High-heat-conductivity LTCC (Low Temperature Co-Fired Ceramic) substrate

Abstract

The utility model relates to a high thermal conductivity LTCC ceramic substrate comprising a mounting plate, the right side of the mounting plate is fixedly provided with a ceramic plate body, the right side of the mounting plate is provided with a mounting mechanism, one end of the mounting mechanism penetrates through and extends to the right side of the ceramic plate body, the front surface and the back surface of the mounting plate are respectively provided with a fixing mechanism, and one end of the fixing mechanism is fixedly connected with the ceramic plate body. And a cooling mechanism in contact with the ceramic plate body is arranged on the right side of the mounting plate. According to the high-heat-conductivity LTCC substrate, through the arranged fixing mechanism, when the high-heat-conductivity LTCC substrate is used, a fixing head penetrates through a ceramic plate body, a gasket makes contact with the ceramic plate body, a telescopic spring is compressed, the fixing head is screwed to be perpendicular to a rectangular hole, the ceramic plate body is fixed, and then installation of the ceramic plate body can be completed; the fixing head is screwed to be parallel to the rectangular hole, the telescopic spring resets to drive the ceramic plate body to be separated from the fixing head, the ceramic plate body is moved rightwards to be separated from the stand column, then the ceramic plate body can be disassembled, and therefore the aim of facilitating disassembly and assembly is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of LTCC ceramic substrates, in particular to a high thermal conductivity LTCC ceramic substrate. Background Art

[0002] LTCC ceramic substrate is made of low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density. The required circuit graphics are made on the green ceramic tape using processes such as laser drilling, micropore grouting, and precision conductor slurry printing. Multiple passive components (such as low-capacitance capacitors, resistors, filters, impedance converters, couplers, etc.) are buried in the multilayer ceramic substrate and then stacked together. The internal and external electrodes can be made of metals such as silver, copper, and gold, respectively, and sintered at 900°C to form high-density circuits that do not interfere with each other in three-dimensional space. It can also be made into a three-dimensional circuit substrate with built-in passive components.

[0003] The existing LTCC ceramic substrate is basically installed on the equipment by means of screws or welding. The LTCC ceramic substrate needs to be disassembled and assembled with the aid of tools, which is time-consuming and labor-intensive, and reduces the efficiency of disassembly and assembly of the LTCC ceramic substrate. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a high thermal conductivity LTCC ceramic substrate, which has the advantages of easy disassembly and assembly, and solves the problem that the LTCC ceramic substrate needs to be disassembled and assembled with the aid of tools, which is time-consuming and labor-intensive.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high thermal conductivity LTCC ceramic substrate, comprising a mounting plate, a ceramic plate body is fixedly mounted on the right side of the mounting plate, a mounting mechanism having one end penetrating and extending to the right side of the ceramic plate body is arranged on the right side of the mounting plate, a fixing mechanism having one end fixedly connected to the ceramic plate body is arranged on the front and back sides of the mounting plate, a cooling mechanism in contact with the ceramic plate body is arranged on the right side of the mounting plate, and a controller is fixedly mounted on the bottom of the cooling mechanism;

[0006] The mounting mechanism includes a column, a fixed head, a telescopic spring and a gasket. Four columns are fixedly mounted on the right side of the mounting plate, one end of which passes through and extends to the right side of the ceramic plate body. A fixed head is movably mounted on the right side of the column. A telescopic spring is sleeved on the outside of the column and located on the left side of the ceramic plate body. A gasket is sleeved on the outside of the column and located on the right side of the telescopic spring.

[0007] Furthermore, four rectangular holes are opened on the right side of the ceramic plate body, the rectangular holes match the fixing head, and the four rectangular holes are evenly distributed at the four corners of the ceramic plate body.

[0008] Furthermore, the fixed head is movably connected to the column via a bearing, and the gasket is a rubber gasket.

