Wafer supporting table

Abstract

The utility model provides a wafer supporting table. The wafer supporting table comprises a carrying table for carrying a wafer to be processed and a plurality of positioning pieces, the plurality of positioning pieces are arranged in the circumferential direction of the carrying table; the side wall of each positioning piece is an inclined face, the bottom end, close to the carrying table, of each inclined face is an arc face, and when the carrying table carries a to-be-machined wafer, the arc faces of the multiple positioning pieces clamp and bear the to-be-machined wafer. According to the utility model, the positioning pieces with the inclined planes of the wafer supporting table enable the wafer to slide down to the carrying table from top to bottom along the inclined planes in the process of loading the wafer to be processed, so that the deflection of the wafer in the loading process is reduced, and meanwhile, the arc surfaces of the plurality of positioning pieces are used for clamping, fixing and bearing the wafer to be processed, so that the working efficiency is improved. The deviation of the to-be-processed wafer in the subsequent processing procedure is prevented, so that the yield of the wafer processing technology is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit processing, in particular to a wafer supporting table. Background Art

[0002] Sub-atmospheric pressure chemical vapor deposition (SACVD) can achieve conformal growth and has a strong filling ability (aspect ratio> 10). It is mainly used for filling shallow trench isolation (STI) and poly-metal dielectric (PMD). However, since SACVD is a thermal reaction process, it has high requirements for the uniformity of wafer heating. If the wafer is directly heated by the heating plate during SACVD, if the position of the wafer on the heating plate is offset, the wafer will be heated unevenly. Abnormal heating will lead to abnormal film thickness, affecting the effect of subsequent chemical mechanical polishing, forming residues and thus affecting the yield.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0004] In view of the problems in the prior art, the purpose of the utility model is to provide a wafer support table, which can reduce the tilt caused by the loading process of the wafer to be processed and the deviation during loading, improve the quality of subsequent wafer processing technology, and improve the wafer processing yield.

[0005] The utility model provides a wafer support platform, comprising a carrier for carrying a wafer to be processed and a plurality of positioning parts;

[0006] A plurality of positioning members are arranged in the circumference of the carrier;

[0007] The side wall of each positioning member is an inclined surface, and the bottom end of the inclined surface close to the carrier is an arc surface. When the carrier carries the wafer to be processed, the arc surfaces of the plurality of positioning members clamp and carry the wafer to be processed.

[0008] According to some examples of the present invention, each of the positioning members is arranged on the circumference of the carrier through a support column arranged on the outer peripheral side of the carrier.

[0009] According to some examples of the present utility model, the positioning member is rotatably connected to the support column, and the positioning member has a first position and a second position;

[0010] When the positioning member is in the first position, the arc surfaces of the plurality of positioning members clamp and support the wafer to be processed;

[0011] When the positioning member is at the second position, the arc surfaces of the plurality of positioning members face away from the carrier.

[0012] According to some examples of the present invention, the support column is movable within the plane of the carrier.

[0013] According to some examples of the present invention, the height of each of the support columns can be raised or lowered.

[0014] According to some examples of the present invention, the positioning member is detachably connected to the support column.

[0015] According to some examples of the present invention, a plurality of the positioning members are evenly arranged along the circumference of the carrier.

[0016] According to some examples of the present invention, the difference between the radius of the annular clamping unit formed by the arc surfaces of the plurality of positioning members and the radius of the wafer to be processed is less than or equal to +1 mm.

[0017] According to some examples of the present invention, the cross section of the inclined surface is in an arc shape or a straight line shape.

[0018] According to some examples of the present invention, the angle between the inclined surface and the plane of the carrier is between 20° and 60°.

[0019] The wafer support table of the utility model has an inclined positioning piece, which enables the wafer to slide down from top to bottom along the inclined surface to the carrier during the process of loading the wafer to be processed, thereby reducing the skewness of the wafer during the loading process. At the same time, the arc surface of multiple positioning pieces is used to clamp and fix the wafer to be processed, thereby preventing the wafer to be processed from shifting in subsequent processing steps, thereby improving the yield rate of the wafer processing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Other features, objectives and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings.

