Heat dissipation device and electronic equipment

Abstract

The utility model provides a heat dissipation device and electronic equipment. The heat dissipation device comprises a radiator, a carrier, a cover plate and an elastic piece. The hot end face of the radiator is used for being attached to a heating element. The radiator is placed on the carrier, and the carrier is provided with a liquid inlet and a liquid outlet. The cover plate is used for being enclosed with the radiator and the carrier to form an accommodating cavity. The elastic piece is arranged in the accommodating cavity; the first end of the elastic piece is fixed to the radiator, and the second end of the elastic piece is used for abutting against the cover plate. The elastic piece is arranged between the radiator and the cover plate, so that the radiator can adjust the height of the radiator according to the height of the heating element, the radiator can be attached to the heating elements with different heights, and the heat dissipation area is fully utilized.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and an electronic device. Background Art

[0002] The heating element may have cumulative tolerances during the manufacturing and assembly process, resulting in multiple heating elements on the same surface of the substrate being at different height planes and unable to fit perfectly with the heat sink surface, such as Figure 1 If external force is used to fit the heating element and the heat sink, the deformation during the process cannot be controlled, which will result in different contact areas between the heating element and the heat sink, wasting some heat dissipation performance. The heat dissipation performance between the heating elements will also be different, and the heating element may also be crushed. Utility Model Content

[0003] In order to solve the problems in the prior art, the present application provides a heat dissipation device and an electronic device to improve the heat dissipation performance of the heat dissipation device.

[0004] The present application provides a heat dissipation device for adapting to heating elements of different heights, the heat dissipation device comprising:

[0005] A heat sink, used to fit the heating element;

[0006] A carrier, wherein the carrier is formed with a receiving cavity and is provided with a liquid inlet and a liquid outlet, wherein the liquid inlet and the liquid outlet are in communication with the receiving cavity, and the radiator is received in the receiving cavity;

[0007] A cover plate, fixed to one side of the carrier and sealing the accommodating cavity;

[0008] The elastic member is arranged in the accommodating cavity, and the opposite two ends of the elastic member elastically abut against the heat sink and the cover plate respectively.

[0009] In one embodiment, the heat sink includes a heat conducting plate and a heat sink disposed on one side of the heat conducting plate, the heat conducting plate is attached to the heating element, and one end of the heat sink away from the heat conducting plate is spaced apart from the cover plate.

[0010] In one embodiment, the heat conducting plate is provided with an abutting top portion, the accommodating cavity is provided with a bearing portion, and the abutting top portion abuts against the bearing portion so that the heat sink is disposed on the carrier.

[0011] In one embodiment, the heat sink further comprises a mounting base;

[0012] The mounting base comprises a guide member and a limit member; the elastic member is mounted on the guide member; the limit member is arranged around the elastic member to limit the circumferential displacement of the elastic member.

[0013] In one embodiment, the guide member is a column protruding from the heat conducting plate for the elastic member to be sleeved, and the limiting member is a sleeve surrounding the outer periphery of the elastic member.

[0014] In one embodiment, there are a plurality of heat sinks; there are a plurality of elastic members, and each heat sink is provided with at least one elastic member.

[0015] In one embodiment, the heat dissipation device further includes a sealing component;

[0016] The sealing component is arranged between the radiator, the carrier and the cover plate, and is used to fill the gap between the contact surfaces of the radiator, the carrier and the cover plate.

[0017] In one embodiment, the elastic member is a coil spring.

[0018] In one embodiment, one end of the radiator facing the cover plate is spaced apart from the cover plate to form a gap, and the liquid inlet and the liquid outlet face the gap and are in communication with the gap.

[0019] The present application also proposes an electronic device, comprising a heating element and the above-mentioned heat dissipation device, wherein the heating element is arranged in contact with the surface of the heat dissipation device.

[0020] The present application arranges an elastic member between the radiator and the cover plate so that the radiator can adjust its height according to the height of the heating element, so that it can fit with heating elements of different heights and make full use of the heat dissipation area. In addition, the downward pressure on each heating element during the heat dissipation process is stable, and the heating element can be protected during the installation and heat dissipation process to prevent the heating element from being squeezed and damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of a heat dissipation device in the prior art.

[0022] Figure 2 This is a cross-sectional view of an embodiment of an electronic device of the present application.

[0023] Figure 3 This is a three-dimensional diagram of an embodiment of the heat dissipation device of the present application.

[0024] Figure 4 for Figure 3 Enlarged view of part IV of the heat sink.

[0025] Figure 5 for Figure 3 An exploded view of the heat sink shown in another perspective.

[0026] Figure 6 for Figure 3 An exploded view of the heat sink shown in another perspective.

