Electronic equipment
By designing an auxiliary heat dissipation structure on the laptop case, using rubber and sponge layers to form a wind wall, and guiding the hot air out, the problem of hot air reflow is solved, significantly improving the heat dissipation performance and efficiency.
Patent Information
- Application Number
- CN202420121411.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-17
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-01-17
AI Technical Summary
The cooling performance of existing laptops is affected by the buffering of the foot pad segment difference, resulting in hot air returning and affecting the heat dissipation effect.
An auxiliary heat dissipation structure is designed, including a stop structure and a guide structure, which is attached to the shell assembly, covers part of the heat dissipation hole group, avoids the heat dissipation component setting, and uses a rubber layer and a sponge layer to form a wind wall. The guide structure will heat the wind. Derived from the first side of the housing to prevent backflow.
Effectively preventing hot air from flowing back, improving the heat dissipation performance of electronic equipment, increasing the heat dissipation efficiency of at least 8W, and solving the problem of ball dropping.
Smart Images
Figure CN222354327U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electronic devices, and in particular to an electronic device. Background Art
[0002] With the development of the electronic equipment industry, each model has a different design, which is a challenge for electronic equipment to perform a ball drop test. Taking a laptop as an example, the rear foot pad of the laptop D shell (the lower shell of the laptop that contacts the desktop) will add a step difference buffer in the middle of the foot pad to perform a ball drop test. At present, in order to improve the heat dissipation performance of the laptop, the internal blowing method is usually adopted to make the hot air blow out from the top of the laptop. However, since the foot pad has a step difference buffer, the hot air will flow back, affecting the heat dissipation effect. Utility Model Content
[0003] The present disclosure provides an electronic device to at least solve the above technical problems existing in the prior art.
[0004] According to the electronic device disclosed in the present invention, it includes a shell assembly and a heat dissipation assembly, the shell assembly includes a first shell and a second shell connected to each other, the first shell is provided with a heat dissipation hole group, a cavity is provided between the first shell and the second shell, the heat dissipation assembly is arranged in the cavity and correspondingly arranged at the heat dissipation hole group, and also includes: an auxiliary heat dissipation structure, the auxiliary heat dissipation structure is attached to the shell assembly, the auxiliary heat dissipation structure covers a part of the heat dissipation hole group in the cavity and is arranged away from the heat dissipation assembly; wherein the auxiliary heat dissipation structure includes a stop structure for guiding the hot air dissipated by the heat dissipation assembly out of the first side of the shell assembly.
[0005] In one possible implementation manner, the auxiliary heat dissipation structure includes a first covering layer, the first covering layer is attached to the first shell, and the stop structure is disposed on the first covering layer and is located at an end away from the first side.
[0006] In one possible implementation, the stop structure includes a rubber layer, and the rubber layer is disposed on the first covering layer.
[0007] In one possible implementation, the stop structure further includes a sponge layer, and the sponge layer is disposed on the rubber layer.
[0008] In one possible implementation manner, the auxiliary heat dissipation structure further includes a guide structure, and the guide structure is disposed on the first covering layer and located at an end close to the first side.
[0009] In one embodiment, the first covering layer includes a first edge, a second edge, a third edge and a fourth edge, the first edge is opposite to the second edge and satisfies a parallel condition, and the third edge is opposite to the fourth edge; wherein the stop structure is arranged close to the second edge, the guide structure is arranged close to the first edge, and a receiving groove is formed between the stop structure and the guide structure.
[0010] In one possible implementation manner, the heat dissipation assembly includes two fans, and the two fans are respectively disposed close to the third side and the fourth side and are symmetrical with respect to a center line of the first covering layer.
[0011] In one embodiment, the fan includes a first air outlet and a second air outlet, the first air outlet is communicated with the receiving groove, and is used to blow the hot air into the receiving groove, and the second air outlet is communicated with the first side edge, and is used to output the hot air from the first side edge; wherein the third side and the fourth side are respectively contoured to the edges of the fan.
[0012] In one embodiment, the first covering layer is a polyester film layer.
[0013] In one possible implementation manner, the heat dissipation structure further includes a second covering layer, the second covering layer is attached to the second shell, and the stop structure further includes a second rubber layer, the second rubber layer is disposed on the second covering layer and is located at an end away from the first side.
