Steel mesh structure for reducing welding bubble rate of chip
By setting up a single-shaped connecting bridge and positioning hole group in the tin planting mesh of the steel mesh structure, the problems of hollows and bubbles in the tin planting hole of the traditional steel mesh are solved, and the strength and electrical connectivity of the solder joints are improved. , improves the performance and reliability of the circuit board.
Patent Information
- Application Number
- CN202420496056.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-14
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-03-14
AI Technical Summary
In the PCBA process, holes or bubbles often appear in traditional steel mesh planting holes, which affects the strength and electrical connectivity of the solder joints and reduces the performance and reliability of the circuit board.
Design a steel mesh structure that reduces the bubble rate of chip welding. By setting a single-shaped connecting bridge in the tin planting mesh as an exhaust channel, the tin planting mesh is divided, and a positioning hole group is set at four corners. Ensure uniform distribution of tin liquid and smooth exhaust.
Significantly reduce bubble generation, improve solder joint strength and electrical connectivity, and improve circuit board performance and reliability.
Smart Images

Figure CN222192700U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip mounting, in particular to a steel mesh structure for reducing the bubble rate of chip welding. Background Art
[0002] In the PCBA process, tin needs to be planted on the solder joints on the PCB board. In this process, a steel mesh is needed to complete this operation; however, the tin planting holes of the traditional steel mesh are simple through holes, and the appearance of solder joint voids or bubbles is a common problem. These voids and bubbles may affect the strength and electrical connectivity of the solder joints, thereby reducing the performance and reliability of the circuit board. Therefore, in order to reduce the bubble rate of chip welding, we need to set up a new structure to overcome the above defects. Utility Model Content
[0003] The utility model aims to overcome the shortcomings of the prior art and provides a steel mesh structure for reducing the bubble rate of chip welding.
[0004] The utility model is realized through the following technical solutions:
[0005] A steel mesh structure for reducing chip welding bubble rate, comprising:
[0006] A steel mesh body, wherein a plurality of tin-planting areas are provided on the surface of the steel mesh body, a plurality of tin-planting mesh holes are opened on the surface of the tin-planting areas, and positioning hole groups are provided at the four outer corners of the tin-planting mesh holes;
[0007] A connecting bridge is arranged in the tin-planting mesh hole, and the connecting bridge is an "I"-shaped structure.
[0008] The technical solution is further configured as follows: the surface of the connecting bridge is flush with the surface of the steel mesh body.
[0009] The technical solution is further configured as follows: the connecting bridge divides the tin-planting mesh hole into two.
[0010] The technical solution is further configured as follows: the ratio of the width of the connecting bridge to the diameter of the tin-planting mesh hole is 0.2-0.4.
[0011] The technical solution is further configured as follows: the diameter of the tin-planting mesh hole is 0.6 mm, and the width of the connecting bridge is 0.13 mm.
[0012] The technical solution is further configured as follows: the positioning hole group includes two rectangular through holes arranged in parallel.
[0013] The utility model discloses a steel mesh structure for reducing the bubble rate of chip welding. Compared with the prior art:
[0014] 1. This technical solution sets a connecting bridge in the tin-planting mesh hole, which can be used as an exhaust channel during tin-planting, which can greatly reduce the generation of bubbles, improve the strength and electrical connectivity of the solder joints, and thus improve the performance and reliability of the circuit board;
[0015] 2. The connecting bridge of this technical solution divides the tinning mesh into two equal parts, which is convenient for exhaust during the tinning process. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a structural schematic diagram of the utility model.
[0017] Figure 2 It is a structural schematic diagram of the tin planting area of the utility model.
[0018] The numbers and letters in the figure represent the corresponding component names:
[0019] Among them: 100, steel mesh body; 101, tin-planting mesh hole; 102, positioning hole group; 200, connecting bridge; 300, tin-planting area. DETAILED DESCRIPTION
[0020] The technical solution of the utility model is further described below in conjunction with the accompanying drawings and through specific implementation methods. Among them, the accompanying drawings are only used for exemplary descriptions, and only represent schematic diagrams rather than physical drawings, and cannot be understood as limitations on this patent; in order to better illustrate the embodiments of the utility model, some parts of the accompanying drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the accompanying drawings may be omitted.
[0021] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.
