] In some embodiments, considering the sintering accuracy of the tube shell 12 and the base plate 2, and in order to ensure the structural strength of the tube shell 12 and the base plate 2 and the heat dissipation performance of the base plate 2, one base plate 2 is preferably arranged with four laser modules 1, which can be arranged in a 1X4 or 2X2 array.

[0057] In some embodiments, Figure 3 As shown, the laser module comprises four laser modules 1 , which are arranged in two rows along a first direction X on a base plate 2 , and in two columns along a second direction Y.

[0058] In some embodiments, Figure 4 or Figure 5 As shown, the laser module comprises four laser modules 1 , which are arranged in a row along a first direction X or in a column along a second direction Y on a base plate 2 .

[0059] Optionally, the slow axes of the lasers emitted by the multiple light-emitting elements 11 in each laser module 1 can be parallel to the arrangement direction of the light-emitting elements 11. It should be noted that the transmission speed of the laser in different light vector directions will be different, the light vector direction with fast transmission speed is the fast axis, the light vector direction with slow propagation speed is the slow axis, and the fast axis is perpendicular to the slow axis. The fast axis can be perpendicular to the surface of the light-emitting element 11, and the slow axis is parallel to the surface of the light-emitting element 11. The divergence angle of the laser on the fast axis is greater than the divergence angle on the slow axis, such as the divergence angle on the fast axis is basically more than 3 times the divergence angle on the slow axis. The light-emitting elements 11 are arranged with the slow axis of the emitted laser as the arrangement direction. Since the divergence angle of the laser in this direction is small, the distance between the light-emitting elements 11 can be small on the basis of avoiding interference and overlap of the lasers emitted by adjacent light-emitting elements 11, and the setting density of the light-emitting elements 11 can be large, which is conducive to the miniaturization of the laser module 1. Optionally, the multiple light-emitting elements 11 in the laser module 1 can also be arranged in an array, arranged in multiple rows and columns, and the embodiments of the present application are not limited.

[0060] In some embodiments, Figures 6 to 9 As shown (for the sake of clarity, Figure 6 and Figure 7 Only the specific structure of one laser module 1 is shown, and the other laser modules 1 on a base plate 2 are similar. Figure 7 for Figure 6 Cross-sectional view along L2, Figure 8 for Figure 7 A partial enlarged schematic diagram of the conductive portion 121, Fig. 9 The 3D schematic diagram of the laser module in which the light-emitting element and the light-transmitting component are omitted) is shown. The tube shell 12 includes an insulating ring frame 120 . The insulating ring frame 120 includes a conductive portion 121 . The conductive portion 121 includes a conductive layer 122 .

[0061] The pin 13 is electrically connected to the light emitting element 11 through the conductive layer 122 in the conductive portion 121 .

[0062] Specifically, the light emitting element 11 is connected to the conductive portion 121 of the insulating ring frame 120 via a wire, and the wire may be an Au wire.

[0063] After the conductive portion 121 is provided, the light emitting element 11 can be directly routed through the tube shell 12 without bypassing the ring frame to connect the external circuit, thereby reducing the height of the device and further reducing the overall volume of the device, further improving the integration of the laser.

[0064] Optionally, the conductive layer 122 is a deposited tungsten paste layer.

[0065] Specifically, Figure 8As shown, the pin 13 is in contact with the insulating material of at least part of the conductive part 121, and the insulating material includes alumina. The pin 13 includes Kovar alloy, which has a linear expansion coefficient similar to that of alumina in the range of 20 to 450°C, can be effectively sealed and matched with alumina, and also has a higher Curie point and good low-temperature structural stability.

[0066] Optionally, the pin 13 shown in the figure not contacting the insulating ring frame 120 in the first direction X is only an embodiment. In other embodiments, the pin 13 contacts the insulating ring frame 120 in the first direction X to fix the pin 13 more firmly on the laser module 1.

[0067] In specific implementation, the laser module 11 in the embodiment of the present application can be a monochromatic laser, or it can also be a multicolor laser. A monochromatic laser is a laser that can only emit laser light of one color, and a multicolor laser is a laser that can emit laser light of multiple colors. If the laser module 11 is a monochromatic laser, different laser modules 11 can be used to emit laser light of different colors, or they can all be used to emit laser light of the same color, which is not limited in the embodiment of the present application.

[0068] In some embodiments, in order to simplify the wiring layout of the laser module, the pins 13 of at least two laser modules 1 on the base plate 2 are welded together.

[0069] In a specific embodiment, Fig.10 As shown, the laser module includes a first laser module 1A and a second laser module 1B. The laser light emitted by at least one light-emitting element 11 included in the first laser module 1A is of the same color. The laser light emitted by at least one light-emitting element 11 included in the second laser module 1B is of the same color. The laser light emitted by the light-emitting elements 11 included in the first laser module 1A and the second laser module 1B is also of the same color, which can be red, green, blue or white. The first laser module 1A includes a positive pin 131A and a negative pin 132A, and the second laser module 1B includes a positive pin 131B and a negative pin 132B. The positive pin of each laser module is connected to the positive electrode of the light-emitting element in the laser module, and the negative electrode is connected in the same manner. Fig.10 As shown, on the base plate 2, the cathode pin 132A of the first laser module 1A is connected to the anode pin 131B of the second laser module 1B, which is equivalent to connecting the laser modules in a laser module in series, and the external circuit only needs to connect the anode pin 131A of the first laser module 1A to the cathode pin 132B of the second laser module 1B.

