Forming spot solder paste loading equipment for ceramic capacitor frame

Abstract

A forming solder paste dispensing and loading device for a ceramic capacitor frame comprises a rack, a frame carrying disc arranged on the rack, a guiding and leveling device, a forming device, a dispensing device, a loading device and a cutting device which are sequentially arranged on the rack, and a bearing frame which is arranged on the rack, extends from the forming device to the cutting device and is used for bearing the frame. The equipment disclosed by the utility model integrates four working procedures of forming, solder paste dispensing, sheet feeding and slitting, automatic production can be realized after loading, the production efficiency is high, the operation is convenient, and the safety is high; and the whole structure is compact, the occupied space is small, and the production cost can be greatly reduced.

Description

Technical Field

[0001] The utility model belongs to the field of ceramic capacitor frame preparation, and in particular relates to a forming point solder paste chip loading device for a ceramic capacitor frame. Background Art

[0002] A multi-core molded capacitor product is composed of dozens of capacitors. Each capacitor is connected to the outer frame. During preparation, the frame must be processed first, and then solder paste is applied to the groove of the molded frame. Then the ceramic chip is placed in the corresponding groove to form a connection with the frame through the solder paste, and finally cut into the required length according to product requirements. The whole process is very cumbersome, and the molding process, glue dispensing process, film loading process and cutting process are independent of each other, resulting in a long production cycle, low production efficiency, and the need to invest more manpower and material resources, thereby increasing production costs. Utility Model Content

[0003] The utility model aims to overcome the shortcomings of the prior art and provide a molding point solder paste chip loading device for a ceramic capacitor frame.

[0004] The utility model adopts the following technical solutions:

[0005] A molding solder paste loading device for a ceramic capacitor frame comprises a frame, a frame carrier arranged on the frame, a guide leveling device, a molding device, a glue dispensing device, a loading device and a cutting device arranged on the frame in sequence, and a receiving frame arranged on the frame and extending from the molding device to the cutting device for receiving the frame.

[0006] A guiding and leveling device, used for guiding the frame on the frame carrier to enter the forming device in a level manner;

[0007] A forming device, forming a mounting groove for placing a ceramic chip on a frame entering thereunder;

[0008] A glue dispensing device is used to apply solder paste to the mounting slots formed on the frame;

[0009] The chip loading device includes a vibrating feed tray for holding ceramic chips, a conveying guide connected to the discharge port of the vibrating feed tray, and a chip loading mechanism connected to the end of the conveying guide, wherein the chip loading mechanism puts a plurality of ceramic chips arranged on the conveying guide into the corresponding mounting grooves one by one, and squeezes the ceramic chips dropped into the mounting grooves downwards to fully connect them with the solder paste;

[0010] The cutting device is used to cut the frame after the upper sheet is finished.

[0011] Furthermore, the loading mechanism includes a mounting frame arranged above the receiving frame and connected to the end of the conveying guide rail, a loading plate movable in the mounting frame and opposite to the frame on the receiving frame, a material guide trough extending inward from the side of the mounting frame and opposite to the conveying guide rail, a material receiving trough extending inward from the side of the loading plate and opposite to the material guide trough, a material discharge port extending upward from the bottom of the mounting frame and opposite to the material receiving trough, a movable part arranged on the mounting frame to drive the loading plate to move, and a tablet pressing assembly arranged on the mounting frame to downwardly squeeze the ceramic chip located in the mounting trough, the material guide trough and the material discharge port are arranged on the same vertical plane, the material discharge port is opposite to the mounting groove formed on the frame, and when the movable part drives the movable plate to move to the material receiving trough and opposite to the material guide trough, the material discharge port is opposite to the material receiving trough, and the ceramic chip enters the material receiving trough from the material guide trough and falls downward into the mounting groove through the material discharge port.

