Multi-heat dissipation structure of computer chip

Abstract

The utility model provides a multiple heat dissipation structure of a computer chip, and relates to the technical field of computers. The multi-heat-dissipation structure comprises an installation frame, the installation frame is provided with a chip body and a heat dissipation fan, the installation frame is provided with a heat dissipation assembly attached to the chip body, a refrigeration assembly is arranged between the heat dissipation fan and the heat dissipation assembly, a bearing disc is arranged below the refrigeration assembly in the gravity direction, and the bearing disc is connected with the chip body. The bearing disc is arranged on the mounting frame, and the bottom of the bearing disc is communicated with a drainage pipe. The utility model aims to provide the multiple heat dissipation structure of the computer chip, which can collect and discharge water generated in the refrigeration structure so as to prevent liquid water from flowing to the surface of the chip, so that the effect of protecting the chip can be achieved while multiple cooling is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a multiple heat dissipation structure of a computer chip. Background Art

[0002] The computer chip is the core component of the motherboard. If the CPU is the heart of the entire computer system, then the chipset is the backbone. The literal meaning alone is enough to demonstrate its importance. Computer chips often generate a large amount of heat during operation. If this heat cannot be dissipated quickly, it often leads to damage to the computer chip.

[0003] Patent document CN212515680U discloses a multi-layer heat dissipation structure for computer chips. This device uses a combination of water cooling and air cooling to dissipate heat from the chip, enabling the chip to dissipate heat in multiple ways. However, the water cooling design tends to condense water in the air into small droplets, which in turn exposes the computer chip to a humid environment. In this environment, the chip's internal electrical components are susceptible to moisture, leading to leakage.

[0004] In summary, we propose a multi-heat dissipation structure for computer chips to solve the above problems. Utility Model Content

[0005] The purpose of the present utility model is to provide a multiple heat dissipation structure for computer chips, which can provide a solution to the problem of chip life loss due to the use of refrigeration in existing multiple heat dissipation mechanisms. It has the function of collecting and discharging water generated in the refrigeration structure, thereby preventing liquid water from flowing to the chip surface, achieving multiple cooling while also protecting the chip.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0007] A multiple heat dissipation structure for a computer chip includes a mounting frame, the mounting frame is provided with a chip body and a heat dissipation fan, the mounting frame is provided with a heat dissipation component that is bonded to the chip body, a refrigeration component is provided between the heat dissipation fan and the heat dissipation component, and the refrigeration component is provided with a receiving tray below the refrigeration component in the direction of gravity, the receiving tray is provided on the mounting frame, and the bottom of the receiving tray is connected to a drain pipe.

[0008] Compared with the existing multiple heat dissipation structure, this design method cools the chip body through the combined action of heat conduction and air cooling, and uses the refrigeration component to further enhance the air cooling effect. At the same time, a receiving tray and a drain pipe are set to discharge the liquid condensed in the cold air, avoiding the condensed water of the refrigeration component from remaining in the heat dissipation structure for a long time, which affects the working environment of the chip body, reduces the impact of the refrigeration component on the humidity in the working environment of the chip body, and thus slows down the damage to the chip body caused by humidity.

[0009] As a preferred embodiment, the heat dissipation assembly includes a heat dissipation frame attached to the chip body, and a plurality of heat dissipation fins are provided on the heat dissipation frame at equal intervals.

[0010] The heat sink and heat sink are both made of copper. Copper has high thermal conductivity and can perform the work of heat dissipation components very well.

[0011] As a preferred embodiment, the above-mentioned refrigeration component includes a water-cooling rack arranged in the above-mentioned receiving tray, and a water-cooling copper pipe is spirally arranged on the above-mentioned water-cooling rack. One end of the above-mentioned water-cooling copper pipe is connected to a return water hose, and the other end is connected to a water pump. The above-mentioned return water hose is connected to a cold water tank, and a water inlet pipe is connected between the above-mentioned water pump and the above-mentioned cold water tank, and a refrigeration plate is provided in the above-mentioned cold water tank.

[0012] This design can quickly realize the refrigeration cycle.

