Integrated circuit QFN plastic packaging device

Abstract

The utility model relates to an integrated circuit QFN plastic package device in the technical field of integrated circuit plastic package, which comprises an upper mold and a lower mold, the lower mold is arranged at the bottom of the upper mold, the lower mold comprises a product bearing area, an ejector pin base area is arranged on the product bearing area, a return pin reverse ejector pin is arranged in the ejector pin base area, and the return pin reverse ejector pin is arranged in the product bearing area. A positioning block is arranged on one side of the product bearing area, and a positioning pin is arranged on the side, away from the positioning block, of the product bearing area. According to the utility model, the return pin reverse ejector pin is arranged on the lower mold, the return pin reverse ejector pin is firstly used for propping against the embedded block in the injection molding process, so that the embedded block is flatly attached to the isolating membrane, the return pin reverse ejector pin is reset before a plastic package material is completely cured, and the plastic package process is formally completed after the return pin reverse ejector pin is reset; the embedded block is completely attached to the isolating membrane in the plastic packaging process, glue overflowing is avoided, the subsequent technological process of removing the overflowing glue is omitted, and therefore time and cost are saved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit plastic packaging, in particular to an integrated circuit QFN plastic packaging device. Background Art

[0002] The QFN plastic encapsulation device for integrated circuits is an efficient and advanced packaging technology in the field of electronic engineering. It is designed to provide excellent space utilization efficiency, heat dissipation performance and circuit layout flexibility. QFN, or Quad Flat No-leads, is a pinless packaging technology that is particularly suitable for surface mounted integrated circuits. However, in the actual operation of the QFN plastic encapsulation device for integrated circuits, especially for high-end products such as Top cool QFN, there are some significant defects. These problems not only affect the yield and cost of the product, but may also lead to a decline in product competitiveness. In the existing QFN plastic encapsulation process, the molding process is completed by flattening the frame and the isolation film. Since the heat sink and the isolation film of the upper mold cannot be perfectly fitted, some gaps will exist. During the injection molding process, the plastic encapsulation material will enter the product surface along these gaps, forming overflow from the surface, thereby reducing the yield and increasing the cost, and ultimately failing to form a competitive product. Utility Model Content

[0003] The utility model aims to solve the shortcomings in the prior art and proposes an integrated circuit QFN plastic packaging device.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated circuit QFN plastic packaging device, comprising an upper mold and a lower mold, characterized in that: the lower mold is arranged at the bottom of the upper mold, the lower mold comprises a product carrying area, a ejector base area is installed on the product carrying area, a return pin and an anti-ejector are arranged inside the ejector base area, a positioning block is arranged on one side of the product carrying area, a positioning pin is arranged on the side of the product carrying area away from the positioning block, the product carrying area is provided with two groups, and a glue extrusion area is arranged in the middle of the two groups of product carrying areas.

[0005] As a further description of the above technical solution:

[0006] A lead frame is arranged between the upper mold and the lower mold, an isolation film is arranged on the surface of the lead frame, an adhesive tape is arranged on the bottom of the lead frame, the upper mold comprises a gasket, and an embedded block is arranged at the bottom of the gasket.

[0007] As a further description of the above technical solution:

[0008] The return pin anti-ejector is installed in the ejector base area. The ejector base area is provided with a plurality of ejector base areas in each product bearing area. The return pin anti-ejector can perform telescopic action on the ejector base area.

[0009] As a further description of the above technical solution:

[0010] The glue squeezing area is made of tungsten steel, and two groups of the glue squeezing areas are provided. The glue squeezing areas squeeze glue toward the product bearing areas on both sides.

[0011] As a further description of the above technical solution:

[0012] The positioning block is used for precise positioning of the upper mold and the lower mold, and one or more positioning blocks are provided in each product bearing area.

[0013] As a further description of the above technical solution:

[0014] The positioning pins are used to position the frame on the upper mold and the lower mold, and one or more positioning pins are provided in each product carrying area.

[0015] As a further description of the above technical solution:

[0016] The product bearing area includes a supporting column and a lower film cavity block.

[0017] As a further description of the above technical solution:

[0018] The product bearing area ensures the stability of the entire cavity surface pressure and supports the entire surface of the product.

