Device for cutting polycrystalline silicon wafer through diamond wires and cutting method

Abstract

The invention discloses a device for cutting a polycrystalline silicon wafer through diamond wires and a cutting method. The device for cutting the polycrystalline silicon wafer through the diamond wires comprises a cutting machine. The cutting machine comprises two large guide wheels arranged in a spaced manner, the multiple diamond wires arranged between the two large guide wheels in a surrounding manner, and a cooling liquid nozzle for spraying cooling liquid. The device is characterized in that two small guide wheels with the diameter smaller than the diameter of the large guide wheels arearranged at the positions above the two large guide wheels in parallel, the two small guide wheels are located on the inner side between the two large guide wheels, and the upper surfaces of the twosmall guide wheels are flush; a plurality of wire grooves are formed in the surfaces of the small guide wheels at intervals, the diamond wires are wound around the upper surfaces of the two small guide wheels and are located in the wire grooves in the small guide wheels, the part between the two small guide wheels is a cutting area, and the diamond wires can move in both directions. According to the device, wire and net balance is achieved in the cutting process, wire breakage is not likely to happen in the cutting process, and the silicon wafer yield can be increased.

Description

technical field [0001] The invention relates to a device for cutting polycrystalline silicon slices with a diamond wire, belonging to the technical field of polycrystalline silicon processing. The invention also relates to a method for cutting polycrystalline silicon wafers by using the device for cutting polycrystalline silicon wafers with the diamond wire. Background technique [0002] Polysilicon is widely used in industries such as photovoltaics. According to needs, the polysilicon block needs to be cut into silicon wafers with a specified thickness by a cutting machine. Due to the high hardness of polysilicon, diamond sand wire is used for cutting large-sized polysilicon at present. The diamond sand wire includes a busbar and a diamond electroplating layer, and diamond particles are consolidated on the surface of the busbar and exposed outside the electroplating layer. [0003] In the prior art, polysilicon is usually cut by mortar cutting. The mortar cutting equipme...

AI Technical Summary

Problems solved by technology

During the cutting process, when cutting to the glue surface, chipping and chipping are prone to occur, resulting in unqualified product quality and low yield

[0005] Generally, the larger the diamond particles on the diamond wire busbar, the higher the cutting efficiency, but it will cause too much waste in the cutting process. On the contrary, the smaller the diamond particles, the lower the cutting efficiency, and at the same time, the waste of the silicon carbide body is smaller

In the prior art, the particle size of diamond particles is usually controlled at 15-50 microns, but the loss of single crystal material is still very large

Images