3results about "Stacked and attached PCBs" patented technology

This application provides a board-level structure, a component, and an electronic device. The board-level structure includes a second substrate and at least one first component. The first component includes a first body and a first substrate, a first solder joint and a second solder joint are disposed on the first substrate, and the first substrate is connected to the first body through the first solder joint. An accommodation portion and a third solder joint are disposed on the second substrate, the third solder joint is located on the second substrate and is close to the accommodation portion, the first substrate is soldered to the second substrate through the second solder joint and the third solder joint, the first substrate is bridged above the accommodation portion, and at least a part of the first body extends into the accommodation portion. In this application, the accommodation portion can offset a part of a Z-direction height of the first body, to reduce space occupation. The first substrate may be directly soldered to the second substrate through the second solder joint and the third solder joint. Therefore, a pad needs to be formed on a surface of the second substrate in only one process flow to connect to the first substrate, thereby simplifying an assembly process and ensuring assembly quality.

This application provides a board-level structure, a component, and an electronic device. The board-level structure includes a second substrate and at least one first component. The first component includes a first body and a first substrate, a first solder joint and a second solder joint are disposed on the first substrate, and the first substrate is connected to the first body through the first solder joint. An accommodation portion and a third solder joint are disposed on the second substrate, the third solder joint is located on the second substrate and is close to the accommodation portion, the first substrate is soldered to the second substrate through the second solder joint and the third solder joint, the first substrate is bridged above the accommodation portion, and at least a part of the first body extends into the accommodation portion.

A connecting element for providing contact between a quantum processor with a large number of qubits and a plurality of signal cables, which connecting element comprises a plurality of RGBs which at one edge all have a plurality of exposed conductors for contacting the processor and with a number of staggered opposite portions where connectors of all RGBs are available for connection with the cables. The RGBs may have ground planes for preventing crosstalk between the conductors of neighbouring RGBs. The assembly may be cooled by a common cooling plate which may also cool the processor. The edge portions or the chip has an electrically conductive layer e.g. preventing fields in the RGBs from entering the chip or fields from the outside from entering into the RGBs.