[0014] In the present disclosure, since the electronic device includes an auxiliary heat dissipation structure, the auxiliary heat dissipation structure is attached to the shell assembly and covers part of the heat dissipation hole group, which can prevent the hot air that has dissipated to the outside of the shell assembly from flowing back into the shell assembly, thereby improving the heat dissipation performance of the electronic product; at the same time, since the auxiliary heat dissipation structure includes a stop structure, the hot air can be concentrated at the auxiliary heat dissipation structure and exported from the first side.
[0015] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:
[0017] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0018] Figure 1A schematic diagram showing the overall structure of an electronic device according to an exemplary embodiment of the present disclosure is shown;
[0019] Figure 2 A schematic diagram of a foot pad structure of a first housing of an electronic device according to an exemplary embodiment of the present disclosure is shown;
[0020] Figure 3 A schematic structural diagram of a first cover layer of an electronic device according to an exemplary embodiment of the present disclosure is shown.
[0021] Explanation of the numbers in the figure: 1. heat dissipation assembly; 2. first shell; 11. stop structure; 12. guide structure; 21. heat dissipation hole group; 22. foot pad; 23. first side edge; 111. first covering layer; 112. rubber layer; 113. sponge layer; 114. accommodating groove; 1111. first side; 1112. second side; 1113. third side; 1114. fourth side. DETAILED DESCRIPTION
[0022] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.
[0023] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
[0024] Reference Figure 1 and Figure 2 As shown, an electronic device of an exemplary embodiment of the present disclosure includes a housing assembly, a heat dissipation assembly 1 and an auxiliary heat dissipation structure. The housing assembly includes a first housing 2 and a second housing connected to each other. The first housing 2 is provided with a heat dissipation hole group 21, and a cavity is provided between the first housing 2 and the second housing. The heat dissipation assembly 1 is arranged in the cavity and is correspondingly arranged at the heat dissipation hole group 21. The auxiliary heat dissipation structure is attached to the housing assembly, and the auxiliary heat dissipation structure covers part of the heat dissipation hole group 21 in the cavity and is arranged away from the heat dissipation assembly 1. The auxiliary heat dissipation structure includes a stopper structure 11, which is used to guide the hot air emitted by the heat dissipation assembly 1 out of the first side 23 of the housing assembly.
[0025] In this embodiment, the electronic device can be any device having the function of the heat dissipation component 1, such as but not limited to a laptop computer and a desktop computer host, etc. In this disclosure, the electronic device is taken as an example of a laptop computer. The first housing 2 is the D housing of the laptop computer (referring to the lower housing of the laptop computer bottom in contact with the desktop), the second housing (not shown in the figure) is the C housing of the laptop computer (referring to the housing around the laptop computer keyboard and touchpad), and a heat dissipation hole group 21 is opened on the first housing 2 along the length direction of the first housing 2, and the heat dissipation hole group 21 includes a plurality of heat dissipation holes. The heat dissipation component 1 (not shown in the figure) is arranged in the cavity of the housing component and is located at the position of the heat dissipation hole group 21, so that the hot air dissipated by the heat dissipation component 1 can be blown out from the heat dissipation hole group 21. By setting an auxiliary heat dissipation structure, the auxiliary heat dissipation structure is attached to the housing component and covers part of the heat dissipation hole group 21, and the auxiliary heat dissipation structure is arranged away from the heat dissipation component 1, so that the hot air dissipated by the heat dissipation component 1 can be blown to the position of the auxiliary heat dissipation structure, and finally derived from the first side 23. Among them, the first side 23 is the side where the laptop computer shaft is located, and the first side 23 has a plurality of openings for dissipating the hot air inside the laptop computer. Thus, the hot air that has been released to the outside of the shell assembly can be prevented from flowing back into the shell assembly through the heat dissipation hole group 21, thereby improving the heat dissipation performance of the electronic product; at the same time, since the auxiliary heat dissipation structure includes a stopper structure 11, the hot air can be concentrated at the auxiliary heat dissipation structure and discharged from the first side 23. In addition, a foot pad 22 is provided on the side of the first shell 2 away from the second shell, that is, the side of the first shell 2 located outside the cavity. The foot pad 22 is provided at one end close to the first side 23 and parallel to the length direction of the first shell 2. The foot pad 22 is provided protruding relative to the first shell 2. When the laptop is placed forward, the foot pad 22 contacts the placement surface, and the hot air discharged from the first side 23 is blocked by the foot pad 22, which can further prevent the hot air from flowing back into the shell assembly through the heat dissipation hole group 21. Through actual testing, this structure can not only improve the heat dissipation by at least 8W, but also solve the problem of falling balls at the same time.
