Signal conditioning circuit board plug-in type connecting mechanism for pressure sensor

Abstract

The utility model relates to the technical field of pressure sensors, in particular to a conditioning signal circuit board plug-in type connecting mechanism for a pressure sensor, which comprises a conditioning signal circuit board and a lead circuit board, and is characterized in that a plurality of conductive reeds are arranged on the upper surface of the lead circuit board; the conductive reeds form a conductive socket assembly with a conductive slot. And the signal conditioning circuit board comprises an electric connection part arranged at the lower part, and the electric connection part is electrically connected with the conductive socket assembly through the vertical plugging of the signal conditioning circuit board and the conductive slot. The conditioning signal circuit board plug-in type connecting mechanism for the pressure sensor is simple in structure and convenient to assemble or disassemble, the internal layout of the sensor can be more concise, the assembling efficiency of the sensor can be effectively improved, and the yield of products is fully guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of pressure sensors, in particular to a signal conditioning circuit board plug-in connection mechanism for pressure sensors. Background Art

[0002] Brake pressure sensors are used in ESC systems (electronic stability control systems) and are mainly installed on hydraulic control modules to monitor the pressure of brake fluid. Traditional pressure sensors involve several circuit boards with functional modules, and the core ones are signal conditioning circuit boards and lead circuit boards. The signal conditioning circuit board is mainly used to collect, process and output pressure signals, while the lead circuit board is mainly used to transmit the bridge resistance differential signal generated by the strain gauge (instrument) to the signal conditioning circuit board.

[0003] Traditionally, the signal conditioning circuit board and the conductive parts are electrically connected by cable spot welding, that is, the two ends of several cables are welded to the signal conditioning circuit board and the lead circuit board respectively. This method not only relies heavily on manpower and has a low yield rate, but also causes spatial clutter in the sensor housing, which is not conducive to heat dissipation, assembly, and subsequent disassembly and maintenance, greatly affecting the assembly efficiency of the pressure sensor.

[0004] Therefore, a technology is urgently needed to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of the utility model is to overcome the above-mentioned problems of the prior art and provide a plug-in connection mechanism for a conditioning signal circuit board of a pressure sensor, which is used to solve the technical problems of the prior art of using cable spot welding for electrical connection, high reliance on manual labor, low yield rate, and easy to cause spatial confusion in the sensor housing, which is not conducive to heat dissipation, assembly, and subsequent disassembly and maintenance.

[0006] The above objectives are achieved through the following technical solutions:

[0007] A signal conditioning circuit board plug-in connection mechanism for a pressure sensor, comprising a signal conditioning circuit board and a lead circuit board, characterized in that a plurality of conductive springs are arranged on the upper surface of the lead circuit board, each of the conductive springs forming a conductive socket assembly with a conductive slot;

[0008] The signal conditioning circuit board includes an electrical connection portion arranged at the bottom, and the electrical connection portion is electrically connected to the conductive socket assembly by vertically plugging the signal conditioning circuit board and the conductive slot.

[0009] Furthermore, the conductive slot is in a straight line shape, and mutually symmetrical pin through slots are provided on the lead circuit board corresponding to the conductive slot;

[0010] Correspondingly, a pair of mutually symmetrical pins are arranged on the bottom surface of the conditioning signal circuit board, and the two pins can respectively pass through the two pin through grooves until the bottom edge of the conditioning signal circuit board corresponding to the two pins is in vertical contact with the surface of the lead circuit board.

[0011] Furthermore, the electrical connection portion includes a plurality of signal conditioning pads arranged on two side surfaces of the signal conditioning circuit board.

[0012] Furthermore, each of the conditioning signal pads is located on the same horizontal plane.

