High-frequency multilayer printed circuit board for 5G communication

Abstract

The utility model relates to the technical field of high-frequency multilayer printed circuit boards for communication, and discloses a high-frequency multilayer printed circuit board for G communication, which comprises a circuit board body, two sides of the upper side of the circuit board body are respectively provided with a heat dissipation plate and a heat dissipation mechanism, and the heat dissipation mechanism is arranged on the heat dissipation plate. According to the high-frequency multilayer printed circuit board for 5G communication, when the circuit board body works, the heat dissipation plate conducts heat dissipation on the circuit board body, the circulation grooves increase the air circulation performance in the whole device, the heat dissipation holes are formed in the heat dissipation plate, and the heat dissipation holes are formed in the heat dissipation plate. And the arrangement of the trapezoidal grooves increases the circulation of gas, thereby improving the heat dissipation effect, dissipating the heat in the circuit board body, and effectively performing heat absorption treatment through the aluminum oxide heat dissipation coating, preventing the heat in the circuit board body from being too high, and prolonging the service life of the circuit board body.

Description

Technical Field

[0001] The utility model relates to the technical field of high-frequency multi-layer printed circuits for communications, specifically a high-frequency multi-layer printed circuit board for 5G communications. Background Art

[0002] The fifth generation of mobile communication technology is the latest generation of cellular mobile communication technology and is an extension of 4G, 3G and 2G systems. The performance goals of 5G are high data rate, reduced latency, energy saving, cost reduction, increased system capacity and large-scale device connection.

[0003] In 5G communication, high-frequency multi-layer printed circuit boards are required. The existing high-frequency multi-layer printed circuit boards have poor anti-breakage effect. When people use high-frequency multi-layer printed circuit boards, they are prone to bending, which causes damage to the high-frequency multi-layer printed circuit boards, increases the cost of use, and is inconvenient for people to use. The high-frequency multi-layer printed circuit boards are not well protected and are easily damaged. High-frequency multi-layer printed circuit boards will generate heat when used. If heat is not dissipated, the life of the high-frequency multi-layer printed circuit boards will be affected. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the utility model provides a high-frequency multi-layer printed circuit board for 5G communication, which has the advantages of improving the heat dissipation performance and anti-bending performance of the circuit board, and solves the problem of poor heat dissipation performance and anti-bending performance of the circuit board.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purpose of improving the heat dissipation performance and anti-bending performance of the circuit board, the utility model provides the following technical solutions: a high-frequency multi-layer printed circuit board for 5G communication, comprising a circuit board body, and heat dissipation plates are respectively arranged on both sides of the upper side of the circuit board body;

[0008] The heat dissipation mechanism is arranged on the heat dissipation plate, and is used to dissipate the heat generated by the circuit board body during operation. The heat dissipation mechanism includes heat dissipation holes, which are respectively opened on the upper surfaces of the two heat dissipation plates. Two protective plates are arranged on the opposite sides of the two heat dissipation plates.

[0009] The anti-breaking mechanism is arranged on two protection plates. The anti-breaking mechanism is used for anti-breaking of multi-layer printed circuit boards. The anti-breaking mechanism includes two high-strength composite anti-breaking plates. The two high-strength composite anti-breaking plates are respectively fixedly installed on the opposite surfaces of the two protection plates.

[0010] Preferably, the heat dissipation mechanism further includes an aluminum oxide heat dissipation coating, and the aluminum oxide heat dissipation coating is respectively arranged on the two heat dissipation plates.

[0011] Preferably, trapezoidal grooves are respectively provided on both sides of the two protection plates, and flow grooves are provided on opposite sides of the two protection plates, and the flow grooves are communicated with the trapezoidal grooves.

[0012] Preferably, the heat dissipation mechanism further includes heat dissipation fins, and the heat dissipation fins are respectively fixedly mounted on opposite surfaces of the two protection plates.

[0013] Preferably, a fixing column is fixedly sleeved on the inner surface of the circuit board body, and two threaded grooves are respectively provided on the upper and lower sides of the fixing column. The inner walls of the two threaded grooves are respectively threadedly sleeved with screws, and the screws are rotatably sleeved on the inner surfaces of the protection plate and the heat dissipation plate.

[0014] Preferably, separation gaskets are provided on the upper and lower sides of the protection plate and the heat dissipation plate respectively.

