Support plate, heating device and coating equipment

Abstract

The utility model relates to a carrier plate, a heating device and coating equipment. The carrier plate comprises a first sub-component and a second sub-component. The first sub-component is provided with a protrusion, the second sub-component is provided with a groove, the first sub-component is arranged on the surface of the second sub-component, and the protrusion is matched with the groove in an embedded mode. The surface, away from the second sub-component, of the first sub-component is a bearing surface, and the surface, away from the first sub-component, of the second sub-component is a supporting surface. And the second sub-component is an aluminum alloy sub-component. According to the carrier plate, through the carbon fiber sub-components with the self-protrusions on the surfaces and the aluminum alloy sub-components with the grooves in the surfaces, the protrusions and the grooves are matched in an embedded mode, the good heating effect on the peripheral position of the carrier plate can be achieved, and the temperature distribution between different areas of the carrier plate is made to be uniform.

Description

Technical Field

[0001] The present application relates to the technical field of coating equipment, and in particular to a carrier plate, a heating device and a coating equipment. Background Art

[0002] When the plasma enhanced chemical vapor deposition plate coating machine heats the carrier, the temperature distribution of the heating plate is uneven. The middle part of the carrier is at the center of the heating plate, which will cause the temperature of the middle part of the carrier to be higher than that of the edge, thereby causing the temperature difference between the materials carried at different positions on the carrier, that is, the heating effect of the materials located at the edge of the carrier is poor, which will affect the coating quality of these materials. Utility Model Content

[0003] Based on this, it is necessary to provide a carrier, a heating device and a coating device. The carrier of the present application can make the temperature distribution between different areas of the carrier more uniform when heating the material on the carrier.

[0004] In a first aspect, the present application provides a carrier board, comprising a first sub-component and a second sub-component;

[0005] The first sub-component has a protrusion, the second sub-component has a groove, the first sub-component is arranged on the surface of the second sub-component and the protrusion is embedded and matched with the groove;

[0006] The surface of the first sub-component away from the second sub-component is a bearing surface, and the surface of the second sub-component away from the first sub-component is a supporting surface;

[0007] The first sub-component is a carbon fiber sub-component;

[0008] The second sub-component is an aluminum alloy sub-component.

[0009] In some embodiments, the thickness of the protrusion gradually decreases from the top to the edges thereof.

[0010] In some embodiments, the protrusion is a pyramidal structure.

[0011] In some embodiments, the protrusion is a regular pyramid structure.

[0012] In some embodiments, the first sub-component and the protrusion are generally in a right pyramid structure.

[0013] In some embodiments, the maximum height of the protrusion from the supporting surface is 1 cm to 10 cm.

[0014] In some embodiments, the minimum distance between the bottom of the groove and the support surface is 1 cm to 10 cm.

[0015] In a second aspect, the present application provides a heating device, comprising a heating element and a carrier plate as described in any one of the above items; the supporting surface of the carrier plate is arranged on the surface of the heating element.

[0016] In a third aspect, the present application provides a coating device, comprising a cavity and the above-mentioned heating device, wherein the heating device is arranged inside the cavity.

[0017] In some embodiments, the coating device further comprises a cathode plate, which is disposed inside the cavity and spaced apart from the heating element;

[0018] The carrier plate is arranged on the surface of the heating element facing the cathode plate.

[0019] The carrier plate includes a first sub-component and a second sub-component, the first sub-component is a carbon fiber sub-component, and the second sub-component is an aluminum alloy sub-component. The first sub-component has a protrusion, and the second sub-component has a groove. The first sub-component is arranged on the surface of the second sub-component, and the protrusion and the groove are embedded and matched. When the carrier plate is used to receive materials and heat the materials, the materials can be placed on the bearing surface of the first sub-component, and the supporting surface is heated by the heating element. When the carrier plate is heated, the thickness of the aluminum alloy sub-component at the position where the groove and the protrusion are embedded and matched on the carrier plate is thinner, and the thickness of the aluminum alloy sub-component at the peripheral position is thicker. The aluminum alloy sub-component has a higher thermal conductivity than the carbon fiber sub-component, and can achieve a better heating effect on the peripheral position of the carrier plate during the heating process, so that the temperature distribution between different areas of the carrier plate is more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG1 is a schematic diagram of the structure of a carrier provided in one embodiment of the present application;

[0021] FIG2 is a schematic structural diagram of a carrier board provided in another embodiment of the present application;

[0022] FIG3 is a schematic structural diagram of a first sub-component provided in an embodiment of the present application;

[0023] FIG4 is a schematic structural diagram of a second sub-component provided in an embodiment of the present application;

[0024] FIG5 is a schematic diagram of the structure of a heating device provided in one embodiment of the present application;

[0025] FIG. 6 is a schematic diagram of the structure of a coating device provided in one embodiment of the present application.

