Assembling carrier

Abstract

The utility model discloses an assembly carrier and a micro-assembly production line used for chip capacitor products, the assembly carrier comprises a substrate and a plurality of carrier bodies, the substrate is movably arranged on the micro-assembly production line, the plurality of carrier bodies are arranged one by one along the extension direction of the substrate, the carrier bodies are detachably fixed on the substrate, a plurality of accommodating grooves are concavely formed in the carrier body, and the accommodating grooves are used for bearing chip capacitor products. Therefore, the problem that an existing carrier is a quick-wear part, when one or more containing grooves in the carrier are damaged, the whole carrier needs to be replaced, and the replacement cost is high is solved.

Description

Technical Field

[0001] The utility model belongs to the field of micro-assembly production of chip capacitor products, and in particular relates to an assembly tool. Background Art

[0002] The existing carrier is an integral carrier, each of which carries 40 to 60 chip capacitor products, that is, has 40 to 60 receiving slots. In addition, the existing carrier is a consumable part. When one or more receiving slots in a carrier are damaged, the entire carrier must be replaced, resulting in a high replacement cost. Utility Model Content

[0003] The purpose of the utility model is to provide an assembly vehicle which can effectively solve the above technical problems.

[0004] The technical solution provided by the utility model to solve the technical problem is as follows:

[0005] An assembly tool, used for a micro-assembly production line of chip capacitor products, comprising:

[0006] A substrate, movably disposed on the micro-assembly production line;

[0007] A plurality of carrier bodies are arranged one by one along the extension direction of the substrate, and the carrier bodies are detachably fixed on the substrate;

[0008] Wherein, a plurality of receiving grooves are recessed on the carrier body, and the receiving grooves are used to carry chip capacitor products.

[0009] Preferably, the plurality of accommodating grooves are arranged in an interval arrangement along the extension direction of the substrate, an auxiliary groove is arranged between two adjacent accommodating grooves, and the auxiliary grooves are connected to the two accommodating grooves;

[0010] Along an extension direction perpendicular to the substrate, an extension length of the accommodating groove is greater than an extension length of the auxiliary groove, and along a thickness direction of the substrate, an extension depth of the accommodating groove is greater than an extension depth of the auxiliary groove.

[0011] Preferably, auxiliary half grooves are also respectively arranged between the adjacent accommodating grooves between two adjacent carrier bodies, and the two adjacent auxiliary half grooves together constitute the auxiliary groove.

[0012] Preferably, the carrier body has a bearing portion, the top end of the bearing portion is recessed with the receiving groove, and the bottom end of the bearing portion is protruding with a guide pin;

[0013] A guide groove is concavely arranged on the base plate corresponding to the guide pin, and the guide pin is accommodated in the guide groove.

[0014] Preferably, the carrier body further includes a connecting portion extending outward from one side of the bearing portion, the connecting portion is provided with a first assembly structure, a second assembly structure is provided on the substrate corresponding to the connecting portion, and the first assembly structure and the second assembly structure are fixedly connected.

[0015] Preferably, the first assembly structure is a first assembly hole, and the second assembly structure is a second assembly hole;

[0016] The micro-assembly lead carrier also includes a plurality of first connecting members, each of which is inserted into one of the first assembly holes and one of the second assembly holes.

[0017] Preferably, a first conducting hole is provided through the bottom of the receiving groove of each carrier body, and a second conducting hole is provided through the substrate at a position corresponding to the first conducting hole, and the first conducting hole is connected to the second conducting hole;

[0018] Wherein, along the up-down direction, the guide groove forms a first projection area, the second conducting hole forms a second projection area, and the first projection area does not overlap with the second projection area.

[0019] Preferably, a positioning guide block is further provided on the base plate, and the positioning guide block is concavely provided with a V-shaped groove along the extension direction of the base plate.

[0020] Preferably, a transfer roller is provided at the bottom of the substrate, a transfer mechanism is provided on the micro-assembly production line, and the transfer roller is movably provided in the transfer mechanism.

[0021] The beneficial effects of the utility model are:

[0022] Compared with the prior art, the utility model provides an assembled carrier, in which a plurality of carrier bodies are detachably fixed on a base plate, and when one of the carrier bodies is damaged, the damaged one can be replaced, which is convenient for replacement and can also be mass-produced to reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the drawings and embodiments, in which:

[0024] Figure 1 It is a structural schematic diagram of an assembly vehicle disclosed in the utility model application;

[0025] Figure 2 for Figure 1 A schematic diagram of the local structure of the assembled vehicle from another angle is shown in FIG.

[0026] Figure 3 for Figure 1 A schematic diagram of the partial structure of the assembled vehicle from another angle is shown in FIG. DETAILED DESCRIPTION

[0027] The present disclosure will now be discussed with reference to several exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and thus implement the present disclosure, rather than implying any limitation on the scope of the present disclosure.

