Semiconductor structure and semiconductor power device

Abstract

The utility model relates to the technical field of semiconductor structures, and discloses a semiconductor structure and a semiconductor power device.The semiconductor structure comprises a circuit board body, two sets of semiconductor bodies are symmetrically installed on the two sides of the circuit board body, L-shaped limiting grooves are formed in the same sides of one set of semiconductor bodies, and the two sets of semiconductor bodies are symmetrically installed in the L-shaped limiting grooves. The top of the circuit board body is provided with a row of butt joint rods vertically corresponding to the limiting grooves, the top of the other set of semiconductor bodies is provided with limiting holes, each limiting hole is provided with a first fixing bolt, and the first fixing bolts are in threaded connection with a row of butt joint holes vertically corresponding to the limiting holes formed in the top of the circuit board body. Reinforcing assemblies are arranged on the other two sides of the semiconductor body; according to the utility model, through the design of the semiconductor structure and the semiconductor power device, the assembly efficiency can be improved, the fixing effect can be enhanced, the safety and the stability can be improved, and the reliability and the stability of equipment in long-time operation can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor structures, in particular to a semiconductor structure and a semiconductor power device. Background Art

[0002] In the field of semiconductor devices, fast and stable positioning is one of the key factors to ensure stable operation of equipment performance. At present, there are some problems with the fixed assembly of semiconductor structures on circuit boards. Traditional fixed assembly methods often use screws or other fixings to fix the semiconductor body, but this method has the following problems:

[0003] Traditional fixing methods are inefficient and the installation process is cumbersome. Screws or other fixings need to be tightened one by one, which is cumbersome and time-consuming, affecting assembly efficiency; traditional fixing methods cannot achieve fast and stable positioning and are easily disturbed by external vibrations, resulting in loose assembly or even falling off, reducing product reliability and stability.

[0004] To this end, we propose a semiconductor structure and a semiconductor power device. Utility Model Content

[0005] The utility model mainly solves the existing technical problems and provides a semiconductor structure and a semiconductor power device.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor structure, including a circuit board body, two groups of semiconductor bodies are symmetrically installed on both sides of the circuit board body, one group of semiconductor bodies is provided with an L-shaped limiting groove on the same side, a row of docking rods corresponding to the limiting grooves are installed on the top of the circuit board body, and the other group of semiconductor bodies are provided with limiting holes on the top, and each limiting hole is provided with a first fixing bolt, the first fixing bolt is threadedly connected to a row of corresponding docking holes on the top of the circuit board body, and reinforcement components are provided on the other two sides of the semiconductor body.

[0007] Preferably, the reinforcement component includes a mounting plate and a second fixing bolt with a thread on the top of the mounting plate extending through the bottom thereof, and the mounting plate is threadedly fixed to the circuit board body by the second fixing bolt.

[0008] Preferably, the reinforcement assembly further comprises insulating sheets located at upper and lower sides of the mounting sheet, and the insulating sheets are provided with holes corresponding to the upper and lower sides of the second fixing bolts.

[0009] Preferably, the insulating sheet and the mounting sheet are both triangular structures.

[0010] Preferably, the insulating sheet and the mounting sheet are both circular structures.

[0011] The present application also provides a semiconductor power device, comprising any one of the semiconductor structures described above.

[0012] Beneficial Effects

[0013] The utility model provides a semiconductor structure and a semiconductor power device, which have the following beneficial effects:

[0014] (1) The semiconductor structure and semiconductor power device can be positioned quickly and stably: through the design of limiting grooves and docking rods, the semiconductor body can be positioned quickly and stably on the circuit board, effectively improving the assembly efficiency;

[0015] Reinforcement effect: The design of the reinforcement component can further enhance the fixing effect, prevent it from falling off due to external vibration, and improve the reliability and stability of the product;

[0016] Preventive effect: By designing a reasonable structure, the semiconductor body can be effectively prevented from accidentally falling off during use, providing a safer working environment.

[0017] (2) The semiconductor structure and semiconductor power device reduce the possibility of the semiconductor body falling off through a stable fixing structure, thereby improving the safety of the equipment; the insulating sheet in the fixing component also has an insulating effect, protecting the device from interference from the circuit board.

[0018] (3) The semiconductor structure and semiconductor power device can ensure that the device can be firmly mounted on the circuit board under various conditions by symmetrically arranging the fixing components and using the mounting plates and insulating plates of special shapes, and have a certain elastic protection effect, which further improves the service life and performance of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings described below are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0020] The structures, proportions, sizes, etc. disclosed in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the restrictive conditions for the implementation of the utility model. Therefore, they have no substantive technical significance. Any modification of the structure, change in the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed in the utility model without affecting the effects and purposes that can be achieved by the utility model.

[0021] Figure 1This is a schematic diagram of installing the semiconductor body of the utility model on the circuit board body;

[0022] Figure 2 This is a schematic diagram of the second embodiment of the present utility model;

[0023] Figure 3 This is a schematic diagram of the third embodiment of the present utility model;

[0024] Figure 4 It is a schematic diagram of the axial side of the semiconductor body of the utility model.

[0025] Legend:

[0026] 1. Circuit board body; 101. Docking hole; 102. Docking rod; 2. Semiconductor body; 3. Limiting groove; 301. Limiting hole; 302. First fixing bolt; 4. Mounting sheet; 401. Second fixing bolt; 402. Insulating sheet; 5. Semiconductor body. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Embodiment: A semiconductor structure and a semiconductor power device, such as Figure 1 - Figure 4 shown.

