Micro differential pressure sensor and packaging structure
By setting the electrode pair in the cavity in the thickness direction of the base of the micro-differential pressure sensor and using the conductive layer and support layer structure, the problem of reduced sensitivity of the capacitive micro-differential pressure sensor is solved, and the compactness of high precision and high sensitivity is achieved Design, reducing the risk of unstable component connections.
Patent Information
- Application Number
- CN202421067288.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-05-16
AI Technical Summary
Existing capacitive micro-differential pressure sensors are difficult to maintain high sensitivity while reducing their size, especially in smaller electronic products.
By setting the electrode pairs in the cavity in the thickness direction of the substrate and utilizing the structural design of the conductive layer and the support layer, the compact layout of the electrode pairs and the vertical arrangement of multiple electrode pairs is achieved, improving the accuracy and sensitivity of the sensor while reducing assembly Interface, stable performance.
This achieves improved accuracy and sensitivity of micro-differential pressure sensors without increasing the sensor size, and reduces performance fluctuations or failures due to unstable component connections.
Smart Images
Figure CN222299022U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of micro differential pressure sensors, in particular to a micro differential pressure sensor and a packaging structure. Background Art
[0002] A micro differential pressure sensor is a component that converts the pressure applied to its sensing element by the outside world into an electrical signal output. There are many types of micro differential pressure sensors, the most common ones include: piezoresistive micro differential pressure sensors, piezoelectric pressure sensors, volumetric micro differential pressure sensors, and capacitive micro differential pressure sensors.
[0003] Compared with other micro differential pressure sensors, capacitive micro differential pressure sensors have the characteristics of small size and low power consumption, and are generally widely used in electronic products, such as: electronic cigarettes, audio equipment, household appliances, smart watches, smart phones and other products. Specifically, the existing capacitive micro differential pressure sensor includes a MEMS chip, and the MEMS chip includes a substrate, a back plate and a diaphragm parallel to the substrate, and the back plate and the diaphragm together form a parallel plate capacitor. When the external air pressure acts on the diaphragm to cause the diaphragm to vibrate, the capacitance of the parallel plate capacitor is changed, and the parallel plate capacitor outputs a voltage signal.
[0004] Electronic products have high requirements for the accuracy of capacitive micro differential pressure sensors. The larger the area of the flat plate capacitor, the higher the sensitivity of the sensor. Specifically, when stress is applied to the flat plate capacitor, the flat plate capacitor with a larger area will produce a larger capacitance change, thereby achieving higher sensitivity, which means that the sensor can detect smaller pressure changes. Moreover, the area of the flat plate capacitor will also affect the frequency response characteristics of the sensor. The flat plate capacitor with a larger area usually makes the sensor have a lower natural frequency, so it can detect higher frequency changes. However, the internal space of electronic products is limited, and there are certain restrictions on the size of capacitive micro differential pressure sensors. Improving the accuracy of the capacitive sensor by increasing the area of the flat plate capacitor or the thickness of the electrode will increase the size of the capacitive sensor, making it difficult for the capacitive sensor to be used in small precision electronic products such as mobile phones, electronic cigarettes, and watches. However, reducing the size of the sensor by reducing the area or thickness of the flat plate capacitor will reduce the sensitivity of the sensor. Utility Model Content
[0005] The embodiments of the utility model provide a micro differential pressure sensor and an electronic device, so as to effectively solve the technical problem of reducing the size of the sensor without reducing the sensitivity of the sensor.
[0006] In order to solve the above technical problems, the embodiments of the present utility model disclose the following technical solutions:
[0007] On the one hand, a micro differential pressure sensor is provided, comprising:
[0008] A substrate, the substrate comprising a cavity extending through the substrate in a thickness direction thereof;
[0009] At least one electrode pair is arranged along the thickness direction of the substrate and is located in the cavity, each of the electrode pairs includes a first electrode and a second electrode, a first cavity is defined between the first electrode and the second electrode, and a second cavity is defined between one side of at least one of the electrode pairs and the substrate, the first cavity is separated from the cavity, and the cavity is connected to the second cavity;
[0010] The supporting layer includes a first portion and a second portion which are fixedly connected, wherein the first portion is stacked on a side surface of the substrate, and the second portion is located in the cavity and covers the first electrode and the second electrode.
[0011] In addition to or as an alternative to one or more of the features disclosed above, the method further includes a partition plate, which is located in the cavity, connected to the second part, and closes a side of the first cavity close to the cavity.
