Semiconductor refrigeration device for embedded refrigeration equipment and embedded refrigeration equipment
By designing a semiconductor refrigeration device in an embedded refrigeration device and using the front space of the embedded refrigeration device to dissipate heat, the problems of poor heat dissipation and large space in the prior art are solved, and efficient heat dissipation and convenient maintenance are achieved.
Patent Information
- Application Number
- CN202420014234.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-03
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-01-03
AI Technical Summary
The existing embedded refrigeration equipment has poor heat dissipation effect, which leads to a large space occupancy and difficulty in repairing.
Design a semiconductor refrigeration device, including a shell, a semiconductor refrigeration sheet and an air duct system, by setting the air inlet of the second air duct to the bottom wall of the shell and the air outlet to the side wall, and heat dissipation is performed using the front space of the embedded refrigeration equipment. , reduce space and facilitate maintenance.
It improves the heat dissipation efficiency of embedded refrigeration equipment, reduces space consumption, and simplifies the installation and maintenance process of semiconductor refrigeration devices.
Smart Images
Figure CN222165210U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of household electrical appliances, for example, to a semiconductor refrigeration device for an embedded refrigeration device and an embedded refrigeration device. Background Art
[0002] At present, in order to improve the aesthetics of the room, more and more users install refrigeration equipment in the embedded installation space by setting a preset embedded installation space in the cabinet. However, the heat dissipation parts of the existing refrigeration equipment are set on the back plate, and the back plate is set close to the wall or the cabinet, resulting in poor heat dissipation effect of the refrigeration equipment.
[0003] In the related art, a certain distance is reserved between the back plate of the refrigeration equipment and the wall or cabinet to ensure the heat dissipation effect of the refrigeration equipment.
[0004] In the publicly available implementation process, the following problems were found in the relevant technology:
[0005] In actual use of the related technology, since a certain distance needs to be reserved between the back panel of the refrigeration equipment and the wall or cabinet, the refrigeration equipment occupies a large space.
[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content
[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.
[0008] The embodiments of the present disclosure provide a semiconductor refrigeration device for an embedded refrigeration device and an embedded refrigeration device, which improve the heat dissipation efficiency of the embedded refrigeration device and reduce the occupied space of the embedded refrigeration device.
[0009] In some embodiments, a semiconductor refrigeration device for an embedded refrigeration device is provided, comprising: a shell, comprising an installation cavity, a first air duct and a second air duct; a semiconductor refrigeration plate, arranged in the installation cavity, the first heat exchange end of the semiconductor refrigeration plate exchanges heat with the first air duct, and the second heat exchange end of the semiconductor refrigeration plate exchanges heat with the second air duct; the air inlet of the second air duct is arranged on the bottom wall of the shell, and the air outlet of the second air duct is arranged on the side wall of the shell; when the semiconductor refrigeration device is arranged in the embedded refrigeration device, the air outlet of the second air duct is arranged corresponding to the front side of the embedded refrigeration device and is connected to the external environment.
[0010] Optionally, a first air inlet, a second air inlet, a first air outlet, and a second air outlet are provided on the side wall of the shell; the two ends of the first air duct are the first air inlet and the first air outlet respectively; the two ends of the second air duct are the second air inlet and the second air outlet respectively.
[0011] Optionally, the first air outlet and the second air outlet are respectively located on opposite side walls of the shell; the first air inlet is located on the top wall of the shell; and the second air inlet is located on the bottom wall of the shell.
[0012] Optionally, the semiconductor refrigeration device for embedded refrigeration equipment also includes: a first heat dissipation structure, which is arranged at the first heat exchange end of the semiconductor refrigeration plate; and the first heat dissipation structure has a first heat dissipation portion, at least part of which is located in the first air duct to exchange heat with the airflow in the first air duct; and / or, a second heat dissipation structure, which is arranged at the second heat exchange end of the semiconductor refrigeration plate; and the second heat dissipation structure has a second heat dissipation portion, at least part of which is located in the second air duct to exchange heat with the airflow in the second air duct.
