160results about How to "Effective thickness control" patented technology

The invention discloses a freeze construction method for wellbore type underground parking garage. A circular wellbore is built underground by sequentially using freeze construction, excavation construction, grouting and thaw grouting, and an elevator type and intelligent tower type stereo garage system currently applied at home and abroad is installed in the wellbore for operation. Before construction of the wellbore, an artificial freezing method is applied, water-bearing strata around the wellbore is frozen, a frozen wall having temporary load bearing and water isolating functions and meeting construction safety requirements is formed, and wellbore excavation is performed under protection of the frozen wall; the frozen wall is formed by mutual matching mutual complementing of inner ringfreezing holes and outer ring freezing holes; a cap beam is firstly constructed at the top of the wellbore; excavation construction of the outer wall of the wellbore, concrete pouring on the bottom plate of the wellbore and construction of the inner wall of the wellbore are performed in sequence; after freezing of the wellbore, lining is performed, and grouting and strata thaw are performed for grouting compensation.

The invention discloses a manufacturing method of a high-density interconnected printed circuit board, which mainly comprises the following steps that: the high-density interconnected printed circuit board is divided into a core layered structure, an outer layered structure and a plurality of middle layered structures which are respectively manufactured and finally pressed in; and the method for manufacturing the core layered structure, the outer layered structure and each middle layered structure is to press protective films onto copper foil base plates with made lines, drill through holes, fully fill conductive paste into the through holes and remove the protective films, so that the conductive paste is protruded out of the surfaces of the copper foil base plates. According to the method, the processing procedures are simple, the repeat of electroplating and hot pressing is reduced, the energy is saved, the environment is protected, and the production efficiency and the yield are high.

The invention discloses a connecting method for sintering/welding titanium-steel dissimilar metal. The differences of physical properties of the titanium and the steel which are dissimilar metal are large, and the titanium and the steel are hard to connect through conventional methods. According to the connecting method, firstly, the titanium or titanium alloy, V-Cu gradient alloy powder C1, C2 and C3 and stainless steel are placed in a die one by one to be pressed in advance, and secondly, the die is placed in a sintering device to be sintered in a spark plasma mode, wherein the V-Cu gradient alloy powder C1, C2 and C3 are composed of mixed powder which is formed by mixing a plurality of kinds of metal powder according to different proportions, and the expansion factor gradient of the V-Cu gradient alloy powder C1, the expansion factor gradient of the V-Cu gradient alloy powder C2 and the expansion factor gradient of the V-Cu gradient alloy powder C3 are matched with one another. The titanium or the titanium alloy and the stainless steel are directly connected and formed at a time in a sintering mode, the method of spark plasma sintering is particularly suitable for sintering molding of V-Cu gradient connectors of the titanium and the stainless steel, and a titanium-steel dissimilar metal sintering/welding connector can have a high mechanical property.

The invention particularly relates to a preparation method of an active graphene/active carbon composite electrode plate, and belongs to the technical field of new energy storage devices. The preparation method comprises the following steps: mixing reduced graphene oxide with a pore-forming agent evenly at the mass ratio of 1 to (5-10); carrying out equivalent-volume impregnation in water for 8-24 hours, carrying out activating treatment at 600-1,000 DEG C in an inert atmosphere for 0.5-4 hours after drying, and cleaning and drying the product to obtain active graphene after activating; carrying out modified treatment on the active graphene; mixing the modified active graphene with the active carbon at the mass ratio of (10%-90%) to (10%-90%), mixing an active graphene/active carbon mixture, a conductive agent and an adhesive at the mass ratio of (75%-93%) to (2%-10%) to (5%-15%) and then laminating the mixture to form a carbon film; and pasting the carbon film and a current collector through a conductive adhesive, and carrying out heating and solidifying to obtain the active graphene/active carbon composite electrode plate. According to the preparation method of the active graphene/active carbon composite electrode plate, the thickness and the density of the final electrode plate are controllable; continuous mass preparation can be carried out; the capacity can also be improved when the prepared electrode plate is applied to a super capacitor; the internal resistance is reduced; the power density is improved; and the voltage endurance capability of the super capacity is improved.