[0012] In addition to or as an alternative to one or more of the features disclosed above, the partition plate is integrally formed with the connected second portion.
[0013] In addition to or as an alternative to one or more of the features disclosed above, the invention further comprises:
[0014] A conductive structure includes a conductive layer and an electrical connector fixedly connected to the conductive layer. In the thickness direction of the substrate, the conductive layer is stacked on a side surface of the first part away from the substrate.
[0015] In addition to one or more of the features disclosed above, or as an alternative, the conductive layer includes at least a first conductive region and a second conductive region, the first conductive region and the second conductive region are separated, the conductive layer located in the first conductive region is connected to the first electrode, the conductive layer located in the second conductive region is connected to the second electrode, and electrical connectors are provided in both the first conductive region and the second conductive region.
[0016] In addition to or as an alternative to one or more features disclosed above, the conductive layer located in the first conductive region is integrally formed with the connected first electrode, and the conductive layer located in the second conductive region is integrally formed with the connected second electrode.
[0017] In addition to one or more of the features disclosed above, or as an alternative, in the thickness direction of the substrate, the second portion covering the first electrode is connected to the second portion covering the second electrode to close the first cavity away from the side of the separator, wherein the first electrode plate and the second electrode plate belong to the same electrode pair.
[0018] In addition to or as an alternative to one or more of the features disclosed above, the number of the electrode pairs is greater than one, and the plurality of electrode pairs are arranged opposite to each other in pairs, with a third cavity between adjacent electrode pairs.
[0019] In addition to or as an alternative to one or more of the features disclosed above, the third cavity is formed between the same electrodes of adjacent electrode pairs.
[0020] In addition to or as an alternative to one or more of the features disclosed above, the number of the electrode pairs is an odd number, the conductive layer further comprises a third conductive region, the third conductive region is separated from the first conductive region and the second conductive region, and in the thickness direction of the substrate, the third conductive region is located above the third cavity, and the first conductive region and the second conductive region are both located above the second cavity;
[0021] The conductive layer located in the third conductive area is connected to the corresponding electrode, and the third conductive area is provided with an electrical connector.
[0022] In addition to or as an alternative to one or more of the features disclosed above, the number of the electrode pairs is an even number, the conductive layer further comprises a fourth conductive region, the fourth conductive region is separated from the first conductive region and the second conductive region, and in the thickness direction of the substrate, the fourth conductive region is located above the second cavity, and the first conductive region and the second conductive region are both located above the third cavity;
[0023] The conductive layer located in the fourth conductive region is simultaneously connected to the first electrode of the electrode pair close to the substrate, or simultaneously connected to the second electrode of the electrode pair close to the substrate, and the fourth conductive region is provided with an electrical connector.
[0024] In addition to or as an alternative to one or more of the features disclosed above, the third cavity is formed between the first electrode and the second electrode of the adjacent electrode pair.
[0025] In addition to one or more features disclosed above, or as an alternative, in the thickness direction of the substrate, the first conductive region simultaneously covers the area above each first electrode, and the conductive layer located in the first conductive region is connected to the corresponding first electrode, and the second conductive region simultaneously covers the area above each second electrode, and the conductive layer located in the second conductive region is connected to the corresponding second electrode.
[0026] On the other hand, a packaging structure is provided, which includes a substrate, a shell fixedly connected to the substrate, an air intake structure, and any one of the above-disclosed micro-differential pressure sensors fixedly connected to the substrate, wherein the air intake structure is arranged on the substrate and / or the shell.
[0027] One of the above technical solutions has the following advantages or beneficial effects: the electrode pair is arranged along the thickness direction of the substrate and is located in the cavity, which can make full use of the space in the thickness direction of the substrate. Compared with the structure in which the electrode pair is arranged parallel to the substrate, the structure of the micro differential pressure sensor disclosed in the present application is more compact, and the size of the micro differential pressure sensor is not reduced at the expense of the accuracy of the micro differential pressure sensor. At the same time, the embodiment disclosed in the present application can also improve the accuracy of the micro differential pressure sensor by arranging multiple electrode pairs in the cavity along a direction perpendicular to the thickness of the substrate. Compared with the structure in which the electrode pair is arranged parallel to the substrate, the present application improves the accuracy of the micro differential pressure sensor without significantly increasing the size of the micro differential pressure sensor. Moreover, in the embodiment disclosed in the present application, the conductive layer is stacked on the surface of one side of the first part away from the substrate, which can reduce the assembly interface and connection points between different materials, and help reduce performance fluctuations or failures caused by unstable connections between components. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.
