Non-contact silicon wafer transmission track

Abstract

The utility model discloses a non-contact silicon wafer transmission track, which comprises a driving servo motor, a non-contact track, silicon wafer guides, a synchronous belt with bosses and a silicon wafer main body, the driving servo motor supplies power to the non-contact track, and the silicon wafer guides are arranged on two sides of the non-contact track. A synchronous belt with a boss is arranged in a gap between the non-contact tracks, a silicon wafer main body is arranged on the silicon wafer guides, and a barometer is arranged on the side surface of the silicon wafer main body. Smooth rotation of the guide can guarantee that the whole conveying track is stable and does not shake in the conveying process, silicon wafer bodies are conveyed through friction force, the whole track can be jacked by the lifting air cylinder to be guided in the middle to be switched into conveying of single silicon wafer bodies, and the whole conveying track is wider in application range and better in compatibility.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer transmission, in particular to a contactless silicon wafer transmission track. Background Art

[0002] Thin film preparation technology has a very wide range of applications in VLSI technology. According to its film forming method, it can be divided into two categories: physical vapor deposition (PVD) and chemical vapor deposition (CVD). Plasma enhanced chemical vapor deposition (PECVD) is a type of chemical vapor deposition, and its most prominent advantage is its low deposition temperature. The thin film deposited by PECVD has excellent electrical properties, good substrate adhesion and excellent step coverage. Because of these advantages, it has a wide range of applications in VLSI, optoelectronic devices, MEMS and other fields. Silicon wafer transmission is an important equipment in the manufacturing process of solar panels and an important technical link in the plasma enhanced chemical vapor deposition (PECVD) process. Currently, the most commonly used method is to use a servo motor to drive a synchronous belt structure to transmit silicon wafers. This method of transmitting silicon wafers usually uses a polyurethane synchronous belt to directly contact the silicon wafer and use friction to transfer the silicon wafer. The biggest disadvantage of this method is that the surface of the silicon wafer will be contaminated to varying degrees when it contacts the synchronous belt, which will affect the subsequent PECVD coating effect of the silicon wafer or the effect of performing other processing techniques, which will also directly affect the performance of the entire product.

[0003] The unavoidable contact between the existing silicon wafers and the track during transportation will cause certain damage to the silicon wafers, thus affecting subsequent processing. For example, a silicon wafer conveying device disclosed in publication number CN215496655U inevitably contacts the silicon wafers during the conveying process. Excessive contact between the silicon wafers and the track will cause damage to the silicon wafers, which is not conducive to subsequent processing.

[0004] Therefore, it is necessary to invent a contactless silicon wafer transfer track to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a contactless silicon wafer transmission track to solve the problem that the necessary contact with the silicon wafer during the silicon wafer transmission in the technology causes damage to the silicon wafer.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a contactless silicon wafer transmission track, comprising a driving servo motor, a contactless track, a silicon wafer guide, a synchronous belt with a boss and a silicon wafer body, the driving servo motor provides power for the operation of the contactless track, silicon wafer guides are arranged on both sides of the contactless track, a synchronous belt with a boss is arranged in the gap between the contactless tracks, a silicon wafer body is installed on the silicon wafer guide, and a pressure gauge is installed on the side of the silicon wafer body.

[0007] Preferably, four contactless tracks are provided, two of which form a group, an intermediate guide is provided between the two groups of contactless tracks, and a synchronous belt with a boss is provided in each group of contactless tracks.

[0008] Preferably, a lifting cylinder is installed at the bottom of the intermediate guide, and a plurality of the lifting cylinders are provided, and the distances between the plurality of lifting cylinders are equal.

[0009] Preferably, the contactless track is made of metal, and the distances between the multiple contactless tracks are equal, and the outermost contactless track and the innermost contactless track are both fixedly connected to a silicon wafer guide.

[0010] Preferably, a plurality of the silicon wafer guides are provided, the lengths of the plurality of silicon wafer guides are adapted to the length of the silicon wafer body, and the number of the silicon wafer body and the silicon wafer guides are the same.

[0011] Preferably, a plurality of the barometers are provided, and the plurality of barometers are spaced apart at the bottom of the silicon wafer guide on both sides.

[0012] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0013] 1. The utility model provides wafer guides on both sides and in the middle of the track. The smooth rotation of the guides can ensure that the entire conveying track is stable and does not shake during the conveying process. The friction force is used to convey the main body of the wafer. The entire track can be lifted by the lifting cylinder to lift the middle guide to switch to the conveying of a single wafer body. The entire conveying track has a wider range of use and better compatibility.

[0014] 2. The utility model adopts contactless transmission, and the silicon wafer will not come into contact with the conveyor line during transmission, which greatly improves the processing effect of the silicon wafer in subsequent processes. The fragmentation rate during silicon wafer transmission is greatly reduced, and the silicon wafer transmission efficiency and accuracy are higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a three-dimensional structural schematic diagram of the lifting cylinder of the utility model;

[0017] Figure 3 This is a bottom view of the contactless track of the utility model;

[0018] Figure 4 It is a side view of the barometer of the utility model;

[0019] Figure 5 It is a top view of the silicon wafer body of the utility model.

