Heat dissipation equipment for motor converter

Abstract

The utility model discloses heat dissipation equipment for a motor converter, which comprises a connecting pipe arranged at a heat dissipation opening of the converter, a fan is arranged at an air outlet of the connecting pipe, an air inlet pipeline is arranged at the top of the converter, and a semiconductor chilling plate is arranged in the middle of the upper surface of the air inlet pipeline. An air inlet is formed in the bottom, corresponding to the semiconductor chilling plate, of the air inlet pipeline, and a bottom cooling fin is arranged on the refrigeration face of the semiconductor chilling plate. According to the heat dissipation equipment for the motor converter, heat dissipation is carried out on the converter in an air draft mode, the heat dissipation effect on the converter is improved in a cold air mixing mode during air draft, the heat dissipation requirement of the converter can be met when the air volume becomes small by adopting the heat dissipation mode, frequent maintenance and replacement of the equipment are not needed, and the heat dissipation efficiency is improved. The production efficiency of the rolling mill can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of converter heat dissipation, in particular to a heat dissipation device for a motor converter. Background Art

[0002] At present, the DC main motor power used in the 2000MM rolling mill is 650KW, and the converter is ABB DCS500. The converter generates a lot of heat during continuous operation and requires stable ventilation and cooling to ensure that the temperature inside the converter does not exceed 90°C. Therefore, a fan is installed at the bottom of the original converter for ventilation and cooling. However, the cooling fan of the DCS500 converter is a capacitor-operated asynchronous motor fan imported from Germany. Although its operation is relatively stable, its fan blades have high requirements for balance. After the bearings are replaced, vibrations often occur, resulting in a decrease in air volume, making it difficult to meet the current converter cooling requirements; and the subsequent stable operation time of the fan after maintenance is short, and it usually breaks down in a few weeks, which seriously affects the production efficiency of the rolling mill. Therefore, the present application provides a heat dissipation device for a motor converter to solve the above problems. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the existing defects and provide a heat dissipation device for a motor inverter. The inverter is cooled by exhausting air, and the heat dissipation effect of the inverter is improved by mixing cold air during exhausting air. The heat dissipation method can meet the heat dissipation demand of the inverter even when the air volume is small. There is no need to frequently repair and replace the equipment, which can improve the production efficiency of the rolling mill and effectively solve the problems in the background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat dissipation device for a motor inverter, comprising a connecting pipe installed at the heat dissipation port of the inverter, a fan is provided at the air outlet of the connecting pipe, an air inlet duct is provided on the top of the inverter, a semiconductor cooling plate is provided in the middle of the upper surface of the air inlet duct, an air inlet is opened at the bottom of the air inlet duct corresponding to the semiconductor cooling plate, and a bottom heat sink is provided on the cooling surface of the semiconductor cooling plate.

[0005] As a preferred technical solution of the utility model, the heating surface of the semiconductor refrigeration plate is provided with a top heat sink.

[0006] As a preferred technical solution of the utility model, a heat exhaust duct is arranged at a position corresponding to the air inlet duct and the top heat sink, and an air outlet of the heat exhaust duct is connected to a connecting pipe.

[0007] As a preferred technical solution of the utility model, a plug plate is movably inserted into the side of the heat exhaust air duct, and a telescopic rod connected to the heat exhaust air duct is provided on the plug plate.

[0008] As a preferred technical solution of the utility model, the length direction of the grooves of the heat dissipation fins in the top heat dissipation fin is consistent with the hot air flow direction of the horizontal part of the heat exhaust air duct.

[0009] As a preferred technical solution of the utility model, the bottom of the bottom heat sink corresponding to the air inlet is exposed at the lower side of the air inlet, and the bottom exposed part of the bottom heat sink gradually becomes longer along its distribution direction.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] The heat dissipation device for the motor inverter in the example of the utility model dissipates heat from the inverter by exhausting air, and improves the heat dissipation effect of the inverter by mixing cold air during exhausting air. This heat dissipation method can meet the heat dissipation demand of the inverter even when the air volume becomes smaller, and there is no need for frequent maintenance and replacement of the equipment, which can improve the production efficiency of the rolling mill. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 It is a partial structural schematic diagram of the utility model;

[0014] Figure 3 for Figure 2 Schematic diagram of the structure viewed from above;

[0015] Figure 4 for Figure 2 Schematic diagram of the cross-sectional structure.

[0016] In the figure: 1 connecting pipe, 2 fan, 3 row of hot air pipes, 4 telescopic rods, 41 plug boards, 5 air intake pipes, 6 semiconductor cooling fins, 7 top heat sinks, and 8 bottom heat sinks. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-4The utility model provides a technical solution: a heat dissipation device for a motor converter, comprising a connecting pipe 1 installed at the heat dissipation port of the converter, a fan 2 is provided at the air outlet of the connecting pipe 1, an air inlet duct 5 is provided on the top of the converter, a semiconductor cooling sheet 6 is provided in the middle of the upper surface of the air inlet duct 5, an air inlet is provided at the bottom of the air inlet duct 5 corresponding to the semiconductor cooling sheet 6, and a bottom heat sink 8 is provided on the cooling surface of the semiconductor cooling sheet 6, the semiconductor cooling sheet 6 cools the bottom heat sink 8 after working, and the low-temperature bottom heat sink 8 cools the air entering the air inlet duct 5, thereby reducing the temperature of the air entering the converter, thereby achieving the purpose of cooling and dissipating the heat of the converter.