[0029] Figure 1 The structure of a micro differential pressure sensor provided in accordance with an embodiment of the present application is shown in FIG. Figure 1 ;
[0030] Figure 2 This is a schematic diagram of a structure of a substrate provided according to an embodiment of the present application. Figure 1 ;
[0031] Figure 3 A schematic diagram of a partition of a conductive layer provided according to an embodiment of the present application Figure 1 (The shaded area is the conductive area);
[0032] Figure 4 A schematic diagram of a partition of a conductive layer provided according to an embodiment of the present application Figure 2 (The shaded area is the conductive area);
[0033] Figure 5 A schematic diagram of a partition of a conductive layer provided according to an embodiment of the present application Figure 3 (The shaded area is the conductive area);
[0034] Figure 6A schematic diagram of a partition of a conductive layer provided according to an embodiment of the present application Figure 4 (The shaded area is the conductive area);
[0035] Figure 7 This is a schematic diagram of a structure of a substrate provided according to an embodiment of the present application. Figure 2 ;
[0036] Figure 8 It is a structural schematic diagram of a packaging structure provided according to an embodiment of the present application.
[0037] Description of reference numerals:
[0038] 100, substrate; 101, cavity; 102, dielectric layer; 103, insulating layer; 104, substrate layer;
[0039] 200, electrode pair; 201, first electrode; 202, second electrode; 203, first cavity; 204, second cavity; 205, third cavity;
[0040] 300, support layer; 301, first part; 302, second part;
[0041] 400, separator;
[0042] 500, conductive structure; 501, conductive layer; 502, electrical connector; 503, first conductive region; 504, second conductive region; 505, third conductive region; 506, fourth conductive region;
[0043] 600, substrate; 601, air intake structure;
[0044] 700. Shell. DETAILED DESCRIPTION
[0045] In order to make the purpose, technical solution and beneficial effects of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining the utility model, and are not intended to limit the utility model.
[0046] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present utility model, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.
[0047] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0048] In the present utility model, unless otherwise clearly stipulated and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0049] The utility model embodiment discloses a micro differential pressure sensor, referring to Figure 1 The micro differential pressure sensor includes: a substrate 100, at least one electrode pair 200, and a support layer 300.
[0050] Specifically, the substrate 100 includes a cavity 101 that penetrates in the thickness direction thereof, and the electrode pair 200 is arranged along the thickness direction of the substrate 100 and is located in the cavity 101. Each electrode pair 200 includes a first electrode 201 and a second electrode 202, and a first cavity 203 is provided between the first electrode 201 and the second electrode 202, and a second cavity 204 is provided between one side of at least one electrode pair 200 and the substrate 100. Moreover, the first cavity 203 is separated from the cavity 101, and the cavity 101 is connected to the second cavity 204.
[0051] In this arrangement, the first electrode 201 and the second electrode 202 of each electrode pair 200 form a capacitor, and the first cavity 203 and the second cavity 204 can serve as deformation space or air intake space of the electrodes. When air is taken into the first cavity 203 or the second cavity 204, the first electrode 201 and the second electrode 202 are deformed, changing the capacitance value, thereby detecting changes in pressure.
[0052] The support layer 300 includes a first portion 301 and a second portion 302 that are fixedly connected. The first portion 301 is stacked on a side surface of the substrate 100, and the second portion 302 is located in the cavity 101 and covers the first electrode 201 and the second electrode 202. Figure 1 The micro differential pressure sensor further includes a partition plate 400, which is located in the cavity 101 and connected to the second portion 302 to close the first cavity 203 on the side close to the cavity 101. In some embodiments, the partition plate 400 and the second portion 302 are made of the same material and are integrally formed. In some embodiments, the partition plate 400 and the second portion 302 are made of different materials.
[0053] In different embodiments, the structure of the substrate is different, referring to Figure 1 In some embodiments, the substrate includes a dielectric layer 102, an insulating layer 103, and a substrate layer 104 that are stacked. In different embodiments, the shape of the substrate 100 is different. Figure 2 In some embodiments, the substrate 100 is provided with a through cavity 101 to form a hollow column.