[0070] In another specific embodiment, Fig.11As shown, the laser module includes a third laser module 1C and a fourth laser module 1D, and the third laser module 1C and the fourth laser module 1D both include at least one first light-emitting element 111 and at least one second light-emitting element 112, wherein the lasers emitted by the first light-emitting element 111 and the second light-emitting element 112 have different colors, which may be red, green, blue or white. The third laser module 1C includes a first positive pin 1311C, a second positive pin 1312C, a first negative pin 1321C and a second negative pin 1322C, and the fourth laser module 1D includes a first positive pin 1311D, a second positive pin 1312D, a first negative pin 1321D and a second negative pin 1322D. The first positive pin and the first negative pin of each laser module are connected to the positive and negative electrodes of a light-emitting element of one color in the laser module, and the second positive pin and the second negative pin are connected to the positive and negative electrodes of a light-emitting element of another color. As shown Fig.11 As shown, on the base plate 2, the two cathode pins of the third laser module 1C are connected to the two anode pins of the fourth laser module 1D, which is equivalent to connecting in series the light-emitting elements with the same laser color in multiple laser modules, and the external circuit only needs to connect the two anode pins of the third laser module to the two cathode pins of the fourth laser module 1D.

[0071] In another specific embodiment, a laser module 1 may include a light-emitting element capable of emitting three colors of laser light. Correspondingly, the laser module may include three groups of six pins. Those skilled in the art can Fig.10 as well as Fig.11 The specific implementation method of the above embodiment is obtained from the embodiment of the present invention, which will not be described in detail here.

[0072] Specifically, the pins for connecting two laser modules on a base plate 2 can be as follows: Fig.10 and Fig.11 As shown, they can also be welded together as Fig.12 As shown, they are connected to each other through a common pin 133, and the common pin 133 is respectively connected to the positive and negative electrodes of the light-emitting elements in the two laser modules to realize the series connection of the light-emitting elements. Fig.12 The specific implementation method of obtaining other numbers of common pins 133 in the embodiment will not be described in detail here.

[0073] In some embodiments, Fig.13 As shown, the conductive layer 122 includes an outer conductive layer 1221 and at least one inner conductive layer 1222 . The inner conductive layer 1222 is electrically connected to the outer conductive layer 1221 through a through hole 1223 . The light emitting element 11 and the pin 13 are connected to the outer conductive layer 1221 .

[0074] Adding more conductive layers in the conductive portion 121 can increase the current-carrying charge between the light-emitting element 11 and the pin 13 and the external circuit, thereby improving the light-emitting efficiency of the light-emitting element 11 .

[0075] Specifically, Fig.13 The number of through holes 1223 shown is only exemplary and not limiting. Those skilled in the art may set one or more through holes 1223 according to actual conditions, all of which are within the protection scope of the present application.

[0076] Optionally, the outer conductive layer 1221 and the inner conductive layer 1222 are both deposited tungsten slurry layers, and the through hole 1223 is filled with tungsten slurry.

[0077] In some embodiments, Fig.14 As shown, the light-transmitting component 14 further includes a collimating lens 141 , and the collimating lens 141 is configured to collimate the outgoing light of the light-emitting element 11 .

[0078] Specifically, Fig.14 As shown, the light-transmitting component 14 includes a collimating lens 141 and a glass cover plate 142. The glass cover plate 142 and the collimating lens 141 can be a sapphire cover plate and a sapphire lens. The divergence angle of the collimating lens 141 is less than 1° and the deviation angle is less than 0.8°, thereby achieving collimation of the light emitted by the light-emitting element 11.

[0079] Optionally, the tube shell 12 is welded to the bottom plate 2 and the glass cover plate 142 by gold-tin soldering to ensure the airtightness of the packaging of the laser module 1 .

[0080] exist Fig.14 In the illustrated embodiment, the glass cover plate 142 is located on the side of the tube shell 12 away from the bottom plate 2, and is used to seal the opening of the side of the tube shell 12 away from the bottom plate 2, so as to form an enclosed space together with the bottom plate 2 and the tube shell 12. Optionally, the light-transmitting component 14 may also not include the glass cover plate 142, and the collimating lens 141 is directly fixed to the surface of the tube shell 12 away from the bottom plate 2. In this way, the collimating lens 141, the tube shell 12 and the bottom plate 2 together form an enclosed space.