[0013] Optionally, when the semiconductor refrigeration device includes a first heat dissipation structure, the first heat dissipation structure includes a first heat conducting part and a first heat dissipation part; the first heat conducting part is thermally connected to the first heat exchange end of the semiconductor refrigeration plate, and the first heat dissipation part is located in the first air duct; when the semiconductor refrigeration device includes a second heat dissipation structure, the second heat dissipation structure includes a second heat conducting part and a second heat dissipation part; the second heat conducting part is thermally connected to the second heat exchange end of the semiconductor refrigeration plate, and the second heat dissipation part is located in the second air duct.
[0014] Optionally, the semiconductor refrigeration device for the embedded refrigeration equipment also includes: a first fan, arranged in the first air duct; the first fan is used to drive the air flow in the first air duct; and / or, a second fan, arranged in the second air duct; the second fan is used to drive the air flow in the second air duct.
[0015] Optionally, the semiconductor refrigeration device for the embedded refrigeration equipment also includes: a first thermal insulation component, arranged on the peripheral side of the first heat exchange end of the semiconductor refrigeration plate, located on the side where the first air duct is located; and / or, a second thermal insulation component, arranged on the peripheral side of the other end of the semiconductor refrigeration plate, located on the side where the second air duct is located.
[0016] In some embodiments, an embedded refrigeration device is provided, comprising: a refrigeration device body, including an air supply duct; and a semiconductor refrigeration device for the embedded refrigeration device as described in any of the above embodiments, wherein the first duct is connected to the air supply duct.
[0017] Optionally, the air supply duct is arranged on the back plate of the refrigeration device body.
[0018] Optionally, the semiconductor refrigeration device is arranged at the bottom of the refrigeration equipment body.
[0019] The semiconductor refrigeration device for embedded refrigeration equipment and the embedded refrigeration equipment provided in the embodiments of the present disclosure can achieve the following technical effects:
[0020] The semiconductor refrigeration device for embedded refrigeration equipment provided by the embodiment of the present disclosure is provided with an air inlet of the second air duct arranged on the bottom wall of the shell, and an air outlet of the second air duct arranged on the side wall of the shell. When the semiconductor refrigeration device is arranged on the embedded refrigeration device, the air outlet of the second air duct is arranged corresponding to the front of the embedded refrigeration device and is connected to the external environment, so as to realize heat dissipation by utilizing the front space of the embedded refrigeration device, improve the heat dissipation efficiency of the embedded refrigeration device, and reduce the occupied space of the embedded refrigeration device. In addition, by integrating the semiconductor refrigeration device, it is convenient to install and disassemble the semiconductor refrigeration device, thereby facilitating the maintenance of the semiconductor refrigeration device.
[0021] The embedded refrigeration device provided in the embodiment of the present disclosure realizes heat dissipation by utilizing the front space of the embedded refrigeration device by arranging the semiconductor refrigeration device for the embedded refrigeration device as described in the above embodiment on the refrigeration device body, thereby improving the heat dissipation efficiency of the embedded refrigeration device and reducing the occupied space of the embedded refrigeration device. In addition, by arranging the semiconductor refrigeration device at the bottom of the embedded refrigeration device, it is convenient to repair when the semiconductor refrigeration device fails.
[0022] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:
[0024] Figure 1 is a schematic diagram of a semiconductor refrigeration device for an embedded refrigeration device provided by an embodiment of the present disclosure from one angle;
[0025] Figure 2 is a schematic diagram of another angle of a semiconductor refrigeration device for an embedded refrigeration device provided by an embodiment of the present disclosure;
[0026] Figure 3 is a schematic diagram of another angle of a semiconductor refrigeration device for an embedded refrigeration device provided by an embodiment of the present disclosure;
[0027] Figure 4 is a cross-sectional view of a semiconductor refrigeration device for an embedded refrigeration device provided by an embodiment of the present disclosure;
[0028] Figure 5 is a schematic diagram of the structure of an embedded refrigeration device provided in an embodiment of the present disclosure;
[0029] Figure 6 is a cross-sectional view of an embedded refrigeration device provided in an embodiment of the present disclosure.