[0013] As a preferred embodiment, the cold water tank is provided with a refrigeration pipe, one end of the refrigeration pipe is placed on the ring side of the cold water tank and is provided with an end cover, and the other end is a sealed end, and the ring side of the refrigeration pipe is provided with multiple flow holes.

[0014] The arrangement of multiple flow holes enables the water in the cold water tank to be in a state of ice-water mixture, that is, when the refrigeration plate does not work, ice cubes can be used for emergency treatment, which is more convenient.

[0015] As a preferred embodiment, the bottom of the receiving tray is inclined along the opening of the drain pipe, and the drain pipe is connected to the upper part of the cold water tank.

[0016] The bottom of the receiving pan is tilted so that the water in the receiving pan can flow into the cold water tank as quickly as possible, reducing the problem of water accumulation in the receiving pan.

[0017] As a preferred embodiment, the cold water tank is provided with a filter screen, and the filter screen is located below the drain pipe. The refrigeration pipe and the water inlet pipe both pass through the filter screen and are placed below the filter screen.

[0018] This design can reduce the problem of pipe blockage.

[0019] As a preferred embodiment, the refrigeration assembly and the chip main body bracket are provided with a drying box, a plurality of drying holes are opened on the ring side of the drying box, and a desiccant is provided in the drying box.

[0020] Silica gel desiccant is a preferred desiccant. Silica gel desiccant is a common desiccant currently used. It is not only inexpensive and easy to use, but also has excellent moisture absorption properties. Silica gel desiccant's moisture absorption is based on a chemical reaction. When moisture comes into contact with the silica gel desiccant, it is adsorbed onto the silica gel surface and converted into harmless sodium silicate. Silica gel desiccant also has a long service life.

[0021] The utility model has at least the following advantages or beneficial effects:

[0022] This multiple heat dissipation structure is provided with a cooling component between the cooling fan and the chip body with the heat dissipation component, so that the temperature of the wind used to dissipate heat from the heat dissipation component is reduced, thereby better cooling the chip body. At the same time, a receiving tray and a drain pipe are provided for the cooling component to prevent water vapor in the air from condensing on the cooling component, thereby reducing the risk of water droplets contaminating the chip body. While achieving multiple cooling, the chip body is protected and damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a structural diagram of a multiple heat dissipation structure of a computer chip according to an embodiment of the present utility model;

[0025] Figure 2 This is a partial structural view of a multiple heat dissipation structure of a computer chip according to an embodiment of the present utility model;

[0026] Figure 3 This is a top view of a filter in a multiple heat dissipation structure of a computer chip according to an embodiment of the present invention.

[0027] Icons: 1-mounting frame, 2-chip body, 3-cooling fan, 4-heat dissipation assembly, 5-refrigeration assembly, 6-receiving tray, 7-drain pipe, 8-heat dissipation frame, 9-heat sink, 10-water cooling frame, 11-water cooling copper pipe, 12-return hose, 13-cold water tank, 14-water pump, 15-water inlet pipe, 16-refrigeration plate, 17-refrigeration pipe, 18-end cover, 19-circulation hole, 20-filter, 21-drying box, 22-drying hole, 23-desiccant. DETAILED DESCRIPTION

[0028] Example

[0029] Please refer to Figure 1-Figure 3 A multiple heat dissipation structure for a computer chip includes a mounting frame 1, the mounting frame 1 is provided with a chip body 2 and a heat dissipation fan 3, the mounting frame 1 is provided with a heat dissipation component 4 that is in contact with the chip body 2, a refrigeration component 5 is provided between the heat dissipation fan 3 and the heat dissipation component 4, and the refrigeration component 5 is provided with a receiving tray 6 below the gravity direction. The receiving tray 6 is provided on the mounting frame 1, and a drainage pipe 7 is connected to the bottom of the receiving tray 6.

