Chip mounting fixing structure of die bonding chip mounting equipment

Abstract

The utility model discloses a die bond paster equipment paster fixing structure, which comprises a base, a loading frame, a pull rod and a bearing plate, a placing groove is arranged at the middle position in the top end of the base, the loading frame is connected in the top end of the placing groove, the placing groove is in sliding connection with the loading frame, and the pull rod is arranged in the loading frame. And a through groove is formed in the middle position of the bottom end in the loading frame. The loading frame is arranged outside the bearing plate, so that the bearing plate can be effectively protected, the clamping grooves are formed in the two sides of the loading frame, and when the insertion blocks movably connected in the base are inserted into the clamping grooves in the loading frame, the position of the loading frame at the top end of the base can be fixed; and meanwhile, a connecting air pipe can be inserted into an air guide pipe on the loading frame through an external vacuum pump, and the vacuum pump can extract air in an empty groove through the air guide pipe, so that lower pressure is formed in the empty groove, and the position of the bearing plate is stably fixed.

Description

Technical Field

[0001] The utility model relates to the technical field of solid crystal patch technology, in particular to a patch fixing structure of solid crystal patch equipment. Background Art

[0002] With the development of the times, the die bonding industry has developed rapidly, which has also led to an increasing demand for die bonding equipment. In the production process of laser transmitters, the chip (LD chip) is first picked up manually, and then positioned on the chip welding base (TO-type base) under a microscope by the naked eye, and the chip mounting is completed through the eutectic process. The chip mounting structure of the die bonding equipment generally uses a cover plate to press and then mount the chip. Such a structure often requires manual assembly and insertion of panels.

[0003] A laser patch fixing structure disclosed in the Chinese utility model patent application disclosure CN107342534B has a simple structure and is easy to implement. By placing the product at an angle and setting an adsorption magnet with the same angle, the dual adsorption force of vacuum adsorption and magnet adsorption is utilized to make the product clamped more firmly, while ensuring that each product is close to the tooling surface and eliminating product warping. However, the fixation stability of the workpiece by the cover plate is poor, and the workpiece may become loose. At the same time, pressing the cover plate may cause external damage to the workpiece, thereby affecting the stability of subsequent patch work. Utility Model Content

[0004] The purpose of the utility model is to provide a chip fixing structure of a die bonding chip mounting device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip fixing structure of a solid crystal chip mounting equipment, comprising a base, a loading frame, a pull rod and a bearing plate, a placement groove is provided in the middle position inside the top of the base, the top of the placement groove is internally connected with a loading frame, the placement groove and the loading frame are slidably connected, a through groove is provided in the middle position of the bottom of the loading frame, a clamping groove is provided in the middle position of both sides of the loading frame, a pull rod is connected in the middle position of both sides of the top of the base, the base and the pull rod are slidably connected, a movable block is fixedly connected to the bottom end of the pull rod, a spring is fixedly connected to one side of the movable block, an insert block is fixedly connected to the middle position of one side of the movable block, the insert block is movably connected to the outside of the insert block with a clamping groove, a bearing plate is connected in the middle position of the top of the loading frame, and the loading frame and the bearing plate are movably connected.

[0006] Preferably, assembly plates are connected to the bottom ends of both sides of the base, the base and the assembly plates are fixedly connected, and a positioning baffle is fixedly connected to the middle position of one side of the top end of the base.

[0007] Preferably, servo motors are installed on both sides of the placement groove, and threaded rods are installed on the output shaft ends of the servo motors.

[0008] Preferably, a threaded block is connected to one side of the outside of the threaded rod, the threaded rod and the threaded block are threadedly connected, and a positioning block is fixedly connected to the middle position of the top end of the threaded block.

[0009] Preferably, positioning grooves are provided inside both sides of the bottom end of the loading frame, and positioning blocks are movably connected inside the positioning grooves.

[0010] Preferably, air ducts are provided on both sides of the interior of the loading frame, and an empty groove is provided at the top of the air ducts.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The chip fixing structure of the die bonding device can effectively protect the carrier plate by arranging a loading frame on the outside of the carrier plate, and card slots are arranged on both sides of the loading frame. When the plug-in block movably connected in the base is inserted into the card slot on the loading frame, the position of the loading frame on the top of the base can be fixed. At the same time, the connecting air pipe can be inserted into the inside of the air guide pipe on the loading frame through an external vacuum pump, and the vacuum pump can extract the air in the empty slot through the air guide pipe to form a lower pressure in the empty slot, thereby stably fixing the position of the carrier plate. The operation is simple and convenient, and the safety and stability of the use of the fixed structure are guaranteed.