[0021] Figure 1 A schematic structural diagram of a wafer support table according to an embodiment of the present invention;

[0022] Figure 2 A top view of a wafer support table carrying a wafer to be processed according to an embodiment of the utility model;

[0023] Figure 3 A side view of a wafer support table carrying a wafer to be processed according to an embodiment of the present invention; and

[0024] Figure 4 and Figure 5They are schematic structural diagrams of a wafer support table according to an embodiment of the present invention when the positioning member is in different states. DETAILED DESCRIPTION

[0025] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the utility model will be comprehensive and complete, and the concept of the example embodiments will be fully conveyed to those skilled in the art. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the utility model, and should not be construed as limitations on the utility model. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0026] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0028] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the utility model. In addition, the utility model can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed in itself. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0029] In response to the existing technical problems, the utility model provides a wafer support table, which includes a carrier for carrying wafers to be processed and a plurality of positioning members; the plurality of positioning members are arranged in the circumference of the carrier; the side wall of each positioning member is an inclined surface, and the bottom end of the inclined surface close to the carrier is an arc surface. When the carrier carries the wafers to be processed, the arc surfaces of the plurality of positioning members clamp the wafers to be processed. The inclined positioning members of the wafer support table of the utility model enable the wafers to slide down from top to bottom along the inclined surface to the carrier during the process of loading the wafers to be processed, thereby reducing the skewness of the wafer during the loading process. At the same time, the arc surfaces of the plurality of positioning members clamp and fix the wafers to be processed, thereby preventing the wafers to be processed from shifting in subsequent processing steps, thereby improving the yield of the wafer processing technology.

[0030] The structure of the wafer support table of the present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It can be understood that the various specific embodiments are not intended to limit the protection scope of the present invention.

[0031] Figure 1 The schematic diagram of the structure of a wafer support platform of an embodiment of the utility model, specifically, the wafer support platform includes a carrier 10 for carrying the wafer to be processed and a plurality of positioning members 20; generally, the carrier is a circle with a radius greater than the radius of the wafer to be processed, and the carrier can be a heating plate with a heating function. A plurality of positioning members 20 are arranged on the circumference of the carrier 10; the side wall of each positioning member 20 is a slope C, and the bottom end of the slope C close to the carrier 10 is an arc surface A. When the carrier carries the wafer to be processed, the arc surfaces of the plurality of positioning members clamp and carry the wafer to be processed. The vertical distance between the slope C of the positioning member 20 and the central axis of the carrier decreases from top to bottom, and the angle between the slope C and the carrying surface of the carrier 10 is θ, which can be between 20° and 60°, and can be set to 45°, which can be determined according to the size of the specific wafer to be carried.

[0032] Figure 2 The top view of a wafer support table carrying a wafer to be processed according to an embodiment of the utility model is shown. The arc surface A at the bottom of the inclined surface C of the plurality of positioning members 20 forms an annular clamping unit. In the process of loading the wafer to be processed, the inclined surface C whose vertical distance from the central axis of the carrier decreases successively enables the wafer to slide down from top to bottom automatically by gravity into the annular clamping unit formed by the arc surface A. Figure 3This is a side view of a wafer support table carrying a wafer to be processed in one embodiment of the utility model; preferably, the difference between the radius of the annular clamping unit formed by the arc surface A of the multiple positioning members 20 and the radius of the carried wafer 9 to be processed is less than or equal to +1mm, that is, the radius of the annular clamping unit needs to be larger than the radius of the carried wafer 9 to be processed, but the difference between the two is less than or equal to 1mm. The above-mentioned smaller difference between the two can prevent problems such as skew or offset of the wafer during loading the wafer and subsequent processing.

