High-density high-pin SOT packaging device

Abstract

The utility model relates to the technical field of packaging technology, in particular to a high-density high-pin SOT packaging device, which comprises a lead frame, anti-reverse holes are arranged on two sides of the surface of the lead frame, plastic package punching runner grooves are arranged on the surface of the lead frame, a packaging mechanism is arranged on the surface of the lead frame, and the packaging mechanism is arranged on the surface of the lead frame. The packaging mechanism is composed of a pin part and a base island, the surface of the lead frame is provided with an efficient heat dissipation mechanism, and the efficient heat dissipation mechanism is composed of a connecting sheet, a heat dissipation assembly and a through hole. According to the utility model, the cost is reduced, the efficiency is improved, and the heat dissipation effect of the packaging device in use is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging technology, in particular to a high-density high-pin position SOT packaging device. Background Art

[0002] SOT packaging is a type of semiconductor component packaging method. Its packaging materials are mostly plastic, ceramic, etc. The packaging can well protect the related electronic components inside and improve the working stability of related components.

[0003] At present, the mainstream SOT high-density high-pin 300MIL package is 4R, with few single products and high packaging costs. The main function of the SOT lead frame is to provide a mechanical support carrier for the integrated circuit chip, and to serve as a conductive medium to connect the external circuit of the integrated circuit, transmit electrical signals, and together with the packaging material, dissipate the heat generated by the chip when it is working. The packaging device generally only dissipates heat through its own material, and the heat dissipation effect is poor. Utility Model Content

[0004] The utility model aims to provide a high-density high-pin SOT packaging device to solve the problems of high packaging cost and poor heat dissipation effect when the packaging device proposed in the above background technology is used.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-density high-pin position SOT packaging device, comprising a lead frame, both sides of the surface of the lead frame are provided with anti-reverse holes, the surface of the lead frame is provided with plastic sealing flow channel grooves, the surface of the lead frame is provided with a packaging mechanism, the packaging mechanism is composed of a pin portion and a base island, the surface of the lead frame is provided with an efficient heat dissipation mechanism, the efficient heat dissipation mechanism is composed of a connecting piece, a heat dissipation component and a through hole.

[0006] Preferably, ten groups of pin portions are mounted on the surface of the lead frame, the pin portions are located between the plastic package runner grooves, and six groups of base islands are inlaid on the surface of the pin portions.

[0007] Preferably, a connecting piece is fixed to the other side of the lead frame, and a through hole is formed on the surface of the connecting piece, and the through hole coincides with the anti-reverse hole.

[0008] Preferably, a heat dissipation component is provided on one side of the lead frame, and a heat sink and a connecting strip are provided inside the heat dissipation component.

[0009] Preferably, the surfaces of the lead frames are all provided with heat sinks, the surfaces of the heat sinks are tightly fitted with the surface of the base island, the heat sinks are fixedly connected to the surfaces of the connecting plates via support bars, and connecting bars are fixed between the heat sinks.

[0010] Compared with the prior art, the beneficial effects of the present invention are: the high-density high-pin position SOT packaging device not only reduces the cost and improves the efficiency, but also improves the heat dissipation effect when the packaging device is used;

[0011] 1. By setting up a packaging mechanism, since six base islands are embedded on the surface of each pin, the packaging device is increased from the original single EA to the current EA, the frame width is increased, and high-density high-pin SOT packaging is realized, which reduces costs and improves efficiency;

[0012] 2. By providing an efficient heat dissipation mechanism, since the heat sink is in close contact with the base island, the base island can dissipate heat quickly. At the same time, the heat sinks can be connected and fixed under the action of the connecting strip. The efficient heat dissipation mechanism is easily installed and fixed under the action of the connecting sheet to realize the efficient heat dissipation function of the packaging device, thereby improving the heat dissipation effect of the packaging device when it is used. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional appearance structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the main structure of the utility model;

[0015] Figure 3 It is a rear view structural schematic diagram of the utility model;

[0016] Figure 4 It is a schematic diagram of the structure of the existing packaging device of the utility model.

[0017] In the figure: 1. lead frame; 101. anti-reverse hole; 102. plastic sealing flushing channel groove; 2. packaging structure; 201. pin part; 202. base island; 3. efficient heat dissipation structure; 301. connecting piece; 302. heat dissipation component; 3021. heat sink; 3022. connecting strip; 303. through hole. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0019] The utility model provides a high-density high-pin SOT packaging device with a structure as follows Figure 1 and Figure 2 As shown, it includes a lead frame 1 , both sides of the surface of the lead frame 1 are provided with anti-reverse holes 101 , and the surface of the lead frame 1 is provided with plastic sealing flushing channel grooves 102 .

