Dustproof heat dissipation device for computer memory bank
By designing and installing plywood, heat sink and airbag structures on the memory stick, the fan-driven airflow can be used to achieve active heat dissipation and dust removal, which solves the problem of dust accumulation and dustproof cover affecting heat dissipation, and improves the heat dissipation efficiency and stability of the memory stick.
Patent Information
- Application Number
- CN202421170922.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-01-07
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing memory stick radiator accumulates dust after long-term use, resulting in a decrease in heat dissipation performance, and the dust cover affects heat dissipation, resulting in an increase in the temperature of the memory module, affecting performance and stability.
A dust-proof and heat dissipation device including mounting a clamp, a heat sink and an airbag is designed, and the fan-driven airflow is used to discharge the hot air through the heat dissipation hole to achieve active heat dissipation and dust removal through thermally conductive materials and airflow.
Effectively reduce the temperature of the heat sink, improve heat dissipation efficiency, and remove dust through airflow to keep the memory stick clean and extend its service life.
Smart Images
Figure CN222319426U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a dust-proof heat dissipation device for a computer memory bar. Background Art
[0002] Memory stick, also known as memory module, is an important hardware component on the computer motherboard. It is used to store and provide temporary data and instructions required by the computer when it is running. The main function of the memory stick is to quickly read and write data to improve the computer's operating speed and performance. Memory sticks usually adopt a slot-type design, which can be easily inserted and removed from the memory slots on the motherboard. They are usually composed of integrated circuit chips that are organized into a modular design for data transmission and storage in the computer. Memory stick heat dissipation and dust prevention are important factors in keeping the memory stick stable and extending its life. First of all, memory stick heat dissipation is the key to ensuring that the memory module maintains the appropriate temperature during operation. Since the memory stick generates heat when running at high speed, if the temperature is too high, it may cause the performance of the memory module to deteriorate or even malfunction. Memory stick dust prevention is the key to keeping the memory module clean and in good working condition. Due to the presence of various dust, fine particles and other contaminants in the computer environment, these substances may enter the contact points between the memory slot and the memory stick, causing poor contact and electrical problems.
[0003] However, the heat sink usually equipped with existing memory sticks is an accessory made of metal or plastic, which is used to increase the heat dissipation area and provide additional heat dissipation capacity. The heat sink can quickly disperse the heat generated by the memory module through thermal conductive materials to keep the temperature of the memory module within a safe range. Although this heat sink structure can provide efficient heat dissipation, after long-term use, a large amount of dust will accumulate between the heat sink fins, reducing the heat dissipation performance. At the same time, since this heat sink has no active heat dissipation capacity, it will still accumulate heat when the memory stick is read and written at high speed for a long time. In addition, existing memory sticks usually use dust covers or covers for dust prevention. This is a protective layer covering the memory stick to prevent dust and dirt from entering the memory slot, but this will cause heat to accumulate between the memory stick and the dust cover, affecting its heat dissipation performance. Utility Model Content
[0004] 1. Technical issues to be resolved
[0005] In view of the deficiencies in the prior art, the utility model provides a dust-proof and heat-dissipating device for computer memory sticks, which has the advantages of being able to actively dissipate the heat for the memory sticks while providing a dust-proof effect, thereby solving the problems of dust accumulation on the existing memory sticks, the lack of active heat dissipation capability of the radiator, and the influence of the dust cover on heat dissipation, which may all lead to an increase in the temperature of the memory module and affect its performance and stability.
[0006] (II) Technical solution
[0007] In order to achieve the above-mentioned purpose of being able to actively dissipate heat for the memory stick while providing a dust-proof effect, the utility model provides the following technical solutions: a dust-proof heat dissipation device for a computer memory stick, including a mounting splint and a heat sink, wherein there are two mounting splints, and the two mounting splints are respectively mounted on adjacent surfaces of two adjacent memory sticks, and the mounting splints are provided with heat sinks that are perpendicular to the side end surfaces of the mounting splints, and a heat dissipation airbag is provided between the heat sinks on both sides, the airbag is attached to the fins of the heat sink, an air cavity is provided inside the airbag, a fan is fixedly mounted on the top surface of the airbag, and the air outlet of the fan is connected to the air cavity.
[0008] Preferably, heat dissipation holes are provided on the surface of the airbag in the gaps between the fins of the heat sink, the heat dissipation holes are arranged in an array along the end surfaces on both sides of the airbag, and the heat dissipation holes are communicated with the air cavity.
[0009] Preferably, two or more fans are installed, and the air inlets of the two fans are in opposite directions.
[0010] Preferably, a gap is left between the heat sinks on both sides, and the width of the gap is greater than the width of the memory bar.
[0011] Preferably, the airbag is made of a heat-conducting material, and a region where the airbag and the heat sink are attached is coated with thermal grease.
