7results about "Stacked and attached PCBs" patented technology

Provided in the present application are a board-level structure, a device and an electronic apparatus. The board-level structure comprises a second substrate and at least one first device. The first device comprises a first body and a first substrate, a first welding spot and a second welding spot being provided on the first substrate, and the first substrate being connected to the first body by means of the first welding spot. The second substrate is provided with an accommodation portion and a third welding spot, the third welding spot being located on the second substrate and close to the accommodation portion, and the first substrate being welded to the second substrate by means of the second welding spot and the third welding spot. The first substrate spans over the accommodation portion, and at least part of the first body extends into the accommodation portion. The present application uses the accommodation portion to accommodate part of the first body in the Z-direction, thus reducing space occupation; the first substrate can be directly welded to the second substrate by means of the second welding spot and the third welding spot, thus the first substrate can be connected simply by forming a pad on the surface of the second substrate in one process step, thereby simplifying the assembly process and ensuring assembling quality.

This application provides a board-level structure, a component, and an electronic device. The board-level structure includes a second substrate and at least one first component. The first component includes a first body and a first substrate, a first solder joint and a second solder joint are disposed on the first substrate, and the first substrate is connected to the first body through the first solder joint. An accommodation portion and a third solder joint are disposed on the second substrate, the third solder joint is located on the second substrate and is close to the accommodation portion, the first substrate is soldered to the second substrate through the second solder joint and the third solder joint, the first substrate is bridged above the accommodation portion, and at least a part of the first body extends into the accommodation portion. In this application, the accommodation portion can offset a part of a Z-direction height of the first body, to reduce space occupation. The first substrate may be directly soldered to the second substrate through the second solder joint and the third solder joint. Therefore, a pad needs to be formed on a surface of the second substrate in only one process flow to connect to the first substrate, thereby simplifying an assembly process and ensuring assembly quality.

This application provides a board-level structure, a component, and an electronic device. The board-level structure includes a second substrate and at least one first component. The first component includes a first body and a first substrate, a first solder joint and a second solder joint are disposed on the first substrate, and the first substrate is connected to the first body through the first solder joint. An accommodation portion and a third solder joint are disposed on the second substrate, the third solder joint is located on the second substrate and is close to the accommodation portion, the first substrate is soldered to the second substrate through the second solder joint and the third solder joint, the first substrate is bridged above the accommodation portion, and at least a part of the first body extends into the accommodation portion.

A multi-use connector circuit for use in communications devices is provided. The multi-use connector circuit includes a flexible connector circuit. The first portion of the flexible connector circuit connects a first element of a device to a printed circuit board of the device. The second portion connects a second element of the device, different from the first element, to the printed circuit board.

The present invention relates to a printed circuit board (10) with an insulated metal substrate, comprising a metal support (1), at least one insulating layer (4), and at least one layer of metallic material (5) on which at least one electronic component (6) is implanted, characterized in that the metal support (1) incorporates a cooling device (3). The invention also relates to an assembly comprising the printed circuit board (10) and a base (101) arranged to form a channel (105) for the circulation of a heat transfer fluid. Figure 2

A circuit board and electronic device, relating to but not limited to the field of circuit board technology, wherein the circuit board comprises a first circuit board, the first circuit board comprising a first substrate and a first circuit layer disposed on a first side of the first substrate, the first circuit layer comprising a first ground circuit; the circuit board further comprises a first protective layer and a first electromagnetic interference shielding layer stacked in sequence on a side of the first circuit layer away from the first substrate; the first protective layer is provided with a first opening, the first opening exposing at least a portion of the first ground circuit, the first opening being filled with a first conductive material, the height difference between the surface of the first conductive material and the surface of the first protective layer away from the first substrate being 0 to 2 microns, and the first conductive material connecting the first electromagnetic interference shielding layer and the first ground circuit. The circuit board of the disclosed embodiment can prevent the circuit board from partially warping or becoming uneven after a window is partially opened to expose the circuit layer.

A connecting element for providing contact between a quantum processor with a large number of qubits and a plurality of signal cables, which connecting element comprises a plurality of RGBs which at one edge all have a plurality of exposed conductors for contacting the processor and with a number of staggered opposite portions where connectors of all RGBs are available for connection with the cables. The RGBs may have ground planes for preventing crosstalk between the conductors of neighbouring RGBs. The assembly may be cooled by a common cooling plate which may also cool the processor. The edge portions or the chip has an electrically conductive layer e.g. preventing fields in the RGBs from entering the chip or fields from the outside from entering into the RGBs.