Soldering lug material gun of high-speed chip mounter

Abstract

The utility model discloses a high-speed chip mounter soldering lug material gun which comprises a material gun shell, a control assembly arranged on the rear side of the material gun shell, a display screen arranged in the middle of the top of the control assembly, a discharging assembly arranged at the bottom of the material gun shell, and a soldering lug channel arranged at the top of the material gun shell. A cutter is arranged at the top of the front side of the material gun shell, a first induction photoelectric device monitors that materials arrive, the materials are pressed through a pressing device, then the materials are limited through a soldering tin material roll material width limiting assembly, and the materials further penetrate through the bottom of a material belt pressing plate to prevent a soldering tin material roll from deviating in the moving process; the wide limiting assembly and the limiting device of the material belt pressing plate can ensure that the soldering tin material roll is kept stable in the moving process, deviation is avoided, accurate arrangement and welding quality of the soldering tin material are guaranteed, the soldering tin material roll is limited and traversed, the positioning accuracy of the material can be improved, the accuracy and consistency of welding spots are guaranteed, and the welding quality of the soldering tin material roll is improved. Therefore, the welding efficiency and quality are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field related to soldering guns, and in particular relates to a high-speed chip placement machine soldering gun. Background Art

[0002] A soldering gun is a device used to cut solder bars. Solder bars are usually composed of solder alloy and flux. The solder bars are in the form of strips, which are convenient for cutting and carrying when used. The use of solder bars usually requires heating them to melt them and apply them to the surface of the components to be welded to form a welding connection. Solder bars are usually used for manual welding and repair welding, and are widely used in electronic components, circuit boards, electrical appliances, metal products and other fields. The advantages of solder bars include easy use, flexible operation, and suitability for small welding projects. At the same time, solder bars with different compositions can also be selected as needed to meet specific welding requirements. When using solder bars for welding, welders usually need to melt the solder bar and apply it to the solder joint, and then solidify it by cooling to form a firm welding connection. During the welding process, the welding material on the solder bar will chemically react with the surface of the weldment to form a stable welding joint.

[0003] However, the solder strip of the existing soldering gun often deviates during movement, and the cutting of the solder strip is also very uneven, resulting in uneven surface area and inconsistent thickness of the solder strip, causing weak points in the welding connection and affecting the welding strength. Utility Model Content

[0004] The purpose of the present utility model is to provide a high-speed chip placement machine soldering gun to solve the problem proposed in the above background technology that the solder strip of the existing soldering gun often deviates during movement, and the cutting of the solder strip is also very uneven, resulting in uneven surface area and inconsistent thickness of the solder strip, causing weak points in the welding connection part, and affecting the welding strength.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-speed chip placement machine soldering gun, comprising a gun housing;

[0006] A control assembly is provided at the rear side of the material gun housing, a display screen is provided at the top middle position of the control assembly, a discharging assembly is provided at the bottom position of the material gun housing, a first guide roller is provided at the right side of the discharging assembly, a second guide roller is provided above the first guide roller, a solder sheet roll is placed on the discharging assembly, and the high-speed placement machine solder sheet gun is powered by an external power supply;

[0007] A welding piece channel is provided at the top position of the material gun housing, a power supply connector is provided at the front side position of the material gun housing, and a cutter is provided at the top position of the front side of the material gun housing.

[0008] Preferably, a clamping device is provided at the right side of the welding plate channel, a first photoelectric induction device is provided at the right side of the clamping device, a material width limiting component is provided at the right side of the first photoelectric induction device, a material strip pressure plate is provided at the right side of the material width limiting component, a protective cover is provided at the right side of the material strip pressure plate, and the protective cover is clamped and connected to the material gun housing.

[0009] Preferably, a discharge port is provided at the bottom right side of the protective cover plate, a negative pressure adsorption hole is provided at the right side of the discharge port, a cutter is provided at the right side of the negative pressure adsorption hole, and a second photoelectric induction device is provided at the left and right sides of the cutter respectively.

[0010] Preferably, positioning pieces are respectively provided at the upper and lower sides of the power connector, the positioning pieces are fixedly connected to the gun housing by bolts, and a clamping piece is provided at the middle position of the bottom of the gun housing.