[0028] As used herein, the term "including" and its variants are to be interpreted as open-ended terms meaning "including but not limited to". The term "based on" is to be interpreted as "based at least in part on". The terms "one embodiment" and "an embodiment" are to be interpreted as "at least one embodiment". The term "another embodiment" is to be interpreted as "at least one other embodiment". The orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like is based on the orientation or position relationship shown in the accompanying drawings. These terms are mainly for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation. In addition, in addition to being used to indicate an orientation or position relationship, some of the above terms may also be used to indicate other meanings, such as the term "upper" may also be used to indicate a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to the specific circumstances. In addition, the terms "install", "set", "provided with", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances. In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0029] See also Figure 1 As shown, an assembly tool disclosed in the utility model application is used for a micro-assembly production line of a chip capacitor product. In the present application, the chip capacitor product can be a chip capacitor or other chip capacitor components.

[0030] In this embodiment, if Figures 1 to 3As shown, the assembly vehicle includes a substrate 1 and 8 carrier bodies 2. The substrate 1 is movably arranged on the micro-assembly production line; the 8 carrier bodies 2 are arranged one by one along the extension direction of the substrate 1, and the 8 carrier bodies 2 are detachably fixed on the substrate 1. In the present application, by detachably fixing the 8 carrier bodies 2 on the substrate 1, when damaged, one of the damaged carrier bodies 2 is replaced, making it easy to replace, and further reducing the use cost of the carrier. The carrier body 2 can be die-casted to achieve mass production, thereby reducing the manufacturing cost.

[0031] Specifically, 40-60 receiving grooves 211 are concavely arranged on the carrier body 2, and the receiving grooves 211 are used to carry chip capacitor products. In the present application, the number of receiving grooves 211 is preferably 50.

[0032] Furthermore, 50 receiving grooves 211 are arranged at intervals along the extension direction of the substrate 1, and an auxiliary groove 212 is provided between two adjacent receiving grooves 211, and the auxiliary grooves 212 are connected to the two receiving grooves 211. In the extension direction perpendicular to the substrate 1, the extension length of the receiving groove 211 is greater than the extension length of the auxiliary groove 212, and in the thickness direction of the substrate 1, the extension depth of the receiving groove 211 is greater than the extension depth of the auxiliary groove 212.

[0033] Furthermore, auxiliary half grooves 2121 are also respectively provided between adjacent receiving grooves 211 between two adjacent carrier bodies 2, and two adjacent auxiliary half grooves 2121 together constitute an auxiliary groove 212. In the present application, a pair of optical fiber detections are provided in the process position before the assembly tool is loaded on the micro-assembly production line. The pair of optical fiber detections are provided on both sides of the assembly tool along the extension direction of the substrate 1 and are located on the side where the outermost auxiliary half groove 2121 of the assembly tool is located, and can be used to detect whether there are any products that have not been taken away or other foreign objects in the assembly tool.

[0034] In this embodiment, the carrier body 2 has a carrying portion 21 , a top end of the carrying portion 21 is concavely provided with a receiving groove 211 , and a bottom end of the carrying portion 21 is protruding with a guide pin 214 .

[0035] Furthermore, a guide groove 13 is recessed on the substrate 1 corresponding to the guide pin 214, and the guide pin 214 is accommodated in the guide groove 13. In the present application, by inserting the guide pin 214 of the bearing portion 21 into the guide groove 13 correspondingly arranged on the substrate 1, the carrier body 2 can be quickly positioned, and then the carrier body 2 can be quickly fixed on the substrate 1.

[0036] In this embodiment, the carrier body 2 further includes a connecting portion 22 extending outward from one side of the bearing portion 21, the connecting portion 22 is provided with a first assembly structure, and a second assembly structure is provided on the substrate 1 at a position corresponding to the connecting portion 22, and the first assembly structure and the second assembly structure are fixedly connected. The first assembly structure is a first assembly hole 221, and the second assembly structure is a second assembly hole.

[0037] Furthermore, the assembly vehicle also includes 8 first connecting members, each of which is inserted into a first assembly hole 221 and a second assembly hole, so that the carrier body 2 can be detachably fixed on the substrate 1. In the present application, the first assembly hole 221 can be a through hole or a threaded hole, the second assembly hole can also be a through hole or a threaded hole, and the first connecting member can be a bolt, a screw, or other implementable components.

[0038] In this embodiment, a first conducting hole 213 is provided through the bottom of the receiving groove 211 of each carrier body 2, and a second conducting hole 14 is provided through the substrate 1 corresponding to the first conducting hole 213, and the first conducting hole 213 is connected to the second conducting hole 14. Among them, along the up and down direction, the guide groove 13 forms a first projection area, and the second conducting hole 14 forms a second projection area, and the first projection area does not overlap with the second projection area. In the present application, the second conducting hole 14 on the substrate 1 is connected to the blowing device of the micro-assembly production line. When it is necessary to take out the chip capacitor product located in the receiving groove 211, the blowing device is turned on, so that the airflow output by the blowing device flows into the first conducting hole 213 through the second conducting hole 14, and then flows into the receiving groove 211, so as to assist the picking device of the micro-assembly production line to quickly take out the chip capacitor product from the receiving groove 211, thereby improving the production efficiency of the micro-assembly production line.