[0022] See also Figure 1 and Figure 2As shown, a steel mesh structure for reducing the bubble rate of chip welding includes: a steel mesh body 100, the surface of the steel mesh body 100 is provided with a plurality of tin-planting areas 300, the tin-planting areas 300 are rectangular areas, preferably square areas; the surface of the tin-planting areas 300 is provided with a plurality of tin-planting mesh holes 101, the number of the tin-planting mesh holes 101 in the tin-planting areas 300 is configured according to the actual tin-planting requirements of the PCB board or the chip, the four outer corners of the tin-planting mesh holes 101 are provided with positioning hole groups 102, and the four outer corners of the tin-planting mesh holes 101 are the four corners of the tin-planting area; a connecting bridge 200, the connecting bridge 200 is arranged in the tin-planting mesh hole 101, and the connecting bridge 200 is an "I"-shaped structure; in the above technical scheme, please refer to the detailed description of the invention. Figure 2 It can be seen that the connecting bridge 200 is set in the tin-planting mesh hole 101. The main purpose of setting the connecting bridge 200 is to provide an exhaust channel during tin-planting, which can greatly reduce the appearance of bubbles or voids at the tin-planting position. Since the tin-planting work is carried out at a high temperature, the setting of the connecting bridge 200 does not affect the effect of the tin-planting ball after tin-planting; at the same time, refer to Figure 2 It can be seen that the connecting bridges 200 in the plurality of longitudinal tin-planting mesh holes 101 are arranged in a straight line, which greatly improves the heat dissipation effect, and also makes the exhaust effect better, so that the probability of bubble occurrence is reduced.
[0023] As a preferred solution for the connecting bridge 200, the surface of the connecting bridge 200 is flush with the surface of the steel mesh body 100; the surface of the connecting bridge 200 is flush with the surface of the steel mesh body 100, so that the exhaust is smoother during the tin implantation process.
[0024] As a preferred solution, the connecting bridge 200 divides the tin-planting mesh 101 into two; the connecting bridge 200 is set in the middle position of the tin-planting mesh 101 to divide the tin-planting mesh 101 into two, which can ensure that the liquid tin on both sides of the tin-planting mesh 101 is evenly distributed during the tin-planting process, which is convenient for exhaust.
[0025] As a preferred solution, the ratio of the width of the connecting bridge 200 to the diameter of the tin-planting mesh hole 101 is 0.2-0.4; since the aperture of the tin-planting mesh hole 101 is generally small, if the connecting bridge 200 is too wide, it will greatly affect the tin-planting effect.
[0026] As a preferred solution, the diameter of the tin-planting mesh hole 101 is 0.6 mm, and the width of the connecting bridge 200 is 0.13 mm.
[0027] As a preferred solution, the positioning hole group 102 includes two parallel rectangular through holes. The arrangement of the two rectangular through holes can facilitate positioning of PCBs or chips of different specifications.
[0028] The tin-planting mesh hole 101 is a circular hole.
[0029] The above are only preferred specific implementation methods of the utility model, but the protection scope of the utility model is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the utility model, who makes equivalent replacements or changes based on the technical scheme and utility model concept of the utility model, should be covered by the protection scope of the utility model.
[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
Claims
1. A steel mesh structure for reducing chip welding bubble rate, characterized in that: include: A steel mesh body (100), wherein a plurality of tin-planting areas (300) are provided on the surface of the steel mesh body (100), a plurality of tin-planting mesh holes (101) are opened on the surface of the tin-planting areas (300), and positioning hole groups (102) are provided at four outer corners of the tin-planting mesh holes (101); A connecting bridge (200), wherein the connecting bridge (200) is arranged in the tin-planting mesh hole (101), and the connecting bridge (200) is an "I"-shaped structure.
2. A steel mesh structure for reducing chip welding bubble rate according to claim 1, characterized in that: The surface of the connecting bridge (200) is flush with the surface of the steel mesh body (100).
3. A steel mesh structure for reducing chip welding bubble rate according to claim 1 or 2, characterized in that: The connecting bridge (200) divides the tin-planting mesh hole (101) into two.
4. A steel mesh structure for reducing chip welding bubble rate according to claim 1, characterized in that: The ratio of the width of the connecting bridge (200) to the diameter of the tin-planting mesh hole (101) is 0.2-0.
4.
5. The steel mesh structure for reducing chip welding bubble rate according to claim 1, characterized in that: The diameter of the tin-planting mesh hole (101) is 0.6 mm, and the width of the connecting bridge (200) is 0.13 mm.
6. A steel mesh structure for reducing chip welding bubble rate according to claim 1, characterized in that: The positioning hole group (102) comprises two rectangular through holes arranged in parallel.