The invention discloses a fabrication method of a dual-polarity solid-state lithium secondary battery, and belongs to the technical field of a chemical power supply. The used bipolarity current collector is a bipolarity aluminum-plated copper current collector obtained by a physical or chemical deposition method, the thickness and the weight of the bipolarity current collector are controllable; and the used solid-state electrolyte is a high-ion conductivity solid-state electrolyte, and room-temperature or low-temperature working can be achieved. A solid-state electrolyte system is used in thebipolarity structure battery, the problem of internal short circuit brought by a liquid-state electrolyte is effectively prevented, the bipolarity solid-state lithium secondary battery fabricated according to the method proposed by the invention has the remarkably advantages of voltage controllability and high safety, and large-scale production is easy.

The invention discloses an ultraviolet light polymerization super-hydrophobic transparent wear-resistant coating and a preparation method thereof, and belongs to the technical field of the photocureable coating. The preparation method comprises the following steps: activating and pre-processing a transparent base material, and preparing dispersion liquid containing active nano-particles; and adding active fluorine monomers, an active diluent and a light initiator to the dispersion liquid containing the active nano-particles, and uniformly coating on the transparent base material activated and pre-processed in the first step, to obtain the super-hydrophobic transparent wear-resistant coating by the solidification of ultraviolet light energy action. The preparation method has the characteristics of efficiency, extensive adaptability, economies, energy-saving and environment-friendliness. The prepared ultraviolet light polymerization super-hydrophobic transparent wear-resistant coating has the characteristics of surface self-cleaning, surface corrosion prevention, dewatering, antifogging, freeze resistance, and good adhesive force to the base material.

The invention discloses a preparation method of hollow oxide microspheres. The preparation method includes the following steps that 1, carbon spheres serve as templates, the surfaces of the carbon spheres adsorb water, then, the carbon spheres are dispersed in solvent with the coordination effect with metal alkoxide, and carbon sphere template suspension is obtained; 2, metal alkoxide is added into the carbon sphere template suspension, the solvent with the coordination effect with metal alkoxide is added to enable the concentration of metal alkoxide to be 0.05-0.5 mol/L, and stirring reaction is conducted; 3, after a solution obtained in the step 2 is subjected to high-temperature and high-pressure reaction, and through washing and separation, C/oxide microspheres with core-shell structures are obtained; 4, after the C/oxide microspheres obtained in the step 3 are dried and subjected to heat treatment, the hollow oxide microspheres are obtained. According to the preparation method of the hollow oxide microspheres, the solvent with the coordination effect is adopted, the water is limited to the surfaces of the carbon spheres, the quantity of homogeneous nucleation can be greatly reduced, the thicknesses of the shell layers of the hollow oxide microspheres are effectively controlled, and the preparation method of the hollow oxide microspheres has good application prospects.

A process for preparing millipore metallic film used for filter, separator, catalyzing, fluid distributor and mass or heat transfer includes such steps as providing a centrifugal drum with a porous substrate fixed on its inner surface, preparing slurry from raw powder, loading the slurry in the centrifugal drum, and high-speed rotating to centrifugally form a gradient millipore film on the inner surface of said porous substrate.

The invention discloses a silicon nanometer wire-conductive polymer PEDOT (polyethylenedioxythiophene) compound as well as a preparation method and an application thereof. The preparation method comprises the following steps: 1) using an HF (Hydrogen Fluoride) solution to treat the surface of a silicon nanometer wire array structure which is acquired by using a metal nanometer particle catalyzing auxiliary etching method, thereby acquiring a treated silicon nanometer wire array structure; and 2) using a cyclic voltammetry to enable a polymer monomer EDOT (ethylenedioxythiophene) to have electrochemical polymerization on the surface of the treated silicon nanometer wire array structure, thereby acquiring a silicon nanometer wire-conductive polymer compound. The preparation method has a mild reaction condition, is easily operated and can be used for efficiently controlling the thickness of functional polymers on the silicon nanometer wire surface, the band structure and the conductivity. The preparation method is an effective method for constructing a compound structure of the silicon nanometer wire-conductive polymer functional compound. The application of the acquired compound structure in the field of photocatalytic hydrogen production is researched and a result shows that the compound structure has high catalytic property.

The invention discloses a self-supported ultra-thin transparent conductive carbon nanotube film and a preparation method and application thereof. The method obtains a carbon nanotube film by transferring a carbon nanotube dispersion liquid to the surface of a selected solution and removing the selected solution; and forms a carbon nanotube hybridized film by transferring the carbon nanotube film to an ink interface to be self assembled. The self-supported ultra-thin transparent conductive carbon nanotube film has good comprehensive properties, such as a thickness of about 20 nm to 100 nm, surface roughness less than 1.5 nm, light transmittance more than 86%, surface resistance of less than 1500ohm/M2. The preparation process is simple, easy to operate, low in environmental requirements, and does not adversely affect the surrounding environment, and meets the large-scale industrial production and mass production needs.

