Nano-silver packaging base structure based on VCSEL laser diode

Abstract

The utility model provides a nanometer silver packaging pedestal structure based on a VCSEL laser diode, and relates to the laser diode field, the nanometer silver packaging pedestal structure comprises a housing, a sealing cover and a DBC substrate, the housing is clamped with the sealing cover, the DBC substrate is fixedly installed on the inner side wall of the sealing cover, the DBC substrate is covered with nanometer silver soldering paste used for connecting a VCSEL chip, the bottom of the housing is provided with a placing groove, and the placing groove is provided with a groove. The DBC substrate has the advantages that the DBC substrate is provided with the accommodating groove, the transparent light-emitting plate is adhered in the accommodating groove, the shell is clamped with the sealing cover, so that on one hand, quick packaging can be effectively performed, on the other hand, the shell can be timely opened for maintenance when the inside is damaged, and the transparent light-emitting plate is adhered in the accommodating groove and seals the bottom of the shell while light emission is not affected, so that protection of the DBC substrate can be improved.

Description

Technical Field

[0001] The utility model relates to the field of laser diodes, in particular to a nano silver packaging base structure based on a VCSEL laser diode. Background Art

[0002] Infrared is an electromagnetic wave with a wavelength between microwaves and visible light, ranging from 760 nanometers to 1 millimeter. It is longer than red light and is invisible. The specific wavelength of infrared can be used to treat human diseases. By irradiating the diseased parts of the human body with the corresponding wavelength, some bacteria can be killed. At the same time, different wavelengths can stimulate the activity of cells inside the body, improve the body's metabolism, and improve the health of the body.

[0003] VCSEL (Vertical Cavity Surface Emitting Laser) laser diode is a common laser source that can emit light of various wavelengths, including visible light and near-infrared light. It is widely used in the biomedical field. The packaging of VCSEL laser diodes is currently based on VCSEL chips and alumina thermal conductive substrates. The VCSEL chip is bonded to the alumina thermal conductive substrate and then filled with sealing glue to seal it. However, since the thermal expansion and contraction coefficient of the chip itself does not match that of the substrate, it is easy to crack and fail after the chip is heated or shrunk at low temperature, and the chip in the sealing glue is not easy to remove.

[0004] Therefore, it is necessary to provide a new nanosilver packaging base structure based on VCSEL laser diode to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a nano silver packaging base structure based on VCSEL laser diode.

[0006] The nano-silver packaging base structure based on VCSEL laser diode provided by the utility model comprises a shell, a cover and a DBC substrate, wherein the shell is engaged with the cover, the DBC substrate is fixedly installed on the inner wall of the cover, the DBC substrate is covered with nano-silver solder paste for connecting the VCSEL chip, and a placement groove is provided at the bottom of the shell, in which a transparent light emitting plate is bonded.

[0007] Furthermore, a plurality of heat dissipation holes are provided on the DBC substrate, and the plurality of heat dissipation holes are respectively located on both sides of the VCSEL chip.

[0008] Furthermore, a card seat is fixedly connected to the outer side of the shell, a card slot is provided on the top of the card seat, and an elastic card plate is provided on the outer side of the cover, and the elastic card plate is engaged with the card slot.

[0009] Furthermore, one end of the elastic clamp is fixedly connected to the outer side of the cover, and one end of the elastic clamp away from the cover is bent downward and is elastic.

[0010] Furthermore, one bent end of the elastic clamping plate is interference-fitted with an inner wall of a clamping groove at the top of the clamping seat.

[0011] Furthermore, a plurality of heat dissipation pins are provided on both sides of the DBC substrate, and through slots for the heat dissipation pins to pass through are respectively provided on both sides of the shell.

[0012] Compared with the related art, the nano silver packaging base structure based on VCSEL laser diode provided by the utility model has the following beneficial effects:

[0013] 1. The engagement of the shell and the cover can effectively and quickly seal the shell, and can be opened and repaired in time when the inside is damaged.

[0014] 2. A transparent light emitting plate is bonded in the placement groove. The transparent light emitting plate seals the bottom of the shell without affecting the light output, which can improve the protection of the DBC substrate. In addition, the DBC substrate has a better thermal conductivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of the nano-silver packaging base structure based on the VCSEL laser diode provided by the utility model;

[0016] Figure 2 A schematic cross-sectional view of a nano-silver packaging base structure based on a VCSEL laser diode provided by the utility model;

[0017] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of shown;

[0018] Figure 4 This is a schematic diagram of the disassembled structure of the nano-silver packaging base structure based on the VCSEL laser diode provided by the utility model.

[0019] Numbers in the figure: 1, shell; 2, cover; 3, DBC substrate; 4, nano silver solder paste; 5, placement slot; 6, transparent light output plate; 7, heat dissipation hole; 8, card seat; 9, elastic card board; 10, heat dissipation pin; 11, VCSEL chip. DETAILED DESCRIPTION

[0020] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0021] Please refer to Figure 1 , Figure 2 , Figure 3 as well as Figure 4 ,in, Figure 1 This is a schematic diagram of the overall structure of the nano-silver packaging base structure based on the VCSEL laser diode provided by the utility model; Figure 2 A schematic cross-sectional view of a nano-silver packaging base structure based on a VCSEL laser diode provided by the utility model; Figure 3 for Figure 2 A schematic diagram of the enlarged structure of shown; Figure 4 This is a schematic diagram of the disassembled structure of the nano-silver packaging base structure based on the VCSEL laser diode provided by the utility model.