[0030] The operating principle of this multiple heat dissipation structure is as follows: when the computer chip starts working, the heat dissipation component 4 that dissipates heat by heat conduction starts working, and the heat dissipation fan 3 starts working to accelerate the heat dissipation of the heat dissipation component 4. After the heat dissipation fan 3 starts, the air passes through the refrigeration component 5, and then the air temperature becomes lower. The circulating cold air quickly passes through the heat dissipation component 4, and takes away the heat from the computer chip on the heat dissipation component 4. In this process, the moisture in the air is condensed into water when it enters the area of ​​the refrigeration component 5 and hangs on the outside of the refrigeration component 5. After a period of time, it condenses into water droplets and falls from the refrigeration component 5 to the receiving area under the action of gravity. In the plate 6, water droplets gather in the receiving plate 6 and then leave the multiple heat dissipation structure through the drain pipe 7; compared with the existing multiple heat dissipation structure, this design method cools the chip body 2 through the combined action of heat conduction and air cooling, and uses the refrigeration component 5 to further enhance the air cooling effect. At the same time, the receiving plate 6 and the drain pipe 7 are provided to discharge the condensed liquid in the cold air, avoiding the condensed water of the refrigeration component 5 to remain in the heat dissipation structure for a long time, thereby affecting the working environment of the chip body 2, reducing the impact of the refrigeration component 5 on the humidity in the working environment of the chip body 2, and thus slowing down the damage of the chip body 2 caused by humidity.

[0031] As a preferred embodiment, the heat dissipation assembly 4 includes a heat dissipation frame 8 attached to the chip body 2 , and a plurality of heat dissipation fins 9 are provided on the heat dissipation frame 8 at equal intervals.

[0032] In the above embodiment, the heat sink 9 and the heat sink frame 8 are both made of copper. Copper has high thermal conductivity and can well complete the work of the heat dissipation component 4.

[0033] As a preferred embodiment, the above-mentioned refrigeration assembly 5 includes a water-cooling rack 10 arranged in the above-mentioned receiving tray 6, and a water-cooling copper pipe 11 is spirally provided on the above-mentioned water-cooling rack 10. One end of the above-mentioned water-cooling copper pipe 11 is connected to a return water hose 12, and the other end is connected to a water pump 14. The above-mentioned return water hose 12 is connected to a cold water tank 13, and a water inlet pipe 15 is connected between the above-mentioned water pump 14 and the above-mentioned cold water tank 13. A refrigeration plate 16 is provided in the above-mentioned cold water tank 13.

[0034] In the above embodiment, the water pump 14 is a machine for conveying liquid or pressurizing liquid; the refrigeration plate 16 is also called a thermoelectric semiconductor refrigeration component 5, Peltier, etc.; the water-cooled copper tube 11 is serpentine-shaped and wound on the water-cooling frame 10, which can increase the water cooling area; when cooling is required, the refrigeration plate 16 works, the water temperature in the cold water tank 13 begins to drop, the water pump 14 starts, and the cold water in the water-cooling tank flows into the water-cooling copper tube 11 through the water inlet pipe 15. The heated water in the water-cooling copper tube 11 flows back to the cold water tank 13 through the return hose 12, forming a cold water circulation; this design method can quickly realize the refrigeration cycle.

[0035] As a preferred embodiment, the cold water tank 13 is provided with a refrigeration pipe 17, one end of the refrigeration pipe 17 is placed on the ring side of the cold water tank 13 and is provided with an end cover 18, and the other end is a sealed end, and the ring side of the refrigeration pipe 17 is provided with multiple flow holes 19.

[0036] In the above embodiment, the end cover 18 is threadedly connected to the cold water tank 13, and a sealing ring is provided on the end cover 18 for sealing with the refrigeration pipe 17. When refrigeration is required, the end cover 18 is first opened and ice cubes are put into the refrigeration pipe 17. Due to the provision of multiple flow holes 19, the water in the cold water tank 13 is in a state of ice-water mixture, that is, when the refrigeration plate 16 is not working, ice cubes can be used for emergency treatment, which is more convenient.

[0037] As a preferred embodiment, the bottom of the receiving pan 6 is tilted along the opening of the drain pipe 7 , and the drain pipe 7 is connected to the upper part of the cold water tank 13 .

[0038] In the above embodiment, the bottom of the receiving pan 6 is tilted, so that the water in the receiving pan 6 can flow into the cold water tank 13 as quickly as possible, reducing the problem of water storage in the receiving pan 6; a liquid one-way valve can be preferably provided in the drain pipe 7 to prevent the water in the cold water tank 13 from flowing back.

