Manufacturing method of high-density interconnected printed circuit board

Abstract

The invention discloses a manufacturing method of a high-density interconnected printed circuit board, which mainly comprises the following steps that: the high-density interconnected printed circuit board is divided into a core layered structure, an outer layered structure and a plurality of middle layered structures which are respectively manufactured and finally pressed in; and the method for manufacturing the core layered structure, the outer layered structure and each middle layered structure is to press protective films onto copper foil base plates with made lines, drill through holes, fully fill conductive paste into the through holes and remove the protective films, so that the conductive paste is protruded out of the surfaces of the copper foil base plates. According to the method, the processing procedures are simple, the repeat of electroplating and hot pressing is reduced, the energy is saved, the environment is protected, and the production efficiency and the yield are high.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and mainly relates to a method for manufacturing high-density interconnected printed circuit boards. Background technique [0002] The traditional multi-layer board is formed by alternately laminating and hot-pressing multiple substrates and adhesive material layers formed with circuits, and then using the drilling and metallization process in the holes to achieve the connection and conduction function between the circuits of each layer. . Under the premise that electronic products tend to be multi-functional and complex, the contact distance of integrated circuit components will be reduced, and the speed of signal transmission will be relatively increased, followed by an increase in the number of connections and the length of wiring between points. Local shortening, these require the application of high-density circuit configuration and microvia technology to achieve the goal. However, du...

AI Technical Summary

Problems solved by technology

[0004] 1. It needs to be electroplated copper many times, which increases the cost of pollution control and is not environmentally friendly;

[0005] 2. It needs multiple times of hot pressing, which consumes a lot of energy;

[0006] 3. The production process requires multiple cycles, and the man-hours of production management increase, resulting in a decline in competitiveness;

[0007] 4. The above practices also cause problems such as poor efficiency and yield

This approach is more cumbersome

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