[0013] Furthermore, the conductive reed includes:

[0014] A reed plug-in portion, the reed plug-in portion is used to be plugged into a lead board slot provided on a lead circuit board below, the lead circuit board being horizontally arranged below the conductive reed;

[0015] An electrical connection portion below the spring, the electrical connection portion below the spring being used to contact a lead pad on the surface of the lead circuit board;

[0016] An electrical connection portion above the reed, the electrical connection portion above the reed being used for crimping with the conditioning signal pad;

[0017] The spring inserting portion is vertically connected to the electrical connection portion below the spring, and the electrical connection portion below the spring is connected to the electrical connection portion above the spring at an angle.

[0018] Furthermore, the electrical connection portion above the reed includes a reed support portion and a reed bending portion connected at an angle, and the angle between the reed support portion and the reed bending portion serves as a reed crimping portion.

[0019] Furthermore, the included angle between the spring support portion and the spring bending portion is an arc angle, and correspondingly, the spring crimping portion is an arc surface.

[0020] Furthermore, the included angle between the spring support portion and the spring bending portion is 90° to 160 degrees.

[0021] Furthermore, there are six conductive springs in the conductive socket assembly, two of which serve as first sides of the conductive slot, and four of which serve as second sides of the conductive slot; the two conductive springs on the first side correspond to the outer sides of the second side respectively.

[0022] Furthermore, the conductive spring is made of metal copper.

[0023] Beneficial Effects

[0024] The plug-in connection mechanism of the conditioning signal circuit board for the pressure sensor provided by the utility model is realized by vertically plugging the conditioning signal circuit board with the electrical connection part at the bottom with the conductive socket assembly by arranging a conductive socket assembly with a conductive slot on the lead circuit board. The purpose of rapid electrical connection is achieved. The plug-in connection mechanism of the conditioning signal circuit board for the pressure sensor provided by the present solution is not only simple in structure and convenient to assemble or disassemble, but also can make the internal layout of the sensor more concise, and can effectively improve the assembly efficiency of the sensor, and the product yield is also fully guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a structural schematic diagram of the plug-in connection mechanism of the conditioning signal circuit board for the pressure sensor of the utility model;

[0026] Figure 2 It is an exploded view of the plug-in connection mechanism of the conditioning signal circuit board for the pressure sensor of the utility model;

[0027] Figure 3 It is a schematic diagram of the connection between the lead circuit board and the conductive spring in the plug-in connection mechanism of the conditioning signal circuit board for the pressure sensor of the utility model from the first perspective;

[0028] Figure 4 It is a schematic diagram of the connection between the lead circuit board and the conductive spring in the plug-in connection mechanism of the conditioning signal circuit board for the pressure sensor of the utility model from a second viewing angle;

[0029] Figure 5 This is a schematic structural diagram of the conductive spring in the plug-in connection mechanism of the signal conditioning circuit board for the pressure sensor of the utility model from the first perspective;

[0030] Figure 6 This is a second perspective structural schematic diagram of the conductive spring in the plug-in connection mechanism of the conditioning signal circuit board for the pressure sensor described in the utility model.

[0031] Graphic marking:

[0032] 1- conditioning signal circuit board, 2- lead circuit board, 3- conductive spring, 4- conductive slot, 5- conductive socket assembly, 6- electrical connection part, 7- pin, 8- pin through slot, 9- conditioning signal pad, 10- spring plug-in part, 11- electrical connection part below the spring, 12- electrical connection part above the spring, 13- spring support part, 14- spring bending part, 15- lead plate slot, 16- lead pad. DETAILED DESCRIPTION

[0033] The utility model is further described in detail below based on the accompanying drawings and embodiments. The described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] like Figures 1 to 4 As shown, the present invention provides a signal conditioning circuit board plug-in connection mechanism for a pressure sensor, comprising a signal conditioning circuit board 1 and a lead circuit board 2, characterized in that a plurality of conductive springs 3 are arranged on the upper surface of the lead circuit board 2, and each of the conductive springs 3 constitutes a conductive socket assembly 5 with a conductive slot 4;

[0035] The signal conditioning circuit board 1 includes an electrical connection portion 6 disposed at the bottom. The electrical connection portion 6 is electrically connected to the conductive socket assembly 5 by vertically plugging the signal conditioning circuit board 1 and the conductive socket 4 .