[0020] Description of reference numerals:

[0021] 1. Driving servo motor; 2. Contactless track; 3. Silicon wafer guide; 4. Synchronous belt with boss; 5. Intermediate guide; 501, lifting cylinder; 6. Pressure gauge; 7. Silicon wafer body. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] The utility model provides Figure 1-3 A contactless silicon wafer transmission track shown in the figure includes a driving servo motor 1, a contactless track 2, a silicon wafer guide 3, a synchronous belt with a boss 4 and a silicon wafer body 7. The driving servo motor 1 provides power for the operation of the contactless track 2. Silicon wafer guides 3 are arranged on both sides of the contactless track 2. A synchronous belt with a boss 4 is arranged in the gap between the contactless tracks 2. A silicon wafer body 7 is installed on the silicon wafer guide 3, and a barometer 6 is installed on the side of the silicon wafer body 7.

[0024] The entire conveyor track can transport both dual silicon wafers and single silicon wafers, making the entire conveyor track more compatible.

[0025] There are four contactless tracks 2, two in a group, an intermediate guide 5 is arranged between the two groups of contactless tracks 2, each group of contactless tracks 2 is provided with a synchronous belt 4 with a boss, the contactless track 2 is made of metal, and the distances between the multiple contactless tracks 2 are equal, and the outermost contactless track 2 and the innermost contactless track 2 are fixedly connected with a silicon wafer guide 3.

[0026] The silicon wafer body 7 is transported in one direction within the transport range of the non-contact track 2 . During the transport process, the silicon wafer body 7 is not contacted by friction, thereby effectively preventing the silicon wafer body 7 from being broken, damaged or contaminated.

[0027] A lifting cylinder 501 is installed at the bottom of the middle guide 5, and there are multiple lifting cylinders 501, and the distances between the multiple lifting cylinders 501 are equal. There are multiple silicon wafer guides 3, and the lengths of the multiple silicon wafer guides 3 are adapted to the length of the silicon wafer body 7. The number of silicon wafer bodies 7 and silicon wafer guides 3 is the same.

[0028] The intermediate guide 5 and the silicon wafer guide 3 can effectively prevent shaking and instability during the conveying process.

[0029] A plurality of barometers 6 are provided, and the plurality of barometers 6 are spaced apart at the bottom of the silicon wafer guide 3 on both sides.

[0030] The function of the barometer 6 is to monitor the air pressure during the entire transportation process in real time.

[0031] Working principle of this utility model:

[0032] Refer to the instruction manual Figure 1-3 When using the utility model, the silicon wafer body 7 is first transmitted from the front-end device to the non-contact track 2, and the gas is blown out from the non-contact track 2 to form a thin air film on its surface. The transmitted silicon wafer body 7 is received by the air film and suspended on the track;

[0033] Refer to the instruction manual Figure 3-5 When the utility model is used, the servo motor 1 is driven to start the synchronous belt, and the boss on the synchronous belt 4 with boss hooks the side of the silicon wafer body 7, driving the silicon wafer body 7 to be transmitted on the non-contact track 2;

[0034] During the transmission of the silicon wafer body 7, the silicon wafer guide 3 and the intermediate guide 5 ensure that the silicon wafer does not move left and right. The barometer 6 can monitor the air pressure of the non-contact track 2 at any time to ensure the high efficiency and high precision operation of the transmission track. Figure 1 The figure shows the contactless transmission of two silicon wafers. Figure 2 The lifting action of the middle guide lifting cylinder 501 can quickly and conveniently switch the contactless conveying track into contactless transmission of a single silicon wafer, thereby improving its compatibility with silicon wafer transmission.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A contactless silicon wafer transmission track, comprising a driving servo motor (1), a contactless track (2), a silicon wafer guide (3), a synchronous belt with a boss (4) and a silicon wafer body (7), characterized in that: The driving servo motor (1) supplies power for the operation of the contactless track (2); silicon wafer guides (3) are arranged on both sides of the contactless track (2); a synchronous belt (4) with a boss is arranged in the gap between the contactless tracks (2); a silicon wafer body (7) is mounted on the silicon wafer guide (3); and a barometer (6) is mounted on the side of the silicon wafer body (7).

2. The contactless silicon wafer transfer track according to claim 1, characterized in that: The non-contact rails (2) are provided in four pieces, two of which form a group, an intermediate guide (5) is provided between two groups of non-contact rails (2), and a synchronous belt (4) with a boss is provided in each group of non-contact rails (2).

3. The contactless silicon wafer transfer track according to claim 2, characterized in that: A lifting cylinder (501) is installed at the bottom of the intermediate guide (5), and a plurality of the lifting cylinders (501) are provided, and the distances between the plurality of lifting cylinders (501) are equal.

4. The contactless silicon wafer transfer track according to claim 2, characterized in that: The contactless track (2) is made of metal, and the distances between the plurality of contactless tracks (2) are equal. The outermost contactless track (2) and the innermost contactless track (2) are both fixedly connected with a silicon wafer guide (3).

5. The contactless silicon wafer transfer track according to claim 1, characterized in that: The silicon wafer guides (3) are provided in plurality, the lengths of the plurality of silicon wafer guides (3) being adapted to the length of the silicon wafer body (7), and the number of the silicon wafer body (7) and the silicon wafer guides (3) being the same.

6. The contactless silicon wafer transfer track according to claim 1, characterized in that: A plurality of the barometers (6) are provided, and the plurality of barometers (6) are arranged at intervals at the bottom of the silicon wafer guide (3) on both sides.

Images