[0033] The number of positioning members 20 included in the wafer support table may be two, three, four or more, which is not limited herein. Preferably, the positioning members 20 may be evenly arranged along the circumference of the carrier 10 .

[0034] In some embodiments, each of the positioning members 20 can be arranged in the circumference of the carrier through a support column 30 arranged on the outer peripheral side of the carrier 10. Further, the positioning member 20 and the support column 10 are rotatably connected, that is, the positioning member 20 can be rotated so that the inclined surface C of the positioning member 20 is in different positions. In the embodiment, the positioning member can have multiple positions. Preferably, the positioning member 20 has at least a first position and a second position. When the positioning member 20 is in the first position, the arc surfaces of the multiple positioning members 20 clamp and carry the wafer to be processed. Figure 3 When the positioning member 20 is in the second position, the arc surface of the plurality of positioning members 20 is away from the carrier, see Figure 5 When the positioning member 20 is in the second position, the wafer can be unloaded more conveniently. When the positioning member 20 is in the first position, the arc surfaces of the multiple positioning members 20 clamp the wafer, that is, the distance between the bottom of the arc surface A of the positioning member 20 and the carrier 10 is less than or equal to the thickness of the wafer, and even the positioning member 20 conflicts with the carrier. In the process of rotating the positioning member to make it in the second position, the positioning member can be raised first (see Figure 4 ) and then rotate to prevent friction between the positioning member and the carrier, etc. Therefore, each of the support columns can be set to be height-adjustable.

[0035] The positioning member 20 and the support column 30 may be detachably connected, and by replacing positioning members 20 with different structures, such as replacing positioning members with arc surfaces A with different curvatures, the wafer support table can be made to carry wafers of different specifications, thereby improving the practicality of the wafer support table. In some embodiments, the support column 30 is movable within the plane of the carrier, that is, the center of the annular clamping unit formed by the arc surface A at the bottom of the inclined surface C of multiple positioning members 20 can be adjusted by moving the support column 30. The center of the annular clamping unit can be determined according to the position of the wafer to be located in the subsequent processing technology. When loading the wafer, the loading position of the wafer on the carrier can be further accurately controlled by adjusting the position of the support column 30 within the plane of the carrier.

[0036] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

[0037] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A wafer support table, characterized in that: It includes a stage for carrying a wafer to be processed and a plurality of positioning parts; A plurality of positioning members are arranged in the circumference of the carrier; The side wall of each positioning member is an inclined surface, and the bottom end of the inclined surface close to the carrier is an arc surface. When the carrier carries the wafer to be processed, the arc surfaces of the plurality of positioning members clamp and carry the wafer to be processed.

2. The wafer support table according to claim 1, wherein: Each of the positioning members is arranged on the circumference of the carrier through a support column arranged on the outer circumference side of the carrier.

3. The wafer support table according to claim 2, characterized in that: The positioning member is rotatably connected to the support column, and the positioning member has a first position and a second position; When the positioning member is in the first position, the arc surfaces of the plurality of positioning members clamp and support the wafer to be processed; When the positioning member is at the second position, the arc surfaces of the plurality of positioning members face away from the carrier.

4. The wafer support table according to claim 2, wherein: The support column is movable within the plane of the carrier.

5. The wafer support table according to claim 2, wherein: The height of each support column can be raised or lowered.

6. The wafer support table according to claim 5, characterized in that: The positioning member is detachably connected to the supporting column.

7. The wafer support table according to claim 1, wherein: The plurality of positioning members are evenly arranged along the circumference of the carrier.

8. The wafer support table according to claim 1, wherein: The difference between the radius of the annular clamping unit formed by the arc surfaces of the plurality of positioning members and the radius of the wafer to be processed is less than or equal to +1 mm.

9. The wafer support table according to claim 1, wherein: The cross section of the inclined surface is in an arc shape or a straight line shape.

10. The wafer support table according to claim 1, wherein: The angle between the inclined surface and the plane of the carrier is between 20° and 60°.

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