COB with heat conduction function
By setting the thermal zone and thermal gap on the back of the COB substrate, and using thermal grease and steel mesh technology to form a discontinuous thermal conductive layer, the problem of low heat dissipation efficiency of existing COB light sources is solved, and better heat dissipation effect is achieved and Coat evenly.
Patent Information
- Application Number
- CN202421176563.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-05-27
AI Technical Summary
The existing COB light sources have problems in heat dissipation. The efficiency of applying the thermal conductive layer is low and the uniformity is poor, resulting in a large thermal resistance and affecting the heat dissipation effect of high-power COB.
A COB with thermal conductivity is designed, and a discontinuous thermal conductivity layer is formed by setting a thermal conductivity zone and a thermal conductivity gap on the back of the substrate and covering the thermal conductivity zone with several thermal conductivity blocks. The thermally conductive layer consists of thermally conductive grease, and the thermally conductive layer is coated on the thermally conductive gap through the steel mesh to avoid defects in the continuous thermally conductive layer.
The uniform coating of the thermal conductive layer is achieved, and the problems of bubble generation and uneven thickness are avoided, which significantly improves the heat dissipation effect of COB.
Smart Images
Figure CN222437873U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of COB, in particular to a COB with a heat conduction function. Background Art
[0002] COB has advantages in optical design due to its smaller light-emitting surface and higher power density, but it has higher requirements for heat dissipation. Therefore, before installing the COB light source, in order to make the COB have a better heat dissipation effect, the user will generally use a brush or a writing brush to apply a thermal conductive layer on the back of the COB. This operation is not only inefficient, but also has poor uniformity, and is prone to produce more bubbles. The thicker the thickness, the greater the thermal resistance, and is not suitable for high-power COB. It can be seen that the non-standard coating leads to poor coating effect of the thermal conductive layer, affecting the thermal conductivity of the substrate, thereby affecting the heat dissipation effect of the COB. In addition, it also causes high labor intensity and high labor costs. Utility Model Content
[0003] The technical problem to be solved by the utility model is to provide a COB with a heat-conducting function, wherein the heat-conducting layer is coated evenly, has a good coating effect, and has a good heat-conducting effect.
[0004] In order to solve the above technical problems, the utility model provides a COB with heat conduction function, including a substrate, a light-emitting module arranged on the front side of the substrate, and a heat-conducting layer arranged on the back side of the substrate;
[0005] The back of the substrate is provided with a plurality of heat-conducting areas and heat-conducting gaps; the heat-conducting layer is composed of a plurality of heat-conducting blocks, and the plurality of heat-conducting blocks are respectively covered on a plurality of heat-conducting areas, and the heat-conducting blocks and heat-conducting areas are arranged in a one-to-one correspondence; the heat-conducting gap is arranged between two adjacent heat-conducting blocks.
[0006] As an improvement of the above solution, the heat-conducting layer is thermally conductive silicone grease.
[0007] As an improvement of the above solution, a plurality of the heat transfer areas are arranged in an array.
[0008] As an improvement of the above solution, a cutting line is provided on the back side of the substrate, and the cutting line is arranged along the extension direction of the heat-conducting gap.
[0009] As an improvement of the above solution, the width of the cutting line is 0.01 mm-0.4 mm, and the height is 0.05 mm-0.6 mm.
[0010] As an improvement of the above solution, the area ratio of the heat-conducting layer and the heat-conducting gap is (1-100):1.
[0011] As an improvement of the above solution, the coverage area of the heat-conducting layer is 50%-95% of the back surface area of the substrate.
[0012] As an improvement of the above solution, the thickness of the heat conductive layer is 0.02 mm-0.5 mm.
[0013] As an improvement of the above solution, the shape of the heat-conducting block is square, and the width ratio of the heat-conducting block and the heat-conducting gap is (1-10):1.
[0014] As an improvement of the above solution, the light-emitting module includes a plurality of chips, and the chips and the heat-conducting areas are arranged in a one-to-one correspondence.