[0029] A semiconductor structure comprises a circuit board body 1 and a semiconductor body 5, two groups of pins 2 are symmetrically installed on both sides of the circuit board body 1, an L-shaped limiting groove 3 is provided on the same side of one group of pins 2, a row of docking rods 102 corresponding to the limiting groove 3 are installed on the top of the circuit board body 1, and limiting holes 301 are provided on the top of the other group of pins 2, and each limiting hole 301 is provided with a first fixing bolt 302, the first fixing bolt 302 is threadedly connected to a row of corresponding docking holes 101 provided on the top of the circuit board body 1, and reinforcement components are provided on the other two sides of the pins 2.

[0030] The reinforcement component includes a mounting plate 4 and a second fixing bolt 401 with a thread on the top of the mounting plate 4 extending through the bottom thereof. The mounting plate 4 is threadedly fixed to the circuit board body 1 by the second fixing bolt 401 .

[0031] The reinforcement component also includes an insulating sheet 402 located on the upper and lower sides of the mounting sheet 4. The insulating sheet 402 is provided with a hole, through which the second fixing bolt 401 can pass downward. The fixing effect of the semiconductor body 5 installed on the circuit board body 1 is further strengthened through the fixing component, preventing the pin 2 from falling off the circuit board body 1 due to external vibration, thereby playing a preventive effect and a reinforcing role.

[0032] Embodiment 2, based on embodiment 1, as Figure 2 As shown, the insulating sheet 402 and the mounting sheet 404 are both triangular structures.

[0033] Embodiment 3, based on embodiment 1, Figure 3 As shown, the insulating sheet 402 and the mounting sheet 404 are both circular structures.

[0034] The present application also provides a semiconductor power device, including a semiconductor structure of a semiconductor power device having any of the above-mentioned features.

[0035] The working principle of the utility model is as follows: by providing a limiting groove 3 on the side of a group of pins 2, when the semiconductor body 5 needs to be fixed on the circuit board body 1, the corresponding docking rod 102 can be moved to its inner ground through the side opening of the limiting groove 3. At this time, the semiconductor body 5 and the top of the circuit board body 1 are inclined, and a row of pins 2 on the other side of the semiconductor body 5 are buckled on the limiting groove 3 of the circuit board body 10 at the top of the circuit board body 1 through its limiting holes 301, so that the pins 2 can be quickly and stably positioned on the circuit board body 1, and when the pins 2 are buckled on the circuit board body 1, the circuit board body 1 will not shake, even if the fixing components on the side of the semiconductor body 5 fall off due to external vibration, the two groups of pins 2 can be firmly fixed on the circuit board body 1 through the docking holes 101 cooperating with the limiting holes 301 and the limiting grooves 3 cooperating with the docking rods 102, thereby improving the stability of the semiconductor body 5 installed on the circuit board body 1.

[0036] By arranging two groups of symmetrical fixing components on the side of the semiconductor body 5, when the semiconductor body 5 is docked and installed on the circuit board body 1, the fixing component can strengthen the fixing effect of the semiconductor body 5 on the circuit board body 1. At the same time, insulating sheets 402 are arranged on the upper and lower sides of the mounting sheet 4 on the fixing component, which not only have an insulating effect, but also the mounting sheet 4 and the corresponding contact surface of the circuit board body 1 have an elastic insulating sheet 402 in the middle, which can play an elastic protection effect on the contact end surface of the circuit board body 1 corresponding to the mounting sheet 4.

[0037] In summary, the main effect of this semiconductor structure and semiconductor power device is to enhance the fixing effect of the semiconductor device 5 on the circuit board 1. Through the specially designed limiting groove 3, docking rod 102 and fixing assembly, the semiconductor body 5 can be firmly installed on the circuit board 1, effectively preventing the device from falling off or shaking due to external vibration. In addition, the insulating sheet 402 in the fixing assembly also has an insulating effect to protect the device from interference from the circuit board.

[0038] In addition, the stability and reliability of the semiconductor device during installation are improved. By symmetrically arranging the fixing components and using the mounting plate 4 and the insulating plate 402 of special shapes, it can be ensured that the device can be firmly installed on the circuit board 1 under various conditions and has a certain elastic protection effect, which further improves the service life and performance of the device.

[0039] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor structure, comprising a circuit board body (1) and a semiconductor body (5), wherein two groups of pins (2) are symmetrically mounted on both sides of the semiconductor body (5), characterized in that: An L-shaped limiting groove (3) is provided on the same side of a group of the pins (2); a row of docking rods (102) corresponding to the limiting groove (3) is installed on the top of the circuit board body (1); a limiting hole (301) is provided on the top of another group of the pins (2); and each limiting hole (301) is provided with a first fixing bolt (302); the first fixing bolt (302) is threadedly connected to a row of corresponding docking holes (101) provided on the top of the circuit board body (1); and reinforcement components are provided on the other two sides of the pins (2).

2. A semiconductor structure according to claim 1, characterized in that: The reinforcement component comprises a mounting plate (4) and a second fixing bolt (401) having a thread on the top of the mounting plate (4) and extending through the bottom thereof, and the mounting plate (4) is threadedly fixed to the circuit board body (1) via the second fixing bolt (401).

3. A semiconductor structure according to claim 2, characterized in that: The reinforcement assembly further comprises insulating sheets (402) located at the upper and lower sides of the mounting sheet (4), and the insulating sheet (402) is provided with holes corresponding to the upper and lower holes of the second fixing bolt (401).

4. A semiconductor structure according to claim 3, characterized in that: The insulating sheet (402) and the mounting sheet (4) are both triangular structures.

5. A semiconductor structure according to claim 3, characterized in that: The insulating sheet (402) and the mounting sheet (4) are both circular structures.

6. A semiconductor power device, characterized in that: The invention comprises a semiconductor structure as claimed in any one of claims 1 to 5.

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