Process gas flow regulation and control device for vacuum ion plating equipment
By designing a process gas flow control device for vacuum ion coating equipment, the problem of increasing vacuum volume during air supply of vacuum coating equipment is solved, and the effect of reducing the pumping time and labor costs and improving production efficiency is achieved.
Patent Information
- Application Number
- CN202421404219.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-06-19
AI Technical Summary
When supplying air, the existing vacuum coating equipment is directly connected to the vacuum chamber through the intake pipe, resulting in an increase in vacuum volume, wasted vacuum time and labor costs.
A process gas flow control device is designed to connect to the gas source device and the vacuum coating chamber through the intake assembly and the air outlet assembly, and to adjust the gas flow by the air outlet regulation assembly and the control device, and to block the connection between the gas circuit pipe and the vacuum coating chamber.
The pumping time and labor cost are reduced, the vacuum volume remains unchanged, and the production efficiency is improved.
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Figure CN222631544U_ABST
Abstract
Description
Technical Field
[0001] This patent relates to the field of vacuum ion plating, and specifically to a process gas flow control device for vacuum ion plating equipment. Background Art
[0002] With the rapid development of science and technology, various industries have higher and higher requirements for product quality, service life and appearance. Vacuum ion plating is to "wear" a layer of "super nano coat" on the product. The quality and service life of the product after vacuum ion plating are "qualitatively" improved; process gas is an indispensable part of vacuum ion plating, and the gas flow rate has a great influence on the composition of the film layer. Because the precise control of gas flow parameters is directly related to the composition and proportion of elements in the film layer, it is very necessary to accurately control the process gas. Dry coating is basically "zero pollution" during the coating process. In recent years, it has been widely used in various fields such as tools, molds, automobiles, aerospace, medical, 3C consumer electronics and military industry. Due to the unique "vacuum working condition" environment of vacuum coating equipment, it must be maintained at a certain vacuum value to carry out coating production. At present, the gas supply of some coating equipment is directly connected to the vacuum chamber through the air inlet pipe, which invisibly increases the vacuum volume and wastes time and labor costs for vacuuming the chamber. Therefore, it is necessary to solve this problem. Summary of the invention
[0003] In order to solve the above problems, the utility model provides a process gas flow control device for vacuum ion plating equipment, which can control the time of evacuating the vacuum plating chamber.
[0004] The technical solution adopted by the utility model is specifically as follows.
[0005] A process gas flow control device for vacuum ion plating equipment, characterized in that: the flow control device is provided with an air inlet component for communicating with a gas source device, and an air outlet component for connecting with a vacuum plating chamber, the vacuum plating chamber is connected with a vacuum pumping device, the air outlet component is provided with an air outlet regulating component for adjusting the connection state between the flow control device and the vacuum plating chamber, the air outlet regulating component is connected with a control device, and the control device is used to adjust the operation state of the air outlet regulating component. The control device also adjusts the operation state of each device constituting the vacuum ion plating equipment.
[0006] The specific solution is: an air intake regulating component for regulating the connectivity between the flow regulating device and the air source device is provided on the air intake component, the air intake regulating component is connected to the control device, and the control device is used to regulate the operating state of the air intake regulating component.
[0007] The gas source device includes various sub-gas source devices, each of which supplies different process gases respectively. The flow regulating device includes a flow regulating unit, and the flow regulating unit is composed of sub-flow regulating units for regulating the flow of different process gases respectively. The sub-flow regulating unit includes a flow regulator. The air intake component includes an A air intake pipe unit, and the air outlet component includes an A air outlet pipe unit. The air intake regulating component includes various A air intake regulating units, and the air outlet regulating component includes various A air outlet regulating units. Each flow regulating unit is connected to the sub-gas source device and the vacuum coating chamber through the A air intake pipe unit and the A air outlet pipe unit respectively. The A air intake regulating unit and the A air outlet regulating unit are respectively arranged on the A air intake pipe unit and the A air outlet pipe unit.