[0026] In one embodiment, the auxiliary heat dissipation structure includes a first covering layer 111 , the first covering layer 111 is attached to the first housing 2 , and the stop structure 11 is disposed on the first covering layer 111 and located at an end away from the first side 23 .
[0027] Specifically, in one embodiment, the first covering layer 111 is a polyester film layer.
[0028] In this embodiment, polyester film has good air tightness and toughness, and has high tensile strength and impact strength, so the first cover layer 111 is usually made of polyester film. The stop structure 11 is located at one end of the first cover layer 111 away from the first side edge 23, forming a wind wall that can block hot wind, so that the hot wind is concentrated at the center of the first cover layer 111 and finally guided out from the first side edge 23.
[0029] In one embodiment, the stopper structure 11 includes a rubber layer 112 , and the rubber layer 112 is disposed on the first cover layer 111 .
[0030] In one embodiment, the stopper structure 11 further includes a sponge layer 113 , and the sponge layer 113 is disposed on the rubber layer 112 .
[0031] In this embodiment, the rubber layer 112 is made of rubber material, and the sponge layer 113 is made of sponge material. The rubber layer 112 is provided and the sponge layer 113 is attached to the rubber layer 112 to form a wind wall to block the wind and prevent hot air from flowing freely in the cavity.
[0032] In one embodiment, the auxiliary heat dissipation structure further includes a guide structure 12 , which is disposed on the first cover layer 111 and located at an end close to the first side edge 23 .
[0033] In this embodiment, the guide structure 12 includes a first guide portion and a second guide portion, which are arranged in an eight-shaped shape and are used to guide the hot air at the first covering layer 111 to the first side edge 23 and finally output it from the first side edge 23.
[0034] Reference Figure 3 As shown, in one embodiment, the first covering layer 111 includes a first side 1111, a second side 1112, a third side 1113 and a fourth side 1114. The first side 1111 is opposite to the second side 1112 and meets the parallel condition, and the third side 1113 is opposite to the fourth side 1114. The stop structure 11 is arranged close to the second side 1112, and the guide structure 12 is arranged close to the first side 1111. A receiving groove 114 is formed between the stop structure 11 and the guide structure 12.
[0035] In this embodiment, the stopping structure 11 forms a wind wall at the second edge 1112 of the first covering layer 111, which plays a wind blocking role and prevents hot air from flowing arbitrarily in the cavity; the guiding structure 12 is arranged close to the first edge 1111, and is used to guide the hot air at the first covering layer 111 to the first side edge 23, and finally output it from the first side edge 23.
[0036] In one embodiment, the heat dissipation assembly 1 includes two fans (not shown in the figure). The two fans are respectively arranged close to the third side 1113 and the fourth side 1114 and are symmetrical with respect to the center line of the first cover layer 111 .
[0037] Specifically, in one embodiment, the fan includes a first air outlet and a second air outlet, the first air outlet communicates with the receiving groove 114 and is used to blow hot air into the receiving groove 114, and the second air outlet communicates with the first side edge 23 and is used to guide the hot air out of the first side edge 23. The third side 1113 and the fourth side 1114 are respectively shaped like the edges of the fan.
[0038] In this embodiment, the auxiliary heat dissipation structure is arranged between the two fans, and each fan has two air outlets, which can blow out wind from the first air outlet and the second air outlet at the same time. The first air outlets of the two fans are both arranged toward the first covering layer 111, and the wind blown out from the first air outlet can be placed in the receiving groove 114. The second air outlets of the two fans are both arranged toward the first side edge 23. Therefore, when the two fans are running at the same time, they can blow air toward the receiving groove 114 and the first side edge 23 at the same time, which increases the heat dissipation efficiency and can improve the heat dissipation performance.
[0039] In one embodiment, the heat dissipation structure further includes a second covering layer attached to the second shell, and the stop structure 11 further includes a second rubber layer disposed on the second covering layer and located at an end away from the first side 23 .
[0040] In this embodiment, the second covering layer (not shown in the figure) is located in the cavity and its position on the second shell corresponds to the first covering layer 111. The second covering layer is specifically a polyester film layer, and a polyester film material is used. The second rubber layer is arranged on the second covering layer and corresponds to the position of the rubber layer 112. The second rubber layer and the rubber layer 112 work together to form a wind wall, which has a good wind blocking effect.
