Transfer mechanism and silicon wafer conveying system

By designing a load transfer mechanism including a sliding vehicle and a load transfer part, the complex problem of adjusting the position of silicon wafers in different sizes in semiconductor silicon wafer processing is solved, and the effect of simplifying process switching and reducing production costs is achieved.

CN222355097UActive Publication Date: 2025-01-14S C NEW ENERGY TECH CORP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202420149688.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-22
Publication Date
2025-01-14
Estimated Expiration
2034-01-22

AI Technical Summary

Technical Problem

In semiconductor silicon wafer processing and manufacturing, due to the differences in positional relationships between different processes and the need for different sizes of silicon wafers, the processing and manufacturing complexity is high, the debugging takes a long time, and the production cost is increased.

Method used

A load transfer mechanism is designed, including a first vehicle and a load transfer unit. By sliding in the first direction in different positioning states, the load transfer unit grabs silicon wafer sets of different sizes at the same position, which simplifies the The position adjustment during process switching reduces debugging and processing time.

Benefits of technology

By simplifying the adjustment of silicon wafer position, the time-consuming and production cost of semiconductor silicon wafer processing and manufacturing is reduced, and the efficiency of process switching is improved.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222355097U_ABST
    Figure CN222355097U_ABST
Patent Text Reader

Abstract

The utility model discloses a transferring mechanism and a silicon wafer conveying system. The transferring mechanism comprises a first carrier, a first conveying part and a transferring part. In the first positioning state, the first carrier positions the first silicon wafer group, and in the second positioning state, the first carrier positions a plurality of second silicon wafer groups distributed along the first direction. The first conveying part is used for conveying the first carrier in the second direction, and the second direction is perpendicular to the first direction. And the transferring part is used for transferring the first silicon wafer group or the second silicon wafer group positioned by the first carrier to a first target position. When the first carrier is in a first positioning state, the transfer part transfers the first silicon wafer group to a first target position at a first position, and the first carrier is configured to slide along a first direction relative to the transfer part, so that when the first carrier is in a second positioning state, the transfer part transfers each second silicon wafer group to the first target position at the first position. According to the invention, the transfer part transfers different silicon wafer groups at the same position, so that the time consumed by silicon wafer processing is reduced.
Need to check novelty before this filing date? Find Prior Art