[0015] Preferably, the anti-fracture mechanism further includes two insulating layers, and the two insulating layers are respectively arranged on opposite sides of the two high-strength composite anti-fracture plates.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the utility model provides a high-frequency multi-layer printed circuit board for 5G communication, which has the following beneficial effects:

[0018] 1. The high-frequency multi-layer printed circuit board for 5G communication, when the circuit board body is working, the heat sink dissipates the heat of the circuit board body, the circulation groove increases the air circulation inside the whole device, and the setting of the trapezoidal groove increases the gas circulation, thereby improving the heat dissipation effect, and can dissipate the heat inside the circuit board body, and can effectively absorb heat through the alumina heat dissipation coating, so as to avoid excessive heat inside the circuit board body and extend the life of the circuit board body.

[0019] 2. The high-frequency multi-layer printed circuit board for 5G communication can improve the anti-breaking function of the circuit board body by setting a high-strength composite anti-bending plate, enhance the strength of the circuit board, and increase the service life of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of a high-frequency multi-layer printed circuit board for 5G communication in the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the protection plate of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the heat sink of the utility model;

[0023] Figure 4 This is a schematic diagram of the internal structure of the fixed column of the utility model;

[0024] Figure 5 For this utility model Figure 4 A magnified view of the structure in the middle.

[0025] In the figure: 1. Circuit board body; 2. Heat sink; 3. Protection plate; 4. High-strength composite anti-bending plate; 5. Insulation layer; 6. Flow groove; 7. Trapezoidal groove; 8. Heat sink fins; 9. Alumina heat sink coating; 10. Heat sink hole; 11. Fixing column; 12. Threaded groove; 13. Screw; 14. Separation gasket. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-5 , the utility model provides a new technical solution: a high-frequency multi-layer printed circuit board for 5G communication, comprising a circuit board body 1, and heat dissipation plates 2 are respectively arranged on both sides of the upper side of the circuit board body 1;

[0028] The heat dissipation mechanism is arranged on the heat dissipation plate 2. The heat dissipation mechanism is used to dissipate the heat generated by the circuit board body 1 during operation. The heat dissipation mechanism includes heat dissipation holes 10. The heat dissipation holes 10 are respectively opened on the upper surfaces of the two heat dissipation plates 2. Two protective plates 3 are arranged on the opposite sides of the two heat dissipation plates 2.

[0029] The anti-breaking mechanism is arranged on two protection plates 3. The anti-breaking mechanism is used to prevent the multi-layer printed circuit board from breaking. The anti-breaking mechanism includes two high-strength composite anti-breaking plates 4. The two high-strength composite anti-breaking plates 4 are fixedly mounted on opposite surfaces of the two protection plates 3 respectively.

[0030] Furthermore, the heat dissipation mechanism further includes an aluminum oxide heat dissipation coating 9 , which is disposed on the two heat dissipation plates 2 .

[0031] Furthermore, trapezoidal grooves 7 are respectively formed on both sides of the two protection plates 3 , and flow grooves 6 are formed on opposite sides of the two protection plates 3 , and the flow grooves 6 are communicated with the trapezoidal grooves 7 .

[0032] Furthermore, the heat dissipation mechanism further includes heat dissipation fins 8 , which are respectively fixedly mounted on opposite surfaces of the two protection plates 3 .

[0033] Furthermore, a fixing column 11 is fixedly sleeved on the inner surface of the circuit board body 1, and two thread grooves 12 are respectively provided on the upper and lower sides of the fixing column 11. The inner walls of the two thread grooves 12 are respectively threadedly sleeved with screws 13, and the screws 13 are rotatably sleeved on the inner surfaces of the protection plate 3 and the heat dissipation plate 2.

[0034] Furthermore, separation gaskets 14 are respectively provided on the upper and lower sides of the protection plate 3 and the heat dissipation plate 2 .

[0035] Furthermore, the anti-fracture mechanism also includes two insulating layers 5, and the two insulating layers 5 are respectively arranged on opposite sides of two high-strength composite anti-fracture plates 4. When the high-frequency multi-layer printed circuit board for 5G communication is in use, when the circuit board itself generates heat, the heat will be adsorbed by the alumina heat dissipation coating 9 arranged on the heat dissipation plate 2 and the heat dissipation fins 8 on the protective plate 3, and part of the heat will be discharged through the heat dissipation holes 10. At this time, the cold air is subjected to heat exchange treatment through the trapezoidal grooves 7 and the flow grooves 6 opened on the protective plate 3 to dissipate the heat, and the two screws 13 can be rotated by a tool to move the two screws 13 toward the opposite side in the threaded grooves 12 opened on the inner surface of the hollow column 11, and at the same time, the distance between the heat dissipation plate 2 and the circuit board body 1 is adjusted to enhance the heat dissipation function, and through the protective plate 3 The high-strength composite anti-folding plate 4 is set to improve the overall strength of the multi-layer printed circuit board and further improve the anti-fracture performance. The high-frequency multi-layer printed circuit board for 5G communication, when the circuit board body is working, the heat sink dissipates the heat of the circuit board body, the circulation groove increases the air circulation inside the overall device, and the setting of the trapezoidal groove increases the gas circulation, thereby improving the heat dissipation effect, and can dissipate the heat inside the circuit board body. The aluminum oxide heat dissipation coating can effectively absorb heat to avoid excessive heat inside the circuit board body and extend the life of the circuit board body. The high-frequency multi-layer printed circuit board for 5G communication can improve the anti-fracture function of the circuit board body by setting a high-strength composite anti-folding plate, enhance the strength of the circuit board, and increase the service life of the circuit board.