[0009] Furthermore, the fixing mechanism includes a fixing block, a connecting rod and a hook. Two fixing blocks are fixedly installed on the front and back sides of the ceramic plate body. Two connecting rods with one end extending to the right side of the mounting plate are movably installed on the front and back sides of the mounting plate. A hook movably connected to the fixing block is fixedly installed on the right side of the connecting rod.

[0010] Furthermore, the connection between the connecting rod and the mounting plate is hinged, and the connecting rod is a stainless steel rod.

[0011] Furthermore, the cooling mechanism includes a warehouse body, heat dissipation fins, a semiconductor refrigeration sheet and a temperature sensor. The warehouse body is fixedly installed on the right side of the mounting plate and between the columns. A heat dissipation fin with one end penetrating through and extending into the interior of the warehouse body is fixedly installed on the right side of the warehouse body. A semiconductor refrigeration sheet is fixedly installed on the left side of the inner wall of the warehouse body. A temperature sensor is fixedly installed on the left side of the inner wall of the warehouse body and above the semiconductor refrigeration sheet.

[0012] Furthermore, the top of the warehouse body is connected to a water supply pipe, the controller is electrically connected to the semiconductor refrigeration sheet, and the temperature sensor is signal-connected to the controller.

[0013] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0014] 1. The high thermal conductivity LTCC ceramic substrate has a fixing mechanism. When in use, the fixing head is passed through the ceramic plate body, the gasket is in contact with the ceramic plate body, the telescopic spring is compressed, the fixing head is twisted to make the fixing head perpendicular to the rectangular hole, and the ceramic plate body is fixed to complete the installation of the ceramic plate body; the fixing head is twisted to make the fixing head parallel to the rectangular hole, the telescopic spring is reset to bring the ceramic plate body away from the fixing head, and the ceramic plate body is moved to the right to be away from the column, and the ceramic plate body can be disassembled, thus achieving the purpose of easy disassembly and assembly.

[0015] 2. The high thermal conductivity LTCC ceramic substrate, through the cooling mechanism, when in use, the heat dissipation fins can introduce the heat generated by the ceramic plate body during operation into the interior of the warehouse body, so as to perform heat dissipation and cooling operations on the ceramic plate body. The temperature threshold is set by the controller, and the temperature sensor can upload the temperature value of the cooling water inside the warehouse body to the controller. When the uploaded temperature value is too high, the controller turns on the semiconductor refrigeration sheet to cool the water inside the warehouse body to maintain the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2For this utility model Figure 1 Enlarged view of point A in the middle;

[0018] Figure 3 It is the right side view of the ceramic plate body of the utility model.

[0019] In the figure: 1 mounting plate, 2 ceramic plate, 21 rectangular hole, 3 mounting mechanism, 31 column, 32 fixed head, 33 telescopic spring, 34 gasket, 4 fixing mechanism, 41 fixing block, 42 ​​connecting rod, 43 hook, 5 cooling mechanism, 51 warehouse, 52 heat dissipation fins, 53 semiconductor refrigeration sheet, 54 temperature sensor, 6 controller. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3 In this embodiment, a high thermal conductivity LTCC ceramic substrate comprises a mounting plate 1, a ceramic plate body 2 is fixedly mounted on the right side of the mounting plate 1, a mounting mechanism 3 having one end penetrating and extending to the right side of the ceramic plate body 2 is arranged on the right side of the mounting plate 1, a fixing mechanism 4 having one end fixedly connected to the ceramic plate body 2 is arranged on the front and back sides of the mounting plate 1, a cooling mechanism 5 in contact with the ceramic plate body 2 is arranged on the right side of the mounting plate 1, and a controller 6 is fixedly mounted on the bottom of the cooling mechanism 5;