[0015] The implementation of this utility model has the following beneficial effects:
[0016] The utility model has a heat-conducting function. The COB is provided with a heat-conducting layer on the back of the substrate. The heat-conducting layer is composed of a plurality of heat-conducting blocks. A plurality of heat-conducting areas are provided on the back of the substrate. The plurality of heat-conducting blocks are respectively covered on the plurality of heat-conducting areas. The heat-conducting gap on the substrate is provided between two adjacent heat-conducting blocks, so that the heat-conducting layer forms a non-continuous coating. During production, a steel mesh can be placed on the heat-conducting gap and then coated with the heat-conducting layer. Multiple heat-conducting blocks can be formed on the heat-conducting area to avoid a series of problems caused by coating a continuous heat-conducting layer, so that the overall uniformity of the heat-conducting layer is better, bubbles are not easily generated, and its thickness can be better controlled, and the coating effect is good. At the same time, the setting of the heat-conducting gap between the heat-conducting blocks is conducive to heat conduction, so that the heat of the chip is quickly guided to the radiator through the substrate and the heat-conducting layer, so that the COB has a good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the back structure of the COB substrate with heat conduction function of the utility model;
[0018] Figure 2 yes Figure 1 Schematic diagram of the structure after coating the thermal conductive layer. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail with reference to the accompanying drawings. It is hereby stated that the directional words such as up, down, left, right, front, back, inside, outside, etc. that appear or will appear in the text of the utility model are only based on the accompanying drawings of the utility model, and are not specific limitations of the utility model.
[0020] See also Figure 1-2 The utility model discloses a COB with heat conduction function, including a substrate 1, a light-emitting module arranged on the front side of the substrate 1, and a heat conduction layer arranged on the back side of the substrate 1.
[0021] The back of the substrate 1 is provided with a plurality of heat-conducting areas 11 and heat-conducting gaps; the heat-conducting layer is composed of a plurality of heat-conducting blocks 2, and the plurality of heat-conducting blocks 2 are respectively covered on a plurality of heat-conducting areas 11, and the heat-conducting blocks 2 and the heat-conducting areas 11 are arranged in a one-to-one correspondence; the heat-conducting gap is arranged between two adjacent heat-conducting blocks 2.
[0022] The utility model has a heat-conducting function. The COB is provided with a heat-conducting layer on the back of the substrate. The heat-conducting layer is composed of a plurality of heat-conducting blocks. A plurality of heat-conducting areas are provided on the back of the substrate. The plurality of heat-conducting blocks are respectively covered on the plurality of heat-conducting areas. The heat-conducting gap on the substrate is provided between two adjacent heat-conducting blocks, so that the heat-conducting layer forms a non-continuous coating. During production, a steel mesh can be placed on the heat-conducting gap and then coated with the heat-conducting layer. Multiple heat-conducting blocks can be formed on the heat-conducting area to avoid a series of problems caused by coating a continuous heat-conducting layer, so that the overall uniformity of the heat-conducting layer is better, bubbles are not easily generated, and its thickness can be better controlled, and the coating effect is good. At the same time, the setting of the heat-conducting gap between the heat-conducting blocks is conducive to heat conduction, so that the heat of the chip is quickly guided to the radiator through the substrate and the heat-conducting layer, so that the COB has a good heat dissipation effect.
[0023] The heat-conducting layer is thermal grease. Thermal grease is commonly known as heat dissipation paste. Thermal grease is made of organic silicone as the main raw material, and is added with heat-resistant and thermally conductive materials to form a thermally conductive organic silicone grease-like compound. It is used for heat conduction and heat dissipation of electronic components such as power amplifiers, transistors, electron tubes, and CPUs, thereby ensuring the stability of the electrical performance of electronic instruments and meters.
[0024] Preferably, if Figure 1 As shown, a plurality of the heat conducting areas 11 are arranged in an array, so that the heat conducting blocks are arranged in an array on the substrate.
[0025] Preferably, if Figure 1-2 As shown, a cutting line 12 is provided on the back of the substrate 1, and the cutting line 12 is arranged along the extension direction of the thermal gap. The cutting line is arranged in the thermal gap, which can increase the surface area of the substrate, facilitate heat conduction, and also play the role of limiting the steel mesh. When the automatic printing machine brushes thermal grease on the surface of the substrate, the steel mesh is placed on the back of the substrate, and the cutting line can play a role in positioning the steel mesh to prevent the steel mesh from moving during printing.
[0026] Under the separation of the steel mesh and the cutting line, the two adjacent heat-conducting blocks are spaced apart, that is, a smaller heat-conducting layer is formed. In this way, the formed heat-conducting layer is more uniform, less likely to produce bubbles, and easier to control its thickness, resulting in a better coating effect. In addition, the gap between the two adjacent heat-conducting blocks can increase the heat-conducting area, thereby making the heat dissipation effect of COB better.
[0027] Preferably, the spacing between two adjacent heat-conducting blocks 2 is equal, so as to facilitate the uniformity of the thermal grease during large-scale automated coating.