The invention relates to a preparation method of a Sn-base composite solder sheet based on a porous Ni/Cu alloy. The preparation method comprises the steps that first of all, a layer of Cu is preparedon the surface of porous Ni metal, and then high-temperature sintering is carried out, so that mutual diffusion between Ni and Cu is facilitated, and bonding of Ni and Cu is further tight; and then the porous Ni/Cu alloy is immersed into the molten Sn-base solder, and finally is rolled into a foil. In the porous Ni/Cu alloy subjected to high-temperature sintering treatment, the bonding strength of Ni and Cu is higher and the oxidation resistance is better through the mutual diffusion between Ni and Cu, and the relatively high strength, good plasticity, high corrosion resistance and high ductility are shown. Along with change of sintering parameters and electroplating parameters, concentration distribution gradients of Ni and Cu in the porous Ni/Cu alloy are different, reaction between theporous Ni/Cu alloy and the Sn-base solder is rapider in the brazing process, and the soldering reliability is high.

The invention discloses a formula of a resin grinding wheel angle abrasive disc. The resin grinding wheel angle abrasive disc comprises a coarse material layer, another coarse material layer and a fine material layer which are composited in sequence. Raw materials of the coarse material layers include SG adhesive materials, AZ40 fused alumina zirconia, white corundum, liquid phenolic resin, liquid epoxy resin, 325-400-mesh powdery phenolic resin, 400-600-mesh potassium fluoborate, 600-800-mesh electrolytic copper powder and 600-800-mesh talcum powder. Raw materials of the fine material layer include brown fused alumina, white corundum, liquid phenolic resin, liquid epoxy resin, 325-400-mesh powdery phenolic resin, 400-600-mesh potassium fluoborate and 600-800-mesh talcum powder. The made resin grinding wheel angle abrasive disc is good in hand feeling, free of edge breakage, large in grinding removal quantity, high in grinding efficiency and adaptability and capable of meeting the requirements for rapid coping of tracks and weld joints, and machined workpieces are high in surface precision.

The invention discloses an epoxy resin adhesive used for encapsulating smart cards. The epoxy resin adhesive is non-conductive adhesive and conductive adhesive and comprises the following components in percentage by weight: 20-40% of epoxy resin, 5-20% of diluent, 4-8% of amine curing agent, 4-8% of curing accelerator, 0.1-1% of coupling agent, 0.1-1% of surfactant, 1-5% of glass microspheres and 20-40% of fillers. The epoxy resin adhesive is prepared in a special preparation sequence. The surfactant is added to effectively inhibit the resin overflow, improve the routing yield and ensure the reliability of the product at the same time, the glass microspheres are added to effectively control the thickness of the adhesive layer, prevent the adhesive layer from becoming excessive thin or thick after being pasted, ensure the reliability of the encapsulated product, and meanwhile, reduce the height difference of four corners and improve the routing yield and efficiency.

The invention discloses a preparation method of a nanometer flake cerium-doped bismuth molybdate catalyst. A simple one-step hydrothermal method is adopted; the PH of reaction liquor is free from being adjusted; the method is green and is free from acid-base pollution. A nanometer flake cerium-doped bismuth molybdate material can be served as a visible light response photocatalyst and has a uniform flake appearance with the average thickness being 20-30nm; a relatively thin flake structure and cerium ions are introduced, so that the absorption for photons is promoted, the high-efficient separation for a photon-generated carrier is realized and the ultrahigh photocatalytic performance is shown under the irradiation of visible light; the catalyst has relatively high catalytic activity at the aspects of degradation of dye wastewater and killing of water bacteria; the application prospect is wide.

The invention relates to a low-resistance-drop filtering material and a preparation method thereof, and belongs to the technical field of high temperature flue gas, porous materials and high-flux filtering materials. The material is formed by compounding a metal fibrofelt base material and a metal powder film layer attached to the surface of the metal fibrofelt base material; and the metal powderfilm layer comprises the following raw materials: a Fe-Al series intermetallic compound and/or a NiCrAlFe intermetallic compound. The preparation method of the material comprises the following steps:firstly, mixing the intermetallic compound powder with a glue solution, and fully stirring to obtain metal powder suspension liquid; secondly, spraying the surface with high filtering precision of themetal fibrofelt base material with the metal powder suspension liquid to obtain a sprayed material; and finally, drying the sprayed material and then carrying out sintering treatment to obtain the low-resistance-drop filtering material finally. By the material, the problems that flux is low, resistance drop is high, high temperature resistance and sulfur attack resistance are poor, and the structural mode is single are solved, the thickness of a spraying layer and the filtering precision are controllable, and the cost is low.