[0011] Preferably, a base is provided at a position below the gun housing, placement slots are provided in an array at a position above the base, and a snap-in slot is provided at a position inside the placement slot.

[0012] Preferably, an array of joint holes is provided at an upper position on the front side of the base, and positioning holes are provided on the upper and lower sides of the joint holes respectively.

[0013] Preferably, an adsorption motor is provided at a position above the positioning member, a fixing member is provided at a bottom position of the base, a bolt hole is provided at an internal position of the fixing member, and the base is made of steel.

[0014] Compared with the prior art, the present invention provides a high-speed chip mounter soldering gun, which has the following beneficial effects:

[0015] 1. Through the arrangement of the soldering passage, the clamping device, the first inductive photoelectric device, the material width limiting component, the material belt pressing plate, the protective cover, the material outlet, the negative pressure adsorption hole, the cutter and the second inductive photoelectric device, the solder material coil is installed on the material discharge component, so that the solder material coil is wound from the first guide roller to the second guide roller and enters the soldering passage. The first inductive photoelectric device detects the arrival of the material and presses the material through the clamping device. Then the solder material coil material width limiting component limits the material. The material further passes through the bottom of the material belt pressing plate to prevent the solder material coil from deflecting during movement. The solder material coil is discharged from the material outlet, left The second photoelectric sensing device on the right side senses the arrival of the solder coil, and the cutter starts to cut the solder ribbon. At the same time, the negative pressure adsorption hole is opened to suck the material to prevent deviation and strain. After the cutting is completed, the placement machine takes away the material, and the soldering gun continues the above process. The wide limit assembly and the limit device of the material strip pressure plate can ensure that the solder coil remains stable during movement, avoids deviation, and ensures the accurate arrangement of the solder material and the welding quality. By limiting and crossing the solder coil, the positioning accuracy of the material can be improved, ensuring the accuracy and consistency of the solder joints, thereby improving the welding efficiency and quality.

[0016] 2. Through the arrangement of the base, placement slots, clamping slots, connector holes and positioning holes, the placement slots arranged in an array at the top of the base can be connected to the welding gun for placement. At the same time, the clamping slots arranged at the inner position of the placement slots correspond to the clamping parts at the bottom of the welding gun. The positioning holes opened on the upper and lower sides of the connector holes can correspond to the positioning parts to limit the welding gun. At the same time, the connector hole in the middle position can be used for power connection to power the internal device. At the same time, the base can hold multiple welding guns to improve the operating efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural diagram of the present utility model.

[0018] Figure 2 This is a schematic diagram of the structure of the first photoelectric sensor in the present invention.

[0019] Figure 3 This is a schematic structural diagram of the cutter in the utility model.

[0020] Figure 4 It is a structural schematic diagram of the base in the utility model.

[0021] Figure 5 It is a structural schematic diagram of the cross section of the base and the placement machine in the utility model.

[0022] In the figure: 1. Material gun housing; 2. Control component; 3. Display screen; 4. Material discharge component; 5. First guide roller; 6. Second guide roller; 7. Welding sheet channel; 8. Clamping device; 9. Protective cover; 10. Power connector; 11. Positioning part; 12. Adsorption motor; 13. Cutter; 14. First induction photoelectric; 15. Material width limit component; 16. Material belt pressure plate; 17. Material discharge port; 18. Negative pressure adsorption hole; 19. Second induction photoelectric; 20. Base; 21. Fixing part; 22. Snap-in groove; 23. Placement groove; 24. Connector hole; 25. Positioning hole; 26. Snap-in part. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] The utility model provides Figure 1-5 A high-speed chip placement machine soldering gun shown includes a gun housing 1;

[0025] A control component 2 is provided at the rear side of the material gun housing 1, a display screen 3 is provided at the top middle position of the control component 2, a discharge component 4 is provided at the bottom position of the material gun housing 1, a first guide roller 5 is provided at the right position of the discharge component 4, and a second guide roller 6 is provided above the first guide roller 5. A solder sheet roll is placed on the discharge component 4, and the high-speed placement machine solder sheet gun is powered by an external power supply;

[0026] A welding piece channel 7 is provided at the top of the gun housing 1 , a power connector 10 is provided at the front of the gun housing 1 , and a cutter 13 is provided at the top of the front of the gun housing 1 .