[0008] The flow regulating unit also includes a gas mixing tank, the A air inlet pipe unit includes each A air inlet pipe, the A air outlet pipe unit includes each A air outlet pipe, the air outlet ends of each A air inlet pipe on the same flow regulating unit are respectively connected to the air inlet end of each flow regulator through the gas mixing tank, and the air outlet ends of each flow regulator are respectively connected to the vacuum chamber through each A air outlet pipe, the A air inlet regulating unit includes each A air inlet regulating valve, and each A air inlet regulating valve is respectively installed on each A air inlet pipe, and the control device regulates the operating state of each A air inlet regulating valve.
[0009] The flow regulating device is provided with m identical flow regulating units, and each flow regulating unit is provided with n flow regulating sub-units, where m≥2 and n≥2.
[0010] m=2,n=4.
[0011] The vacuum coating chamber is provided with n A connecting pipes connected thereto. The A outlet pipes for regulating the same process gas on each flow regulating unit are connected to the same A connecting pipe through pipe joints. The A outlet regulating unit includes A outlet regulating valves, which are respectively installed on A connecting pipes. The control device regulates the operating status of each A outlet regulating valve.
[0012] A outlet regulating valve and A inlet regulating valve are stop valves respectively.
[0013] The vacuum coating chamber is provided with n coating source devices, and each A connecting pipe is arranged corresponding to each coating source device.
[0014] The flow regulator is an MFC gas flow meter.
[0015] The utility model provides the above-mentioned solution, which perfectly cuts off the connection between the gas pipeline and the vacuum coating chamber when the chamber is pressurized or vacuumed, so that the vacuum volume remains unchanged, reduces the air extraction time and labor costs, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1It is an assembly diagram of the utility model.
[0017] Figure 2 It is a structural schematic diagram of the utility model.
[0018] Figure 3 This is the wiring diagram of the flow regulator.
[0019] The reference numerals in the figure are: 10 - vacuum coating chamber, 20 - vacuum equipment, 30 - coating source device, 40 - gas source device, 50 - control device, 51 - control cabinet, 60 - A connecting pipe, 70 - flow control device, 71 - flow regulator, 72 - gas mixing tank, 73 - A air inlet pipe, 74 - air inlet regulating valve, 75 - A air outlet pipe, 76 - air outlet regulating valve, 77 - pipe joint, 78 - mounting seat. DETAILED DESCRIPTION
[0020] In order to make the purpose and advantages of the utility model more clear, the utility model is specifically described in combination with the following embodiments. It should be understood that the following text is only used to describe one or several specific implementations of the utility model, and does not strictly limit the protection scope of the specific request of the utility model.
[0021] As used herein, the terms "parallel," "perpendicular," and the like are not limited to their strict geometric definitions, but include tolerances for reasonable and inconsistent machining or human errors.
[0022] like Figure 1 As shown, a process gas flow control device 70 for vacuum ion plating equipment is provided on the flow control device 70, which is provided with an air intake component for communicating with the gas source device 40 and an air outlet component for connecting with the vacuum plating chamber 10. The vacuum plating chamber 10 is connected to the vacuum pumping device 20. The air outlet component is provided with an air outlet regulating component for adjusting the connection state between the flow control device 70 and the vacuum plating chamber. The air outlet regulating component is connected to the control device 50, and the control device 50 is used to adjust the operation state of the air outlet regulating component. The air intake component is provided with an air intake regulating component for adjusting the connection state between the flow control device 70 and the gas source device 40. The air intake regulating component is connected to the control device 50, and the control device 50 is used to adjust the operation state of the air intake regulating component. The control device 50 also adjusts the operation state of each device constituting the vacuum ion plating equipment. The vacuum ion plating equipment includes a control device 50 (specifically a PC-side control console), a vacuum pumping system or equipment, a gas source device 40 (gas storage station), a vacuum plating chamber 10 and various plating source devices 30 .
[0023] The utility model provides the above solution, which perfectly cuts off the connection between the gas pipeline and the vacuum coating chamber 10 when the chamber is pressurized or vacuumed, so that the vacuum volume remains unchanged, reduces the pumping time and labor costs, and improves production efficiency.