[0030] Reference numerals:
[0031] 1. A semiconductor refrigeration device for an embedded refrigeration device; 11. a housing; 111. a first air inlet; 112. a second air inlet; 113. a first air outlet; 114. a second air outlet; 12. a first heat dissipation structure; 13. a second heat dissipation structure; 14. a first fan; 15. a second fan; 16. a windshield;
[0032] 2. Embedded refrigeration equipment; 21. Refrigeration equipment body; 211. Air supply duct; 212. Air outlet of the air supply duct. DETAILED DESCRIPTION
[0033] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.
[0034] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.
[0035] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0036] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0037] Unless otherwise stated, the term "plurality" means two or more.
[0038] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.
[0039] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.
[0040] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
[0041] Combination Figures 1 to 6 As shown, the embodiment of the present disclosure provides a semiconductor refrigeration device 1 for an embedded refrigeration device, comprising: a shell 11 and a semiconductor refrigeration plate. The shell 11 includes an installation cavity, a first air duct and a second air duct. The semiconductor refrigeration plate is arranged in the installation cavity, and the first heat exchange end of the semiconductor refrigeration plate exchanges heat with the first air duct, and the second heat exchange end of the semiconductor refrigeration plate exchanges heat with the second air duct. The air inlet of the second air duct is arranged on the bottom wall of the shell 11, and the air outlet of the second air duct is arranged on the side wall of the shell 11. In the case where the semiconductor refrigeration device 1 is arranged in the embedded refrigeration device 2, the air outlet of the second air duct is arranged corresponding to the front of the embedded refrigeration device 2 and is connected to the external environment.
[0042] The semiconductor refrigeration device 1 for an embedded refrigeration device provided in the embodiment of the present disclosure is configured such that the air inlet of the second air duct is arranged on the bottom wall of the shell 11, and the air outlet of the second air duct is arranged on the side wall of the shell 11. When the semiconductor refrigeration device 1 is arranged on the embedded refrigeration device 2, the air outlet of the second air duct is arranged corresponding to the front side of the embedded refrigeration device 2 and is connected to the external environment, so as to realize heat dissipation by utilizing the front space of the embedded refrigeration device 2, thereby improving the heat dissipation efficiency of the embedded refrigeration device 2 and reducing the occupied space of the embedded refrigeration device 2.
[0043] Specifically, when the semiconductor refrigeration plate is powered on, one end of the semiconductor refrigeration plate releases cold (i.e., the first heat exchange end) and the other end releases heat (i.e., the second heat exchange end). Since the air outlet of the second air duct is set on the side wall of the shell 11, and the air inlet of the second air duct is set on the bottom wall of the shell 11, the air flow enters the second air duct from the lower space of the shell 11 through the air inlet of the second air duct, and then exchanges heat with the second heat exchange end, and then flows out from the air outlet of the second air duct to the front space of the shell 11, that is, flows to the external space corresponding to the front of the embedded refrigeration device 2. In this way, the heat generated by the second heat exchange end of the semiconductor refrigeration plate is transferred to the external space corresponding to the front of the embedded refrigeration device 2, and there is no need to use the back plate of the embedded refrigeration device 2 for heat dissipation, which improves the heat dissipation efficiency of the embedded refrigeration device 2 and reduces the occupied space of the embedded refrigeration device 2.
[0044] Optionally, combined Figures 1 to 4 As shown, the side wall of the housing 11 is provided with a first air inlet 111, a second air inlet 112, a first air outlet 113 and a second air outlet 114. The first air duct has two ends, namely, the first air inlet 111 and the first air outlet 113. The second air duct has two ends, namely, the second air inlet 112 and the second air outlet 114.