[0041] In the description of the present disclosure, it is necessary to understand that the orientation or positional relationship indicated by the directional words is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.
[0042] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between one or more components or features shown in the figure and other components or features. It should be understood that spatially relative terms include not only the orientation of the components as described in the figure, but also different orientations in use or operation. For example, if the components in the accompanying drawings are inverted as a whole, the components "above other components or features" or "above other components or features" will include the situation where the components are "below other components or structures" or "below other components or structures". Therefore, the exemplary term "above" may include both "above" and "below". In addition, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this article is intended to include all of these situations.
[0043] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, parts, components and / or combinations thereof.
[0044] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein.
[0045] The present disclosure has been described through the above-mentioned embodiments, but it should be understood that the above-mentioned embodiments are only for the purpose of example and description, and are not intended to limit the present disclosure to the scope of the described embodiments. In addition, it can be understood by those skilled in the art that the present disclosure is not limited to the above-mentioned embodiments, and more variations and modifications can be made according to the teachings of the present disclosure, and these variations and modifications all fall within the scope of protection claimed by the present disclosure. The scope of protection of the present disclosure is defined by the attached claims and their equivalents.
Claims
1. An electronic device, comprising a housing component and a heat dissipation component (1), wherein the housing component comprises a first housing (2) and a second housing connected to each other, wherein a heat dissipation hole group (21) is provided on the first housing (2), and a cavity is provided between the first housing (2) and the second housing, wherein the heat dissipation component (1) is arranged in the cavity and correspondingly arranged at the heat dissipation hole group (21), wherein: Also includes: An auxiliary heat dissipation structure, the auxiliary heat dissipation structure is attached to the shell component, the auxiliary heat dissipation structure covers a portion of the heat dissipation hole group (21) in the cavity, and is arranged away from the heat dissipation component (1); wherein the auxiliary heat dissipation structure includes a stop structure (11) for directing hot air dissipated from the heat dissipation component (1) out from the first side edge (23) of the shell component.
2. The electronic device according to claim 1, characterized in that: The auxiliary heat dissipation structure comprises a first covering layer (111), the first covering layer (111) is attached to the first shell (2), and the stop structure (11) is arranged on the first covering layer (111) and is located at an end away from the first side edge (23).
3. The electronic device according to claim 2, characterized in that: The stop structure (11) comprises a rubber layer (112), and the rubber layer (112) is arranged on the first covering layer (111).
4. The electronic device according to claim 3, characterized in that: The stop structure (11) further comprises a sponge layer (113), wherein the sponge layer (113) is arranged on the rubber layer (112).
5. The electronic device according to claim 2, characterized in that: The auxiliary heat dissipation structure further comprises a guide structure (12), wherein the guide structure (12) is arranged on the first covering layer (111) and is located at an end close to the first side edge (23).
6. The electronic device according to claim 5, characterized in that: The first covering layer (111) comprises a first edge (1111), a second edge (1112), a third edge (1113) and a fourth edge (1114); the first edge (1111) is opposite to the second edge (1112) and satisfies a parallel condition; the third edge (1113) is opposite to the fourth edge (1114); wherein the stop structure (11) is arranged close to the second edge (1112), the guide structure (12) is arranged close to the first edge (1111), and a receiving groove (114) is formed between the stop structure (11) and the guide structure (12).
7. The electronic device according to claim 6, characterized in that: The heat dissipation component (1) comprises two fans, the two fans being respectively arranged close to the third side (1113) and the fourth side (1114) and symmetrical with respect to the center line of the first covering layer (111).
8. The electronic device according to claim 7, characterized in that: The fan comprises a first air outlet and a second air outlet, wherein the first air outlet is in communication with the receiving groove (114) and is used to blow the hot air into the receiving groove (114), and the second air outlet is in communication with the first side edge (23) and is used to guide the hot air out from the first side edge (23); wherein the third edge (1113) and the fourth edge (1114) are respectively shaped like the edges of the fan.
9. The electronic device according to claim 2, characterized in that: The first covering layer (111) is a polyester film layer.
10. The electronic device according to claim 1, characterized in that: The heat dissipation structure further comprises a second covering layer, the second covering layer being attached to the second shell, and the stop structure (11) further comprises a second rubber layer (112), the second rubber layer (112) being arranged on the second covering layer and located at an end away from the first side edge (23).