[0013] 2. The chip fixing structure of this type of solid crystal chip mounting equipment is provided with positioning grooves on both sides of the bottom of the loading frame. When the loading frame is placed in the placement groove, the positioning blocks on both sides of the top of the placement groove can be inserted into the positioning grooves at the bottom of the loading frame. When the mounting work of the carrier plate in the loading frame is completed, the limit of the loading frame can be cancelled by pulling the insert block out from the card slot on the loading frame. At this time, the servo motor in the placement groove is started to drive the threaded rod to rotate, and the threaded block on the threaded rod can push the loading frame through the positioning block to perform rapid material discharge, thereby improving the flexibility of subsequent use of the fixed structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a cross-sectional structural schematic diagram of the utility model;

[0016] Figure 3 It is a schematic diagram of the top view of the base of the utility model;

[0017] Figure 4 It is a bottom view structural diagram of the loading frame of the utility model.

[0018] In the figure: 1. base; 101. assembly plate; 102. positioning baffle; 2. placement slot; 3. servo motor; 301. threaded rod; 302. threaded block; 303. positioning block; 4. loading frame; 401. positioning slot; 402. through slot; 403. card slot; 404. air guide tube; 405. empty slot; 5. pull rod; 501. movable block; 502. spring; 503. plug-in block; 6. load-bearing plate. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-4 The utility model provides an embodiment: a chip fixing structure of a die bonding device, comprising a base 1, a loading frame 4, a pull rod 5 and a bearing plate 6, the bottom ends of both sides of the base 1 are connected with an assembly plate 101, the base 1 and the assembly plate 101 are fixedly connected, and a positioning baffle 102 is fixedly connected to the middle position of one side of the top of the base 1, and the fixing structure can be quickly fixed in position through the assembly plate 101, and at the same time, a positioning baffle 102 is provided on one side of the top of the base 1 to assist in limiting the bearing plate 6;

[0021] A placement slot 2 is provided at the middle position inside the top of the base 1, servo motors 3 are installed on both sides of the placement slot 2, a threaded rod 301 is installed at the output shaft end of the servo motor 3, a threaded block 302 is connected to one side of the outside of the threaded rod 301, the threaded rod 301 and the threaded block 302 are threadedly connected, a positioning block 303 is fixedly connected to the middle position of the top of the threaded block 302, two groups of servo motors 3 are installed inside the placement slot 2, and the two groups of servo motors 3 are used alternately. When the servo motor 3 is started, it can drive the threaded rod 301 on one side to rotate, and at this time, the threaded block 302 on the threaded rod 301 can move freely on the threaded rod 301, and the threaded block 302 can drive the loading frame 4 to slide inside the placement slot 2 through the positioning block 303;

[0022] The top of the placement slot 2 is internally connected with a loading frame 4, the placement slot 2 and the loading frame 4 are slidably connected, positioning slots 401 are internally provided on both sides of the bottom of the loading frame 4, and positioning blocks 303 are movably connected inside the positioning slots 401, and the positions of the positioning blocks 303 and the positioning slots 401 correspond to each other. By inserting the positioning blocks 303 into the positioning slots 401 at the bottom of the loading frame 4, the movement of the positioning blocks 303 can drive the loading frame 4 to move;

[0023] A through slot 402 is provided in the middle of the bottom of the loading frame 4, and a clamping slot 403 is provided in the middle of both sides of the loading frame 4. Through the provision of the through slot 402, the loading plate 6 can be quickly ejected and replaced from the inside of the loading frame 4 after the die bonding process, and the plug block 503 movably connected in the placement slot 2 is inserted into the clamping slot 403 on the loading frame 4, so that the loading frame 4 can be fixed in the position of the placement slot 2 at the top of the base 1;

[0024] Air guide tubes 404 are provided on both sides of the interior of the loading frame 4, and an empty groove 405 is provided at the top of the air guide tube 404. The air guide tube 404 can be connected to an external negative pressure pump through an air pipe. The vacuum pump can extract air in the empty groove 405 through the air guide tube 404, so that a lower pressure is formed in the empty groove 405, forming a vacuum environment. At this time, the pressure difference between the empty groove 405 and the bottom end of the carrying plate 6 will generate vacuum suction, thereby completing the stable adsorption work of the carrying plate 6, ensuring the stability of the carrying plate 6 inside the loading frame 4;

[0025] A pull rod 5 is connected to the middle position of both sides of the top of the base 1. The base 1 and the pull rod 5 are slidably connected. A movable block 501 is fixedly connected to the bottom end of the pull rod 5. A spring 502 is fixedly connected to one side of the movable block 501. An insert block 503 is fixedly connected to the middle position of one side of the movable block 501. The outer movability of the insert block 503 is connected with a slot 403. When the insert block 503 is subjected to a force from the outside to the inside, the spring 502 on one side can be squeezed by the movable block 501. At this time, the insert block 503 can be retracted into the inside of the base 1. When the force on the insert block 503 is cancelled, the movable block 501 can push the insert block 503 out of the inside of the base 1 due to the reaction force of the squeezed spring 502. In addition, a pull rod 5 is fixedly connected to the top of the movable block 501. The movable block 501 and the insert block 503 can be pulled to move their positions by the pull rod 5.