[0012] Furthermore, the movable part includes a movable cylinder arranged on the mounting frame, a limit plate connected to the front end of the movable cylinder and capable of resisting against the front end of a loading plate, and a limit spring arranged between the front end of the loading plate and the mounting frame. A limit portion opposite to the mounting frame is formed at the front end of the loading plate, and the limit spring is arranged between the limit portion and the mounting frame.

[0013] Furthermore, the mounting frame is provided with a movable cavity for the loading plate to move back and forth, the movable cavity is respectively connected with the material guide groove and the discharge port, and the rear end of the loading plate is provided with a limiting column to prevent it from escaping from the movable cavity.

[0014] Furthermore, the tablet pressing assembly includes a tablet pressing cylinder arranged on a mounting frame, a lifting seat connected to the tablet pressing cylinder and movable up and down, and a tablet pressing rod arranged on the lifting seat and opposite to the mounting groove. The lifting seat moves downward to drive the tablet pressing rod to move downward, and squeezes the ceramic chips that fall into the mounting groove through the material guide groove, the material receiving groove, and the material discharge port in sequence.

[0015] Furthermore, the mounting frame includes a first frame body located on one side of the supporting frame and connected to the end of the conveying guide rail, a second frame body located on the other side of the supporting frame opposite to the first frame body, and a connecting block located above the supporting frame and connected between the first frame body and the second frame body, the material guide trough extends from the first frame body to the connecting block, the loading plate is movably arranged in the connecting block, and the discharge port is arranged on the connecting block.

[0016] Furthermore, the forming device includes a movable seat arranged above the receiving frame and capable of moving up and down, a forming knife arranged below the movable seat and opposite to the frame, and a driving mechanism arranged on the frame and connected to drive the movable seat to move up and down. A forming groove which is recessed downward and opposite to the forming knife is formed on the receiving frame. The forming knife moves downward to squeeze and deform the part of the frame opposite to the forming knife downward to form the installation groove on the frame.

[0017] Furthermore, the dispensing device includes a dispensing seat arranged on the movable seat and two dispensing guns arranged on the dispensing seat at intervals, and the dispensing heads of the two dispensing guns are staggered front and back to apply solder paste at two locations in the installation groove.

[0018] Furthermore, the frame is provided with a plurality of positioning holes arranged at intervals along its length direction, and the forming device also includes a movable plate arranged on the frame and moving back and forth along the moving direction of the frame, and a positioning plate arranged on the front end of the movable plate and embeddable in the positioning hole, a positioning portion which can be embedded in the positioning hole is formed at the front end of the positioning plate, and an inclined surface extending upward is formed at the front end of the positioning portion, and when the driving mechanism drives the movable plate to drive the positioning plate to move back to the left, the positioning portion can be separated from the current positioning hole under the action of the inclined surface and embedded in the previous positioning hole located in front of the positioning hole.

[0019] Furthermore, the cutting device includes a cutting seat arranged on the frame at the rear end of the receiving frame, a cutting knife arranged on the cutting seat and movable up and down for cutting the frame, and a cutting cylinder arranged on the cutting seat and connected to drive the cutting knife to move up and down.

[0020] From the above description of the utility model, it can be seen that compared with the prior art, the beneficial effects of the utility model are: the equipment specified in the present application combines four working processes of molding, solder paste application, sheeting, and slitting. It can automatically produce after loading, with high production efficiency, convenient operation, and high safety; and the overall structure is compact, occupies little space, and can greatly reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The structure of the utility model is shown in FIG. Figure 1 ;

[0022] Figure 2 It is a partial structure diagram of the utility model Figure 1 ;

[0023] Figure 3 It is a partial structure diagram of the utility model Figure 2 ;

[0024] Figure 4 for Figure 2 The enlarged view of point A in the middle;

[0025] Figure 5 for Figure 3 The enlarged view of point B in the middle;

[0026] Figure 6 It is a structural schematic diagram of a molding device;

[0027] Figure 7 Schematic diagram of the connecting plate structure Figure 1 ;