[0019] The utility model has the following beneficial effects: in the utility model, a return pin and an anti-ejector are arranged in the lower mold, and during the injection molding process, the return pin and the anti-ejector are first used to support the embedded block so that the embedded block and the isolation film are evenly fitted, and the return pin and the anti-ejector are reset before the plastic sealing material is completely solidified. After the return pin and the anti-ejector are reset, the plastic sealing process is formally completed. Through the design of the return pin and the anti-ejector, the embedded block is completely fitted with the isolation film during the plastic sealing process, the occurrence of glue overflow is avoided, and the subsequent process flow of removing the glue overflow is reduced, thereby saving time and cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the integrated circuit QFN plastic packaging device proposed by the utility model;

[0021] Figure 2 The utility model is a schematic diagram of the structure of the lower mold of the integrated circuit QFN plastic packaging device.

[0022] Legend:

[0023] 1. Upper mold; 2. Lower mold; 3. Product bearing area; 4. Ejector base area; 5. Return pin and anti-ejector; 6. Positioning block; 7. Positioning pin; 8. Glue extrusion area; 9. Lead frame; 10. Tape; 11. Gasket; 12. Embedded block; 13. Isolation film. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Reference Figure 1-2 The utility model provides an embodiment: an integrated circuit QFN plastic packaging device, comprising an upper mold 1 and a lower mold 2, the lower mold 2 is arranged at the bottom of the upper mold 1, the upper mold 1 and the lower mold 2 are the main parts of the plastic packaging device, they are closely combined to form a closed plastic packaging space, and together constitute a plastic packaging working environment, the lower mold 2 includes a product carrying area 3, the product carrying area 3 can ensure the stability and safety of the product during the plastic packaging process, the product carrying area 3 is used to support and fix the integrated circuit product to be plastic packaged, the product carrying area 3 is designed as two groups, each group is equipped with a complete support and positioning structure, which not only improves the production efficiency, but also ensures that each product can be uniformly plastic packaged, a ejector base area 4 is installed on the product carrying area 3, a return pin anti-ejector 5 is arranged inside the ejector base area 4, a positioning block 6 is arranged on one side of the product carrying area 3, and a positioning pin 7 is arranged on the side of the product carrying area 3 away from the positioning block 6, the product carrying area 3 is provided with two groups, and a glue squeezing area 8 is arranged in the middle of the two groups of the product carrying area 3.

[0026] A lead frame 9 is arranged between the upper mold 1 and the lower mold 2, and an isolation film 13 is arranged on the surface of the lead frame 9. A tape 10 is arranged at the bottom of the lead frame 9. The tape 10 is used to fix the integrated circuit product to be plastic-sealed. The viscosity of the tape 10 can ensure that the product will not move or fall off during the plastic-sealing process, thereby ensuring the accuracy and quality of the plastic-sealing. The upper mold 1 includes a gasket 11, and an embedded block 12 is arranged at the bottom of the gasket 11. The main function of the embedded block 12 is to reduce the heat generated during the plastic-sealing process and ensure the stability and reliability of the integrated circuit product. Through the design of the embedded block 12, the service life of the product can be effectively extended and its performance stability can be improved. At the same time, the use of the embedded block 12 in conjunction with the return pin anti-ejector 5 can ensure that the embedded block 12 is completely in contact with the isolation film 13 during the plastic-sealing process, thereby avoiding the occurrence of mold overflow.

[0027] The return pin anti-ejector 5 is installed in the ejector base area 4. Several ejector base areas 4 are provided in each product bearing area 3. The return pin anti-ejector 5 can perform telescopic movements on the ejector base area 4, providing important support and positioning functions for the subsequent plastic packaging process. During the injection molding process, the return pin anti-ejector 5 will support the embedded block 12 to ensure that the embedded block 12 and the isolation membrane 13 are flatly fitted, thereby avoiding the occurrence of glue overflow.

[0028] The glue extrusion area 8 is made of tungsten steel with high hardness, which can ensure uniform extrusion of glue, thereby improving the quality of plastic sealing and optimizing the distribution of glue during the plastic sealing process. The glue extrusion area 8 is provided with two groups, and the glue extrusion area 8 squeezes glue toward the product bearing areas 3 on both sides.

[0029] The positioning block 6 is used for precise positioning of the upper mold 1 and the lower mold 2 , and can accurately position the upper mold 1 and the lower mold 2 to ensure accurate docking between the two to ensure accuracy and stability during the plastic packaging process. One or more positioning blocks 6 are provided in each product carrying area 3 .