[0026] Description of Reference Numerals

[0027] 10. Carrier plate; 110. First sub-component; 111. Protrusion; 120. Second sub-component; 121. Groove; 20. Heating device; 11. Heating element; 30. Coating equipment; 21. Cavity; 22. Cathode plate; 23. Pipe. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0030] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] Exemplarily, please refer to FIG. 1 , which is a schematic diagram of the structure of a carrier 10 provided in an embodiment of the present application. The carrier 10 of the present application can be used for carrying materials. Specifically, the carrier 10 of the present application can be used for carrying battery cells. More specifically, the carrier 10 of the present application can be used for carrying battery cells, so that the battery cells carried by the carrier 10 can be heated by a heating element. More specifically, the carrier 10 of the present application can be used for carrying battery cells in a plate-type coating device, so that the battery cells carried by the carrier 10 can be heated and coated by a heating element.

[0034] Referring to FIG. 1 , FIG. 3 and FIG. 4 , the present application provides a carrier plate 10, comprising a first subcomponent 110 and a second subcomponent 120. The first subcomponent 110 has a protrusion 111, and the second subcomponent 120 has a groove 121. The first subcomponent 110 is disposed on the surface of the second subcomponent 120, and the groove 121 and the protrusion 111 are embedded and matched. The surface of the first subcomponent 110 away from the second subcomponent 120 is a bearing surface, and the surface of the second subcomponent 120 away from the first subcomponent 110 is a supporting surface. The first subcomponent 110 is a carbon fiber subcomponent. The second subcomponent 120 is an aluminum alloy subcomponent.

[0035] The carrier 10 includes a first sub-component 110 and a second sub-component 120, wherein the first sub-component 110 is a carbon fiber sub-component and the second sub-component 120 is an aluminum alloy sub-component. The first sub-component 110 has a protrusion 111, and the second sub-component 120 has a groove 121. The first sub-component 110 is arranged on the surface of the second sub-component 120, and the protrusion 111 and the groove 121 are embedded and matched. When the carrier 10 is used to receive materials and heat the materials, the materials can be placed on the bearing surface of the first sub-component 110, and the supporting surface is heated by the heating element. When the carrier 10 is heated, the thickness of the aluminum alloy sub-component at the position where the groove 121 and the protrusion 111 are embedded and matched on the carrier 10 is thinner, and the thickness of the aluminum alloy sub-component at the peripheral position is thicker. The aluminum alloy sub-component has a higher thermal conductivity than the carbon fiber sub-component, and can achieve a better heating effect on the peripheral position of the carrier 10 during the heating process, so that the temperature distribution between different areas of the carrier 10 is more uniform.

[0036] It can be understood that the support is used to support materials. The support surface is used to support the carrier plate 10.

[0037] In some embodiments, the thickness of the protrusion 111 gradually decreases from its top to the surrounding edge positions. The protrusion 111 whose thickness gradually decreases from its top to the surrounding edge positions can make the thickness of the second sub-component 120 gradually increase from the middle position to the surrounding edge positions. The aluminum alloy sub-component has a higher thermal conductivity than the carbon fiber sub-component, which can achieve a better heating effect on the peripheral position of the carrier 10 during the heating process, and the thickness of the protrusion 111 gradually decreases from its top to the surrounding edge positions, which can make the temperature distribution between different areas of the carrier 10 more uniform.

[0038] In some embodiments, the thickness of the protrusion 111 decreases gradually from the top to the edges thereof in a step-like manner.

[0039] In some embodiments, the thickness of the protrusion 111 decreases linearly from the top to the edges.

[0040] In some embodiments, the protrusion 111 is a cone structure. It is understood that the cone structure may be a pyramid structure.

[0041] In some embodiments, the protrusion 111 is a regular pyramid structure. The protrusion 111 is a regular pyramid structure, that is, the top position of the protrusion 111 is located in the middle position of its bottom surface, which can achieve a better heating effect on the peripheral position of the carrier 10 during the heating process, and can make the temperature distribution between different areas of the carrier 10 more uniform.

[0042] In some embodiments, the shape and size of the bottom surface of the protrusion 111 are the same as the shape and size of the surface of the first sub-component 110 facing the second sub-component 120 .