[0019] Furthermore, the heating surface of the semiconductor refrigeration plate 6 is provided with a top heat sink 7, and a heat exhaust air duct 3 is provided at a position corresponding to the air inlet duct 5 and the top heat sink 7. The air outlet of the heat exhaust air duct 3 is connected to the connecting pipe 1, and the fan 2 extracts hot air from the top heat sink 7 through the connecting pipe 1 and the heat exhaust air duct 3, thereby dissipating the heat from the heating surface of the semiconductor refrigeration plate 6.

[0020] Furthermore, a plug plate 41 is movably inserted into the side of the heat exhaust air duct 3 , and a telescopic rod 4 connected to the heat exhaust air duct 3 is provided on the plug plate 41 .

[0021] Furthermore, the length direction of the grooves of the heat dissipating fins in the top heat dissipating fin 7 is consistent with the hot air flow direction of the horizontal portion of the heat exhaust air duct 3 , which can improve the flow performance of air in the heat dissipating fins in the top heat dissipating fin 7 .

[0022] Furthermore, the bottom of the bottom heat sink 8 corresponding to the air inlet is exposed on the lower side of the air inlet, and the exposed bottom portion of the bottom heat sink 8 gradually becomes longer along its distribution direction, which can increase the contact time between the air and the bottom heat sink 8, thereby improving the cooling effect on the air; it can also make it easier for the air away from the side of the heat exhaust duct 3 to enter the air inlet.

[0023] Fan 2 is a domestically produced low-noise centrifugal fan, which has the characteristics of low price, easy maintenance and large ventilation volume.

[0024] The fan 2 and semiconductor cooling sheet 6 used in the present invention are both commonly used electronic components in the prior art, and their working methods and circuit structures are well-known technologies and are not described here in detail. The fan 2 and semiconductor cooling sheet 6 are both electrically connected to the external switch.

[0025] When using:

[0026] In the initial state, the plug board 41 is inserted into the heat exhaust duct 3, the external switch group controls the fan to work, the fan 2 extracts the hot air in the converter, and the external air enters the converter through the air intake duct 5, thereby dissipating the heat of the converter;

[0027] When the temperature of the converter is too high, the plug plate 41 is pulled outward, and the plug plate 41 drives the telescopic rod 4 to extend;

[0028] The semiconductor refrigeration sheet 6 is controlled to work by an external switch group. After the semiconductor refrigeration sheet 6 works, it cools the bottom heat sink 8. The low-temperature bottom heat sink 8 cools the air entering the air intake duct 5, so that the temperature of the air entering the converter is reduced, thereby achieving the purpose of cooling and dissipating the converter.

[0029] The fan 2 extracts hot air from the top heat sink 7 through the connecting pipe 1 and the heat exhaust duct 3, thereby dissipating heat from the heating surface of the semiconductor refrigeration plate 6.

[0030] The utility model dissipates heat to the converter by exhausting air, and improves the heat dissipation effect of the converter by mixing cold air during exhausting air. The heat dissipation method can meet the heat dissipation demand of the converter even when the air volume becomes small. There is no need to frequently repair and replace the equipment, and the production efficiency of the rolling mill can be improved.

[0031] The undisclosed parts in the present utility model are all prior art, and their specific structures, materials and working principles are not described in detail. Although the embodiments of the present utility model have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present utility model, and the scope of the present utility model is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation device for a motor converter, comprising a connecting pipe (1) installed at a heat dissipation port of the converter, characterized in that: The air outlet of the connecting pipe (1) is provided with a fan (2), the top of the inverter is provided with an air intake duct (5), the middle of the upper surface of the air intake duct (5) is provided with a semiconductor cooling plate (6), the bottom of the air intake duct (5) corresponding to the semiconductor cooling plate (6) is provided with an air intake, and the cooling surface of the semiconductor cooling plate (6) is provided with a bottom heat sink (8).

2. The heat dissipation device for a motor converter according to claim 1, characterized in that: The heating surface of the semiconductor refrigeration sheet (6) is provided with a top heat sink (7).

3. The heat dissipation device for a motor converter according to claim 2, characterized in that: A heat exhaust duct (3) is provided at a position of the air inlet duct (5) corresponding to the top heat sink (7), and an air outlet of the heat exhaust duct (3) is connected to the connecting pipe (1).

4. The heat dissipation device for a motor converter according to claim 3, characterized in that: A plug plate (41) is movably inserted into the side of the heat exhaust air duct (3), and a telescopic rod (4) connected to the heat exhaust air duct (3) is provided on the plug plate (41).

5. The heat dissipation device for a motor converter according to claim 3, characterized in that: The length direction of the grooves of the heat dissipation fins in the top heat dissipation sheet (7) is consistent with the hot air flow direction of the horizontal portion of the heat exhaust air pipe (3).

6. The heat dissipation device for a motor converter according to claim 1, characterized in that: The bottom of the bottom heat sink (8) corresponding to the air inlet is exposed at the lower side of the air inlet, and the exposed bottom portion of the bottom heat sink (8) gradually becomes longer along its distribution direction.

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