[0081] Specifically, in the embodiment of the present application, each collimating lens 141 can be integrally formed. Fig.14 As shown, the collimating lens 141 is roughly plate-shaped, and the side of the collimating lens 141 close to the base plate 2 is a plane, and the side away from the base plate 2 has one or more convex curved surfaces, and the portion where each convex curved surface of the multiple convex curved surfaces is located is a collimating microlens, and the collimating microlenses correspond one-to-one to the multiple light-emitting elements 11.

[0082] In a specific embodiment, the laser module 1 is as follows: Fig.15 and Fig.16 As shown ( Fig.15This is a top view of the light emitting direction of the laser module 1. For the sake of clarity, Fig.15 The light-transmitting components are not shown. Fig.16 for Fig.15 The laser module 1 of the embodiment is a cross-sectional view cut along the dotted line L3, and the light-emitting element 11 includes a laser chip 15, a heat sink 16 and a reflecting prism 17. The heat sink 16 and the reflecting prism 17 can correspond one-to-one to the multiple laser chips 15 in the laser module. Each laser chip 15 is located on a corresponding heat sink 16, and the heat sink 16 is used to assist the corresponding laser chip 15 in heat dissipation. The material of the heat sink 16 may include ceramics. Each reflecting prism 17 is located on the light-emitting side of the corresponding laser chip 15. The laser chip 15 can emit a laser to the corresponding reflecting prism 17, and the reflecting prism 17 reflects the laser to the collimating lens 141 in a direction away from the base plate 2 (such as the Z direction), and then the laser can be collimated by the lens and then emitted.

[0083] In some embodiments, Fig.17 As shown, the bottom plate 2 includes a semicircular notch 21 on at least one side.

[0084] like Fig.18 as well as Fig.19 As shown, the semicircular notches 21 on the bottom plates 2 of the two laser modules together form a fixing hole 22 , and the external fixing member 32 can fix the two laser modules to the external component 31 through the fixing hole 22 .

[0085] like Fig. 20 As shown, in a specific implementation, a laser module includes at least two semicircular notches 21. When there is only one laser module, two fixing members 32 are required to fix it on the external component 31. When two laser modules are arranged adjacent to each other to form a larger array, such as Fig.19 As shown, two laser modules can be fixed at the same time using three fixing parts, which reduces the number of fixing parts, simplifies the process flow, and reduces the distance between the two laser modules, further improving the integration of the laser modules.

[0086] Specifically, the external component 31 may be a heat sink, and the fixing member 32 may be a screw.

[0087] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the existence of other identical elements in the process, method, article or device including the above elements.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0089] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A laser module, comprising a laser module and a base plate, wherein: At least two of the laser modules are located on one of the base plates; The laser module comprises a light-emitting element, a tube shell, a light-transmitting component and pins, wherein: The tube shell is located on one side of the bottom plate; The light-transmitting component is located at a side of the tube shell away from the bottom plate, and the tube shell, the light-transmitting component and the bottom plate together form an enclosed space; The light emitting element is mounted on the bottom plate and is located in the enclosed space; The lead is located at least on one side of the tube shell away from the light emitting element and is electrically connected to the light emitting element.

2. The laser module according to claim 1, wherein: At least two of the laser modules are arranged in an array on the bottom plate along a first direction and / or a second direction, and the first direction intersects with the second direction.

3. The laser module according to claim 2, wherein: The distance between at least two of the laser modules in the first direction is greater than or equal to 1 mm; And / or, the distance between at least two of the laser modules in the second direction is greater than or equal to 1 mm.

4. The laser module according to claim 3, wherein: The distance between at least two of the laser modules in the first direction is greater than or equal to 1.5 mm and less than or equal to 2 mm; And / or, a distance between at least two of the laser modules in the second direction is greater than or equal to 1.5 mm and less than or equal to 2 mm.

5. The laser module according to claim 1, wherein: The thickness of the laser module in a direction perpendicular to the plane of the base plate is less than or equal to 3.5 mm.

6. The laser module according to claim 2, wherein: Comprising four laser modules, the four laser modules are arranged in two rows along the first direction on the bottom plate, and the four laser modules are arranged in two columns along the second direction on the bottom plate; or, Four laser modules are arranged in a row on the bottom plate along the first direction; or, The four laser modules are arranged in a row on the bottom plate along the second direction.

7. The laser module according to claim 1, wherein: The tube shell includes an insulating ring frame, the insulating ring frame includes a conductive part, and the conductive part includes a conductive layer; The pin is electrically connected to the light emitting element through the conductive layer in the conductive portion.

8. The laser module according to claim 7, wherein: The conductive layer includes an outer conductive layer and at least one inner conductive layer. The inner conductive layer is electrically connected to the outer conductive layer through a through hole. The light-emitting element and the pins are both connected to the outer conductive layer.

9. The laser module according to claim 1, wherein: The light-transmitting component includes a collimating lens configured to collimate the outgoing light of the light-emitting element.

10. The laser module according to claim 1, wherein: The bottom plate includes a semicircular notch on at least one side; The semicircular notches on the bottom plates of the two laser modules together form a fixing hole, and the fixing hole is configured so that an external fixing member can fix the two laser modules to an external component through the fixing hole.

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