[0028] Figure 8 Schematic diagram of the connecting plate structure Figure 2 ;

[0029] Fig. 9 It is a structural schematic diagram of the feeding plate;

[0030] Fig.10 is a structural schematic diagram of a positioning plate;

[0031] In the figure, 1-frame, 2-frame carrier, 3-receiving frame, 4-guiding leveling device, 5-molding device, 6-glue dispensing device, 7-loading device, 8-cutting device, 9-discharging device, 10-frame, 21-carrier body, 22-feeding motor, 31-receiving seat, 32-receiving plate, 33-receiving groove, 34-molding groove, 41-guide wheel, 42-leveling mechanism, 421-leveling frame, 422-leveling wheel, 51-moving seat, 52 molding knife, 53-moving plate, 54-positioning plate, 541-positioning part, 542-inclined surface, 55-driving mechanism, 551-rotating seat, 552-rotating shaft, 553-rotating motor, 554 first eccentric cam, 555-second eccentric cam, 556-first connecting rod assembly, 5 57-second connecting rod assembly, 61-glue dispensing seat, 62-glue dispensing gun, 71-vibrating feeding tray, 72-conveying guide rail, 73-loading mechanism, 74-mounting frame, 741-first frame, 742-second frame, 743-connecting block, 744-moving cavity, 75-loading plate, 751-limiting part, 752-limiting column, 76-material guide trough, 77-material receiving trough, 78-discharging port, 79-moving part, 791-moving cylinder, 792-limiting plate, 793-limiting spring, 70-tablet pressing assembly, 701-tablet pressing cylinder, 702-lifting seat, 703-tablet pressing rod, 81-cutting seat, 82-cutting knife, 83-cutting cylinder, 101-frame body, 102-frame unit, 103-positioning hole, 104-mounting groove. DETAILED DESCRIPTION

[0032] The present invention is further described below through specific implementation methods.

[0033] Reference Figures 1 to 10 As shown, a molding solder paste loading device for a ceramic capacitor frame includes a frame 1, a frame carrier 2, a receiving frame 3, a guide leveling device 4, a molding device 5, a dispensing device 6, a loading device 7, a cutting device 8 and a discharging device 9.

[0034] The frame 10 includes a frame body 101 , a plurality of frame units 102 arranged at intervals on the frame body 101 , and a plurality of positioning holes 103 arranged at intervals along the length direction of the frame body.

[0035] The frame carrier 2 is arranged on the frame 1, and comprises a carrier body 21 with a frame rolled up inside and a feeding motor 22 arranged on the frame 1 and connected to drive the carrier body 21 to rotate.

[0036] The receiving frame 3 is arranged on the frame 1 and is used to receive the incoming frame 10. It extends from the forming device 5 to the cutting device 8 and includes a receiving seat 31, a receiving plate 32 arranged on the receiving seat 31 and used to receive the frame 10, and a receiving groove 33 arranged on the receiving plate 32 and used to place the frame 10.

[0037] The guiding and leveling device 4 is arranged on the frame 1, and guides the frame 10 on the frame carrier 2 into the receiving groove 33. It includes a plurality of guide wheels 41 arranged on the frame 1 at intervals along the moving direction of the frame 10 and a leveling mechanism 42 arranged at the rear end of the plurality of guide wheels 41 and located at the front end of the forming device 5. By setting the leveling mechanism 42, the frame 10 coming out of the frame carrier 2 can be leveled and enter the forming device 5; specifically, the leveling mechanism 42 includes a leveling frame 421 arranged on the frame 1 and a plurality of leveling wheels 422 alternately arranged on the leveling frame 421 up and down, and a leveling channel for the frame 10 to enter is formed between the two leveling wheels 422 arranged up and down.