[0045] In this embodiment, the airflow circulation inside the embedded refrigeration device 2 is realized through the first air inlet 111 and the first air outlet 113 of the first air duct, thereby realizing the refrigeration inside the embedded refrigeration device 2. The heat dissipation of the hot end of the semiconductor refrigeration plate is realized through the second air inlet 112 and the second air outlet 114 of the second air duct, and the heat generated by the second heat exchange end is transferred to the external space corresponding to the front of the embedded refrigeration device 2. There is no need to use the back plate of the embedded refrigeration device 2 for heat dissipation, which improves the heat dissipation efficiency of the embedded refrigeration device 2 and reduces the occupied space of the embedded refrigeration device 2.
[0046] Specifically, when the semiconductor refrigeration plate is powered on and working, the air flow enters the first air duct through the first air inlet 111 of the first air duct from the embedded refrigeration device 2, exchanges heat with the cold energy generated by the first heat exchange end, and after the heat exchange, flows out of the first air duct through the first air outlet 113 of the first air duct and enters the embedded refrigeration device 2 to achieve cooling of the embedded refrigeration device 2.
[0047] Optionally, combined Figures 1 to 4 As shown, the first air outlet 113 and the second air outlet 114 are respectively located on opposite side walls of the housing 11. The first air inlet 111 is located on the top wall of the housing 11. The second air inlet 112 is located on the bottom wall of the housing 11.
[0048] In this embodiment, the positions of the first air inlet 111, the second air inlet 112, the first air outlet 113 and the second air outlet 114 are set to reduce interference between the first air inlet 111, the second air inlet 112, the first air outlet 113 and the second air outlet 114.
[0049] Specifically, by arranging the second air outlet 114 on the side wall of the shell 11 and the second air inlet 112 on the bottom wall of the shell 11, the problem of poor heat dissipation efficiency caused by the hot air flow discharged by the second air outlet 114 entering the second air inlet 112 can be reduced.
[0050] Optionally, combined Figure 5 and Figure 6 As shown, the semiconductor refrigeration device 1 for embedded refrigeration equipment further includes: a windshield 16. The windshield 16 is arranged on the bottom wall of the housing 11. The windshield 16 is used to separate the second air inlet 112 from the second air outlet 114. In this way, the airflow exchange between the second air inlet 112 and the second air outlet 114 can be further reduced by the windshield 16.
[0051] Optionally, combined Figure 4 As shown, the semiconductor refrigeration device 1 for embedded refrigeration equipment also includes: a first heat dissipation structure 12. The first heat dissipation structure 12 is arranged at the first heat exchange end of the semiconductor refrigeration plate. The first heat dissipation structure 12 has a first heat dissipation portion, at least part of which is located in the first air duct to exchange heat with the airflow in the first air duct.
[0052] In this embodiment, a first heat dissipation structure 12 is provided, and at least a portion of the first heat dissipation portion is located in the first air duct, so that the cold energy generated by the first heat exchange end is transferred to the airflow in the first air duct through the first heat dissipation structure 12, and then the airflow in the first air duct is used to exchange heat with the interior of the embedded refrigeration device 2, thereby realizing refrigeration of the embedded refrigeration device 2.
[0053] Specifically, when the semiconductor refrigeration plate is powered on, the first heat exchange end generates cold energy, which is transferred to the first air duct by the first heat dissipation part of the first heat dissipation structure 12, and then exchanges heat with the airflow in the first air duct.
[0054] Optionally, combined Figure 4 As shown, the semiconductor refrigeration device 1 for embedded refrigeration equipment further includes: a second heat dissipation structure 13. The second heat dissipation structure 13 is arranged at the second heat exchange end of the semiconductor refrigeration plate. The second heat dissipation structure 13 has a second heat dissipation portion, at least part of which is located in the second air duct to exchange heat with the airflow in the second air duct.