[0027] A clamping device 8 is provided at the right side of the welding plate channel 7, a first sensing photoelectric 14 is provided at the right side of the clamping device 8, a material width limiting component 15 is provided at the right side of the first sensing photoelectric 14, a material strip pressure plate 16 is provided at the right side of the material width limiting component 15, a protective cover plate 9 is provided at the right side of the material strip pressure plate 16, and the protective cover plate 9 is snap-connected to the material gun housing 1.

[0028] A discharge port 17 is provided at the bottom right side of the protective cover 9, a negative pressure adsorption hole 18 is provided at the right side of the discharge port 17, a cutter 13 is provided at the right side of the negative pressure adsorption hole 18, and a second photoelectric sensor 19 is provided at the left and right sides of the cutter 13 respectively.

[0029] Positioning members 11 are respectively provided at the upper and lower sides of the power connector 10 . The positioning members 11 are fixedly connected to the gun housing 1 by bolts. A clamping member 26 is provided at the middle position of the bottom of the gun housing 1 .

[0030] A base 20 is provided at a position below the gun housing 1 , placement grooves 23 are provided in an array above the base 20 , and a clamping groove 22 is provided inside the placement groove 23 .

[0031] An array of joint holes 24 is provided at the upper front side of the base 20 , and positioning holes 25 are provided on the upper and lower sides of the joint holes 24 .

[0032] An adsorption motor 12 is provided above the positioning member 11 , a fixing member 21 is provided at the bottom of the base 20 , a bolt hole is provided inside the fixing member 21 , and the base 20 is made of steel.

[0033] In this embodiment, the specific implementation steps of a high-speed placement machine soldering gun are as follows: the solder roll is installed on the discharge component 4, and the corresponding limit and setting parameters are adjusted through the control component 2 according to the width and length of the required material. When the solder strip is conveyed to the end position of the gun housing 1, the cutter 13 is started to cut the solder strip. At the same time, the negative pressure adsorption hole 18 is opened to absorb the material to prevent deviation and strain. After the cutting is completed, the placement machine removes the material, and the soldering gun continues the above process.

[0034] like Figure 1-3 As shown, a clamping device 8 is provided at the right side of the welding plate channel 7, a first induction photoelectric 14 is provided at the right side of the clamping device 8, a material width limiting component 15 is provided at the right side of the first induction photoelectric 14, a material strip pressure plate 16 is provided at the right side of the material width limiting component 15, a protective cover 9 is provided at the right side of the material strip pressure plate 16, the protective cover 9 is snap-connected to the material gun housing 1, a discharge port 17 is provided at the right side of the protective cover 9, a negative pressure adsorption hole 18 is provided at the right side of the discharge port 17, a cutter 13 is provided at the right side of the negative pressure adsorption hole 18, a second induction photoelectric 19 is provided at the left and right sides of the cutter 13, positioning parts 11 are provided at the upper and lower sides of the power connector 10, the positioning part 11 is fixedly connected to the material gun housing 1 by bolts, and a clamping part 26 is provided at the middle position of the bottom of the material gun housing 1.

[0035] Preferably, the solder coil is installed on the unloading component 4, so that the solder coil goes from the first guide roller 6 to the second guide roller 7 and enters the soldering channel. The first photoelectric sensing device 14 detects the arrival of the material and presses the material through the pressing device 8. Then the solder coil width limiting component 15 limits the material. The material further passes through the bottom of the material belt pressure plate 16 to prevent the solder coil from deviating during the movement. The solder coil is discharged from the discharge port 17. The second photoelectric sensing devices 19 on the left and right sides sense the arrival of the solder coil, and the cutter 13 starts to cut the solder tape. At the same time, the negative pressure adsorption hole 18 is opened to absorb the material to prevent deviation and strain. After the cutting is completed, the placement machine takes away the material, and the soldering gun continues the above process.