[0012] (III) Beneficial effects
[0013] Compared with the prior art, the utility model provides a computer memory module dust-proof heat dissipation device, which has the following beneficial effects:
[0014] 1. This computer memory stick dustproof heat dissipation device uses a heat sink structure and an air bag structure in combination. Compared with the traditional technical structure, when the memory stick generates heat during operation, the heat is transferred to the heat sink through the mounting plate, and the heat can be quickly transferred to the air bag surface through the internal gas flow. In addition, due to the presence of the fan, an airflow will be formed inside the air bag, and this airflow will take away the hot air gathered in the air bag, so that the hot air is continuously replaced by cooler air. This convection heat dissipation mechanism can accelerate the transfer and dissipation of heat and reduce the temperature of the heat sink.
[0015] 2. This kind of dust-proof heat dissipation device for computer memory sticks uses an air bag structure and a heat dissipation hole structure. Compared with the traditional technical structure, the heat dissipation hole of the device is connected to the air cavity, so that the hot air in the air cavity can be discharged through the heat dissipation hole. In this way, the hot air will not accumulate in the air bag, but will be discharged in time, thereby reducing the temperature of the heat sink, and when the airflow is discharged from the heat dissipation hole, it will drive the surrounding air to flow together, forming a strong airflow. The flow rate of this airflow is fast and can produce a greater impact force. When the airflow passes through the heat dissipation hole, a certain pressure difference will be generated. This pressure difference will cause the airflow to flow in the direction of lower pressure. Since there are dust particles on the surface of the memory stick, these particles will be affected by the impact force of the airflow and the pressure difference, and will leave the surface of the memory stick and be carried away into the airflow. In this way, the dust on the memory stick will be blown off, achieving the effect of dust removal. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a three-dimensional structural schematic diagram of a dust-proof and heat-dissipating device for a computer memory module of the utility model;
[0017] Figure 2 This is a structural front view of a dust-proof and heat-dissipating device for a computer memory module according to the utility model;
[0018] Figure 3 This is a structural side view of a dust-proof and heat-dissipating device for a computer memory module according to the utility model;
[0019] Figure 4 This is a top view of the structure of a dust-proof and heat-dissipating device for a computer memory module according to the utility model;
[0020] Figure 5 This is a structural AA cross-sectional view of a dust-proof and heat-dissipating device for a computer memory module according to the utility model;
[0021] Figure 6 The utility model is a three-dimensional schematic diagram of the air bag structure of a dust-proof and heat-dissipating device for a computer memory stick.
[0022] In the figure: 1-installation plate, 2-heat sink, 3-memory module, 4-heat dissipation hole, 5-air bag, 6-air cavity, 7-fan. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] See also Figure 1, Figure 2 , Figure 3 , Figure 4 , Figure 5 A dustproof heat dissipation device for a computer memory bar comprises a mounting plate 1 and a heat sink 2. There are two mounting plates 1, and the two mounting plates 1 are respectively mounted on adjacent surfaces of two adjacent memory bars 3. The internal space of the computer is limited. In order to be able to install multiple memory bars 3 and heat dissipation devices at the same time, it is necessary to reasonably use the space. By mounting the two mounting plates 1 on adjacent surfaces of adjacent memory bars 3, the gaps between the memory bars 3 can be effectively utilized, so that the space between the heat dissipation device and the memory bars 3 can be fully utilized. And the two mounting plates 1 are respectively mounted on adjacent surfaces of adjacent memory bars 3, which can improve the stability of the device. The mounting plates 1 are attached to the surface of the memory bars 3 to prevent the heat dissipation device from vibrating or loosening during operation. At the same time, the two mounting plates 1 support each other, which can increase the structural stability of the device and avoid tilting or shaking of the device. The mounting splint 1 is provided with a heat sink 2 perpendicular to the side end face of the mounting splint 1, and a heat dissipation airbag 5 is provided between the heat sinks 2 on both sides. The airbag 5 is attached to the fins of the heat sink 2, and an air cavity 6 is provided inside the airbag 5. A fan 7 is fixedly installed on the top surface of the airbag 5, and the air outlet of the fan 7 is connected to the air cavity 6. When the memory stick 3 generates heat during operation, the heat is conducted to the heat sink 2 through the mounting splint 1. Through the internal gas flow, the heat can be quickly conducted to the surface of the airbag 5. And due to the presence of the fan 7, an airflow will be formed inside the airbag 5. This airflow will take away the hot air accumulated in the airbag 5, so that the hot air is continuously replaced by cooler air. This convection heat dissipation mechanism can accelerate the transfer and dissipation of heat and reduce the temperature of the heat sink 2.
[0025] See also Figure 5 and Figure 6 , the surface of the airbag 5 located in the gap between the fins of the heat sink 2 is provided with heat dissipation holes 4, and the heat dissipation holes 4 are arranged in an array along the end surfaces of both sides of the airbag 5, and the heat dissipation holes 4 are connected with the air cavity 6. These heat dissipation holes 4 are connected with the air cavity 6, so that the hot air in the air cavity 6 can be discharged through the heat dissipation holes 4. In this way, the hot air will not accumulate in the airbag 5, but will be discharged in time, further reducing the temperature of the heat sink 2. And when the airflow is discharged from the heat dissipation holes 4, it will drive the surrounding air to flow together, forming a strong airflow. The flow rate of this airflow is fast and can generate a large impact force. When the airflow passes through the heat dissipation holes 4, a certain pressure difference will be generated, and this pressure difference will cause the airflow to flow in the direction of lower pressure. Since there are dust particles on the surface of the memory stick 3, these particles will be affected by the impact force of the airflow and the pressure difference, and will leave the surface of the memory stick 3 and be carried away into the airflow.