[0038] The molding device 5 molds a mounting groove 104 for placing ceramic chips on the frame unit 102 on the frame 10 that enters below it, and includes a movable seat 51 that can move up and down and is arranged above the receiving frame 3, a molding knife 52 that is arranged below the movable seat 51 and is opposite to the frame 10, a movable plate 53 that is arranged on the frame 1 and moves back and forth along the moving direction of the frame 10, a positioning plate 54 that is arranged on the front end of the movable plate 53 and can be embedded in the positioning hole 103, and a driving mechanism 55 that is arranged on the frame 1 and connects and drives the movable seat 51 and the movable plate 53 to work. Correspondingly, a molding groove 34 that is recessed downward and opposite to the molding knife 52 is formed on the receiving plate 32. When the frame 10 is molded, the molding knife 52 moves downward to squeeze and deform the portion of the frame 10 that is opposite to the molding knife 52 downward to form the mounting groove 104 on the frame 10; specifically, a positioning portion 541 that can be embedded in the positioning hole 103 is formed at the front end of the positioning plate 54, and an inclined surface 542 that extends upward is formed at the front end of the positioning portion 541. When the driving mechanism 55 drives the movable plate 53 to move to the right, the frame moves forward with the movable plate 53 when the positioning portion 541 cooperates with the positioning hole 403, so that the next unformed frame unit moves to the bottom of the forming knife; when the driving mechanism 55 drives the movable plate 53 to drive the positioning plate 54 to move back to the left, the positioning portion 541 can be separated from the current positioning hole 103 and embedded in the previous positioning hole located in front of the positioning hole under the action of the inclined surface 542; further, the driving mechanism 55 includes a rotating seat 551 arranged on the frame 1, a rotating shaft 552 rotatably arranged on the rotating seat 551, a rotating motor 553 arranged on the frame 1 and connected to and driving the rotating shaft 552 to rotate, a first eccentric cam 554 and a second eccentric cam 555 arranged at intervals on the rotating shaft 552, a first connecting rod assembly 556 connected between the first eccentric cam 554 and the movable seat 51, and a second connecting rod assembly 557 arranged between the second eccentric cam 555 and the movable plate 53.

[0039] The glue dispensing device 6 applies solder paste to the mounting groove 104 formed on the frame 10, including a glue dispensing seat 61 arranged on the movable seat 51 and two glue dispensing guns 62 arranged at intervals on the glue dispensing seat 61. The glue dispensing heads of the two glue dispensing guns 62 are staggered front and back to apply solder paste at two locations in the mounting groove 104.

[0040] The loading device 7 includes a vibrating feeding tray 70 for holding ceramic chips, a conveying guide rail 72 connected to the discharge port of the vibrating feeding tray 70, and a loading mechanism 73 connected to the end of the conveying guide rail 72. The loading mechanism 73 puts multiple ceramic chips arranged on the conveying guide rail 72 into the corresponding mounting grooves 104 one by one, and squeezes the ceramic chips dropped into the mounting grooves 104 downward to make them fully connected with the solder paste; it includes a mounting frame 74 arranged above the receiving frame 3 and connected to the end of the conveying guide rail 72, a loading plate 75 that can be moved in the mounting frame 74 and is opposite to the frame 10 on the receiving frame 3, a guide groove 76 extending inward from the side of the mounting frame 74 and opposite to the conveying guide rail 72, and a material loading plate 75 that can be moved inward from the side of the loading plate 75. A receiving trough 77 opposite to the material guide trough 76, a discharge port 78 extending upward from the bottom of the mounting frame 74 and opposite to the receiving trough 77, a moving member 79 arranged on the mounting frame 74 for driving the loading plate 75 to move, and a tablet pressing assembly 70 arranged on the mounting frame 74 for downwardly squeezing the ceramic chip located in the mounting groove 104. Specifically, the material guide trough 76 and the discharge port 78 are arranged on the same vertical plane, and the discharge port 78 is opposite to the mounting groove 104 formed on the frame 10. When the moving member 79 drives the loading plate 75 to move to the receiving trough 77 and is opposite to the material guide trough 76, the discharge port 78 is opposite to the receiving trough 77, and the ceramic chip enters the receiving trough 77 from the material guide trough 76 and falls downward into the mounting groove 104 through the discharge port 78.

