Wave crest width adjusting mechanism for wave crest welding equipment

Abstract

The utility model discloses a wave crest width adjusting mechanism for wave crest welding equipment, which relates to the technical field of wave crest welding, and is characterized by comprising a soldering tin groove for storing molten soldering tin, vertical grooves which are arranged in parallel are formed in the surface of the soldering tin groove, and adjusting grooves communicated with the vertical grooves are formed in the inner wall of the soldering tin groove. A plurality of mounting plates are arranged between the adjusting grooves in a sliding mode, adjusting parts for changing the horizontal positions of the mounting plates are installed in the vertical grooves, and the mounting plates distributed in a staggered mode are connected with the same adjusting part; the device has the effects that the horizontal positions of the spray head and the electromagnetic pump can be integrally and horizontally moved, the influence of the length of a guide pipe when the positions of the spray nozzles are adjusted is avoided, the situation that the guide pipe is folded after being moved to cause blockage of the guide pipe is avoided, and the wave crest width during wave-soldering operation is conveniently adjusted and changed.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering, and more specifically, to a wave width regulating mechanism for wave soldering equipment. Background Art

[0002] Wave soldering refers to the process of spraying molten soft solder (lead-tin alloy) into a solder wave crest as required by the design through an electric pump or an electromagnetic pump, so that a printed circuit board pre-installed with components passes through the solder wave crest, and the welding surface of the printed circuit board is directly in contact with the high-temperature liquid tin.

[0003] The spray width of wave soldering is closely related to the nozzle distance. Adjusting the nozzle distance can achieve the purpose of adjusting the spray width. If the nozzle distance is too large, the sprayed solder will be dispersed in a larger area, forming a wider wave crest; if the nozzle distance is too small, the solder will gather at one point, forming a narrower wave crest. Therefore, in the wave soldering process, the nozzle distance needs to be adjusted according to actual needs to achieve the appropriate spray width. In order to keep the wave crest width within the appropriate range, a wave crest width adjustment device needs to be used to adjust the nozzle distance.

[0004] Since the nozzle is connected to the liquid outlet of the electric pump or electromagnetic pump through a pipeline, and the electric pump or electromagnetic pump is mostly installed and fixed in the solder tank, when the nozzle position is adjusted horizontally, the nozzle movement distance is limited by the length of the pipeline. If the pipeline is set too long, it is easy to cause the pipeline to overlap and fold, causing blockage inside the pipeline.

[0005] Therefore, in order to solve the above technical problems, the present application proposes a wave crest width adjustment mechanism for wave soldering equipment. Utility Model Content

[0006] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a wave width adjustment mechanism for wave soldering equipment, which can horizontally move the horizontal position of the nozzle and the electromagnetic pump as a whole, avoid being affected by the length of the catheter when adjusting the nozzle position, avoid folding of the catheter after movement, and cause clogging of the catheter, and facilitate the adjustment of the wave width during wave soldering operations.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solution: comprising a solder tank for storing molten solder, wherein the surface of the solder tank is structured with parallel vertical grooves, and the inner wall of the solder tank is structured with adjustment grooves connected to the vertical grooves, and a plurality of mounting plates are slidably arranged between the adjustment grooves, and the inside of the vertical grooves are all installed with adjustment components for changing the horizontal position of the mounting plates, and the staggered mounting plates are installed and connected with the same adjustment component;

[0008] The surface of the mounting plate is installed with nozzles distributed at equal intervals, and a conduit for providing solder liquid to the nozzle is installed inside the mounting plate, a bottom frame is installed at the bottom of the mounting plate, and an electromagnetic pump for introducing solder liquid into the conduit is installed on the inner side of the bottom frame, and the liquid outlet of the electromagnetic pump is connected to the nozzle through the conduit, and the length of the conduit is fixed. When moving, the nozzle and the electromagnetic pump move as a whole, will not be limited by the length of the conduit, and avoid folding of the conduit to cause conduit blockage.

[0009] Preferably, the adjusting component includes an adjusting motor installed and fixed in the vertical slot, and the output shaft of the adjusting motor is transmission-connected to a horizontal screw rod whose end is rotationally connected to the inner wall of the vertical slot, the outer circumference of the horizontal screw rod is rotationally connected to a plurality of inner sliding blocks slidably arranged in the vertical slot, and a vertical rod is fixed to the bottom of the inner sliding block, a connecting rod is fixed to the bottom of the vertical rod, the side wall of the connecting rod is rotationally provided with a transmission block located in the adjusting slot, and the side wall of the transmission block is rotationally provided with end rods fixed to both ends of the mounting plate.

[0010] Preferably, a limiting rod is fixed to the outer periphery of the end rod, the inner wall of the solder tank is configured with a limiting slide groove, and the end of the limiting rod is slidably disposed in the limiting slide groove.