[0022] In the specific implementation process, Figure 1-Figure 4 As shown, the nanosilver package base structure based on the VCSEL laser diode includes a shell 1, a cover 2 and a DBC substrate 3, the shell 1 is engaged with the cover 2, the DBC substrate 3 is fixedly installed on the inner wall of the cover 2, the DBC substrate 3 is covered with a nanosilver solder paste 4 for connecting the VCSEL chip 11, a placement groove 5 is provided at the bottom of the shell 1, a transparent light emitting plate 6 is bonded in the placement groove 5, a plurality of heat dissipation pins 10 are also provided on both sides of the DBC substrate 3, through grooves for the heat dissipation pins 10 to pass through are respectively provided on both sides of the shell 1, a plurality of heat dissipation holes 7 are also provided on the DBC substrate 3, and the plurality of heat dissipation holes 7 are respectively located on both sides of the VCSEL chip 11, and the heat dissipation pins 10 and the heat dissipation holes 7 can effectively improve the heat dissipation effect;

[0023] The transparent light output plate 6 can be bonded by gluing or welding, preferably by gluing. In addition, in order to ensure the service life of the light output plate, the depth of the placement groove 5 should be greater than the thickness of the light output plate to avoid direct contact between the light output plate and the outside;

[0024] It should be noted that the VCSEL chip 11 is fixed in the following manner: a layer of nano-silver solder paste 4 is screen-printed on the upper surface of the DBC substrate 3, pre-baked and dried in the air to remove excess organic solvent, and then the VCSEL chip 11 is placed on the nano-silver paste using an automatic suction device, and pressure sintering is performed using a sintering press, and a nano-silver pressureless sintering slurry is applied to the chip and the substrate surface above the VCSEL chip 11 using a glue dispenser to perform pressureless sintering of the silver molded solder sheet, thereby completing the installation and fixation of the VCSEL chip 11;

[0025] A card seat 8 is fixedly connected to the outer side of the housing 1, a card slot is opened on the top of the card seat 8, and an elastic card plate 9 is provided on the outer side of the cover 2. The elastic card plate 9 is engaged with the card slot, and one end of the elastic card plate 9 is fixedly connected to the outer side of the cover 2. The end of the elastic card plate 9 away from the cover 2 is bent downward and has elasticity, and the bent end of the elastic card plate 9 is interference fit with the inner wall of the card slot at the top of the card seat 8;

[0026] It should be noted that the elastic card plate 9 is fixed to the outer side of the cover 2 in an integrated manner, so that the elastic card plate 9 maintains better elasticity. One end of the elastic card plate 9 is inserted into the card slot at the top of the card seat 8. One end of the elastic card plate 9 provides an extrusion force outward and applies it to the inner side of the card slot, so that the cover 2 and the shell 1 are not easy to loosen and can be disassembled. On the one hand, it can be effectively packaged quickly, and on the other hand, it can be opened in time for maintenance when the internal part is damaged;

[0027] The working principle provided by the utility model is as follows: when the structure is used, one end of the elastic card plate 9 is inserted into the card slot on the top of the card seat 8, and the one end of the elastic card plate 9 provides an extrusion force outward and applies it to the inner side of the card slot, so that the cover 2 and the shell 1 are not easy to loosen. At this time, multiple heat dissipation pins 10 on both sides of the DBC substrate 3 are aligned with the through slots on the shell 1, so that the multiple heat dissipation pins 10 are engaged in the through slots to complete the fixation of the DBC substrate 3. In addition, the heat dissipation pins 10 can be combined with the heat dissipation holes 7 to effectively improve the heat dissipation effect.

[0028] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0029] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A nanosilver packaging base structure based on VCSEL laser diode, characterized in that: The invention comprises a shell (1), a cover (2) and a DBC substrate (3), wherein the shell (1) is engaged with the cover (2), the DBC substrate (3) is fixedly mounted on the inner wall of the cover (2), the DBC substrate (3) is covered with nano silver solder paste (4) for connecting a VCSEL chip (11), and a placement groove (5) is provided at the bottom of the shell (1), and a transparent light emitting plate (6) is bonded in the placement groove (5).

2. The nanosilver packaging base structure based on VCSEL laser diode according to claim 1, characterized in that: The DBC substrate (3) is also provided with a plurality of heat dissipation holes (7), and the plurality of heat dissipation holes (7) are respectively located on both sides of the VCSEL chip (11).

3. The nanosilver packaging base structure based on VCSEL laser diode according to claim 2, characterized in that: A card seat (8) is fixedly connected to the outer side of the shell (1), a card slot is provided on the top of the card seat (8), and an elastic card plate (9) is provided on the outer side of the cover (2), and the elastic card plate (9) is engaged with the card slot.

4. The nanosilver packaging base structure based on VCSEL laser diode according to claim 3, characterized in that: One end of the elastic clamping plate (9) is fixedly connected to the outer side of the cover (2), and one end of the elastic clamping plate (9) away from the cover (2) is bent downward and has elasticity.

5. The nanosilver packaging base structure based on VCSEL laser diode according to claim 4, characterized in that: One bent end of the elastic clamping plate (9) is interference-fitted with the inner wall of the clamping groove at the top of the clamping seat (8).

6. The nanosilver packaging base structure based on VCSEL laser diode according to claim 5, characterized in that: A plurality of heat dissipation pins (10) are also provided on both sides of the DBC substrate (3), and through slots for the heat dissipation pins (10) to pass through are respectively provided on both sides of the housing (1).

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