Improved groove type gate associated transistor

Abstract

The utility model relates to the technical field of transistors, in particular to an improved groove type gate associated transistor. Comprising a shell, the shell is in a circular ring shape, the two ends of the shell are each of an open structure, one end of the shell is provided with a heat dissipation assembly used for cooling the associated gate transistor, and the shell is internally provided with a cooling assembly used for further cooling the associated gate transistor; the cooling assembly comprises a temperature controller and a cooling pipe. According to the utility model, through the arrangement of the cooling assembly, when heat dissipation is carried out on the associated gate transistor, the heat dissipation fan guides external air into the housing, when the air is blown to the associated gate transistor, the air passes through the cooling pipe, so that the air blown to the associated gate transistor is cooled by the cooling pipe, and when the external temperature is relatively high, the air is cooled by the cooling pipe. The temperature of air blown to the gate associated transistor is always kept at a low temperature, so that the heat dissipation effect of the gate associated transistor is improved, and the heat dissipation efficiency of the gate associated transistor is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of transistors, and particularly relates to an improved trench-type gate-coupled transistor. Background Art

[0002] A transistor is a solid semiconductor device that has multiple functions such as detection, rectification, amplification, switching, voltage regulation, and signal modulation. As a variable current switch, a transistor can control the output current based on the input voltage. Unlike ordinary mechanical switches, transistors use electrical signals to control their own opening and closing, and the switching speed can be very fast. The switching speed in the laboratory can reach more than 100GHz.

[0003] After searching, in the prior art, Chinese patent application number: CN202222654978.2 discloses an improved slot-type gate transistor, including a shell, a gate transistor body, a heat sink and a cooling fan, the shell is a cylindrical shell with a hollow interior, the gate transistor is arranged in the shell, the inner wall of the shell and the gate transistor body are connected by at least one heat sink, an air duct is formed between the shell, the gate transistor body and the heat sink, the cooling fan is installed at one end of the shell, and a vent is provided at the other end of the shell. The beneficial effects of the utility model include: the heat generated by the gate transistor body during operation can be transferred to the heat sink and dissipated into the air duct through the heat sink, the heat outside the shell can be blown into the air duct through the heat sink to circulate the air in the air duct, so that the heat in the air duct can be blown out of the air duct through the vent, and the heat on the surface of the gate transistor body can be quickly reduced, thereby extending the service life of the gate transistor body.

[0004] However, the device still has the following defects:

[0005] When the device is cooling the tandem-gate transistor, air is supplied into the housing through the cooling fan, and the air cools the tandem-gate transistor through the housing. Since the cooling fan directly guides the external air at normal temperature into the interior of the housing, the heat dissipation efficiency of the tandem-gate transistor changes with the external temperature. When the external temperature is high, the temperature of the air entering the housing is high, resulting in poor heat dissipation effect of the tandem-gate transistor and low heat dissipation efficiency. Utility Model Content

[0006] The purpose of the utility model is to provide an improved slot-type tandem transistor, which can effectively reduce the temperature of the air blown onto the tandem transistor by a cooling fan through a cooling component, so that when the outside temperature is high, the temperature of the air blown onto the tandem transistor is always maintained at a low temperature, thereby improving the heat dissipation effect of the tandem transistor and accelerating the heat dissipation efficiency of the tandem transistor to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above object, the utility model provides the following technical solutions: an improved trench-type bisector transistor, comprising a housing, the housing is in a ring shape, and both ends of the housing are open structures, a heat dissipation component for cooling the bisector transistor is installed at one end of the housing, and a cooling component for further cooling the bisector transistor is installed in the housing;

[0008] The cooling assembly includes a temperature controller and a cooling pipe. The temperature controller is installed on the outer wall of the shell, and the cooling pipe is installed inside the shell. The cooling pipe is a continuous S-shaped structure. Both ends of the temperature controller penetrate the side wall of the shell and extend to the inside of the shell. The two ends of the temperature controller are respectively installed on the two ends of the cooling pipe.

[0009] The heat dissipation assembly comprises a second mounting plate, the second mounting plate is mounted on one end of the housing, and a heat dissipation fan is mounted on one end of the second mounting plate close to the cooling pipe;

[0010] The heat dissipation assembly also includes a mounting block, which has a circular ring-shaped structure and is clamped on the inner wall of one end of the shell. A plurality of groups of second connecting rods are installed on the side wall of the second mounting plate. The plurality of groups of second connecting rods are equidistantly arranged in a ring around the central axis of the second mounting plate, and the ends of the plurality of second connecting rods away from the second mounting plate are installed on the inner wall of the mounting block. The mounting block is provided with two groups of adjustment grooves, and the two groups of adjustment grooves are symmetrically arranged around the central line of the mounting block. The side wall of the mounting block is provided with two groups of movable grooves, and the two groups of movable grooves are respectively connected with the two groups of adjustment grooves. A spring is installed on the inner wall of one side of the adjustment groove, and a pull plate is installed at one end of the spring. The pull plate is slidably connected in the adjustment groove. A fixing rod is installed on the side of the pull plate away from the spring, and a clamping block is installed at the end of the fixing rod away from the pull plate. The clamping block is slidably connected in the movable groove, and the end of the clamping block away from the fixing rod is set to an inclined surface.