[0030] The positioning pins 7 are used to position the frame on the upper mold 1 and the lower mold 2. They can ensure the precise positioning of the lead frame 9 on the upper mold 1 and the lower mold 2, providing reliable protection for the subsequent plastic packaging process. One or more positioning pins 7 are provided in each product carrying area 3.

[0031] The product bearing area 3 includes a support column and a lower film cavity block. The support column of the product bearing area 3 is used to ensure the stability of the entire cavity surface pressure and support the entire surface of the product.

[0032] Working principle: Before plastic encapsulation, the integrated circuit products need to be pre-processed, including cleaning, testing and classification, to ensure that the product surface is free of impurities and damage, and to screen out qualified products for subsequent plastic encapsulation. The product carrying area 3, the ejector base area 4, the glue squeezing area 8, and the positioning block 6 and the positioning pin 7 and other components are set on the lower mold 2. By adjusting the positions of the positioning block 6 and the positioning pin 7, the precise docking between the upper mold 1 and the lower mold 2 is ensured to ensure the accuracy and stability of the plastic encapsulation process. The pre-processed integrated circuit products are placed on the product carrying area and fixed with tape 10. The viscosity of the tape 10 can ensure the product The upper mold 1 is provided with a return pin and an anti-ejector 5, and the upper mold 1 is provided with a return pin and an anti-ejector 5. The return pin and an anti-ejector 5 are used to support the embedded block 12 during the injection molding process, so that the embedded block 12 and the isolation film 13 are evenly fitted. The return pin and an anti-ejector 5 are reset before the plastic sealing material is completely solidified. After the return pin and an anti-ejector 5 are reset, the upper mold 1 rises and separates from the lower mold 2, and the entire plastic sealing process is formally completed. Through the design of the return pin and an anti-ejector 5, the embedded block 12 is completely fitted with the isolation film 13 during the plastic sealing process, and the occurrence of glue overflow is avoided, and the subsequent process flow of removing the glue overflow is reduced, thereby saving time and cost.

[0033] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit QFN plastic packaging device, comprising an upper mold (1) and a lower mold (2), characterized in that: The lower mold (2) is arranged at the bottom of the upper mold (1), and the lower mold (2) comprises a product bearing area (3), an ejector base area (4) is installed on the product bearing area (3), a return pin ejector (5) is arranged inside the ejector base area (4), a positioning block (6) is arranged on one side of the product bearing area (3), and a positioning pin (7) is arranged on the side of the product bearing area (3) away from the positioning block (6), the product bearing area (3) is provided with two groups, and a glue extrusion area (8) is arranged in the middle of the two groups of the product bearing area (3).

2. The integrated circuit QFN plastic packaging device according to claim 1, characterized in that: A lead frame (9) is arranged between the upper mold (1) and the lower mold (2), an isolation film (13) is arranged on the surface of the lead frame (9), an adhesive tape (10) is arranged on the bottom of the lead frame (9), and the upper mold (1) comprises a gasket (11), and an embedding block (12) is arranged on the bottom of the gasket (11).

3. The integrated circuit QFN plastic packaging device according to claim 1, characterized in that: The return pin anti-thrust pin (5) is installed in the thrust pin base area (4), and a plurality of the thrust pin base areas (4) are provided in each product bearing area (3). The return pin anti-thrust pin (5) can perform a telescopic action on the thrust pin base area (4).

4. The integrated circuit QFN plastic packaging device according to claim 1, characterized in that: The glue squeezing area (8) is made of tungsten steel. The glue squeezing area (8) is provided with two groups. The glue squeezing area (8) squeezes glue toward the product bearing areas (3) on both sides.

5. The integrated circuit QFN plastic packaging device according to claim 1, characterized in that: The positioning block (6) is used for precise positioning of the upper mold (1) and the lower mold (2), and one or more positioning blocks (6) are provided in each product bearing area (3).

6. The integrated circuit QFN plastic packaging device according to claim 1, characterized in that: The positioning pins (7) are used to position the frame on the upper mold (1) and the lower mold (2), and one or more positioning pins (7) are provided in each product carrying area (3).

7. The integrated circuit QFN plastic packaging device according to claim 1, characterized in that: The product bearing area (3) comprises a support column and a lower film cavity block.

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