[0028] Preferably, the width of the cutting line 12 is 0.01 mm-0.4 mm, and the height is 0.05 mm-0.6 mm. The limitation of the width and height is beneficial to heat conduction and the positioning of the steel mesh.
[0029] Preferably, the area ratio of the heat-conducting layer to the heat-conducting gap is (1-100):1, and the heat-conducting effect is good. More preferably, the area ratio of the heat-conducting layer to the heat-conducting gap is (10-80):1. More preferably, the area ratio of the heat-conducting layer to the heat-conducting gap is (30-50):1.
[0030] Preferably, the coverage area of the heat-conducting layer is 50%-95% of the back surface area of the substrate 1. The coverage ratio is limited to ensure the heat conduction effect of the substrate, thereby ensuring the heat dissipation effect of the COB.
[0031] Preferably, the thickness of the heat-conducting layer is 0.02 mm-0.5 mm. More preferably, the thickness of the heat-conducting layer is 0.1 mm-0.4 mm. More preferably, the thickness of the heat-conducting layer is 0.2 mm-0.3 mm. The thickness limitation ensures that the heat-conducting layer has a certain thickness while avoiding the problem of high thermal resistance caused by excessive thickness.
[0032] Preferably, the shape of the heat-conducting block 2 is square, and the width ratio of the heat-conducting block 2 to the heat-conducting gap is (1-10):1, which is conducive to heat conduction. It should be noted that the width of the heat-conducting gap is the distance between two adjacent heat-conducting blocks. More preferably, the width ratio of the heat-conducting block 2 to the heat-conducting gap is (5-8):1.
[0033] Preferably, the light emitting module comprises a plurality of chips, and the chips and the heat transfer areas are arranged in a one-to-one correspondence, which is helpful for heat conduction of the chips. The chips are LED chips.
[0034] Before the COB leaves the factory, thermal grease is applied to the substrate in advance to facilitate the assembly of lamps. When the COB is ready but not separated, use an automatic printing machine and a steel mesh to brush thermal grease on the back of the COB substrate, bake the COB coated with thermal grease, then wrap it with a film, and then use a board separator to separate the COB and the film. When the user uses it, tear off the film and install it directly. This coating method can realize large-scale automated coating production, avoiding the problems of unevenness, bubbles and excessive thickness caused by manual coating. In addition to better coating effect, it also saves labor costs.
[0035] In summary, the utility model provides a COB with a heat-conducting function, the heat-conducting layer is coated evenly, the coating effect is good, and the heat-conducting effect is good.
[0036] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the protection scope of the present invention.
Claims
1. A COB with thermal conductivity, characterized in that: It includes a substrate, a light-emitting module arranged on the front side of the substrate, and a heat-conducting layer arranged on the back side of the substrate; The back of the substrate is provided with a plurality of heat-conducting areas and heat-conducting gaps; the heat-conducting layer is composed of a plurality of heat-conducting blocks, and the plurality of heat-conducting blocks are respectively covered on a plurality of heat-conducting areas, and the heat-conducting blocks and heat-conducting areas are arranged in a one-to-one correspondence; the heat-conducting gap is arranged between two adjacent heat-conducting blocks.
2. The COB with heat conduction function according to claim 1, characterized in that: The heat-conducting layer is heat-conducting silicone grease.
3. The COB with heat conduction function according to claim 1, characterized in that: A plurality of the heat transfer areas are arranged in an array.
4. The COB with heat conduction function according to claim 1, characterized in that: A cutting line is arranged on the back side of the substrate, and the cutting line is arranged along the extending direction of the heat conducting gap.
5. The COB with heat conduction function as claimed in claim 4, characterized in that: The width of the cutting line is 0.01mm-0.4mm, and the height is 0.05mm-0.6mm.
6. The COB with heat conduction function according to claim 1, characterized in that: The area ratio of the heat-conducting layer to the heat-conducting gap is (1-100):
1.
7. The COB with heat conduction function according to claim 1, characterized in that: The coverage area of the heat-conducting layer is 50%-95% of the back surface area of the substrate.
8. The COB with heat conduction function according to claim 1, characterized in that: The thickness of the heat-conducting layer is 0.02 mm-0.5 mm.
9. The COB with heat conduction function according to claim 1, characterized in that: The shape of the heat-conducting block is square, and the width ratio of the heat-conducting block to the heat-conducting gap is (1-10):
1.
10. The COB with heat conduction function according to any one of claims 1 to 9, characterized in that: The light-emitting module includes a plurality of chips, and the chips and the heat-conducting areas are arranged in a one-to-one correspondence.