[0020] Furthermore, if Figure 2 and Figure 4 As shown, a packaging structure 2 is provided on the surface of the lead frame 1, and the packaging structure 2 consists of a pin portion 201 and a base island 202. Ten groups of pin portions 201 are installed on the surface of the lead frame 1. The pin portions 201 are located between the plastic package flow channel grooves 102, and six groups of base islands 202 are inlaid on the surface of the pin portions 201.

[0021] When in use, since six base islands 202 are embedded on the surface of each pin portion 201, the packaging device is increased from the original single 40EA to the current 60EA, the frame width is increased, high-density high-pin SOT packaging is achieved, the cost is reduced, and the efficiency is improved.

[0022] Furthermore, if Figure 3As shown, the surface of the lead frame 1 is provided with a high-efficiency heat dissipation mechanism 3, and the high-efficiency heat dissipation mechanism 3 is composed of a connecting piece 301, a heat dissipation component 302 and a through hole 303. A connecting piece 301 is fixed on the other side of the lead frame 1, and the surface of the connecting piece 301 is provided with a through hole 303, and the through hole 303 coincides with the anti-reflection hole 101. A heat dissipation component 302 is provided on one side of the lead frame 1, and a heat dissipation fin 3021 and a connecting strip 3022 are provided inside the heat dissipation component 302. The surface of the lead frame 1 is provided with a heat dissipation fin 3021, and the surface of the heat dissipation fin 3021 is tightly fitted with the surface of the base island 202. The heat dissipation fin 3021 is fixedly connected to the surface of the connecting piece 301 through a supporting strip, and connecting strips 3022 are fixed between the heat dissipation fins 3021.

[0023] When in use, since the heat sink 3021 is in close contact with the base island 202, the base island 202 can dissipate heat quickly. At the same time, the heat sinks 3021 can be connected and fixed under the action of the connecting strip 3022. The installation and fixation of the efficient heat dissipation mechanism 3 is facilitated under the action of the connecting sheet 301, so as to realize the efficient heat dissipation function of the packaging device.

[0024] Working principle: When in use, firstly, since six base islands 202 are embedded on the surface of each pin portion 201, the packaging device is increased from the original single 40EA to the current 60EA, the frame width is increased, and high-density high-pin SOT packaging is realized, which reduces costs and improves efficiency.

[0025] At the same time, since the heat sink 3021 is in close contact with the base island 202, the base island 202 can dissipate heat quickly. At the same time, the heat sinks 3021 can be connected and fixed under the action of the connecting strip 3022. The installation and fixation of the high-efficiency heat dissipation mechanism 3 are facilitated under the action of the connecting sheet 301 to realize the high-efficiency heat dissipation function of the packaging device, thereby improving the heat dissipation effect of the packaging device when in use, and finally completing the use of the packaging device.

[0026] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A high-density high-pin-position SOT packaging device, comprising a lead frame (1), characterized in that: Anti-reverse holes (101) are provided on both sides of the surface of the lead frame (1), plastic sealing flushing channel grooves (102) are provided on the surface of the lead frame (1), a packaging mechanism (2) is provided on the surface of the lead frame (1), the packaging mechanism (2) is composed of a pin portion (201) and a base island (202), and a high-efficiency heat dissipation mechanism (3) is provided on the surface of the lead frame (1), the high-efficiency heat dissipation mechanism (3) is composed of a connecting piece (301), a heat dissipation component (302) and a through hole (303).

2. A high-density high-pin position SOT packaging device according to claim 1, characterized in that: Ten groups of pin portions (201) are installed on the surface of the lead frame (1), the pin portions (201) are located between plastic-encapsulated flushing channel grooves (102), and six groups of base islands (202) are inlaid on the surface of the pin portions (201).

3. A high-density high-pin position SOT packaging device according to claim 1, characterized in that: A connecting piece (301) is fixed to the other side of the lead frame (1), and a through hole (303) is provided on the surface of the connecting piece (301), and the through hole (303) overlaps with the anti-reverse hole (101).

4. A high-density high-pin position SOT packaging device according to claim 3, characterized in that: A heat dissipation component (302) is provided on one side of the lead frame (1), and a heat dissipation sheet (3021) and a connecting strip (3022) are provided inside the heat dissipation component (302).

5. A high-density high-pin position SOT packaging device according to claim 4, characterized in that: The surface of the lead frame (1) is provided with a heat sink (3021), the surface of the heat sink (3021) is tightly fitted with the surface of the base island (202), the heat sink (3021) is fixedly connected to the surface of the connecting plate (301) via a supporting bar, and connecting bars (3022) are fixed between the heat sinks (3021).

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