[0027] Main component symbols

[0028] Heat dissipation device 100 Heat sink 110

[0029] Carrier 120 Cover plate 130

[0030] Elastic member 140 Mounting base 111

[0031] Guide member 111a Limiting member 111b

[0032] Sealing member 150 Heating element 200

[0033] Electronic device 10 liquid outlet 122

[0034] Liquid inlet 121 Heat conducting plate 112

[0035] Heat sink 113 Baffle 123

[0036] Circuit board 300 through hole 124

[0037] Carrying part 125 Liquid inlet connector 160

[0038] Liquid outlet connector 170 O-ring 180

[0039] The receiving cavity 126 abuts against the top portion 114

[0040] Gap 190

[0041] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0042] The following description will refer to the accompanying drawings to more fully describe the content of the present application. Shown in the accompanying drawings are exemplary embodiments of the present application. However, the present application can be implemented in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. Similar reference numerals represent identical or similar components.

[0043] The terms used herein are only used for the purpose of describing specific exemplary embodiments and are not intended to limit the present application. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to also include the plural forms. In addition, when used herein, "including" and / or "comprising" and / or "having", integers, steps, operations, components and / or components, but do not exclude the existence or addition of one or more other features, regions, integers, steps, operations, components and / or groups thereof.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs. In addition, unless explicitly defined herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant technology and the content of this application, and will not be interpreted as an idealized or overly formal meaning.

[0045] The following will describe exemplary embodiments in conjunction with the accompanying drawings. It should be noted that the components depicted in the reference drawings are not necessarily shown to scale; and the same or similar components will be given the same or similar reference numerals or similar technical terms.

[0046] Please refer to Figure 2 , Figure 5 and Figure 6 The present application proposes an electronic device 10, which includes a circuit board 300, a heating element 200 arranged on the circuit board 300, and a heat dissipation device 100. The heat dissipation device 100 is used to adapt to the heating elements 200 of different heights. The heat dissipation device 100 includes a radiator 110, a carrier 120, a cover plate 130 and an elastic member 140. The radiator 110 is used to fit with the heating element 200. The carrier 120 is formed with a receiving cavity 126 and is provided with a liquid inlet 121 and a liquid outlet 122, the liquid inlet 121 and the liquid outlet 122 are connected to the receiving cavity 126, and the radiator 110 is accommodated in the receiving cavity 126. The cover plate 130 is fixed to one side of the carrier 120 and seals the receiving cavity 126. The elastic member 140 is arranged in the receiving cavity 126, and the opposite ends of the elastic member 140 elastically abut the radiator 110 and the cover plate 130 respectively.

[0047] In this embodiment, the heat dissipation device 100 is a liquid-cooled radiator. The radiator coolant enters the accommodating cavity 126 from the liquid inlet 121 and exchanges heat with the radiator 110 before flowing out from the liquid outlet 122 to achieve the heat dissipation function.

[0048] Please also see Figure 3 and Figure 4The carrier 120 is a plate body with a certain thickness, and a through hole 124 is provided in the height direction thereof to form the accommodating cavity 126 inside thereof to accommodate the radiator 110. Part of the radiator 110 extends out of the through hole 124 and fits with the heating element 200, and the other part is received in the accommodating cavity 126 and abuts against the elastic member 140. The radiator 110 and the cover plate 130 seal the opposite ends of the through hole 124. The carrier 120 is away from the bottom end of the cover plate 130, and a bearing portion 125 protrudes toward each other at the edge of the accommodating cavity 126 (through hole 124), and the bearing portion 125 is used to prevent the radiator 110 from falling from the through hole 124. In this embodiment, the bearing portion 125 is a sheet body protruding toward each other. The height of the heat sink 110 located in the accommodating cavity 126 is smaller than the depth of the accommodating cavity 126 , so that a gap 190 is formed between the top end of the heat sink 110 facing the cover plate 130 and the cover plate 130 .

[0049] If the height of the heating element 200 is relatively high, when it is attached to the radiator 110, an upward pressure will be applied to the radiator 110, and the radiator 110 will then exert pressure on the elastic member 140, causing the elastic member 140 to collide with the cover plate 130, and the elastic member 140 will deform. In this way, the radiator 110 can adjust its own height according to the height of the heating element 200 through the deformation of the elastic member 140, so that it can be attached to heating elements 200 of different heights, without wasting the heat dissipation area, and the downward pressure on each heating element 200 during the heat dissipation process is stable. Due to the buffering of the elastic member 140, the heating element 200 can also be protected during the installation and heat dissipation process to prevent the heating element 200 from being squeezed and damaged.

[0050] In one embodiment, there are a plurality of heat sinks 110 ; there are a plurality of elastic members 140 , and at least one elastic member 140 is disposed in each heat sink 110 .