[0039] In this embodiment, a positioning guide block 11 is further provided on the substrate 1, and the positioning guide block 11 is concavely provided with a V-shaped groove along the extension direction of the substrate 1. In this application, through the above arrangement, when the assembly tool is moved to the position to be processed, the positioning mechanism of the micro-assembly production line can be connected to the positioning guide block 11 of the assembly tool to achieve rapid positioning of the assembly tool, thereby improving the working efficiency of the micro-assembly production line.

[0040] In this embodiment, three transfer rollers 12 are arranged at the bottom of the substrate 1, and a transfer mechanism is arranged on the micro-assembly production line, and the transfer rollers 12 are movably arranged in the transfer mechanism. The transfer rollers 12 are driven to rotate by the transfer mechanism, thereby driving the assembly of tools to move along a preset direction. In this application, the transfer mechanism includes a stepper motor, a belt and a guide wheel, and a rotating wheel is fixed on the output shaft of the stepper motor. Among them, the guide wheel and the rotating wheel are respectively located at the two opposite ends of the belt, and the three transfer rollers 12 of the assembly of tools are all located between the guide wheel and the rotating wheel, and extend into the belt, and the opposite sides of the outer peripheral surfaces of the three transfer rollers 12 are respectively in contact with the inner wall surfaces of the opposite sides of the belt. When the stepper motor is working, the opposite sides of the belt are driven to move relative to each other by the rotating wheel, thereby driving the three transfer rollers 12 to rotate, so as to realize the movement of the assembly of tools.

[0041] In summary, the utility model discloses an assembled vehicle, on which 8 carrier bodies are installed. When a damaged carrier body is replaced, the damaged carrier body is replaced. The carrier body is die-casted by open mold, which can achieve mass production, thereby reducing costs and facilitating replacement.

Claims

1. An assembly tool for a micro-assembly production line of chip capacitor products, characterized in that: include: A substrate, movably disposed on the micro-assembly production line; A plurality of carrier bodies are arranged one by one along the extension direction of the substrate, and the carrier bodies are detachably fixed on the substrate; Wherein, a plurality of receiving grooves are recessed on the carrier body, and the receiving grooves are used to carry chip capacitor products.

2. The assembly vehicle according to claim 1, characterized in that: The plurality of receiving grooves are arranged in an interval arrangement along the extension direction of the substrate, an auxiliary groove is arranged between two adjacent receiving grooves, and the auxiliary grooves are connected to the space between the two receiving grooves; Along an extension direction perpendicular to the substrate, an extension length of the accommodating groove is greater than an extension length of the auxiliary groove, and along a thickness direction of the substrate, an extension depth of the accommodating groove is greater than an extension depth of the auxiliary groove.

3. The assembly vehicle according to claim 2, characterized in that: Auxiliary half grooves are also respectively arranged between the adjacent receiving grooves between two adjacent carrier bodies, and the two adjacent auxiliary half grooves together constitute the auxiliary groove.

4. The assembly vehicle according to claim 1, characterized in that: The carrier body has a bearing portion, the top end of which is concavely provided with the receiving groove, and the bottom end of which is protruding with a guide pin; A guide groove is concavely arranged on the base plate corresponding to the guide pin, and the guide pin is accommodated in the guide groove.

5. The assembly vehicle according to claim 4, characterized in that: The carrier body also includes a connecting portion extending outward from one side of the bearing portion, the connecting portion is provided with a first assembly structure, and a second assembly structure is provided on the base plate corresponding to the connecting portion, and the first assembly structure and the second assembly structure are fixedly connected.

6. The assembly vehicle according to claim 5, characterized in that: The first assembly structure is a first assembly hole, and the second assembly structure is a second assembly hole; The micro-assembly lead carrier also includes a plurality of first connecting members, each of which is inserted into one of the first assembly holes and one of the second assembly holes.

7. The assembly vehicle according to claim 4, characterized in that: A first conducting hole is provided through the bottom of the receiving groove of each carrier body, and a second conducting hole is provided through the substrate at a position corresponding to the first conducting hole, and the first conducting hole is connected to the second conducting hole; Wherein, along the up-down direction, the guide groove forms a first projection area, the second conducting hole forms a second projection area, and the first projection area does not overlap with the second projection area.

8. The assembly vehicle according to claim 1, characterized in that: A positioning guide block is also arranged on the base plate, and a V-shaped groove is concavely arranged on the positioning guide block along the extension direction of the base plate.

9. The assembly vehicle according to claim 1, characterized in that: A transfer roller is arranged at the bottom of the substrate, a transfer mechanism is arranged on the micro-assembly production line, and the transfer roller is movably arranged in the transfer mechanism.

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