[0022] The mounting mechanism 3 comprises a column 31, a fixed head 32, a telescopic spring 33 and a gasket 34. Four columns 31 are fixedly mounted on the right side of the mounting plate 1, one end of which passes through and extends to the right side of the ceramic plate body 2. A fixed head 32 is movably mounted on the right side of the column 31. A telescopic spring 33 is sleeved on the outside of the column 31 and located on the left side of the ceramic plate body 2. A gasket 34 is sleeved on the outside of the column 31 and located on the right side of the telescopic spring 33. When installing the ceramic plate body 2, the fixed head 32 is passed through the ceramic plate body 2 to make the gasket 34 contact with the ceramic plate body 2, compress the telescopic spring 33, and twist the fixed head 32 to fix the ceramic plate body 2, so that the installation of the ceramic plate body 2 is completed. By twisting the fixed head 32, the telescopic spring 33 is reset and the ceramic plate body 2 is separated from the fixed head 32. The ceramic plate body 2 is moved to the right to separate from the column 31, and the disassembly of the ceramic plate body 2 is completed.

[0023] In this embodiment, four rectangular holes 21 are opened on the right side of the ceramic plate 2. The rectangular holes 21 match the fixing heads 32. The four rectangular holes 21 are evenly distributed at the four corners of the ceramic plate 2. The setting of the rectangular holes 21 facilitates the fixing and detachment of the fixing heads 32.

[0024] In this embodiment, the fixed head 32 is movably connected to the column 31 through a bearing, and the gasket 34 is a rubber gasket.

[0025] In this embodiment, the fixing mechanism 4 includes a fixing block 41, a connecting rod 42 and a hook 43. Two fixing blocks 41 are fixedly installed on the front and back of the ceramic plate body 2, and two connecting rods 42 with one end extending to the right side of the mounting plate 1 are movably installed on the front and back of the mounting plate 1. A hook 43 movably connected to the fixing block 41 is fixedly installed on the right side of the connecting rod 42. After the ceramic plate body 2 is installed on the mounting plate 1, the connecting rod 42 can be flipped to the right so that the hook 43 can clamp the fixing block 41, so that the ceramic plate body 2 can be fixed more firmly.

[0026] In this embodiment, the connection between the connecting rod 42 and the mounting plate 1 is hinged. The connecting rod 42 is a stainless steel rod. The stainless steel material has good corrosion resistance and heat resistance and a long service life.

[0027] In this embodiment, the cooling mechanism 5 includes a warehouse body 51, heat dissipation fins 52, semiconductor cooling sheets 53 and a temperature sensor 54. The warehouse body 51 is fixedly installed on the right side of the mounting plate 1 and between the columns 31. A heat dissipation fin 52 with one end penetrating through and extending into the interior of the warehouse body 51 is fixedly installed on the right side of the warehouse body 51. A semiconductor cooling sheet 53 is fixedly installed on the left side of the inner wall of the warehouse body 51. A temperature sensor 54 is fixedly installed on the left side of the inner wall of the warehouse body 51 and above the semiconductor cooling sheet 53. When in use, the heat dissipation fins 52 can introduce the heat generated by the ceramic plate body 2 during operation into the interior of the warehouse body 51 to perform heat dissipation and cooling operations on the ceramic plate body 2. Turning on the semiconductor cooling sheet 53 can cool the water inside the warehouse body 51 to maintain the cooling effect.

[0028] In this embodiment, a water supply pipe is connected to the top of the warehouse body 51, the controller 6 is electrically connected to the semiconductor refrigeration plate 53, and the temperature sensor 54 is signal-connected to the controller 6. When in use, the temperature sensor 54 can upload the temperature value of the cooling water inside the warehouse body 51 to the controller 6, and the controller 6 controls the start and stop of the semiconductor refrigeration plate 53.

[0029] The working principle of the above embodiment is:

[0030] (1) Pass the fixing head 32 through the ceramic plate body 2, make the gasket 34 contact the ceramic plate body 2, compress the telescopic spring 33, twist the fixing head 32 so that the fixing head 32 is perpendicular to the rectangular hole 21, fix the ceramic plate body 2, and then complete the installation of the ceramic plate body 2;