[0051] For example, the number of heat sinks 110 can be set to six, and the six heat sinks 110 can be respectively attached to the six heating elements 200. If the six heating elements 200 have different heights, the height of the carrier 120 can be adaptively adjusted by the elastic member 140 disposed on the heat sink 110, so that the six heating elements 200 can all be attached to the heat sink 110, and the heat dissipation area can be fully utilized. Among them, multiple elastic members 140 can also be disposed in each heat sink 110 to improve the stability of the heat sink 110.

[0052] In one embodiment, the carrier 120 has a plurality of through holes 124, and adjacent through holes 124 are separated by a baffle 123. These through holes 124 are interconnected. Due to the provision of a plurality of through holes 124, the heat dissipation device 100 can be adapted to a plurality of radiators 110, or even radiators 110 of different heights to better adapt to different heating elements 200. The liquid inlet 121 and the liquid outlet 122 are provided at opposite ends of one side of the carrier 120. By providing a plurality of baffles 123 to divide the accommodating cavity 126 into a plurality of sub-chambers, a plurality of radiators 110 can be fixed, the upward movement direction of the radiator 110 can be limited, and the stability of the heat dissipation device 100 can be improved. Among them, the size of each through hole 124 can be set according to the size of the corresponding radiator 110.

[0053] The heat dissipation device 100 may further include a liquid inlet connector 160 for connecting to a liquid inlet pipe and a liquid outlet connector 170 for connecting to a liquid outlet pipe. The liquid inlet 121 and the liquid outlet 122 may also be provided with an O-ring 180. The liquid inlet connector 160 and the liquid outlet connector 170 are inserted into the corresponding liquid inlet 121 and the liquid outlet 122 with the sealing rings.

[0054] In one embodiment, the elastic member 140 may be a spring, such as a coil spring or an elastic element arranged in a “Z” shape.

[0055] In this embodiment, the heat sink 110 includes a heat conducting plate 112 and a heat sink 113 disposed on one side of the heat conducting plate 112. The heat conducting plate 112 is a plate body with good thermal conductivity, and has abutment tops 114 protruding outwards at opposite ends thereof, and the abutment tops 114 are used to cooperate with the bearing portion 125 of the carrier 120. Preferably, the abutment tops 114 extend outwards from the top edge of the carrier 120 toward the cover plate 130, and the thickness thereof is less than the thickness of the carrier 120, so that the bottom of the heat conducting plate 112 can extend from the through hole 124, and the abutment tops 114 located at the top of the heat conducting plate 112 abut the bearing portion 125 to enable the heat sink 110 to be disposed on the carrier 120. In this embodiment, the abutment tops 114 are two sheets extending away from each other, and their shapes and sizes can be adapted to the bearing portion 125. The heat sinks 113 are spaced apart from each other and protrude toward the cover plate 130 . One end of the heat sink 113 away from the heat conducting plate 112 is spaced apart from the cover plate 130 , so that one end of the heat sink 113 facing the cover plate 130 is spaced apart from the cover plate 130 to form the gap 190 .

[0056] In this embodiment, the heat sink 113 can be arranged according to the liquid inlet direction, for example, arranged to be parallel to the liquid inlet direction. The heat absorbed by the heat conducting plate 112 is transmitted to the plurality of heat sinks 113, and then absorbed by the coolant passing through the heat sink 113. By providing a plurality of heat sinks 113, the contact area between the radiator 110 and the coolant can be increased, thereby improving the heat dissipation performance. At the same time, it can also play a guiding role. Among them, the interval between the heat sink 113 and the cover plate 130 can be set according to actual needs, so that the heat sink 113 can achieve heat conduction without affecting the operation of the elastic member 140.

[0057] Reference Figure 4 In one embodiment, the radiator 110 further includes a mounting base 111. In this embodiment, the mounting base 111 is located on the top of the heat conducting plate 112 and protrudes toward the direction of the cover plate 130. The mounting base 111 is spaced apart from the cover plate 130 to accommodate the elastic member 140. The mounting base 111 can be integrally formed with the radiator 110. In practical applications, the cumulative tolerance of multiple heating elements 200 on the same substrate is usually small, so that the height of the substrate moving up is also small. By fixing the elastic member 140 by the mounting base 111, the distance that the elastic member 140 can be deformed is shortened, thereby reducing the space in which the radiator 110 can move, and improving the stability of the carrier 120.

[0058] In one embodiment, the mounting base 111 includes a guide member 111a and a limit member 111b. The guide member 111a protrudes from the heat conducting plate 112 and is used for the elastic member 140 to be sleeved. The limit member 111b is located at the periphery of the elastic member 140 and is used to limit the circumferential displacement of the elastic member 140.

