High-insulation heat-conducting adhesive tape

By adopting a multi-layer structure of highly insulating and thermally conductive tape design, the problems of low thermal conductivity and insufficient strength of existing tapes are solved, achieving more efficient heat conduction and a stronger tape structure, extending the service life of components.

CN222389768UActive Publication Date: 2025-01-24DONGGUAN HENGMAO ADHESIVE PROD CO LTD
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Patent Information

Application Number
CN202323227945.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-11-29
Publication Date
2025-01-24
Estimated Expiration
2033-11-29

AI Technical Summary

Technical Problem

The existing tape has low thermal conductivity, resulting in high surface temperature of components and inability to conduct heat effectively, reducing the service life and stability of components. At the same time, the tape is prone to breakage during use and has low strength.

Method used

The high -insulation tape design with a multi -layer structure includes the thermal conductivity, reinforcement layer, adhesive rubber layer, high temperature resistance and adhesive layer. The heat conduction heat is transmitted to increase the contact area and intensity of the through -hole reinforcement layer. Cool conduction coverage.

Benefits of technology

It improves the thermal conductivity and intensity of the tape, avoids interruption of tape, enhances the efficiency of heat conduction, and extends the service life of the component.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a high-insulation heat-conducting adhesive tape, which belongs to the technical field of adhesive tapes and comprises a heat-conducting layer, adhesive layers are adhered to one side surface and the other side surface of the heat-conducting layer, reinforcing layers are adhered to one side surface and the other side surface of the heat-conducting layer through the adhesive layers, and a high-temperature-resistant layer is arranged on the surface of the reinforcing layer adhered to one side surface of the heat-conducting layer. According to the high-insulation heat-conducting adhesive tape provided by the utility model, the heat-conducting layer is exposed out of the through holes of the reinforcing layer, so that the contact area of the heat-conducting layer is increased, and the heat-conducting layer can absorb heat and conduct the heat conveniently; the overall toughness and strength of the adhesive tape are improved through the reinforcing layer, the adhesive tape is prevented from being broken in the using process, the overall strength of the adhesive tape is improved, the high-temperature-resistant layer is protected through the polyurethane scratch-resistant film, meanwhile, the adhesive tape body is subjected to insulation treatment, and the strength of the adhesive tape body is improved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of adhesive tapes, and in particular relates to a high-insulation thermally conductive adhesive tape. Background Art

[0002] During the use of tapes, most tapes have low thermal conductivity, which leads to high surface temperature of components and inability to conduct heat, reducing the service life and stability of components. Among them, the "a kind of high thermal conductivity insulating adhesive" disclosed in the application number "CN202110228254.9" is also an increasingly mature technology. By coating and modifying the metal powder with polydopamine, the compatibility of the modified metal powder with the adhesive matrix is ​​increased, and the metal powder can be evenly dispersed in the adhesive, which is conducive to the formation of a thermal conductive network chain in the adhesive, so that it can still have a high thermal conductivity coefficient while reducing the amount of metal powder filling. However, the device still has the following defects: in actual use, although the above-mentioned thermally conductive insulating tape can improve the thermal conductivity of the tape and reduce the surface temperature of the components through metal raw materials, it is easy to cause damage to the tape during use, affecting the usability of the tape. At the same time, the thermal conductivity of the tape is not high. During use, the tape is easily broken due to pulling, and the strength is not high. Utility Model Content

[0003] The utility model aims to provide a high-insulation thermally conductive tape, aiming to solve the problems in the prior art that the tape is easily damaged during use, affecting the usability of the tape, and at the same time the thermal conductivity of the tape is not high, the tape is easily broken due to pulling during use, and the strength is not high.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-insulation thermally conductive tape, comprising a thermally conductive layer, one surface of the thermally conductive layer and the other surface of the thermally conductive layer are both bonded with an adhesive layer, one surface of the thermally conductive layer and the other surface of the thermally conductive layer are bonded with a reinforcement layer through the adhesive layer, the surface of the reinforcement layer bonded to the one surface of the thermally conductive layer is provided with a high-temperature resistant layer, the surface of the reinforcement layer bonded to the other surface of the thermally conductive layer is provided with an adhesive layer, and the surface of the adhesive layer is bonded with release paper.