The invention discloses an LED integrated light source board with low cost, simple structure and process, high production efficiency and high color temperature precision and a manufacturing method thereof. The light source board comprises a heat-conducting insulation substrate (1) and an LED light source unit (30), wherein, the LED light source unit (30) comprises a plurality of LED modules (31) formed by integrating a plurality of LED chips (3) or composed of the separate LED chip (3); a circuit connecting wire (21) and a radiating foil (22) which are composed of metal layers are laid on the surface of the heat-conducting insulation substrate (1); the LED modules (31) are electrically connected with the circuit connecting wire (21); the LED chips (3) are connected with a radiating foil (22) for conducting heat; and a white colloid coffer (4) the height of which is 0.3-1.5mm is coated around the LED modules (31), and silica gel or resin (6) is filled in the colloid coffer (4) to cover the LED chips (3). The manufacturing method comprises the following steps: die-bonding, forming the colloid coffer, filling the silica gel or the resin (6), and curing. The invention can be applied to the LED integrated light source field.

The invention relates to a method for chemically plating Ni-Mo-P on silicon dioxide (SiO2), which belongs to the electroless plating application field. The method comprises: firstly, carrying out former treatment such as cleaning, coupling, activating and the like for a substrate (SiO2Si), then, arranging the substrate into chemical plating liquid which is heated in water bath, happening redox reaction in the chemical plating liquid, and rapidly depositing on the surface of the silicon dioxide (SiO2) to obtain Ni-Mo-P film. The Ni-Mo-P film which is prepared by the technique has bright, compact, and flat surface, strong binding force with the substrate and excellent barrier property. The method is convenient for preparing solution, production procedure is easy, and the cost is low, which is one of the best choices for integrating electric circuit copper interconnected wire barrier layers in the future.

The biofluidized composite reactor adopts honeycomb section structure, the internal cylinder of said reactor is positioned in the centre of interior of external cylinder of said reactor, in the annular space between external cylinder and internal cylinder of the reactor even number of partion boards can be added, and the separated adjacent annular space zones are successively used as flow-lifting zone and flow-falling zone, said flow-lifting zone and flow-falling zone are limited by said honeycomb section structure, and the section area of single flow-lifting zone is reduced, so that it can better uniformly fluidize, reduce energy consumption and raise oxygen-transferring efficiency.

The invention provides a preparation method of flake silver powder. The method comprises the steps that water, silver salt, a complexing agent, a silver-plated brightener, a dispersing agent, sublimated flake compound crystals and a reducing agent are adopted as raw materials, a chemical plating method is adopted, silver is plated on the surface of the sublimated flake compound crystal until silver ions react completely, and after the reaction is finished, the flake silver powder is directly obtained through separation and purification and processing treatment processes without ball milling. The preparation method has a series of advantages of being low in energy consumption, small in environmental pollution, simple in production process, short in process route, low in the large-scale production equipment investment, high in production efficiency, lower in production cost, good in product dispersion performance, good in product conductivity and the like, the method is suitable for large-scale production, the problems existing in the process of preparing the sheet-like silver powder by a ball milling method are solved, and the method has the good industrialization prospects.

The invention provides a diffusion bonding method for tungsten and copper dissimilar metal. The diffusion bonding method includes steps of (1), electrochemically polishing copper sheets and copper foils; (2), encapsulating the surface of one side of each electromechanically polished copper foil, then electroplating the copper foils in electroplate liquid and acquiring an amorphous Fe-W coating on the surface of the other side of each copper foil; (3), sequentially overlapping each copper sheet, the corresponding copper foil and a tungsten sheet from bottom to top to obtain a combination, and performing vacuum hot-pressed sintering on the combinations so as to implement diffusion bonding on the tungsten and copper dissimilar metal. The electroplate liquid comprises sodium tungstate, ferrous sulfate, ammonium tartrate and water. The side surfaces of the amorphous Fe-W coatings of the copper foils are in contact with the tungsten sheets. The diffusion bonding method has the advantages of simplicity in technological operation, low cost, high applicability, good connection performance and tensile strength which is higher than 146MPa.