[0036] In this embodiment, the signal conditioning circuit board 1 is quickly connected to the lead circuit board 2 vertically, so as to quickly plug the electrical connection portion 6 and the conductive socket assembly 5 to achieve the purpose of electrical connection.

[0037] Among them, Figure 2 and 4 As shown, the conductive slot 4 is in a straight line shape, and symmetrical pin through slots 8 are provided on the lead circuit board 2 corresponding to the conductive slot 4;

[0038] Correspondingly, a pair of mutually symmetrical pins 7 are provided on the bottom surface of the conditioning signal circuit board 1, and the two pins 7 can respectively pass through the two pin through slots 8 until the bottom edge of the conditioning signal circuit board 1 corresponding to the two pins 7 is in vertical contact with the surface of the lead circuit board 2;

[0039] In this embodiment, the two pins in the signal conditioning circuit board 1 serve to guide the signal conditioning circuit board 1 to quickly achieve vertical connection with the lead circuit board 2, and can also accurately guide the electrical connection part 6 to enter the conductive slot 4 to achieve crimping with each conductive spring sheet 3 in the conductive socket assembly 5, thereby achieving the purpose of electrically connecting the two circuit boards.

[0040] Compared with the traditional method of using cable spot welding, the plug-and-conduct electrical connection method used in this structure is more efficient and quick, and can effectively improve the assembly efficiency between the lead circuit board 2 and the signal conditioning circuit board 1.

[0041] In addition, the interaction between the pin 7 and the pin slot 8 in this embodiment can not only guide the conditioning signal circuit board 1 to quickly achieve vertical connection with the lead circuit board 2, but also clamp and limit the two sides of the lead circuit board 2, which can effectively prevent the two from shifting due to external vibration after connection, and further ensure the stability of the electrical connection.

[0042] like Figure 3 and 4 As shown, as a specific embodiment of the present scheme, there are 6 conductive spring sheets 3 in the conductive socket assembly 5, 2 of which serve as the first side edges of the conductive slot 4, and 4 of which serve as the second side edges of the conductive slot 4. The conductive slot 4 is formed between the first side edges and the second side edges; the 2 conductive spring sheets 3 on the first side edges correspond to the outer sides of the second side edges respectively.

[0043] like Figure 1 and 2 As shown, in this embodiment, the electrical connection portion 6 includes a plurality of signal conditioning pads 9 arranged on two side surfaces of the signal conditioning circuit board 1 .

[0044] In order to facilitate accurate crimping of each signal conditioning pad 9 and the plurality of conductive springs 3 plugged into the upper surface of the lead circuit board 2 , in this embodiment, each signal conditioning pad 9 is located on the same horizontal plane.

[0045] Among them, Figure 5 and 6 As shown, the conductive reed 3 includes:

[0046] A reed plug-in portion 10, the reed plug-in portion 10 is used to be plugged into a lead plate slot 15 provided on a lead circuit board 2 below, the lead circuit board 2 being horizontally arranged below the conductive reed 3;

[0047] The electrical connection portion 11 below the spring piece is used to contact the lead pad 16 on the surface of the lead circuit board 2;

[0048] The electrical connection portion 12 above the reed is used for crimping with the conditioning signal pad 9;

[0049] The spring inserting portion 10 is vertically connected to the lower electrical connection portion 11 of the spring, and the lower electrical connection portion 11 of the spring is connected to the upper electrical connection portion 12 of the spring at an angle.

[0050] Specifically, the electrical connection portion 12 above the spring includes a spring support portion 13 and a spring bending portion 14 connected at an angle, and the angle between the spring support portion 13 and the spring bending portion 14 serves as a spring crimping portion 17 .

[0051] Specifically, the included angle between the spring support portion 13 and the spring bending portion 14 is an arc angle, and correspondingly, the spring crimping portion 17 is an arc surface.

[0052] It should be noted that, in this embodiment, the angle between the spring support portion 13 and the spring bending portion 14 is 90° to 160°.