[0026] The airbag 5 is made of heat-conducting material, and the area where the airbag 5 and the heat sink 2 are attached is coated with thermal grease. Figure 1 and Figure 4 Two or more fans 7 are installed, and the air inlets of the two fans 7 are in opposite directions. Installing more than two fans 7 can form a better air circulation. The airflow generated by the two fans 7 can make the air circulate inside the heat dissipation device, improving the heat dissipation effect and the balance of heat dissipation. Moreover, the air inlets of the two fans 7 are in opposite directions, so that air can enter the heat dissipation device from two directions, increasing the comprehensiveness and uniformity of heat dissipation. There is a gap between the heat sinks 2 on both sides, and the width of the gap is greater than the width of the memory bar 3.
[0027] Working principle: When installing the heat dissipation device, first set the device in the gap between the two memory bars 3, and attach the mounting clamps 1 on both sides to the surface of the memory bars 3. When in use, connect the power supply line of the fan 7 to the power supply port of the mainboard. During the operation of the memory bars 3, the two fans 7 rotate and suck the wind into the air cavity 6 and discharge it from the heat dissipation holes 4. When the memory bars 3 generate heat during operation, the heat is conducted to the heat sink 2 through the mounting clamps 1. The heat sink 2 is attached to the air bag 5, and the air bag 5 is made of heat-conducting material with high thermal conductivity. Through the internal gas flow, the heat can be quickly conducted to the surface of the air bag 5. And due to the presence of the fan 7, an airflow will be formed inside the air bag 5. This airflow will take away the hot air gathered in the air bag 5, so that the hot air is continuously replaced by cooler air. This convection heat dissipation mechanism can accelerate the transfer and dissipation of heat and reduce the temperature of the heat sink 2. The surface of the air bag 5 is provided with heat dissipation holes 4, which are arranged in an array along the end faces of both sides of the air bag 5. These heat dissipation holes 4 are connected with the air cavity 6, so that the hot air in the air cavity 6 can be discharged through the heat dissipation holes 4. In this way, the hot air will not accumulate in the air bag 5, but will be discharged in time, further reducing the temperature of the heat sink 2. At the same time, when the airflow is discharged from the heat dissipation holes 4, it will drive the surrounding air to flow together, forming a strong airflow. The flow rate of this airflow is fast and can generate a large impact force. When the airflow passes through the heat dissipation holes 4, a certain pressure difference will be generated, and this pressure difference will cause the airflow to flow in the direction of lower pressure. Since there are dust particles on the surface of the memory stick 3, these particles will be forced to leave the surface of the memory stick 3 and be taken away into the airflow due to the impact force and pressure difference of the airflow. In this way, the dust on the memory stick 3 will be blown off, achieving the effect of dust removal. In addition, since the heat dissipation holes 4 face the memory stick 3, the airflow will directly impact the surface of the memory stick 3 when passing through the heat dissipation holes 4, increasing the probability of dust removal effect. Moreover, the heat dissipation holes 4 are arranged in an array along the end faces on both sides of the air bag 5, covering the entire surface of the memory stick 3, so that the airflow can fully cover the surface of the memory stick 3, thereby better removing dust.
[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A dustproof and heat dissipation device for a computer memory module, comprising a mounting plate (1) and a heat sink (2), wherein the mounting plates (1) are two in number, and the two mounting plates (1) are respectively mounted on adjacent surfaces of two adjacent memory modules (3), and the mounting plates (1) are provided with heat sinks (2) perpendicular to the side end surfaces of the mounting plates (1), characterized in that: A heat dissipation airbag (5) is provided between the heat sinks (2) on both sides; the airbag (5) is attached to the fins of the heat sink (2); an air cavity (6) is provided inside the airbag (5); a fan (7) is fixedly mounted on the top surface of the airbag (5); and an air outlet of the fan (7) is connected to the air cavity (6).
2. The dust-proof and heat-dissipating device for computer memory stick according to claim 1, characterized in that: The surface of the airbag (5) located in the gap between the fins of the heat sink (2) is provided with heat dissipation holes (4), the heat dissipation holes (4) are arranged in an array along the end surfaces on both sides of the airbag (5), and the heat dissipation holes (4) are connected to the air cavity (6).
3. The dust-proof and heat-dissipating device for computer memory stick according to claim 1, characterized in that: Two or more fans (7) are installed, and the air inlets of the two fans (7) are in opposite directions.
4. The dust-proof and heat-dissipating device for computer memory stick according to claim 1, characterized in that: A gap is left between the heat sinks (2) on both sides, and the width of the gap is greater than the width of the memory bar (3).
5. The dust-proof and heat-dissipating device for computer memory stick according to claim 1, characterized in that: The airbag (5) is made of a heat-conducting material, and the area where the airbag (5) and the heat sink (2) are attached is coated with heat-conducting silicone grease.