[0041] The mounting frame 74 includes a first frame body 741 located on one side of the receiving frame 3 and connected to the end of the conveying guide rail 72, a second frame body 742 located on the other side of the receiving frame 3 opposite to the first frame body 741, and a connecting block 743 located above the receiving frame 3 and connected between the first frame body 741 and the second frame body 742. Specifically, the material guide trough extends from the first frame body 741 76 to the connecting block 743, the loading plate 75 is movably arranged in the connecting block 743, and the discharge port 78 is arranged on the connecting block 743.

[0042] The movable member 79 includes a movable cylinder 791 arranged on the mounting frame 74, a limit plate 792 connected to the front end of the movable cylinder 791 and capable of abutting against the front end of the loading plate 75, and a limit spring 793 arranged between the front end of the loading plate 75 and the connecting block 743. Specifically, a limit portion 751 opposite to the connecting block 743 is formed at the front end of the loading plate 75, and the limit spring 793 is arranged between the limit portion 751 and the connecting block 743; further, a movable cavity 744 for the loading plate 75 to move back and forth is arranged on the connecting block 743, and the movable cavity 744 is respectively connected to the material guide groove 76 and the discharge port 78, and a limit column 752 is arranged at the rear end of the loading plate 75 to prevent it from escaping from the movable cavity 744.

[0043] The tablet pressing assembly 70 includes a tablet pressing cylinder 701 arranged on the mounting frame 74, a lifting seat 702 connected to the tablet pressing cylinder 701 and movable up and down, and a tablet pressing rod 703 arranged on the lifting seat 702 and opposite to the mounting groove 104. The lifting seat 702 moves downward to drive the tablet pressing rod 703 to move downward, and squeezes the ceramic chips that fall into the mounting groove 104 through the material guide groove 76, the material receiving groove 77, and the material outlet 78 in sequence.

[0044] The cutting device 8 cuts the frame 10 after the upper sheet is completed, including a cutting seat 81 arranged on the frame 1 at the rear end of the receiving frame 3, a cutting knife 82 that can be moved up and down on the cutting seat 81 for cutting the frame 10, and a cutting cylinder 83 that is connected to the cutting seat 81 and drives the cutting knife 82 to move up and down.

[0045] The discharging device 9 is arranged behind the cutting device 8, receives the cut frames and conveys them to a designated position, and includes a discharging conveyor belt arranged behind the cutting device 8.

[0046] The working principle includes the following steps:

[0047] Step 1, start the feeding motor 22, place the frame 10 in the receiving groove 33 through the guiding integral mechanism 4, and move forward until the positioning portion 541 at the front end of the positioning plate 54 is embedded in a positioning hole 103 on the frame;

[0048] Step 2, start the equipment, the driving mechanism 55 drives the moving seat 51 to move downward and drives the moving plate 53 to move back to the left at the same time, so that the forming knife 52 forms the installation groove 104 on the frame 10, and the positioning part 541 is separated from the current positioning hole 103 and moves back to the adjacent previous positioning hole; then the driving mechanism 55 drives the moving seat 51 to move upward and drives the moving plate 53 to move right at the same time, so that the forming knife 52 is away from the frame, and the positioning part 541 moves rightward to drive the frame 10 to move backward;

[0049] Step 3: The frame 10 moves backward to drive the installation slot 104 to move below the two glue guns 62. When the driving mechanism 55 drives the moving seat 51 to move downward, it also drives the glue guns 62 to move downward to apply solder paste on both sides of the installation slot 104;