[0005] In an implementation scheme of the high-insulation thermally conductive adhesive tape of the utility model, the thermally conductive layer is thermally conductive silica gel, the reinforcement layer is provided with a plurality of through holes, and the thermally conductive layer is filled in the through holes.

[0006] In this solution, heat is conducted through the heat-conducting layer, and the contact surface of the heat-conducting layer is increased through the through holes, thereby improving the heat conduction effect of the heat-conducting layer.

[0007] In an implementation scheme of the high-insulation thermally conductive adhesive tape of the utility model, the reinforcement layer is one of polytetrafluoroethylene and saturated polyester.

[0008] In this solution, the reinforcement layer is used to improve the tensile strength and toughness of the tape body, thereby preventing the tape from breaking during use.

[0009] In an implementation scheme of the high-insulation thermal conductive adhesive tape of the utility model, the adhesive layer is one of temperature-resistant epoxy adhesive, phenolic resin adhesive and urea-formaldehyde resin adhesive.

[0010] In this solution, the heat conducting layer and the reinforcement layer are bonded together by an adhesive layer, thereby improving the tightness between the heat conducting layer and the reinforcement layer and strengthening the connection structure between the heat conducting layer and the reinforcement layer.

[0011] In an implementation scheme of the high-insulation thermally conductive adhesive tape of the utility model, a polyurethane anti-scratch film is bonded to the surface of the high-temperature resistant layer.

[0012] In this solution, the high temperature resistant layer is protected by a polyurethane anti-scratch film, and the tape body is insulated to improve the surface strength of the tape body.

[0013] In an implementation scheme of the high-insulation thermally conductive adhesive tape of the utility model, the high-temperature resistant layer is a graphene coating.

[0014] In this solution, the high temperature resistant layer is in contact with the heat conductive layer, and heat is conducted through the high temperature resistant layer, thereby increasing the coverage area of ​​heat conduction through the high temperature resistant layer.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1) The heat-conducting layer leaks out through the through-holes in the reinforcement layer, thereby increasing the contact area of ​​the heat-conducting layer, making it easier for the heat-conducting layer to absorb and conduct heat. The reinforcement layer improves the overall toughness and strength of the tape, thereby preventing the tape from breaking during use and improving the overall strength of the tape.

[0017] 2) The high temperature resistant layer is protected by a polyurethane anti-scratch film, and the tape body is insulated to improve the strength of the tape body. The thermal conductive layer is in contact with the high temperature resistant layer, and the heat absorbed by the bottom of the thermal conductive layer is conducted to the high temperature resistant layer. After the high temperature resistant layer absorbs the heat, the heat conduction coverage is expanded to improve the heat conduction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 It is a schematic diagram of the structure of the utility model;

[0020] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the heat-conducting layer structure of the utility model.

[0022] In the figure: 10, heat conducting layer; 20, adhesive layer; 30, reinforcement layer; 301, through hole; 40, high temperature resistant layer; 50, adhesive layer; 60, release paper; 70, polyurethane anti-scratch film. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-3 The utility model provides the following technical solutions: a high-insulation thermally conductive tape, comprising a thermally conductive layer 10, an adhesive layer 20 is bonded to one side surface and the other side surface of the thermally conductive layer 10, a reinforcement layer 30 is bonded to one side surface and the other side surface of the thermally conductive layer 10 through the adhesive layer 20, a high-temperature resistant layer 40 is provided on the surface of the reinforcement layer 30 bonded to one side surface of the thermally conductive layer 10, an adhesive layer 50 is provided on the surface of the reinforcement layer 30 bonded to the other side surface of the thermally conductive layer 10, and a release paper 60 is bonded to the surface of the adhesive layer 50.

[0025] For a specific embodiment of a high insulation thermal conductive tape, please refer to Figure 3 : The heat-conducting layer 10 is heat-conducting silica gel, the reinforcement layer 30 is provided with a plurality of through holes 301 , and the heat-conducting layer 10 is filled in the through holes 301 .

[0026] See also Figure 3 : The heat conducting layer 10 leaks out through the through hole 301 of the reinforcement layer 30, thereby increasing the contact area of ​​the heat conducting layer 10 and facilitating the heat conducting layer 10 to absorb and conduct heat.

