Semiconductor resistor element packaging and positioning structure

Abstract

The utility model relates to the field of semiconductor packaging, in particular to a semiconductor resistor element packaging and positioning structure, which can solve the problem that pins are easy to break at the bottom of a connecting groove when being swung in the prior art; and a positioning structure is relatively complicated, and a protective structure is not arranged outside, so that the positioning structure is easy to break. Comprising a glass-sealed shell, a chip is arranged in the glass-sealed shell, electrodes are arranged on the left side and the right side of the chip, the electrodes are fixedly connected with the tops of pins, and the pins extend out of the glass-sealed shell downwards; a packaging positioning structure with a buffering effect on the pin is fixedly arranged at the joint of the pin and the glass-sealed shell, the packaging positioning structure comprises a first fixing block with a cylindrical upper side, a second fixing block is fixedly arranged on the lower side of the first fixing block, and a vertical fixing hole matched with the pin is jointly embedded in the first fixing block and the second fixing block; the fixing hole comprises a rectangular hole in the upper side, and the lower end of the rectangular hole is connected with a horn-shaped guide hole with a lower opening. The device is simple to operate, convenient to use and suitable for various resistors.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, in particular to a semiconductor resistor element packaging and positioning structure. Background Art

[0002] Semiconductor resistance is the impedance phenomenon generated when current passes through a semiconductor material. Different doping concentrations and types will affect the electron or hole concentration and carrier mobility of the material, thereby affecting the resistivity. Chinese utility model patent application number 202321443287.6 discloses a single-ended glass-encapsulated thermistor. By setting a positioning shell, a positioning structure is provided inside the positioning shell, and grooves are symmetrically provided on the surface of the glass-encapsulated shell. The spring in the positioning structure allows the movable plate to slide inside the mounting groove and fit with the limit block, so that the end of the positioning block is clamped inside the groove, which can prevent the positioning shell from falling off from the lower end of the glass-encapsulated shell, thereby providing more stable protection for the pins.

[0003] The above-mentioned thermistor packaging structure can provide protection for the pins. However, during use, it was found to have the following defects: 1. The connection slot of the positioning shell is an overall vertical rectangular structure, without a buffer structure at the bottom to allow the pins to swing. This makes the pins prone to breaking at the bottom of the connection slot when they swing; 2. The positioning structure is relatively complex, which is not conducive to reducing production costs; 3. The glass shell is directly exposed, without a protective structure on the outside, making it prone to breakage. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the utility model provides a semiconductor resistor element packaging positioning structure, which can solve the problem that the previous packaging structure did not have a buffer structure for the pins to swing, so that the pins were easily broken at the bottom of the connecting groove when they were swung; the positioning structure was relatively complex, which was not conducive to reducing production costs; and the glass-sealed shell was directly exposed and there was no protective structure on the outside, which made it easy to break.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor resistor element packaging and positioning structure, comprising a glass-sealed shell, a chip being arranged in the glass-sealed shell, electrodes being arranged on the left and right sides of the chip, the electrodes being fixedly connected to the top of the pins, and the pins extending downward from the glass-sealed shell; a packaging and positioning structure having a buffering effect on the pins is fixedly arranged at the connection between the pins and the glass-sealed shell, the packaging and positioning structure comprising a first cylindrical fixing block on the upper side, a second fixing block being fixedly arranged on the lower side of the first fixing block, a vertical fixing hole cooperating with the pin being embedded in the first and second fixing blocks, the fixing hole comprising a rectangular hole on the upper side, the lower end of the rectangular hole being connected to a trumpet-shaped guide hole with an open bottom.

[0006] As a preferred technical solution, the top surface of the first fixing block is in a curved structure that matches the lower surface of the glass-sealed housing.

[0007] As a preferred technical solution, the diameter of the first fixing block is smaller than the transverse diameter of the glass-sealed housing.

[0008] As a preferred technical solution, the diameter of the second fixing block is smaller than the diameter of the first fixing block.

[0009] As a preferred technical solution, a protective structure is further provided on the outside of the glass-sealed shell.

[0010] As a preferred technical solution, the protective structure includes arc-shaped elastic steel sheets arranged at circumferential intervals, one end of the elastic steel sheet is fixedly connected to the side of the first fixed block, and the other end of the elastic steel sheet is fixedly connected to the connecting head, which is fixed to the top surface of the glass-sealed shell.

[0011] As a preferred technical solution, the connector is a flat cylindrical structure, and the bottom surface is an arc-shaped structure that matches the top surface of the glass-sealed shell.

[0012] Compared with the prior art, the present invention provides a semiconductor resistor element packaging and positioning structure, which has the following beneficial effects:

[0013] 1. The utility model comprises a first fixing block with an upper cylindrical shape through a packaging positioning structure, a second fixing block is fixedly provided on the lower side of the first fixing block, and a vertical fixing hole cooperating with the pin is embedded in the first fixing block and the second fixing block. The fixing hole comprises a rectangular hole on the upper side, and the lower end of the rectangular hole is connected to a trumpet-shaped guide hole with a lower opening. When in use, the rectangular hole is adhered to and bonded to the outer surface of the pin, which can enhance the protection and fixation of the pin. The guide hole is trumpet-shaped, which can play a buffering role when the pin swings to both sides, avoiding right-angle bending and easy breakage.

[0014] 2. The utility model comprises a protective structure including arc-shaped elastic steel sheets arranged at circumferential intervals, one end of the elastic steel sheet is fixedly connected to the side of the first fixed block, and the other end of the elastic steel sheet is fixedly connected to the connecting head, which is fixed to the top surface of the glass-sealed shell. When in use, the elastic steel sheet can play a circumferential protective role on the outside to prevent the glass-sealed shell from being easily broken by collision.