[0054] Continue to refer to Figure 1 The micro differential pressure sensor disclosed in the embodiment of the present application further includes a conductive structure 500, the conductive structure 500 includes a conductive layer 501 and an electrical connector 502 fixedly connected to the conductive layer 501. In the thickness direction of the substrate 100, the conductive layer 501 is stacked on a side surface of the first portion 301 away from the substrate 100. In different embodiments, the conductive layer 501 may include multiple conductive areas. Figure 3As an example, the conductive layer 501 at least includes a first conductive region 503 and a second conductive region 504, the first conductive region 503 and the second conductive region 504 are separated, the conductive layer 501 located in the first conductive region 503 is connected to the first electrode 201, the conductive layer 501 located in the second conductive region 504 is connected to the second electrode 202, and the first conductive region 503 and the second conductive region 504 are both provided with an electrical connector 502. The charge polarity on the first electrode and the charge polarity on the second electrode of the same electrode pair are opposite, when the charge polarity on the first electrode is positive, the charge polarity on the second electrode is negative, in the embodiment of the present application, taking the charge polarity on the first electrode as positive and the charge polarity on the second electrode as negative as an example, the electrical connector 502 provided on the first conductive region 503 is a positive terminal, and the electrical connector 502 provided on the second conductive region 504 is a negative terminal.
[0055] In different embodiments, the first conductive region 503 and the second conductive region 504 have different coverages. Figure 3 In some embodiments, the number of the first conductive regions 503 is equal to the number of the electrode pairs 200, the number of the second conductive regions 504 is equal to the number of the electrode pairs 200, the first conductive regions 503 and the electrode pairs 200 correspond one-to-one, the second conductive regions 504 and the electrode pairs 200 correspond one-to-one, the first conductive regions 503 are located above the corresponding electrode pairs 200 and connected to the first electrodes 201 of the electrode pairs 200, and the second conductive regions 504 are located above the corresponding electrode pairs 200 and connected to the second electrodes 202 of the electrode pairs 200. In this configuration, the number of conductive regions and the number of electrical connectors 502 are both twice the number of electrode pairs 200.
[0056] In order to reduce the number of assembly interfaces and connection points between different materials and reduce performance fluctuations or failures caused by unstable connections between components, refer to Figure 4In some embodiments, when the number of electrode pairs 200 is an odd number greater than one, multiple electrode pairs 200 are arranged opposite to each other in pairs, and a third cavity 205 is formed between the same electrodes of adjacent electrode pairs 200, and a second cavity 204 is formed between the electrodes of the two electrode pairs 200 close to the substrate 100 and the substrate 100, the first conductive region 503 is provided with one, which is located above the second cavity 204 formed between the first electrode 201 of the electrode pair 200 close to the substrate 100 and the substrate 100, and is connected to the first electrode 201, and the second conductive region 504 is provided with one, which is located above the second cavity 204 formed between the second electrode 202 of the electrode pair 200 close to the substrate 100 and the substrate 100, and is connected to the second electrode 202. A third conductive region 505 is disposed above each third cavity 205. The third conductive regions 505 are separated from each other, and the third conductive region 505 is separated from the first conductive region 503 and the second conductive region 504. The conductive layer 501 located in the third conductive region 505 is connected to the corresponding electrode, and the third conductive region 505 is provided with an electrical connector 502. Specifically, in the embodiment of the present application, taking the charge polarity on the first electrode as positive and the charge polarity on the second electrode as negative as an example, when the conductive layer 501 located in the third conductive region 505 is connected to the first electrode 201, the electrical connector 502 disposed on the third conductive region 505 is a positive terminal, and when the conductive layer 501 located in the third conductive region 505 is connected to the second electrode 202, the electrical connector 502 disposed on the third conductive region 505 is a negative terminal. In this way, the number of conductive regions and the number of electrical connectors 502 are only one more than the number of electrode pairs 200.