[0011] Preferably, a hot melt plate is installed on the inner bottom surface of the solder bath.

[0012] Preferably, the cross-section of the limiting rod is configured as an inverted L-shape.

[0013] Preferably, the side wall of the transmission block is flush with the inner wall of the solder tank.

[0014] Preferably, pads are installed at the bottom of the solder bath, and the pads are distributed in a rectangular array.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] 1. In the utility model, the nozzle is fixed on the surface of the mounting plate, and the nozzle is connected to the electromagnetic pump fixed on the bottom of the mounting plate through a conduit arranged inside the mounting plate. The horizontal position of the nozzle and the electromagnetic pump can be moved horizontally as a whole by means of an adjusting component, thereby avoiding the influence of the conduit length when adjusting the nozzle position, and preventing the overly long conduit from folding after movement and causing conduit blockage;

[0017] 2. In the utility model, the staggered mounting plates are connected to different adjusting components, and two independent adjusting components can drive non-adjacent mounting plates to move simultaneously, thereby changing the distance between adjacent mounting plates and adjusting the spacing between nozzles, thereby facilitating the adjustment of the wave peak width during wave soldering operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 It is a structural schematic diagram of the utility model;

[0020] Figure 2 It is a side sectional view of the utility model;

[0021] Figure 3 It is an enlarged view of the structure at A in the utility model;

[0022] In the figure: 1. Soldering tank; 2. Vertical slot; 3. Limiting slide; 4. Adjusting motor; 5. Horizontal screw rod; 6. Inner slider; 7. Vertical rod; 8. Connecting rod; 9. Transmission block; 10. End rod; 11. Limiting rod; 12. Mounting plate; 13. Bottom frame; 14. Electromagnetic pump; 15. Conduit; 16. Nozzle; 17. Hot melt plate. DETAILED DESCRIPTION

[0023] like Figure 1-3 As shown, the utility model provides a wave crest width adjustment mechanism for wave crest soldering equipment, comprising a solder tank 1 for storing molten solder, a hot melt plate 17 is installed on the inner bottom surface of the solder tank 1, a surface of the solder tank 1 is structured with parallel vertical grooves 2, and the inner wall of the solder tank 1 is structured with adjustment grooves connected to the vertical grooves 2, a plurality of mounting plates 12 are slidably arranged between the adjustment grooves, and the interior of the vertical grooves 2 are all installed with adjustment components for changing the horizontal position of the mounting plates 12, the staggered mounting plates 12 are installed and connected to the same adjustment component, and the surface of the mounting plates 12 is installed with equidistant A nozzle 16 is distributed, and a conduit 15 for providing solder liquid to the nozzle 16 is installed inside the mounting plate 12. A bottom frame 13 is installed at the bottom of the mounting plate 12, and an electromagnetic pump 14 for introducing solder liquid into the conduit 15 is installed on the inner side of the bottom frame 13. The liquid outlet of the electromagnetic pump 14 is connected to the nozzle 16 through the conduit 15, and the length of the conduit 15 is fixed. When moving, the nozzle and the electromagnetic pump 14 move as a whole and will not be limited by the length of the conduit 15, and the conduit 15 is prevented from being folded and blocked. Pads are installed at the bottom of the solder tank 1, and the pads are distributed in a rectangular array.

[0024] In order to control the horizontal movement of the staggered mounting plates 12, change the distance between adjacent mounting plates 12, and adjust the peak width by changing the nozzle spacing, the adjustment component includes an adjustment motor 4 installed and fixed in the vertical slot 2, and the output shaft of the adjustment motor 4 is transmission-connected with a horizontal screw rod 5 whose end is rotationally connected to the inner wall of the vertical slot 2, and the outer circumference of the horizontal screw rod 5 is rotatably connected with a plurality of inner sliders 6 slidably arranged in the vertical slot 2, and a vertical rod 7 is fixed to the bottom of the inner slider 6, and a connecting rod 8 is fixed to the bottom of the vertical rod 7, and a side wall of the connecting rod 8 is rotationally provided with a transmission block 9 located in the adjustment slot, and the side wall of the transmission block 9 is flush with the inner wall of the solder tank 1, and the side wall of the transmission block 9 is rotationally provided with an end rod 10 fixed to both ends of the mounting plate 12, and the output shaft of the adjustment motor 4 drives the horizontal screw rod 5 rotates, and the inner slide block 6 moves horizontally in the vertical slot 2 under the action of the horizontal screw rod 5, driving the vertical rod 7 at one end of the mounting plate 12 to move, and the vertical rod 7 drives the transmission block 9 at one end of the mounting plate 12 to move horizontally through the connecting rod 8, and the transmission block 9 drives the mounting plate 12 to move horizontally through the end rod 10, and the end rod 10 at the other end of the mounting plate 12 moves horizontally, and the transmission block 9 connected thereto rotates in the limiting slide groove 3 on the other side, and the limiting rod 11 is fixed on the outer periphery of the end rod 10, and the inner wall of the solder tank 1 is configured with the limiting slide groove 3, and the end of the limiting rod 11 is slidably arranged in the limiting slide groove 3, and the cross-section of the limiting rod 11 is configured as an inverted L-shape, and under the action of the limiting rod 11, the end rod 10 is prevented from rotating with the transmission block 9, thereby keeping the mounting plate 12 always in a horizontal state.