[0031] (2) The heat dissipation fins 52 can introduce the heat generated by the ceramic plate body 2 during operation into the interior of the bin body 51 to perform heat dissipation and cooling operations on the ceramic plate body 2. The temperature threshold is set by the controller 6, and the temperature sensor 54 can upload the temperature value of the cooling water inside the bin body 51 to the controller 6. When the uploaded temperature value is too high, the controller 6 turns on the semiconductor refrigeration sheet 53 to cool the water inside the bin body 51 to maintain the cooling effect;

[0032] (3) Twist the fixing head 32 to make it parallel to the rectangular hole 21, and the telescopic spring 33 is reset to bring the ceramic plate body 2 out of the fixing head 32, and move the ceramic plate body 2 to the right to make it out of the column 31, and the removal of the ceramic plate body 2 is completed.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high thermal conductivity LTCC ceramic substrate, comprising a mounting plate (1), characterized in that: A ceramic plate body (2) is fixedly mounted on the right side of the mounting plate (1); a mounting mechanism (3) having one end penetrating through and extending to the right side of the ceramic plate body (2) is provided on the right side of the mounting plate (1); a fixing mechanism (4) having one end fixedly connected to the ceramic plate body (2) is provided on the front and back sides of the mounting plate (1); a cooling mechanism (5) in contact with the ceramic plate body (2) is provided on the right side of the mounting plate (1); a controller (6) is fixedly mounted on the bottom of the cooling mechanism (5); The mounting mechanism (3) comprises a column (31), a fixed head (32), a telescopic spring (33) and a gasket (34); four columns (31) are fixedly mounted on the right side of the mounting plate (1), one end of which penetrates through and extends to the right side of the ceramic plate body (2); the fixed head (32) is movably mounted on the right side of the column (31); the telescopic spring (33) is sleeved on the outside of the column (31) and located on the left side of the ceramic plate body (2); and the gasket (34) is sleeved on the outside of the column (31) and located on the right side of the telescopic spring (33).

2. The high thermal conductivity LTCC ceramic substrate according to claim 1, characterized in that: Four rectangular holes (21) are opened on the right side of the ceramic plate body (2), the rectangular holes (21) match the fixing head (32), and the four rectangular holes (21) are evenly distributed at the four corners of the ceramic plate body (2).

3. The high thermal conductivity LTCC ceramic substrate according to claim 1, characterized in that: The fixed head (32) is movably connected to the column (31) via a bearing, and the gasket (34) is a rubber gasket.

4. The high thermal conductivity LTCC ceramic substrate according to claim 1, characterized in that: The fixing mechanism (4) comprises a fixing block (41), a connecting rod (42) and a hook (43); two fixing blocks (41) are fixedly mounted on the front and back sides of the ceramic plate body (2); two connecting rods (42) are movably mounted on the front and back sides of the mounting plate (1) and one end of the connecting rods (42) extends to the right side of the mounting plate (1); and a hook (43) movably connected to the fixing block (41) is fixedly mounted on the right side of the connecting rods (42).

5. The high thermal conductivity LTCC ceramic substrate according to claim 4, characterized in that: The connection mode between the connecting rod (42) and the mounting plate (1) is hinged, and the connecting rod (42) is a stainless steel rod.

6. The high thermal conductivity LTCC ceramic substrate according to claim 1, characterized in that: The cooling mechanism (5) comprises a bin body (51), a heat dissipation fin (52), a semiconductor cooling sheet (53) and a temperature sensor (54); the bin body (51) is fixedly mounted on the right side of the mounting plate (1) and located between the columns (31); a heat dissipation fin (52) having one end penetrating through and extending into the interior of the bin body (51) is fixedly mounted on the right side of the bin body (51); a semiconductor cooling sheet (53) is fixedly mounted on the left side of the inner wall of the bin body (51); and a temperature sensor (54) is fixedly mounted on the left side of the inner wall of the bin body (51) and located above the semiconductor cooling sheet (53).

7. The high thermal conductivity LTCC ceramic substrate according to claim 6, characterized in that: The top of the warehouse body (51) is connected to a water supply pipe, the controller (6) is electrically connected to the semiconductor refrigeration plate (53), and the temperature sensor (54) is signal-connected to the controller (6).

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