[0059] In this embodiment, the guide member 111a is a column protruding from the heat conducting plate 112 for the elastic member 140 to be sleeved, and the limit member 111b is a sleeve surrounding the outer periphery of the elastic member 140. Preferably, the guide member 111a is a cylinder extending from the heat conducting plate 112, and its diameter gradually decreases from the bottom end connected to the heat conducting plate 112 to the top end away from the heat conducting plate 112. The elastic member 140 slides along the surface of the guide member 111a and is sleeved on the guide member 111a. The cross-section of the bottom end of the guide member 111a is larger than the cross-section of the elastic member 140, so that the elastic member 140 can be stuck on the guide member 111a. The limit member 111b is arranged around the guide member 111a, and the inner diameter of the limit member 111b is equal to or slightly larger than the outer diameter of the elastic member 140.

[0060] In one embodiment, the heat dissipation device 100 further includes a sealing member 150 . The sealing member 150 is disposed between the heat sink 110 , the carrier 120 and the cover plate 130 , and is used to fill the gaps between the contact surfaces of the heat sink 110 , the carrier 120 and the cover plate 130 .

[0061] In this embodiment, the sealing component 150 can be made of a material with a certain elasticity, such as liquid silicone, rubber, etc. After the radiator 110, the carrier 120 and the cover plate 130 are installed, the sealing component 150 can be filled in the gap between the radiator 110, the carrier 120 and the cover plate 130 through mold injection molding, so that the sealing component 150 can fit the radiator 110, the carrier 120 and the cover plate 130 to achieve a sealing effect. In this way, while ensuring the sealing of the heat dissipation device 100, it can also move up and down within a certain range.

[0062] The present application arranges an elastic member 140 between the heat sink 110 and the cover plate 130, so that the heat sink 110 can adjust its height according to the height of the heating element 200, so that it can fit with the heating elements 200 of different heights and make full use of the heat dissipation area. In addition, the downward pressure on each heating element 200 during the heat dissipation process is stable, and the heating element 200 can be protected during the installation and heat dissipation process to prevent the heating element 200 from being squeezed and damaged.

[0063] In the above, the specific implementation of the present application is described with reference to the accompanying drawings. However, those skilled in the art will appreciate that various changes and substitutions may be made to the specific implementation of the present application without departing from the spirit and scope of the present application. These changes and substitutions are all within the scope defined by the present application.

Claims

1. A heat dissipation device, used to adapt to heating elements of different heights, characterized in that: The heat dissipation device comprises: A heat sink, used to fit the heating element; A carrier, wherein the carrier is formed with a receiving cavity and is provided with a liquid inlet and a liquid outlet, wherein the liquid inlet and the liquid outlet are in communication with the receiving cavity, and the radiator is received in the receiving cavity; A cover plate, fixed to one side of the carrier and sealing the accommodating cavity; The elastic member is arranged in the accommodating cavity, and the opposite two ends of the elastic member elastically abut against the heat sink and the cover plate respectively.

2. The heat dissipation device according to claim 1, characterized in that: The heat sink comprises a heat conducting plate and a heat sink arranged on one side of the heat conducting plate. The heat conducting plate is attached to the heating element, and one end of the heat sink away from the heat conducting plate is spaced apart from the cover plate.

3. The heat dissipation device according to claim 2, characterized in that: The heat conducting plate is provided with an abutting top portion, the accommodating cavity is provided with a bearing portion, and the abutting top portion abuts against the bearing portion so that the radiator is disposed on the carrier.

4. The heat dissipation device according to claim 3, characterized in that: The radiator also includes a mounting base; The mounting base comprises a guide member and a limit member; the elastic member is mounted on the guide member; the limit member is arranged around the elastic member to limit the circumferential displacement of the elastic member.

5. The heat dissipation device according to claim 4, characterized in that: The guide member is a column protruding from the heat conducting plate and provided for the elastic member to be sleeved, and the limiting member is a sleeve surrounding the outer periphery of the elastic member.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: There are multiple radiators; there are multiple elastic members, and each radiator is provided with at least one elastic member.

7. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further comprises a sealing component; The sealing component is arranged between the radiator, the carrier and the cover plate, and is used to fill the gap between the contact surfaces of the radiator, the carrier and the cover plate.

8. The heat dissipation device according to claim 1, characterized in that: The elastic member is a coil spring.

9. The heat dissipation device according to claim 1, characterized in that: One end of the radiator facing the cover plate is spaced apart from the cover plate to form a gap, and the liquid inlet and the liquid outlet face the gap and are in communication with the gap.

10. An electronic device, characterized in that: It comprises a heating element and the heat dissipation device according to any one of claims 1 to 9, wherein the heating element is arranged in contact with the surface of the heat dissipation device.

Images