[0050] Step 4: The frame 10 continues to move backward, so that the mounting groove 104 dotted with solder paste moves to the bottom of the connecting block 743 and is opposite to the discharge port 78. The moving member 79 controls the loading plate 75 to move leftward until the receiving groove 77 is opposite to the guide groove 76, and the discharge port 78 is opposite to the receiving groove 76. At this time, the ceramic chip enters the receiving groove 77 from the guide groove 76 and falls downward into the mounting groove 104 through the discharge port 78; then the moving member 79 drives the loading plate 75 to reset, so that the receiving groove 77 and the guide groove 76 are staggered, and the ceramic chip will not fall into the same mounting groove repeatedly;

[0051] Step 5: The tablet pressing cylinder 701 drives the lifting seat 702 to move downward, driving the tablet pressing rod 703 to move downward in sequence through the material guide groove 76, the material receiving groove 77, and the material outlet 78 to squeeze the ceramic chip dropped into the mounting groove 104, so that the ceramic chip is fully in contact with the solder paste in the mounting groove 104, thereby achieving the connection between the ceramic chip and the frame 10;

[0052] Step six, the frame 10 with the finished sheet continues to move forward to the cutting device 8, and the cutting cylinder 83 controls the cutting knife 82 to move downward to cut the frame 10 to obtain the frame 10 of the required length and send the cut frame 10 to the discharge device 9, which will transport it to the designated position.

[0053] The equipment specified in the present application integrates four working steps: forming, solder paste application, sheet loading and slitting. It can automatically start production after loading, with high production efficiency, convenient operation and high safety. The overall structure is compact and occupies little space, which can greatly reduce production costs.

[0054] The above description is only a preferred embodiment of the present invention, and therefore cannot be used to limit the scope of implementation of the present invention. That is, equivalent changes and modifications made according to the scope of application of the present invention and the contents of the specification should still fall within the scope covered by the present invention.

Claims

1. A molding point solder paste loading device for ceramic capacitor frames, characterized in that: The machine comprises a frame, a frame carrier arranged on the frame, a guide leveling device, a molding device, a glue dispensing device, a sheet loading device and a cutting device arranged on the frame in sequence, and a receiving frame arranged on the frame and extending from the molding device to the cutting device for receiving the frame. A guiding and leveling device, used for guiding the frame on the frame carrier to enter the forming device in a level manner; A forming device, forming a mounting groove for placing a ceramic chip on a frame entering thereunder; A glue dispensing device is used to apply solder paste to the mounting slots formed on the frame; The chip loading device includes a vibrating feed tray for holding ceramic chips, a conveying guide connected to the discharge port of the vibrating feed tray, and a chip loading mechanism connected to the end of the conveying guide, wherein the chip loading mechanism puts a plurality of ceramic chips arranged on the conveying guide into the corresponding mounting grooves one by one, and squeezes the ceramic chips dropped into the mounting grooves downwards to fully connect them with the solder paste; The cutting device is used to cut the frame after the upper sheet is finished.

2. The device for placing solder paste on a molding point of a ceramic capacitor frame according to claim 1, characterized in that: The loading mechanism includes a mounting frame arranged above the receiving frame and connected to the end of the conveying guide rail, a loading plate movable in the mounting frame and opposite to the frame on the receiving frame, a material guide trough extending inward from the side of the mounting frame and opposite to the conveying guide rail, a material receiving trough extending inward from the side of the loading plate and opposite to the material guide trough, a material discharge port extending upward from the bottom of the mounting frame and opposite to the material receiving trough, a moving part arranged on the mounting frame to drive the loading plate to move, and a tablet pressing assembly arranged on the mounting frame to downwardly press the ceramic chip located in the mounting trough, the material guide trough and the material discharge port are arranged on the same vertical plane, the material discharge port is opposite to the mounting groove formed on the frame, and when the moving part drives the moving plate to move to the material receiving trough and opposite to the material guide trough, the material discharge port is opposite to the material receiving trough, and the ceramic chip enters the material receiving trough from the material guide trough and falls downward into the mounting groove through the material discharge port.