[0036] like Figure 4-5 As shown, a base 20 is provided at the lower position of the gun housing 1, a placement groove 23 is provided in an array above the base 20, a clamping groove 22 is provided inside the placement groove 23, and a joint hole 24 is provided in an array at the upper position of the front side of the base 20, and positioning holes 25 are provided on the upper and lower sides of the joint hole 24 respectively.

[0037] Preferably, the placement slots 23 arranged in an array at the upper position of the base 20 can be connected to the welding gun for placement, and the clamping slots 22 arranged at the internal position of the placement slots 23 correspond to the clamping parts 26 at the bottom of the welding gun. The positioning holes 25 opened on the upper and lower sides of the connector hole 24 can correspond to the positioning parts 11 to limit the welding gun. At the same time, the connector hole 24 in the middle position can be connected to the power supply to power the internal device.

[0038] like Figure 1-5 As shown, an adsorption motor 12 is provided above the positioning member 11, a fixing member 21 is provided at the bottom of the base 20, a bolt hole is provided inside the fixing member 21, and the base 20 is made of steel.

[0039] Optionally, an adsorption motor 12 is provided above the positioning member 11, which can control the internal negative pressure adsorption hole 18 to absorb the material to prevent displacement and strain, thereby ensuring the smooth operation of the device. The internal position of the fixing member 21 with a bolt hole can provide a convenient and effective bolt fixing method, which is beneficial to the installation and fixation of the fixing member. Steel materials usually have higher strength and can withstand greater pressure and load. Therefore, they are suitable as the material of the base 20 of the fixing member and can provide good support and stability.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-speed chip placement machine soldering gun, comprising a gun housing (1); A control component (2) is arranged at the rear side of the gun housing (1), a display screen (3) is arranged at the middle position of the top of the control component (2), a discharge component (4) is arranged at the bottom of the gun housing (1), a first guide roller (5) is arranged at the right side of the discharge component (4), and a second guide roller (6) is arranged above the first guide roller (5), a solder sheet roll is placed on the discharge component (4), and the high-speed placement machine solder sheet gun is powered by an external power supply; Features: A welding sheet channel (7) is provided at the top of the gun housing (1), a power connector (10) is provided at the front of the gun housing (1), and a cutter (13) is provided at the top of the front of the gun housing (1).

2. A high-speed chip mounter soldering gun according to claim 1, characterized in that: A clamping device (8) is arranged at the right side of the welding plate channel (7), a first inductive photoelectric device (14) is arranged at the right side of the clamping device (8), a material width limiting component (15) is arranged at the right side of the first inductive photoelectric device (14), a material strip pressing plate (16) is arranged at the right side of the material width limiting component (15), a protective cover plate (9) is arranged at the right side of the material strip pressing plate (16), and the protective cover plate (9) is snap-connected to the material gun housing (1).

3. A high-speed chip mounter soldering gun according to claim 2, characterized in that: A discharge port (17) is provided at the bottom right side of the protective cover plate (9), a negative pressure adsorption hole (18) is provided at the right side of the discharge port (17), a cutter (13) is provided at the right side of the negative pressure adsorption hole (18), and second photoelectric sensors (19) are provided at the left and right sides of the cutter (13), respectively.

4. A high-speed chip mounter soldering gun according to claim 3, characterized in that: Positioning members (11) are respectively provided at upper and lower sides of the power connector (10); the positioning member (11) is fixedly connected to the gun housing (1) by bolts; and a clamping member (26) is provided at the middle position of the bottom of the gun housing (1).

5. A high-speed chip mounter soldering gun according to claim 4, characterized in that: A base (20) is provided at a position below the gun housing (1), placement grooves (23) are provided in an array at a position above the base (20), and a clamping groove (22) is provided at a position inside the placement groove (23).

6. A high-speed chip mounter soldering gun according to claim 5, characterized in that: Joint holes (24) are arranged in an array at the upper front side of the base (20), and positioning holes (25) are respectively arranged at the upper and lower sides of the joint holes (24).

7. A high-speed chip mounter soldering gun according to claim 6, characterized in that: An adsorption motor (12) is arranged above the positioning member (11), a fixing member (21) is arranged at the bottom of the base (20), a bolt hole is provided inside the fixing member (21), and the base (20) is made of steel.

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