[0055] In this embodiment, by providing a second heat dissipation structure 13, and at least part of the second heat dissipation part is located in the second air duct, the cold energy generated by the second heat exchange end is transferred to the airflow in the second air duct through the second heat dissipation structure 13, thereby realizing heat dissipation of the semiconductor refrigeration plate by the airflow in the second air duct. In addition, since the air outlet of the second air duct is correspondingly arranged at the front of the embedded refrigeration device 2, the airflow after heat exchange is sent to the external space corresponding to the front of the embedded refrigeration device 2, and the external space corresponding to the front of the embedded refrigeration device 2 is used for heat exchange, there is no need to reserve space on the back plate of the embedded refrigeration device 2 for heat dissipation, thereby reducing the space required for the embedded refrigeration device 2.
[0056] Specifically, when the semiconductor refrigeration plate is powered on, the second heat exchange end generates heat, which is transferred to the second air duct by the second heat dissipation part of the second heat dissipation structure 13, and then exchanges heat with the airflow in the second air duct.
[0057] Optionally, combined Figure 4 As shown, the semiconductor refrigeration device 1 for embedded refrigeration equipment also includes: a first heat dissipation structure 12 and a second heat dissipation structure 13. The first heat dissipation structure 12 is arranged at the first heat exchange end of the semiconductor refrigeration plate. The first heat dissipation structure 12 has a first heat dissipation portion, at least part of which is located in the first air duct to exchange heat with the airflow in the first air duct. The second heat dissipation structure 13 is arranged at the second heat exchange end of the semiconductor refrigeration plate. The second heat dissipation structure 13 has a second heat dissipation portion, at least part of which is located in the second air duct to exchange heat with the airflow in the second air duct.
[0058] Optionally, when the semiconductor refrigeration device 1 includes the first heat dissipation structure 12, the first heat dissipation structure 12 includes a first heat conduction part and a first heat dissipation part. The first heat conduction part is thermally connected to the first heat exchange end of the semiconductor refrigeration plate, and the first heat dissipation part is located in the first air duct.
[0059] In this embodiment, the first heat conducting part and the first heat dissipating part are provided to transfer the cold energy generated by the first heat exchange end to the first heat dissipating part, and further to the air flow in the first air duct.
[0060] Specifically, when the semiconductor refrigeration plate is powered on, the first heat exchange end generates cold energy, which is transferred to the first heat conducting part thermally connected to the first heat exchange end, and then transferred from the first heat conducting part to the first heat dissipation part to the first air duct, and then exchanges heat with the airflow in the first air duct.
[0061] Optionally, when the semiconductor refrigeration device 1 includes the second heat dissipation structure 13, the second heat dissipation structure 13 includes a second heat conduction part and a second heat dissipation part. The second heat conduction part is thermally connected to the second heat exchange end of the semiconductor refrigeration plate, and the second heat dissipation part is located in the second air duct.
[0062] In this embodiment, a second heat conducting portion and a second heat dissipating portion are provided to transfer the cold energy generated by the second heat exchange end to the second heat dissipating portion, and further to the air flow in the second air duct.
[0063] Specifically, when the semiconductor refrigeration plate is powered on, the second heat exchange end generates heat, which is transferred to the second heat conducting part thermally connected to the second heat exchange end, and then transferred from the second heat conducting part to the second heat dissipation part and to the second air duct, and then exchanges heat with the airflow in the second air duct.
[0064] Optionally, combined Figure 4 As shown, the semiconductor refrigeration device 1 for embedded refrigeration equipment further includes: a first fan 14. The first fan 14 is arranged in the first air duct. The first fan 14 is used to drive the air flow in the first air duct.
[0065] In this embodiment, a first fan 14 is provided in the first air duct to drive the air flow in the first air duct, thereby accelerating the flow speed of the air flow in the first air duct and improving the cooling effect of the semiconductor refrigeration device 1.
[0066] Optionally, combined Figure 4 As shown, the semiconductor refrigeration device 1 for embedded refrigeration equipment further includes: a second fan 15. The second fan 15 is arranged in the second air duct. The second fan 15 is used to drive the air flow in the second air duct.
[0067] In this embodiment, a second fan 15 is provided in the second air duct to drive the air flow in the second air duct, thereby accelerating the flow speed of the air flow in the second air duct and improving the heat dissipation effect of the semiconductor refrigeration device 1.