[0025] It should be noted that the utility model relates to a wave crest width adjustment mechanism for wave soldering equipment. When the wave crest width needs to be adjusted during wave soldering operations, the adjustment component on one side is first started. The output shaft of the adjustment motor 4 in the adjustment component drives the horizontal screw 5 to rotate. The inner slider 6 moves horizontally in the vertical groove 2 under the action of the horizontal screw 5. The inner slider 6 drives the transmission block 9 and the end rod 10 at one end of the mounting plate 12 to move horizontally through the vertical rod 7 and the connecting rod 8, and the transmission block 9 rotates a certain angle in the adjustment groove. The end rod 10 maintains horizontal movement under the action of the limit rod 11 and the limit slide groove 3, and controls the horizontal movement of the mounting plate 12, thereby changing the spacing of the mounting plate 12. When the mounting plate 12 moves, the nozzle installed on the surface of the mounting plate 12, the electromagnetic pump 14 installed at the bottom of the mounting plate 12, and the conduit 15 inside the mounting plate 12 move as a whole, avoiding the nozzle position adjustment being limited by the length of the conduit 15.

[0026] The above description is only a preferred embodiment of the utility model and does not limit the utility model in any form. Any ordinary technician in the industry can smoothly implement the utility model as shown in the drawings of the specification and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the utility model using the technical content disclosed above are all equivalent embodiments of the utility model. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the utility model are still within the protection scope of the technical solution of the utility model.

Claims

1. A wave crest width adjustment mechanism for wave soldering equipment, characterized in that: The invention comprises a solder tank (1) for storing molten solder, wherein the surface of the solder tank (1) is structured with parallel vertical grooves (2), and the inner wall of the solder tank (1) is structured with adjustment grooves connected to the vertical grooves (2), and a plurality of mounting plates (12) are slidably arranged between the adjustment grooves, and adjustment components for changing the horizontal position of the mounting plates (12) are installed inside the vertical grooves (2), and the staggered mounting plates (12) are installed and connected to the same adjustment component; The surface of the mounting plate (12) is mounted with nozzles (16) distributed at equal intervals, and a conduit (15) for supplying solder liquid to the nozzles (16) is mounted inside the mounting plate (12), a bottom frame (13) is mounted at the bottom of the mounting plate (12), and an electromagnetic pump (14) for introducing solder liquid into the conduit (15) is mounted on the inner side of the bottom frame (13).

2. The wave width adjustment mechanism for wave soldering equipment according to claim 1, characterized in that: The adjusting component comprises an adjusting motor (4) installed and fixed in the vertical slot (2), and the output shaft of the adjusting motor (4) is drivingly connected to a horizontal screw rod (5) whose end is rotatably connected to the inner wall of the vertical slot (2), the outer circumference of the horizontal screw rod (5) is rotatably connected to a plurality of inner slide blocks (6) slidably arranged in the vertical slot (2), and a vertical rod (7) is fixed to the bottom of the inner slide block (6), and a connecting rod (8) is fixed to the bottom of the vertical rod (7), and a transmission block (9) located in the adjusting slot is rotatably arranged on the side wall of the connecting rod (8), and an end rod (10) fixed to both ends of the mounting plate (12) is rotatably arranged on the side wall of the transmission block (9).

3. A wave crest width adjustment mechanism for wave soldering equipment according to claim 2, characterized in that: A limiting rod (11) is fixed to the outer periphery of the end rod (10), a limiting slide groove (3) is formed on the inner wall of the solder tank (1), and the end of the limiting rod (11) is slidably arranged in the limiting slide groove (3).

4. The wave crest width adjustment mechanism for wave soldering equipment according to claim 1, characterized in that: A hot melt plate (17) is installed on the inner bottom surface of the solder bath (1).

5. The wave crest width adjustment mechanism for wave soldering equipment according to claim 3, characterized in that: The cross-section of the limiting rod (11) is in an inverted L shape.

6. The wave crest width adjustment mechanism for wave soldering equipment according to claim 2, characterized in that: The side wall of the transmission block (9) is flush with the inner wall of the solder tank (1).

7. The wave crest width adjustment mechanism for wave soldering equipment according to claim 1, characterized in that: Pads are installed at the bottom of the solder tank (1), and the pads are distributed in a rectangular array.

Images