[0039] As a preferred embodiment, the cold water tank 13 is provided with a filter 20, and the filter 20 is located below the drain pipe 7. The refrigeration pipe 17 and the water inlet pipe 15 both pass through the filter 20 and are placed below it.

[0040] In the above method, the filter 20 is arranged below the drain pipe 7, which can prevent the dust left on the refrigeration component 5 from entering the bottom of the cold water tank 13 through the drain pipe 7, and further prevent the large particles of impurities contained in the water from entering the interior of the refrigeration component 5 through the water inlet pipe 15, thereby reducing the problem of pipe blockage.

[0041] As a preferred embodiment, the refrigeration assembly 5 and the chip body 2 support are provided with a drying box 21 , a plurality of drying holes 22 are opened on the circumference of the drying box 21 , and a desiccant 23 is provided inside the drying box 21 .

[0042] In the above embodiment, a cover plate is hingedly connected to the drying box 21 and is engaged with the drying box 21. The cover plate may be provided with multiple circular holes. Silica gel desiccant is preferably used as the desiccant 23. Silica gel desiccant is a common desiccant currently used. Silica gel desiccant is not only inexpensive and easy to use, but also has excellent moisture absorption properties. Silica gel desiccant's moisture absorption is based on a chemical reaction. When moisture comes into contact with the silica gel desiccant, it is adsorbed onto the silica gel surface and converted into harmless sodium silicate. Silica gel desiccant also has a long service life.

[0043] In summary, the embodiments of the present invention provide a multiple heat dissipation structure for a computer chip, which has at least the following beneficial effects: in the present invention, a receiving tray 6 is provided below the refrigeration component 5 and is connected to a drain pipe 7. While cleverly using air cooling for heat dissipation, the refrigeration component 5 is introduced to cool the circulating air. At the same time, it can prevent moisture in the air from flowing onto the chip body 2, thereby reducing the degree of damage to the chip body 2 caused by cooling, and ensuring the service life of the chip body 2.

[0044] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A multiple heat dissipation structure for a computer chip, characterized in that: It includes a mounting frame, the mounting frame is provided with a chip body and a cooling fan, the mounting frame is provided with a cooling component that is bonded to the chip body, a refrigeration component is provided between the cooling fan and the cooling component, the refrigeration component is provided with a receiving tray below the gravity direction, the receiving tray is arranged on the mounting frame, and the bottom of the receiving tray is connected to a drain pipe.

2. The multiple heat dissipation structure of a computer chip according to claim 1, characterized in that: The heat dissipation component comprises a heat dissipation frame attached to the chip body, and a plurality of heat dissipation fins are arranged on the heat dissipation frame at equal intervals.

3. The multiple heat dissipation structure of a computer chip according to claim 2, characterized in that: The refrigeration component includes a water-cooling rack arranged in the receiving plate, a water-cooling copper pipe is spirally arranged on the water-cooling rack, one end of the water-cooling copper pipe is connected to a return hose, and the other end is connected to a water pump, the return hose is connected to a cold water tank, a water inlet pipe is connected between the water pump and the cold water tank, and a refrigeration plate is arranged in the cold water tank.

4. The multiple heat dissipation structure of a computer chip according to claim 3, characterized in that: The cold water tank is provided with a refrigeration pipe, one end of the refrigeration pipe is placed on the ring side of the cold water tank and is provided with an end cover, and the other end is a sealed end, and the ring side of the refrigeration pipe is provided with a plurality of flow holes.

5. The multiple heat dissipation structure of a computer chip according to claim 4, characterized in that: The bottom of the receiving pan is arranged obliquely along the opening of the drain pipe, and the drain pipe is connected to the upper part of the cold water tank.

6. The multiple heat dissipation structure of a computer chip according to claim 5, characterized in that: The cold water tank is provided with a filter screen, and the filter screen is located below the drain pipe. The refrigeration pipe and the water inlet pipe both pass through the filter screen and are placed below the filter screen.

7. The multiple heat dissipation structure of a computer chip according to claim 1, characterized in that: The refrigeration assembly and the chip main body bracket are provided with a drying box, a plurality of drying holes are opened on the ring side of the drying box, and a desiccant is arranged in the drying box.

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