3. The device for placing solder paste on a molding point of a ceramic capacitor frame according to claim 2, characterized in that: The moving part includes a moving cylinder arranged on the mounting frame, a limit plate connected to the front end of the moving cylinder and capable of resisting against the front end of a loading plate, and a limit spring arranged between the front end of the loading plate and the mounting frame. A limit portion opposite to the mounting frame is formed at the front end of the loading plate, and the limit spring is arranged between the limit portion and the mounting frame.

4. The device for placing solder paste on a molding point of a ceramic capacitor frame according to claim 3, characterized in that: The mounting frame is provided with a moving cavity for the feeding plate to move back and forth, the moving cavity is respectively connected with the material guide groove and the material outlet, and the rear end of the feeding plate is provided with a limiting column to prevent it from leaving the moving cavity.

5. The device for placing solder paste on a molding point of a ceramic capacitor frame according to claim 2, characterized in that: The tablet pressing assembly includes a tablet pressing cylinder arranged on a mounting frame, a lifting seat connected to the tablet pressing cylinder and movable up and down, and a tablet pressing rod arranged on the lifting seat and opposite to the mounting groove. The lifting seat moves downward to drive the tablet pressing rod to move downward to sequentially pass through the material guide groove, the material receiving groove, and the material discharge port to squeeze the ceramic chips that fall into the mounting groove.

6. The device for placing solder paste on a molding point for a ceramic capacitor frame according to claim 2, characterized in that: The mounting frame includes a first frame body located on one side of the supporting frame and connected to the end of the conveying guide rail, a second frame body located on the other side of the supporting frame opposite to the first frame body, and a connecting block located above the supporting frame and connected between the first frame body and the second frame body, the material guide trough extends from the first frame body to the connecting block, the loading plate is movably arranged in the connecting block, and the discharge port is arranged on the connecting block.

7. The device for placing forming point solder paste on a ceramic capacitor frame according to claim 1, characterized in that: The forming device includes a movable seat arranged above the receiving frame and capable of moving up and down, a forming knife arranged below the movable seat and opposite to the frame, and a driving mechanism arranged on the frame and connected to drive the movable seat to move up and down. A forming groove which is recessed downward and opposite to the forming knife is formed on the receiving frame. The forming knife moves downward to squeeze and deform the part of the frame opposite to the forming knife downward to form the installation groove on the frame.

8. The device for placing forming point solder paste on a ceramic capacitor frame according to claim 7, characterized in that: The glue dispensing device comprises a glue dispensing seat arranged on a movable seat and two glue dispensing guns arranged on the glue dispensing seat at intervals. The glue dispensing heads of the two glue dispensing guns are arranged staggered front and back to dispense solder paste at two locations in the installation groove.

9. The device for placing solder paste on a molding point for a ceramic capacitor frame according to claim 7, characterized in that: The frame is provided with a plurality of positioning holes arranged at intervals along its length direction. The forming device also includes a movable plate arranged on the frame and moving back and forth along the moving direction of the frame and a positioning plate arranged on the front end of the movable plate and can be embedded in the positioning hole. A positioning portion which can be embedded in the positioning hole is formed at the front end of the positioning plate, and an inclined surface extending upward is formed at the front end of the positioning portion. When the driving mechanism drives the movable plate to drive the positioning plate to move back to the left, the positioning portion can be separated from the current positioning hole under the action of the inclined surface and embedded in the previous positioning hole located in front of the positioning hole.

10. The device for placing solder paste on a molding point of a ceramic capacitor frame according to claim 1, characterized in that: The cutting device comprises a cutting seat arranged on the frame at the rear end of the receiving frame, a cutting knife arranged on the cutting seat and used for cutting the frame and movable up and down, and a cutting cylinder arranged on the cutting seat and connected to drive the cutting knife to move up and down.

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