[0053] Specifically, under this structure, if the angle between the reed support portion 13 and the reed bending portion 14 is smaller, the crimping area of ​​the reed crimping portion 17 is smaller; if the angle between the reed support portion 13 and the reed bending portion 14 is larger, the crimping area of ​​the reed crimping portion 17 is larger, the contact area with the conditioning signal pad 9 is larger, and the electrical connection is more stable.

[0054] It should be noted that the conductive spring in this embodiment is made of metal copper.

[0055] Specifically, the reed inserting portion 10, the electrical connecting portion 11 below the reed, and the electrical connecting portion 12 above the reed are integrally formed and made of conductive metal material, such as copper.

[0056] The above description is only for illustrating the implementation mode of the present invention and is not intended to limit the present invention. For those skilled in the art, any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A signal conditioning circuit board plug-in connection mechanism for a pressure sensor, comprising a signal conditioning circuit board (1) and a lead circuit board (2), characterized in that: A plurality of conductive springs (3) are arranged on the upper surface of the lead circuit board (2), and each of the conductive springs (3) forms a conductive socket assembly (5) with a conductive slot (4); The signal conditioning circuit board (1) comprises an electrical connection portion (6) arranged at the bottom, and the electrical connection portion (6) is electrically connected to the conductive socket assembly (5) by vertically plugging the signal conditioning circuit board (1) and the conductive socket (4).

2. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 1, characterized in that: The conductive slot (4) is in a straight line shape, and symmetrical pin through slots (8) are provided on the lead circuit board (2) corresponding to the conductive slot (4); Correspondingly, a pair of mutually symmetrical pins (7) are provided on the bottom surface of the conditioning signal circuit board (1), and the two pins (7) can respectively pass through the two pin through slots (8) until the bottom edge of the conditioning signal circuit board (1) corresponding to the two pins (7) is in vertical contact with the surface of the lead circuit board (2).

3. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 1 or 2, characterized in that: The electrical connection portion (6) comprises a plurality of signal conditioning pads (9) arranged on two side surfaces of the signal conditioning circuit board (1).

4. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 3, characterized in that: Each of the conditioning signal pads (9) is located on the same horizontal plane.

5. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 3, characterized in that: The conductive reed (3) comprises: A reed plug-in portion (10), the reed plug-in portion (10) being used for plugging into a lead plate slot (15) provided on a lead circuit board (2) below, the lead circuit board (2) being arranged horizontally below the conductive reed (3); An electrical connection portion (11) below the spring sheet, the electrical connection portion (11) below the spring sheet being used to contact a lead pad (16) on the surface of the lead circuit board (2); An electrical connection portion (12) above the reed, the electrical connection portion (12) above the reed being used for crimping with the conditioning signal pad (9); The spring inserting portion (10) and the electrical connection portion (11) below the spring are vertically connected, and the electrical connection portion (11) below the spring is connected to the electrical connection portion (12) above the spring at an angle.

6. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 5, characterized in that: The electrical connection portion (12) above the spring leaf comprises a spring leaf support portion (13) and a spring leaf bending portion (14) connected at an angle, and the angle between the spring leaf support portion (13) and the spring leaf bending portion (14) serves as a spring leaf crimping portion (17).

7. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 6, characterized in that: The included angle between the leaf spring support portion (13) and the leaf spring bent portion (14) is an arc angle, and correspondingly, the leaf spring crimping portion (17) is an arc surface.

8. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 6, characterized in that: The included angle between the leaf spring support portion (13) and the leaf spring bending portion (14) is 90° to 160 degrees.

9. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 1, characterized in that: There are six conductive spring sheets (3) in the conductive socket assembly (5), two of which serve as first sides of the conductive slot (4), and four of which serve as second sides of the conductive slot (4); the two conductive spring sheets (3) on the first side respectively correspond to the outer sides of the second side.

10. The signal conditioning circuit board plug-in connection mechanism for a pressure sensor according to claim 1 or 9, characterized in that: The conductive spring (3) is made of metal copper.

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