[0024] Specific plans, such as Figure 2 As shown, the gas source device 40 includes each sub-gas source device 40, each sub-gas source device 40 supplies different process gases respectively, the flow regulating device includes a flow regulating unit, the flow regulating unit is composed of sub-flow regulating units for regulating the flow of different process gases respectively, the sub-flow regulating unit includes a flow regulator 71, the air inlet component includes an A air inlet pipe 73 unit, the air outlet component includes an A air outlet pipe 75 unit, the air inlet regulating component includes each A air inlet regulating unit, the air outlet regulating component includes each A air outlet regulating unit, each flow regulating unit is connected to the sub-gas source device 40 and the vacuum coating chamber 10 through the A air inlet pipe 73 unit and the A air outlet pipe 75 unit, and the A air inlet regulating unit and the A air outlet regulating unit are respectively arranged on the A air inlet pipe 73 unit and the A air outlet pipe 75 unit. The flow regulating device is provided with m identical flow regulating units, and each flow regulating unit is provided with n flow regulating sub-units, m≥2, n≥2. The flow regulating unit also includes a gas mixing tank 72, the A air inlet pipe 73 unit includes each A air inlet pipe 73, and the A air outlet pipe 75 unit includes each A air outlet pipe 75. The outlet ends of each A air inlet pipe 73 on the same flow regulating unit are respectively connected to the air inlet end of each flow regulator 71 through the gas mixing tank 72, and the outlet ends of each flow regulator 71 are respectively connected to the vacuum chamber through each A air outlet pipe 75. The A air inlet regulating unit includes each A air inlet regulating valve 74, and each A air inlet regulating valve 74 is respectively installed on each A air inlet pipe 73. The control device 50 regulates the operating state of each A air inlet regulating valve 74. The vacuum coating chamber 10 is provided with n A connecting pipes 60 connected thereto, and the A outlet pipes 75 for regulating the same process gas on each flow regulating unit are connected to the same A connecting pipe 60 through pipe joints 77 (such as three-way joints), and the A outlet regulating units include A outlet regulating valves 76, and each A outlet regulating valve 76 is respectively installed on each A connecting pipe 60, and the control device 50 regulates the operating state of each A outlet regulating valve 76. Preferably, n coating source devices 30 are provided on the vacuum coating chamber 10, and each A connecting pipe 60 is arranged corresponding to each coating source device 30. The flow regulating device 70 is installed on the mounting seat 78. The flow regulator 71 is an MFC gas flow meter. m=2, n=4. The A outlet regulating valve 76 and the A inlet regulating valve 74 are stop valves respectively. In this way, each flow regulating unit stores the process gas used in the coating, such as the four process gases can be respectively: N 2 (nitrogen), O 2 (oxygen), Ar (argon), C 2 H2 (Acetylene). The function of the gas mixing tank 72 is to inject two or more process gases into the gas mixing tank according to the process ratio requirements so that the mixed process gas meets the coating requirements. The control device 50 can control the air inlet regulating valve 74 (front stop valve) and the air outlet regulating valve 76 (rear stop valve) through software, and can also control the flow rate of the coating process gas by controlling the flow regulator 71 (MFC gas flow meter) to make the process gas reach the coating process gas value. By adjusting the air inlet regulating valve 74, the gas between the gas source device 40 and the flow meter device can be instantly cut off or circulated, and by adjusting the air outlet regulating valve 76, the gas between the vacuum coating chamber 10 and the flow meter device can be instantly cut off or circulated.
[0025] The inlet regulating valve 74 and the outlet regulating valve 76 are respectively provided with wiring terminals for connecting to the control device 50. The wiring terminals on the flow regulator 71 are arranged as follows: Figure 3 The method shown is connected to the control cabinet 51 constituting the control device 50, and the wiring terminals on the air inlet regulating valve 74 and the air outlet regulating valve 76 are also connected to the control cabinet 51. After the equipment is powered on, the PC end of the control device 50 uses the control software to accurately control the gas flow of the air inlet regulating valve 74, the air outlet regulating valve 76 and the flow regulator 71, so that the coating film layer can obtain the expected effect.
[0026] The above-mentioned scheme provided by the utility model can open or stop the gas circuit immediately through the air inlet regulating valve 74 and the air outlet regulating valve 76, accurately control the flow rate of the process gas through the flow regulator 71, and feed back the gas data signal to the control device 50 for reference and operation control by the staff. In addition, different process gases can be provided for ion plating, the connection between different process gases and the vacuum coating chamber 10 can be cut off at any time, and different process gases can be mixed in proportion to achieve the coating requirement value. The gas flow data is fed back to the PC end, which solves the problem that the process gas is uncontrolled due to the single-tube gas circuit directly connecting the chamber, and solves the problem that the single-channel direct gas circuit increases the vacuum volume invisibly, saves the vacuum pumping time and labor costs of the coating equipment, improves the flexibility of the vacuum coating process gas supply and the coating work efficiency, and meets different production needs.