[0068] Optionally, combined Figure 4As shown, the semiconductor refrigeration device 1 for embedded refrigeration equipment also includes: a first fan 14 and a second fan 15. The first fan 14 is arranged in the first air duct. The first fan 14 is used to drive the air flow in the first air duct. The second fan 15 is arranged in the second air duct. The second fan 15 is used to drive the air flow in the second air duct.
[0069] Optionally, the semiconductor refrigeration device 1 for embedded refrigeration equipment further includes: a first heat preservation member. The first heat preservation member is arranged around the first heat exchange end of the semiconductor refrigeration plate and is located on the side where the first air duct is located.
[0070] In this embodiment, a first heat preservation component is provided around the first heat exchange end to reduce heat exchange between the first heat exchange end and the air around the semiconductor refrigeration plate, thereby reducing the amount of cold lost at the first heat exchange end and improving the refrigeration efficiency of the semiconductor refrigeration device 1.
[0071] Optionally, the semiconductor refrigeration device 1 for embedded refrigeration equipment further includes: a second heat preservation member. The second heat preservation member is arranged around the other end of the semiconductor refrigeration sheet and is located on the side where the second air duct is located.
[0072] In this embodiment, a second thermal insulation component is provided around the second heat exchange end to reduce heat exchange between the second heat exchange end and the air around the semiconductor refrigeration plate, thereby reducing the effect of heat generated by the second heat exchange end on the first heat exchange end, thereby improving the refrigeration efficiency of the semiconductor refrigeration device 1.
[0073] Combination Figure 5 and Figure 6 As shown, the embodiment of the present disclosure provides an embedded refrigeration device 2, comprising: a refrigeration device body 21 and a semiconductor refrigeration device 1 for an embedded refrigeration device according to any one of the above embodiments. The refrigeration device body 21 comprises an air supply duct 211. The first duct is connected to the air supply duct 211.
[0074] The embedded refrigeration device 2 provided in the embodiment of the present disclosure is provided with a semiconductor refrigeration device 1 for embedded refrigeration devices as described in the above embodiment on the refrigeration device body 21, so as to utilize the front space of the embedded refrigeration device 2 for heat dissipation, thereby improving the heat dissipation efficiency of the embedded refrigeration device 2 and reducing the occupied space of the embedded refrigeration device 2. In addition, by providing the semiconductor refrigeration device 1 at the bottom of the embedded refrigeration device 2, it is convenient to repair when a failure occurs in the semiconductor refrigeration device 1.
[0075] Optionally, the refrigeration device body 21 further includes a return air duct. The air outlet of the return air duct is connected to the first air inlet 111. The air inlet of the supply air duct 211 is connected to the first air outlet 113. The air outlet of the supply air duct 211 is connected to the storage room of the refrigeration device body 21. The air inlet of the return air duct is connected to the storage room.
[0076] It is understandable that the return air duct can be located in the foam layer of the refrigeration device body 21 or at other locations of the refrigeration device body 21, as long as the air inlet of the return air duct can be connected to the storage compartment of the refrigeration device body 21, and the air outlet of the return air duct is connected to the first air inlet 111. The disclosed embodiment is not limited to this.
[0077] Optionally, combined Figure 6 As shown, the air supply duct 211 is arranged on the back plate of the refrigeration device body 21. In this way, the airflow after heat exchange with the cold energy generated by the first heat exchange end can be transferred to the storage space of the refrigeration device through the back plate of the refrigeration device body 21. There is no need to use the back plate of the refrigeration device for heat dissipation, so as to reduce the occupied space required by the embedded refrigeration device 2.
[0078] Optionally, combined Figure 5 and Figure 6 As shown, the semiconductor refrigeration device 1 is arranged at the bottom of the refrigeration device body 21. In this way, the second air outlet 114 of the semiconductor refrigeration device 1 can be arranged corresponding to the front of the embedded refrigeration device 2 and connected to the external environment, thereby realizing heat dissipation by utilizing the external environment on the front of the embedded refrigeration device 2, so as to realize heat dissipation without using the back plate of the refrigeration device, thereby reducing the occupied space required by the embedded refrigeration device 2.