[0011] Furthermore, a first mounting plate is installed at the other end of the shell, and a bis-gate transistor body is installed at one end of the first mounting plate close to the cooling pipe through bolts.

[0012] Furthermore, a plurality of first connecting rods are installed on the side wall of the first mounting plate, the plurality of first connecting rods are equidistantly arranged in a ring around the central axis of the first mounting plate, and the ends of the plurality of first connecting rods away from the first mounting plate are all installed on the inner wall of the outer shell.

[0013] The beneficial effects of the utility model are:

[0014] The utility model arranges a cooling component. When the cooling of the tandem transistor is performed, the cooling fan introduces external air into the shell. When the air is blown toward the tandem transistor, the air passes through the cooling pipe, so that the cooling pipe cools the air blown onto the tandem transistor. When the external temperature is high, the temperature of the air blown onto the tandem transistor is always maintained at a low temperature, thereby improving the heat dissipation effect of the tandem transistor and accelerating the heat dissipation efficiency of the tandem transistor.

[0015] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by implementing the utility model. The purpose and other advantages of the utility model can be realized and obtained by the structures indicated in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the structure according to an embodiment of the utility model is shown;

[0018] Figure 2 A rear view structural schematic diagram according to an embodiment of the utility model is shown;

[0019] Figure 3 A schematic diagram of the internal structure according to an embodiment of the utility model is shown;

[0020] Figure 4 A schematic diagram of the structure of a heat dissipation assembly according to an embodiment of the utility model is shown;

[0021] Figure 5 A partial structural schematic diagram of a mounting block according to an embodiment of the utility model is shown.

[0022] In the figure: 110, housing; 120, first mounting plate; 130, first connecting rod; 140, gate transistor body; 210, second mounting plate; 211, second connecting rod; 220, mounting block; 230, adjustment slot; 240, moving slot; 250, spring; 260, pull plate; 270, fixing rod; 280, clamping block; 290, cooling fan; 310, temperature controller; 320, cooling pipe. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-5 The utility model provides a technical solution: an improved trench-type bisector transistor. The utility model comprises a housing 110, the housing 110 is in a circular ring shape, and both ends of the housing 110 are open structures, a heat dissipation component for cooling the bisector transistor is installed at one end of the housing 110, and a cooling component for further cooling the bisector transistor is installed in the housing 110;

[0025] The cooling assembly includes a temperature controller 310 and a cooling pipe 320, wherein the temperature controller 310 is mounted on the outer wall of the housing 110, and the cooling pipe 320 is mounted inside the housing 110. The cooling pipe 320 is a continuous S-shaped structure, and both ends of the temperature controller 310 penetrate the side wall of the housing 110 and extend to the inside of the housing 110, and both ends of the temperature controller 310 are mounted on both ends of the cooling pipe 320, respectively.

[0026] When cooling the tandem transistor, the heat dissipation component blows the outside air into the housing 110. The air entering the housing 110 passes through the cooling pipe 320 and then blows onto the tandem transistor. Under the action of the cooling pipe 320, the air is cooled, thereby reducing the temperature of the air, so that the temperature of the air blown onto the tandem transistor is always maintained at a relatively low temperature, thereby improving the heat dissipation effect of the tandem transistor and accelerating the heat dissipation efficiency of the tandem transistor. The temperature controller 310 is used to control the flow of cooling water in the cooling pipe 320 and the cooling of the cooling water, so that when the air contacts the cooling pipe 320, the cooling pipe 320 and the air are heat-exchanged to reduce the temperature of the air.

[0027] A first mounting plate 120 is mounted on the other end of the housing 110, and a tandem transistor body 140 is mounted on one end of the first mounting plate 120 close to the cooling pipe 320 by bolts. Multiple groups of first connecting rods 130 are mounted on the side wall of the first mounting plate 120, and the multiple groups of first connecting rods 130 are arranged in an annular manner with equal distances around the central axis of the first mounting plate 120, and the ends of the multiple groups of first connecting rods 130 away from the first mounting plate 120 are all mounted on the inner wall of the housing 110.

[0028] The heat dissipation assembly includes a second mounting plate 210, which is mounted at one end of the housing 110, and a heat dissipation fan 290 is mounted at one end of the second mounting plate 210 close to the cooling pipe 320. The heat dissipation assembly also includes a mounting block 220, which is in a circular ring structure and is clamped on the inner wall of one end of the housing 110. Multiple groups of second connecting rods 211 are mounted on the side wall of the second mounting plate 210, and the multiple groups of second connecting rods 211 are arranged in an annular manner with the central axis of the second mounting plate 210 as the center, and the multiple groups of second connecting rods 211 are mounted on the inner wall of the mounting block 220 at one end away from the second mounting plate 210. Two groups of adjusting grooves 230 are provided on the mounting block 220, and the two groups of adjusting grooves 230 are symmetrically arranged with the center line of the mounting block 220 as the center. Two groups of movable grooves 240 are provided on the side wall of the mounting block 220, and the two groups of movable grooves 240 are respectively connected with the two groups of adjusting grooves 230. A spring 250 is installed on the inner wall of one side of the adjusting groove 230, and a pull plate 260 is installed at one end of the spring 250. The pull plate 260 is slidably connected in the adjusting groove 230. A fixing rod 270 is installed on the side of the pull plate 260 away from the spring 250, and a clamping block 280 is installed on the end of the fixing rod 270 away from the pull plate 260. The clamping block 280 is slidably connected in the movable groove 240, and the end of the clamping block 280 away from the fixing rod 270 is set as an inclined surface.