[0026] A carrying plate 6 is connected to the middle position inside the top of the loading frame 4 . The loading frame 4 and the carrying plate 6 are movably connected, and multiple groups of chips can be mounted through the inside of the carrying plate 6 .

[0027] When the embodiment of the present application is in use: the carrier plate 6 that needs to be die-bonded is placed inside the loading frame 4, and the loading frame 4 is placed inside the placement slot 2 at the top of the base 1. At the same time, the positioning slot 401 at the bottom of the loading frame 4 is stuck on the positioning block 303 inside the placement slot 2, and the loading frame 4 is pushed to slide inside the placement slot 2. At this time, the plug blocks 503 on both sides of the placement slot 2 are subjected to force, and the spring 502 can be squeezed by the movable block 501, and the plug blocks 503 are retracted into the base 1. When the loading frame 4 moves to the innermost part of the placement slot 2 at the top of the base 1, the plug blocks 503 are no longer subjected to force. Due to the reaction force of the spring 502 being squeezed, the plug blocks 503 can be pushed by the movable block 501 to be inserted into the card slot 403 on the loading frame 4, thereby completing the fixing of the loading frame 4 at the top of the placement slot 2. At this time, the external vacuum pump can insert the connecting air pipe into the interior of the air guide pipe 404 on the loading frame 4, and the vacuum pump can pass through the air guide pipe 40 4 extracts the air in the empty slot 405, so that a lower pressure is formed in the empty slot 405, forming a vacuum environment. At this time, the pressure difference between the empty slot 405 and the bottom end of the carrier plate 6 will generate a vacuum suction force, thereby completing the stable adsorption work of the carrier plate 6. At the same time, the chip mounting work on the top of the carrier plate 6 can be carried out in cooperation with the solid crystal mounting equipment. After the mounting is completed, by pulling the pull rod 5 at the top of the base 1, the pull rod 5 can drive the plug block 503 to be pulled out from the slot 403 on the loading frame 4 through the movable block 501. At this time, the servo motor 3 is started to drive the threaded rod 301 to rotate, and the threaded block 302 on the threaded rod 301 can push the loading frame 4 to move through the positioning block 303, and make the loading frame 4 quickly slide out from one side of the placement slot 2. At this time, the loading frame 4 is pulled out from the positioning block 303, and the carrier plate 6 can be quickly pushed out from the inside of the loading frame 4 through the through slot 402 at the bottom of the loading frame 4, so as to carry out the subsequent chip mounting and fixing work.

[0028] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A die bonding device chip fixing structure, characterized in that , comprising a base (1), a loading frame (4), a pull rod (5) and a carrying plate (6), wherein a placement groove (2) is provided at the middle position inside the top of the base (1), a loading frame (4) is connected to the top of the placement groove (2), the placement groove (2) and the loading frame (4) are slidably connected, a through groove (402) is provided at the middle position of the bottom of the loading frame (4), a card slot (403) is provided at the middle position of both sides of the loading frame (4), and pull rods are provided at the middle position of both sides of the top of the base (1) (5), the base (1) and the pull rod (5) are in sliding connection, the bottom end of the pull rod (5) is fixedly connected with a movable block (501), one side of the movable block (501) is fixedly connected with a spring (502), the middle position of one side of the movable block (501) is fixedly connected with an insertion block (503), the outside of the insertion block (503) is movably connected with a slot (403), the middle position inside the top of the loading frame (4) is connected with a bearing plate (6), and the loading frame (4) and the bearing plate (6) are movably connected.

2. The chip fixing structure of die bonding equipment according to claim 1, characterized in that: The bottom ends of both sides of the base (1) are connected with assembly plates (101), the base (1) and the assembly plates (101) are fixedly connected, and a positioning baffle (102) is fixedly connected to the middle position of one side of the top end of the base (1).

3. The chip fixing structure of die bonding equipment according to claim 1, characterized in that: A servo motor (3) is installed on both sides of the placement groove (2), and a threaded rod (301) is installed on the output shaft end of the servo motor (3).

4. The chip fixing structure of die bonding equipment according to claim 3, characterized in that: A threaded block (302) is connected to one side of the outside of the threaded rod (301), the threaded rod (301) and the threaded block (302) are threadedly connected, and a positioning block (303) is fixedly connected to the middle position of the top of the threaded block (302).

5. The chip fixing structure of die bonding equipment according to claim 1, characterized in that: Positioning grooves (401) are provided inside the two sides of the bottom end of the loading frame (4), and positioning blocks (303) are movably connected inside the positioning grooves (401).

6. The chip fixing structure of die bonding equipment according to claim 1, characterized in that: Air guide tubes (404) are arranged on both sides of the interior of the loading frame (4), and an empty groove (405) is arranged at the top of the air guide tube (404).

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