1results about How to "Improve concentration uniformity" patented technology

The application discloses a kind of jet structure and plasma etching machine.The jet structure includes air inlet pipe cover, can be communicated with gas source;Jet member is detachably connected with air inlet pipe cover, and jet member and air inlet pipe cover form accommodating space after being connected;Gas path switching member is movably arranged in accommodating space;Wherein, gas path switching member is provided with gas through hole group, jet member is provided with jet hole group, the number of gas through hole group and jet hole group is multiple group, and each group of jet hole group corresponds a group of gas through hole group, the jet direction of each group of jet hole group is different, based on the movable setting of gas path switching member, the conduction of jet hole group and its corresponding gas through hole group can be switched to the conduction of another jet hole group and another gas through hole group.The jet structure can realize multiple direction jet, with the continuity movement of gas path switching member, the jet structure can also realize the periodic jet of multiple directions, improve plasma concentration uniformity, so that the uniformity of plasma etching is improved.