[0036] Working principle: When the high-frequency multi-layer printed circuit board for 5G communication is in use, when the circuit board itself generates heat, the heat will be absorbed by the alumina heat dissipation coating 9 arranged on the heat sink 2 and the heat dissipation fins 8 on the protective plate 3, and part of the heat will be discharged through the heat dissipation holes 10. At this time, the cold air is subjected to heat exchange treatment through the trapezoidal grooves 7 and the flow grooves 6 opened on the protective plate 3 to dissipate the heat, and the two screws 13 can be rotated by a tool so that the two screws 13 move toward opposite sides in the threaded grooves 12 opened on the inner surface of the hollow column 11, and at the same time, the distance between the heat sink 2 and the circuit board body 1 is adjusted to enhance the heat dissipation function, and the high-strength composite anti-bending plate 4 arranged on the protective plate 3 can be used to improve the overall strength of the multi-layer printed circuit board, and further improve the anti-bending performance.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-frequency multi-layer printed circuit board for 5G communication, comprising a circuit board body (1), characterized in that: Heat dissipation plates (2) are respectively arranged on both sides of the upper side of the circuit board body (1); A heat dissipation mechanism, the heat dissipation mechanism is arranged on the heat dissipation plate (2), and the heat dissipation mechanism is used to dissipate heat generated by the circuit board body (1) during operation, and the heat dissipation mechanism comprises heat dissipation holes (10), and the heat dissipation holes (10) are respectively opened on the upper surfaces of the two heat dissipation plates (2), and two protective plates (3) are arranged on the opposite sides of the two heat dissipation plates (2); The anti-breaking mechanism is arranged on two protection plates (3) and is used for preventing the multi-layer printed circuit board from breaking. The anti-breaking mechanism comprises two high-strength composite anti-breaking plates (4). The two high-strength composite anti-breaking plates (4) are respectively fixedly mounted on opposite surfaces of the two protection plates (3).

2. A high-frequency multi-layer printed circuit board for 5G communication according to claim 1, characterized in that: The heat dissipation mechanism further comprises an aluminum oxide heat dissipation coating (9), and the aluminum oxide heat dissipation coating (9) is respectively arranged on the two heat dissipation plates (2).

3. A high-frequency multi-layer printed circuit board for 5G communication according to claim 2, characterized in that: Trapezoidal grooves (7) are respectively provided on both sides of the two protection plates (3), and flow grooves (6) are provided on the opposite sides of the two protection plates (3), and the flow grooves (6) are communicated with the trapezoidal grooves (7).

4. A high-frequency multi-layer printed circuit board for 5G communication according to claim 3, characterized in that: The heat dissipation mechanism also includes heat dissipation fins (8), and the heat dissipation fins (8) are respectively fixedly mounted on opposite surfaces of the two protection plates (3).

5. A high-frequency multi-layer printed circuit board for 5G communication according to claim 4, characterized in that: A fixing column (11) is fixedly sleeved on the inner surface of the circuit board body (1), and two thread grooves (12) are respectively provided on the upper and lower sides of the fixing column (11), and screw rods (13) are respectively threadedly sleeved on the inner walls of the two thread grooves (12), and the screw rods (13) are rotatably sleeved on the inner surfaces of the protection plate (3) and the heat dissipation plate (2).

6. A high-frequency multi-layer printed circuit board for 5G communication according to claim 5, characterized in that: Separation gaskets (14) are respectively provided on the upper and lower sides of the protection plate (3) and the heat dissipation plate (2).

7. A high-frequency multi-layer printed circuit board for 5G communication according to claim 6, characterized in that: The anti-fracture mechanism further comprises two insulating layers (5), and the two insulating layers (5) are respectively arranged on opposite sides of two high-strength composite anti-fracture plates (4).

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