[0027] The above is only a preferred embodiment of the present invention. It should be noted that, for ordinary technicians in the technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the field unless otherwise specified and limited.
Claims
1. A process gas flow control device for vacuum ion plating equipment, characterized in that: The flow control device is provided with an air inlet component for communicating with the air source device and an air outlet component for connecting with the vacuum coating chamber. The vacuum coating chamber is connected to the vacuum pumping equipment. The air outlet component is provided with an air outlet regulating component for adjusting the connection state between the flow control device and the vacuum coating chamber. The air outlet regulating component is connected to the control device, and the control device is used to adjust the operation state of the air outlet regulating component.
2. The process gas flow control device for vacuum ion plating equipment according to claim 1, characterized in that: The air intake assembly is provided with an air intake regulating assembly for regulating the connection state between the flow regulating device and the air source device. The air intake regulating assembly is connected to the control device, and the control device is used to regulate the operation state of the air intake regulating assembly.
3. The process gas flow control device for vacuum ion plating equipment according to claim 1 or 2, characterized in that: The gas source device includes various sub-gas source devices, each of which supplies different process gases respectively. The flow regulating device includes a flow regulating unit, and the flow regulating unit is composed of sub-flow regulating units for regulating the flow of different process gases respectively. The sub-flow regulating unit includes a flow regulator. The air inlet component includes an A air inlet pipe unit, and the air outlet component includes an A air outlet pipe unit. The air inlet regulating component includes various A air inlet regulating units, and the air outlet regulating component includes various A air outlet regulating units. Each flow regulating unit is connected to the sub-gas source device and the vacuum coating chamber through the A air inlet pipe unit and the A air outlet pipe unit respectively. The A air inlet regulating unit and the A air outlet regulating unit are respectively arranged on the A air inlet pipe unit and the A air outlet pipe unit.
4. The process gas flow control device for vacuum ion plating equipment according to claim 3, characterized in that: The flow regulating unit also includes a gas mixing tank, the A air inlet pipe unit includes each A air inlet pipe, the A air outlet pipe unit includes each A air outlet pipe, the air outlet ends of each A air inlet pipe on the same flow regulating unit are respectively connected to the air inlet end of each flow regulator through the gas mixing tank, and the air outlet ends of each flow regulator are respectively connected to the vacuum chamber through each A air outlet pipe, the A air inlet regulating unit includes each A air inlet regulating valve, and each A air inlet regulating valve is respectively installed on each A air inlet pipe, and the control device regulates the operating state of each A air inlet regulating valve.
5. The process gas flow control device for vacuum ion plating equipment according to claim 4, characterized in that: The flow regulating device is provided with m identical flow regulating units, and each flow regulating unit is provided with n flow regulating sub-units, where m≥2 and n≥2.
6. The process gas flow control device for vacuum ion plating equipment according to claim 4, characterized in that: m=2,n=4.
7. The process gas flow control device for vacuum ion plating equipment according to claim 6, characterized in that: The vacuum coating chamber is provided with n A connecting pipes connected thereto. The A outlet pipes for regulating the same process gas on each flow regulating unit are connected to the same A connecting pipe through pipe joints. The A outlet regulating unit includes A outlet regulating valves, which are respectively installed on A connecting pipes. The control device regulates the operating status of each A outlet regulating valve.
8. The process gas flow control device for vacuum ion plating equipment according to claim 7, characterized in that: A outlet regulating valve and A inlet regulating valve are stop valves respectively.
9. The process gas flow control device for vacuum ion plating equipment according to claim 8, characterized in that: The vacuum coating chamber is provided with n coating source devices, and each A connecting pipe is arranged corresponding to each coating source device.
10. The process gas flow control device for vacuum ion plating equipment according to claim 6, characterized in that: The flow regulator is an MFC gas flow meter.