[0057] Reference Figure 5 In some embodiments, when the number of electrode pairs 200 is an even number, the plurality of electrode pairs 200 are arranged opposite to each other in pairs, and a third cavity 205 is formed between the same electrodes of adjacent electrode pairs 200, and a second cavity 204 is formed between the electrodes of the two electrode pairs 200 close to the substrate 100 and the substrate 100, the first conductive region 503 and the second conductive region 504 are both located above the third cavity 205. The conductive layer 501 located in the first conductive region 503 is connected to the two adjacent first electrodes 201 at the same time. The conductive layer 501 located in the second conductive region 504 is connected to the two adjacent second electrodes 202 at the same time. A fourth conductive region 506 is arranged above the second cavity 204, and the fourth conductive region 506 is separated from the first conductive region 503 and the second conductive region 504. The conductive layer 501 located in the fourth conductive region 506 is connected to the first electrode 201 of the electrode pair 200 close to the substrate 100 at the same time (refer to Figure 5), or, at the same time, connected to the second electrode 202 of the electrode pair 200 close to the substrate 100 (not shown in the figure). The fourth conductive region 506 is provided with an electrical connector 502. Specifically, in the embodiment of the present application, taking the charge polarity on the first electrode as positive and the charge polarity on the second electrode as negative as an example, when the conductive layer 501 located in the fourth conductive region 506 is connected to the first electrode 201, the electrical connector 502 provided on the fourth conductive region 506 is a positive terminal, and when the conductive layer 501 located in the fourth conductive region 506 is connected to the second electrode 202, the electrical connector 502 provided on the fourth conductive region 506 is a negative terminal. In this way, the number of conductive regions and the number of electrical connectors 502 are equal to the number of electrode pairs 200.
[0058] Reference Figure 6 In some embodiments, when the number of electrode pairs 200 is greater than one, multiple electrode pairs 200 are arranged opposite to each other in pairs, and a third cavity 205 is formed between the first electrode 201 and the second electrode 202 of the adjacent electrode pairs 200, one first conductive region 503 and one second conductive region 504 are provided. In the thickness direction of the substrate 100, the first conductive region 503 simultaneously covers the upper region of each first electrode 201, and the conductive layer 501 located in the first conductive region 503 is connected to the corresponding first electrode 201. The second conductive region 504 simultaneously covers the upper region of each second electrode 202, and the conductive layer 501 located in the second conductive region 504 is connected to the corresponding second electrode 202. In this way, the number of conductive regions and the number of electrical connectors 502 are both one. It should be noted that when preparing a micro-differential pressure sensor, the conductive layer 501 and the electrode pair 200 can be made of the same conductive material, and the connected conductive layer 501 and the electrode can be integrally formed.
[0059] It is worth mentioning that in practical applications, Figure 1 When the first cavity 203 is filled with air, the second cavity 204 and the third cavity 205 can be connected to the atmospheric pressure, and the second cavity 204 and the third cavity 205 are the deformation space of the electrode. When the second cavity 204 and the third cavity 205 are filled with air, the first cavity 203 can be connected to the atmospheric pressure, and the first cavity 203 is the deformation space of the electrode.
[0060] Reference Figure 7In some embodiments, no matter the number of electrode pairs 200 is one or more, in the thickness direction of the substrate 100, the second portion 302 covering the first electrode 201 is also connected to the second portion 302 covering the second electrode 202 to close the side of the first cavity 203 away from the partition plate 400. The first electrode 201 and the second electrode 202 belong to the same electrode pair 200. In practical applications, when the second cavity 204 and the third cavity 205 are filled with air, the first cavity 203 is closed and serves as a deformation space for the electrode.
[0061] Reference Figure 8 The embodiment of the present application further discloses a packaging structure, which includes a substrate 600, an air intake structure 601, a housing 700 fixedly connected to the substrate 600, and any of the above-disclosed micro differential pressure sensors fixedly connected to the substrate 600. In some embodiments, the air intake structure 601 is disposed on the substrate 600, in some embodiments, the air intake structure 601 is disposed on the housing 700, and in some embodiments, the air intake structure 601 is disposed on both the housing 700 and the substrate 600.
[0062] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0063] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A micro differential pressure sensor, characterized in that: include: A substrate (100), wherein the substrate (100) comprises a cavity (101) penetrating in a thickness direction thereof; At least one electrode pair (200) is arranged along the thickness direction of the substrate (100) and is located in the cavity (101); each of the electrode pairs (200) comprises a first electrode (201) and a second electrode (202); a first cavity (203) is provided between the first electrode (201) and the second electrode (202); a second cavity (204) is provided between one side of at least one of the electrode pairs (200) and the substrate (100); the first cavity (203) is separated from the cavity (101), and the cavity (101) is connected to the second cavity (204); A support layer (300), the support layer (300) comprising a first part (301) and a second part (302) which are fixedly connected, the first part (301) being stacked on a side surface of the substrate (100), and the second part (302) being located in the cavity (101) and covering the first electrode (201) and the second electrode (202).