[0029] A slot for cooperating with the clamping block 280 is provided on the inner wall of one end of the housing 110 , thereby facilitating the fixing of the mounting block 220 .

[0030] The heat dissipation fan 290 is used to blow external air into the housing 110 , thereby achieving air flow in the housing 110 , discharging heat from the BIGBET body 140 , and reducing the temperature of the BIGBET body 140 .

[0031] When the cooling fan 290 is damaged, the pull plate 260 is pulled so that the pull plate 260 drives the block 280 to move through the fixed rod 270, and the block 280 is moved into the movable groove 240, thereby separating the block 280 and the shell 110, releasing the limit on the cooling fan 290, and then the cooling fan 290 can be disassembled and repaired or replaced.

[0032] Specifically, the internal electrical connection structure of the tandem transistor body 140, the cooling fan 290 and the temperature controller 310 is well known to those skilled in the art and will not be described in detail herein. The electrical components in this application are all connected to an external power source when in use.

[0033] The circuits, electrical components and modules involved are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by this utility model does not involve improvements to the software.

[0034] The control method of the present application document is automatic control through a controller. The control circuit of the controller can be realized by simple programming by technicians in this field, which is common knowledge in this field. In addition, the present application document is mainly used to protect mechanical devices, so the present application document will no longer explain the control method and circuit connection in detail.

[0035] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An improved trench-type tandem-gate transistor, characterized in that: The invention comprises a shell (110), the shell (110) is in a ring shape, and both ends of the shell (110) are open structures, one end of the shell (110) is equipped with a heat dissipation component for cooling the bisector transistor, and the shell (110) is equipped with a cooling component for further cooling the bisector transistor; The cooling assembly comprises a temperature controller (310) and a cooling pipe (320), wherein the temperature controller (310) is mounted on the outer wall of the housing (110), and the cooling pipe (320) is mounted inside the housing (110), and the cooling pipe (320) is a continuous S-shaped structure, and both ends of the temperature controller (310) penetrate the side wall of the housing (110) and extend to the inside of the housing (110), and the two ends of the temperature controller (310) are respectively mounted on the two ends of the cooling pipe (320); The heat dissipation assembly comprises a second mounting plate (210), the second mounting plate (210) being mounted on one end of the housing (110), and a heat dissipation fan (290) being mounted on one end of the second mounting plate (210) close to the cooling pipe (320); The heat dissipation assembly further comprises a mounting block (220), the mounting block (220) being in a circular ring-shaped structure, and the mounting block (220) being clamped on the inner wall of one end of the housing (110), a plurality of groups of second connecting rods (211) being mounted on the side wall of the second mounting plate (210), the plurality of groups of second connecting rods (211) being arranged in a circular shape and equidistantly with the central axis of the second mounting plate (210) as the center, and the plurality of groups of second connecting rods (211) being mounted on the inner wall of the mounting block (220) at one end away from the second mounting plate (210), the mounting block (220) being provided with two groups of adjustment grooves (230), the two groups of adjustment grooves (230) being symmetrically arranged with the central axis of the mounting block (220) as the center, and the mounting block (220) being provided with a plurality of adjustment grooves (230). Two groups of movable grooves (240) are provided on the side wall of the movable groove (220), and the two groups of movable grooves (240) are respectively connected with the two groups of adjusting grooves (230), and a spring (250) is installed on the inner wall of one side of the adjusting groove (230), and a pull plate (260) is installed at one end of the spring (250), and the pull plate (260) is slidably connected in the adjusting groove (230), and a fixing rod (270) is installed on the side of the pull plate (260) away from the spring (250), and a clamping block (280) is installed on the end of the fixing rod (270) away from the pull plate (260), and the clamping block (280) is slidably connected in the movable groove (240), and the end of the clamping block (280) away from the fixing rod (270) is set as an inclined surface.

2. The improved trench-type tandem-gate transistor according to claim 1, characterized in that: A first mounting plate (120) is installed at the other end of the housing (110), and a bisector transistor body (140) is installed at one end of the first mounting plate (120) close to the cooling pipe (320) via bolts.

3. The improved trench-type tandem-gate transistor according to claim 2, characterized in that: A plurality of groups of first connecting rods (130) are installed on the side wall of the first mounting plate (120), and the plurality of groups of first connecting rods (130) are equidistantly arranged in a ring shape with the central axis of the first mounting plate (120) as the center, and the ends of the plurality of groups of first connecting rods (130) away from the first mounting plate (120) are all installed on the inner wall of the outer shell (110).

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