[0043] As shown in FIG. 2 , in some embodiments, the first sub-component 110 and the protrusion 111 are in a regular pyramid structure as a whole. For ease of understanding, by comparing the carrier 10 shown in FIG. 1 and FIG. 2 , the first sub-component 110 and the protrusion 111 are in a regular pyramid structure as a whole, that is, the first sub-component 110 is a quadrangular pyramid structure. Under this structure, the thickness of the periphery of the first sub-component 110 is small, which can achieve a better heating effect on the periphery of the carrier 10, so that the temperature distribution between different areas of the carrier 10 is more uniform.

[0044] In some embodiments, the first sub-component 110 and the second sub-component 120 cooperate to form a rectangular parallelepiped carrier 10 .

[0045] In some embodiments, the maximum height of the protrusion 111 from the bearing surface is 1 cm to 10 cm. Exemplarily, referring to FIG. 2 , a in FIG. 2 is the maximum height of the protrusion 111 from the bearing surface. Within the maximum height range of the protrusion 111 from the bearing surface, a better improvement effect can be achieved in the uniformity of the temperature distribution when the carrier 10 is heated. Optionally, the maximum height of the protrusion 111 from the bearing surface is 1 cm, 1.5 cm, 2 cm, 2.5 cm, 3 cm, 3.5 cm, 4 cm, 4.5 cm, 5 cm, 5.5 cm, 6 cm, 6.5 cm, 7 cm, 7.5 cm, 8 cm, 8.5 cm, 9 cm, 9.5 cm or 10 cm. Alternatively, the maximum height of the protrusion 111 from the bearing surface may also be within the range between any two of the above heights.

[0046] In some embodiments, the supporting surface is rectangular and has two first pairs of sides that are opposite to each other and two second pairs of sides that are opposite to each other.

[0047] In some embodiments, the length of the first pair of sides is 100 cm to 500 cm. Exemplarily, referring to FIG. 3 , FIG. 3 e is the length of the first pair of sides. Optionally, the length of the first pair of sides is 100 cm, 120 cm, 140 cm, 160 cm, 180 cm, 200 cm, 220 cm, 240 cm, 260 cm, 280 cm, 300 cm, 320 cm, 340 cm, 360 cm, 380 cm, 400 cm, 420 cm, 440 cm, 460 cm, 480 cm or 500 cm. Alternatively, the length of the first pair of sides may also be within the range between any two of the above lengths.

[0048] In some embodiments, the length of the second opposite side is 100cm~500cm. Exemplarily, as shown in Figure 3, f in Figure 3 is the length of the second opposite side. Optionally, the length of the second opposite side is 100cm, 120cm, 140cm, 160cm, 180cm, 200cm, 220cm, 240cm, 260cm, 280cm, 300cm, 320cm, 340cm, 360cm, 380cm, 400cm, 420cm, 440cm, 460cm, 480cm or 500cm. Alternatively, the length of the second opposite side may also be within the range between any two of the above lengths.

[0049] In some embodiments, the bearing surface is square.

[0050] In some embodiments, the minimum distance between the bottom position of the groove 121 and the support surface is 1 cm to 10 cm. Exemplarily, referring to FIG. 4 , FIG. 4 b is the minimum distance between the bottom position of the groove 121 and the support surface. Optionally, the minimum distance between the bottom position of the groove 121 and the support surface is 1 cm, 1.5 cm, 2 cm, 2.5 cm, 3 cm, 3.5 cm, 4 cm, 4.5 cm, 5 cm, 5.5 cm, 6 cm, 6.5 cm, 7 cm, 7.5 cm, 8 cm, 8.5 cm, 9 cm, 9.5 cm or 10 cm. Alternatively, the minimum distance between the bottom position of the groove 121 and the support surface may also be within the range between any two of the above distances.

[0051] In some embodiments, the thickness of the second sub-component 30 is 2 cm to 20 cm. For example, referring to FIG. 4 , c in FIG. 4 is the thickness of the second sub-component 30. Optionally, the thickness of the second sub-component 30 is 2 cm, 2.5 cm, 3 cm, 3.5 cm, 4 cm, 4.5 cm, 5 cm, 5.5 cm, 6 cm, 6.5 cm, 7 cm, 7.5 cm, 8 cm, 8.5 cm, 9 cm, 9.5 cm, 10 cm, 10.5 cm, 11 cm, 11.5 cm, 12 cm, 12.5 cm, 13 cm, 13.5 cm, 14 cm, 14.5 cm, 15 cm, 15.5 cm, 16 cm, 16.5 cm, 17 cm, 17.5 cm, 18 cm, 18.5 cm, 19 cm, 19.5 cm or 20 cm.

[0052] In some embodiments, the support surface is rectangular and has two third pairs of sides that are opposite to each other and two fourth pairs of sides that are opposite to each other.