2. The micro differential pressure sensor according to claim 1, characterized in that: It also includes a partition plate (400), which is located in the cavity (101), connected to the second part (302), and closes a side of the first cavity (203) close to the cavity (101).
3. The micro differential pressure sensor according to claim 2, characterized in that: The partition plate (400) is integrally formed with the second portion (302) connected thereto.
4. The micro differential pressure sensor according to claim 1, characterized in that: Also includes: A conductive structure (500), the conductive structure (500) comprising a conductive layer (501) and an electrical connector (502) fixedly connected to the conductive layer (501), wherein in the thickness direction of the substrate (100), the conductive layer (501) is stacked on a side surface of the first part (301) away from the substrate (100).
5. The micro differential pressure sensor according to claim 4, characterized in that: The conductive layer (501) at least comprises a first conductive region (503) and a second conductive region (504); the first conductive region (503) and the second conductive region (504) are separated from each other; the conductive layer (501) located in the first conductive region (503) is connected to the first electrode (201); the conductive layer (501) located in the second conductive region (504) is connected to the second electrode (202); and the first conductive region (503) and the second conductive region (504) are both provided with an electrical connector (502).
6. The micro differential pressure sensor according to claim 5, characterized in that: The conductive layer (501) located in the first conductive region (503) is integrally formed with the first electrode (201) connected thereto, and the conductive layer (501) located in the second conductive region (504) is integrally formed with the second electrode (202) connected thereto.
7. The micro differential pressure sensor according to claim 2, characterized in that: In the thickness direction of the substrate (100), the second part (302) covering the first electrode (201) is connected to the second part (302) covering the second electrode (202) to close the first cavity (203) away from the separator (400), wherein the first electrode (201) and the second electrode (202) belong to the same electrode pair.
8. The micro differential pressure sensor according to claim 5, characterized in that: The number of the electrode pairs (200) is greater than one, and the plurality of electrode pairs (200) are arranged opposite to each other in pairs, with a third cavity (205) being provided between adjacent electrode pairs (200).
9. The micro differential pressure sensor according to claim 8, characterized in that: The third cavity (205) is formed between the same electrodes of the adjacent electrode pairs (200).
10. The micro differential pressure sensor according to claim 9, characterized in that: The number of the electrode pairs (200) is an odd number, the conductive layer (501) further comprises a third conductive region (505), the third conductive region (505) is separated from the first conductive region (503) and the second conductive region (504), and in the thickness direction of the substrate (100), the third conductive region (505) is located above the third cavity (205), and the first conductive region (503) and the second conductive region (504) are both located above the second cavity (204); The conductive layer (501) located in the third conductive region (505) is connected to the corresponding electrode, and the third conductive region (505) is provided with an electrical connector (502).
11. The micro differential pressure sensor according to claim 9, characterized in that: The number of the electrode pairs (200) is an even number, the conductive layer (501) further comprises a fourth conductive region (506), the fourth conductive region (506) is separated from the first conductive region (503) and the second conductive region (504), and in the thickness direction of the substrate (100), the fourth conductive region (506) is located above the second cavity (204), and the first conductive region (503) and the second conductive region (504) are both located above the third cavity (205); The conductive layer (501) located in the fourth conductive region (506) is simultaneously connected to the first electrode (201) of the electrode pair (200) close to the substrate (100), or simultaneously connected to the second electrode (202) of the electrode pair (200) close to the substrate (100), and the fourth conductive region (506) is provided with an electrical connector (502).
12. The micro differential pressure sensor according to claim 8, characterized in that: The third cavity (205) is formed between the first electrode (201) and the second electrode (202) of the adjacent electrode pair (200).
13. The micro differential pressure sensor according to claim 12, characterized in that: In the thickness direction of the substrate (100), the first conductive region (503) simultaneously covers the area above each first electrode (201), and the conductive layer (501) located in the first conductive region (503) is connected to the corresponding first electrode (201), and the second conductive region (504) simultaneously covers the area above each second electrode (202), and the conductive layer (501) located in the second conductive region (504) is connected to the corresponding second electrode (202).
14. A packaging structure, characterized in that: A substrate (600), a shell (700) fixedly connected to the substrate (600), an air intake structure (601), and a micro-differential pressure sensor as described in any one of claims 1 to 13 fixedly connected to the substrate (600), wherein the air intake structure (601) is arranged on the substrate (600) and / or the shell (700).