The utility model discloses a gold immersion device for PCB surface treatment and
processing, and relates to the technical field of PCB surface treatment and
processing. The technical problems that the surface of a PCB is not uniform after gold immersion, and the product quality is reduced are solved through an existing gold immersion device. According to the technical scheme, the gold immersion device for surface treatment of the PCB comprises a gold immersion device body and further comprises a treatment
pool, a supporting frame, a positioning
assembly, a lifting
assembly, a cleaning
assembly, a heating box, a
drying assembly and a gold immersion
pool; according to the gold immersion device for surface treatment of the PCB, the horizontal position of the PCB can be conveniently changed through the positioning assembly, so that switching between the treatment
pool and the gold immersion pool is facilitated, the height of the PCB can be changed through the lifting assembly, the PCB can be cleaned through the cleaning assembly, the PCB is dried through the
drying assembly, and compared with a traditional gold immersion mode, the gold immersion device has the advantages that the production efficiency is improved, and the production cost is reduced. The device is provided with a cleaning
system which can be properly treated before gold immersion, so that the
gold layer is uniformly deposited on the surface of the PCB, and the
processing quality is improved.