[0027] For a specific embodiment of a high insulation thermal conductive tape, please refer to Figure 2 : The reinforcement layer 30 is made of polytetrafluoroethylene or saturated polyester.

[0028] See also Figure 2 : The reinforcement layer 30 improves the overall toughness and strength of the tape, thereby preventing the tape from breaking during use.

[0029] For a specific embodiment of a high insulation thermal conductive tape, please refer to Figure 1 Figure 2 : The adhesive layer 20 is one of heat-resistant epoxy glue, phenolic resin glue and urea-formaldehyde resin glue.

[0030] See also Figure 1 Figure 2 : The heat-conducting layer 10 and the reinforcement layer 30 are connected by the adhesive layer 20 to improve the tightness between the reinforcement layer 30 and the heat-conducting layer 10.

[0031] For a specific embodiment of a high insulation thermal conductive tape, please refer to Figure 1 : A polyurethane anti-scratch film 70 is bonded to the surface of the high temperature resistant layer 40 .

[0032] See also Figure 1 : The high temperature resistant layer 40 is protected by the polyurethane anti-scratch film 70, and the tape body is insulated to improve the strength of the tape body.

[0033] For a specific embodiment of a high insulation thermal conductive tape, please refer to Figure 1 : The high temperature resistant layer 40 is graphene coating.

[0034] See also Figure 1 : The heat-conducting layer 10 contacts the high-temperature resistant layer 40, conducts the heat of the covered surface through the heat-conducting layer 10, and conducts the heat to the high-temperature resistant layer 40, and conducts the heat through the high-temperature resistant layer 40 to increase the heat conduction area.

[0035] The utility model provides a high-insulation thermally conductive tape, which is specifically used in the following manner: the thermally conductive layer 10 leaks out through the through hole 301 of the reinforcement layer 30 to increase the contact area of ​​the thermally conductive layer 10, so that the thermally conductive layer 10 can absorb and conduct heat easily; the thermally conductive layer 10 is connected to the reinforcement layer 30 through the adhesive layer 20 to improve the tightness between the reinforcement layer 30 and the thermally conductive layer 10; the overall toughness and strength of the tape are improved through the reinforcement layer 30 to avoid the tape from breaking during use; the high-temperature resistant layer 40 is protected by the polyurethane anti-scratch film 70; at the same time, the tape body is insulated to improve the strength of the tape body; the thermally conductive layer 10 contacts the high-temperature resistant layer 40; the heat absorbed by the bottom of the thermally conductive layer 10 is conducted to the high-temperature resistant layer 40; after the high-temperature resistant layer 40 absorbs the heat, the heat conduction coverage is expanded to improve the heat conduction efficiency.

[0036] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A high insulation thermal conductive tape, characterized in that: The invention comprises a heat-conducting layer (10), wherein an adhesive layer (20) is bonded to one side surface and the other side surface of the heat-conducting layer (10), a reinforcement layer (30) is bonded to one side surface and the other side surface of the heat-conducting layer (10) via the adhesive layer (20), a high-temperature-resistant layer (40) is provided on the surface of the reinforcement layer (30) bonded to one side surface of the heat-conducting layer (10), and an adhesive layer (50) is provided on the surface of the reinforcement layer (30) bonded to the other side surface of the heat-conducting layer (10), and a release paper (60) is bonded to the surface of the adhesive layer (50).

2. A high insulation thermal conductive tape according to claim 1, characterized in that: The heat-conducting layer (10) is heat-conducting silica gel, the reinforcement layer (30) is provided with a plurality of through holes (301), and the heat-conducting layer (10) is filled in the through holes (301).

3. A high insulation thermal conductive tape according to claim 1, characterized in that: The reinforcement layer (30) is one of polytetrafluoroethylene and saturated polyester.

4. A high insulation thermal conductive tape according to claim 3, characterized in that: The adhesive layer (20) is one of heat-resistant epoxy glue, phenolic resin glue and urea-formaldehyde resin glue.

5. The high insulation thermal conductive tape according to claim 1, characterized in that: A polyurethane anti-scratch film (70) is bonded to the surface of the high temperature resistant layer (40).

6. The high insulation thermal conductive tape according to claim 1, characterized in that: The high temperature resistant layer (40) is graphene coating.

Citation Information

Patent Citations

  • High-thermal-conductivity insulating tape

    CN113136146A