[0079] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims
1. A semiconductor refrigeration device for embedded refrigeration equipment, characterized in that: include: The housing comprises a mounting cavity, a first air duct and a second air duct; The semiconductor refrigeration plate is arranged in the installation cavity, the first heat exchange end of the semiconductor refrigeration plate exchanges heat with the first air duct, and the second heat exchange end of the semiconductor refrigeration plate exchanges heat with the second air duct; The air inlet of the second air duct is arranged on the bottom wall of the shell, and the air outlet of the second air duct is arranged on the side wall of the shell; when the semiconductor refrigeration device is arranged in an embedded refrigeration device, the air outlet of the second air duct is arranged corresponding to the front of the embedded refrigeration device and is connected to the external environment.
2. The semiconductor refrigeration device for embedded refrigeration equipment according to claim 1, characterized in that: The side wall of the shell is provided with a first air inlet, a second air inlet, a first air outlet and a second air outlet; the two ends of the first air duct are the first air inlet and the first air outlet respectively; the two ends of the second air duct are the second air inlet and the second air outlet respectively.
3. The semiconductor refrigeration device for embedded refrigeration equipment according to claim 2, characterized in that: The first air outlet and the second air outlet are respectively located on opposite side walls of the housing; The first air inlet is located on the top wall of the shell; The second air inlet is located on the bottom wall of the shell.
4. The semiconductor refrigeration device for embedded refrigeration equipment according to any one of claims 1 to 3, characterized in that: Also includes: A first heat dissipation structure is arranged at a first heat exchange end of the semiconductor refrigeration plate; The first heat dissipation structure has a first heat dissipation portion, at least part of which is located in the first air duct to exchange heat with the airflow in the first air duct; and / or, The second heat dissipation structure is arranged at the second heat exchange end of the semiconductor refrigeration plate; and the second heat dissipation structure has a second heat dissipation part, at least part of which is located in the second air duct to exchange heat with the airflow in the second air duct.
5. The semiconductor refrigeration device for embedded refrigeration equipment according to claim 4, characterized in that: In the case where the semiconductor refrigeration device includes a first heat dissipation structure, the first heat dissipation structure includes a first heat conduction part and a first heat dissipation part; the first heat conduction part is heat-conductingly connected to the first heat exchange end of the semiconductor refrigeration plate, and the first heat dissipation part is located in the first air duct; When the semiconductor refrigeration device includes a second heat dissipation structure, the second heat dissipation structure includes a second heat conduction part and a second heat dissipation part; the second heat conduction part is thermally connected to the second heat exchange end of the semiconductor refrigeration plate, and the second heat dissipation part is located in the second air duct.
6. The semiconductor refrigeration device for embedded refrigeration equipment according to any one of claims 1 to 3, characterized in that: Also includes: A first fan is disposed in the first air duct; The first fan is used to drive the air flow in the first air duct; and / or, The second fan is arranged in the second air duct; the second fan is used to drive the air flow in the second air duct.
7. The semiconductor refrigeration device for embedded refrigeration equipment according to any one of claims 1 to 3, characterized in that: Also includes: A first heat-insulating member is arranged on the peripheral side of the first heat exchange end of the semiconductor refrigeration plate and is located on the side where the first air duct is located; and / or, The second heat-insulating component is arranged on the peripheral side of the other end of the semiconductor refrigeration plate and is located on the side where the second air duct is located.
8. An embedded refrigeration device, characterized in that: include: The refrigeration equipment body includes an air supply duct; and According to any one of claims 1 to 7, the semiconductor refrigeration device for an embedded refrigeration device, the first air duct is connected to the air supply duct.
9. The embedded refrigeration device according to claim 8, characterized in that: The air supply duct is arranged on the back plate of the refrigeration equipment body.
10. The embedded refrigeration device according to claim 8, characterized in that: The semiconductor refrigeration device is arranged at the bottom of the refrigeration equipment body.