[0053] In some embodiments, the length of the third pair of sides is 100 cm to 500 cm. Exemplarily, referring to FIG. 4 , g in FIG. 4 is the length of the third pair of sides. Optionally, the length of the third pair of sides is 100 cm, 120 cm, 140 cm, 160 cm, 180 cm, 200 cm, 220 cm, 240 cm, 260 cm, 280 cm, 300 cm, 320 cm, 340 cm, 360 cm, 380 cm, 400 cm, 420 cm, 440 cm, 460 cm, 480 cm or 500 cm. Alternatively, the length of the third pair of sides may also be within the range between any two of the above lengths.

[0054] In some embodiments, the length of the fourth pair of sides is 100 cm to 500 cm. Exemplarily, as shown in FIG. 4 , h in FIG. 4 is the length of the fourth pair of sides. Optionally, the length of the fourth pair of sides is 100 cm, 120 cm, 140 cm, 160 cm, 180 cm, 200 cm, 220 cm, 240 cm, 260 cm, 280 cm, 300 cm, 320 cm, 340 cm, 360 cm, 380 cm, 400 cm, 420 cm, 440 cm, 460 cm, 480 cm or 500 cm. Alternatively, the length of the fourth pair of sides may also be within the range between any two of the above lengths.

[0055] In some embodiments, the support surface is square.

[0056] 5 , another embodiment of the present application provides a heating device 20 , comprising a heating element 11 and any one of the above-mentioned carrier plates 10 ; a supporting surface of the carrier plate 10 is disposed on a surface of the heating element 11 .

[0057] In some embodiments, the heating element 11 is a metal heating element 11 .

[0058] 6 , another embodiment of the present application provides a coating device 30 , including a cavity 21 and the above-mentioned heating device 20 , wherein the heating device 20 is disposed inside the cavity 21 .

[0059] In some embodiments, the coating device 30 further includes a cathode plate 22, which is disposed inside the chamber 21 and spaced apart from the heating element 11. The carrier 10 is disposed on the surface of the heating element 11 facing the cathode plate 22.

[0060] In some embodiments, the coating device 30 further includes a pipeline 23 , which is disposed on the outer wall of the cavity 21 and is used to introduce gas into the cavity 21 .

[0061] In some embodiments, the gas outlet end of the pipe 23 is disposed toward the cathode plate 22 .

[0062] In some embodiments, the heating element 11 is a metal heating element. The aluminum alloy second sub-component 120 has good electrical conductivity, and the metal heating element 11 and the aluminum alloy second sub-component 120 together constitute an anode plate, and plasma enhanced chemical vapor deposition can be achieved through the anode plate and the cathode plate 22.

[0063] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims, and the description and drawings may be used to interpret the contents of the claims.

Claims

1. A carrier board (10), characterized in that: It comprises a first sub-component (110) and a second sub-component (120); The first sub-component (110) has a protrusion (111), the second sub-component (120) has a groove (121), the first sub-component (110) is arranged on the surface of the second sub-component (120), and the protrusion (111) and the groove (121) are embedded and matched; The surface of the first sub-component (110) away from the second sub-component (120) is a bearing surface, and the surface of the second sub-component (120) away from the first sub-component (110) is a supporting surface; The first sub-component (110) is a carbon fiber sub-component; The second sub-component (120) is an aluminum alloy sub-component.

2. The carrier board according to claim 1, characterized in that: The thickness of the protrusion (111) gradually decreases from its top to the surrounding edges.

3. The carrier board according to claim 2, characterized in that: The protrusion (111) is a cone structure.

4. The carrier board according to claim 3, characterized in that: The protrusion (111) is a regular pyramid structure.

5. The carrier board according to claim 4, characterized in that: The first sub-component (110) and the protrusion (111) are in a regular pyramid structure as a whole.

6. The carrier board according to any one of claims 1 to 5, characterized in that: The maximum height of the protrusion (111) from the bearing surface is 1 cm to 10 cm.

7. The carrier board according to any one of claims 1 to 5, characterized in that: The minimum distance between the bottom of the groove (121) and the support surface is 1 cm to 10 cm.

8. A heating device (20), characterized in that: It comprises a heating element (11) and a carrier plate (10) according to any one of claims 1 to 7; the supporting surface of the carrier plate (10) is arranged on the surface of the heating element (11).

9. A coating device (30), characterized in that: It comprises a cavity (21) and the heating device (20) according to claim 8, wherein the heating device (20) is arranged inside the cavity (21).

10. The coating device (30) according to claim 9, characterized in that: The coating device (30) further comprises a cathode plate (22), wherein the cathode plate (22) is arranged inside the cavity (21) and is spaced apart from the heating element (11); The carrier plate (10) is arranged on a surface of the heating element (11) facing the cathode plate (22).

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