[0015] 3. The connector of the present invention is a flat cylindrical structure, and the bottom surface is an arc structure that matches the top surface of the glass-sealed shell. When in use, the arc structure can increase the connection area, which is more conducive to the firmness of the connection between the connector and the glass-sealed shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the first embodiment of the present utility model;

[0018] Figure 2 It is an enlarged structural diagram of the package positioning structure;

[0019] Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure;

[0020] Figure 4 for Figure 2 Schematic diagram of the cross-sectional structure;

[0021] Figure 5 This is a schematic diagram of the three-dimensional structure of the second embodiment of the present invention.

[0022] Markings in the figure: 1. Glass-sealed shell; 11. Chip; 12. Electrode; 2. Pin; 3. Package positioning structure; 31. First fixing block; 32. Second fixing block; 321. Guide hole; 33. Rectangular hole; 34. Arc surface structure; 4. Connector; 5. Elastic steel sheet. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example 1

[0024] like Figures 1 to 4 As shown, a semiconductor resistor component packaging and positioning structure includes a glass-sealed housing 1, in which a chip 11 is mounted. Electrodes 12 are provided on the left and right sides of chip 11. Electrodes 12 are fixedly connected to the tops of pins 2, which extend downwardly out of the glass-sealed housing 1. A packaging and positioning structure 3, which provides a buffering effect for pins 2, is fixedly installed at the connection between pins 2 and the glass-sealed housing 1. This packaging and positioning structure 3 includes a first cylindrical fixing block 31 on the upper side, a second fixing block 32 fixed to the lower side of the first fixing block 31, and both the first and second fixing blocks 31, 32 have vertical fixing holes embedded therein, which mate with pins 2. The fixing holes include a rectangular hole 33 on the upper side, with a downwardly open, trumpet-shaped guide hole 321 connected to the lower end of the rectangular hole 33.

[0025] The top surface of the first fixing block 31 is a curved surface structure 34 that matches the bottom surface of the glass-sealed housing 1 .

[0026] The diameter of the first fixing block 31 is smaller than the transverse diameter of the glass-sealed housing 1 .

[0027] The diameter of the second fixing block 32 is smaller than the diameter of the first fixing block 31 .

[0028] When in use, the rectangular hole 33 is adhered and bonded to the outer surface of the pin 2, which can enhance the protection and fixation of the pin 2. The guide hole 321 is trumpet-shaped, which can act as a buffer when the pin 2 swings to both sides, avoiding breakage caused by right-angle bending. Example 2

[0029] like Figure 5 As shown, a protective structure is also provided on the outside of the glass-sealed housing 1 .

[0030] The protective structure includes arc-shaped elastic steel sheets 5 arranged at intervals in the circumferential direction. One end of the elastic steel sheet 5 is fixedly connected to the side of the first fixing block 31, and the other end of the elastic steel sheet 5 is fixedly connected to the connector 4, which is fixed to the top surface of the glass-sealed shell 1.

[0031] The connector 4 is a flat cylindrical structure, and its bottom surface is an arc-shaped structure that matches the top surface of the glass-sealed housing 1 .

[0032] When in use, the elastic steel sheet 5 can play a circumferential protective role on the outside to prevent the glass-sealed shell 1 from being easily broken by collision. The arc structure can increase the connection area, which is more conducive to the firm connection between the connector 4 and the glass-sealed shell 1.

[0033] The components used in the present invention are all universal standard components or components known to those skilled in the art, and their structures and principles are well known to those skilled in the art.

[0034] It should be noted that, in this document, the directions or positional relationships indicated by the terms "first", "second", "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprising" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0035] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so that people familiar with this technology can understand and read them. They are not intended to limit the conditions under which the present invention can be implemented. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in this utility model without affecting the effects and purposes that can be achieved by the present utility model.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor resistor element packaging and positioning structure, comprising a glass-sealed shell, a chip is arranged in the glass-sealed shell, electrodes are arranged on the left and right sides of the chip, the electrodes are fixedly connected to the top of the pins, and the pins extend downward from the glass-sealed shell; characterized in that: A package positioning structure having a buffering effect on the pin is fixedly provided at the connection between the pin and the glass-sealed shell, the package positioning structure includes a first cylindrical fixing block on the upper side, a second fixing block is fixedly provided on the lower side of the first fixing block, and vertical fixing holes cooperating with the pin are embedded in the first fixing block and the second fixing block, the fixing hole includes a rectangular hole on the upper side, and a lower open trumpet-shaped guide hole is connected to the lower end of the rectangular hole.

2. A semiconductor resistor element packaging and positioning structure according to claim 1, characterized in that: The top surface of the first fixing block is in a curved structure matching the lower surface of the glass-sealed housing.

3. The semiconductor resistor element packaging and positioning structure according to claim 1, characterized in that: The diameter of the first fixing block is smaller than the transverse diameter of the glass-sealed housing.

4. The semiconductor resistor element packaging and positioning structure according to claim 1, characterized in that: The diameter of the second fixing block is smaller than the diameter of the first fixing block.

5. The semiconductor resistor element packaging and positioning structure according to claim 1, characterized in that: A protective structure is also arranged on the outer side of the glass-sealed shell.

6. A semiconductor resistor element packaging and positioning structure according to claim 5, characterized in that: The protection structure includes arc-shaped elastic steel sheets arranged at intervals in the circumferential direction, one end of the elastic steel sheet is fixedly connected to the side surface of the first fixing block, and the other end of the elastic steel sheet is fixedly connected to the connecting head, which is fixed to the top surface of the glass-sealed shell.

7. A semiconductor resistor element packaging and positioning structure according to claim 6, characterized in that: The connector is in a flat cylindrical structure, and the bottom surface is in an arc structure matched with the top surface of the glass-sealed shell.

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