Etching device and etching method
An etching device and etching technology, which are applied in chemical/electrolytic methods to remove conductive materials, electrical components, liquid processing of printed circuits, etc., can solve the deviation of the width and cross-sectional shape of the conductor pattern 3a, the difficulty in etching the conductor pattern 3a, and the difficulty in etching. Conductor pattern and other problems, to achieve the effect of eliminating deflection, uniform etching speed, and realizing narrow spacing
Active Publication Date: 2009-12-30
DEXERIALS CORP
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Problems solved by technology
[0008] while using the above figure 2 In the method of etching with the shown etching device, when etching is performed on the upper surface side of the substrate 3 for flexible wiring, due to the spray pressure of the etching solution 5 sprayed from the spray nozzle 100 and the remaining liquid for flexible wiring The weight of the etchant 5 on the upper surface of the substrate 3 makes the flexible wiring substrate 3 deflect, and the etchant 5 cannot contact the deflected part at a normal spray angle. The etchant 5, so the new etchant 5 cannot contact the bent part, and it is difficult to etch the miniaturized conductor pattern 3a with high precision
[0009] In addition, even if the etchant 5 is sprayed only on the lower surface side of the flexible wiring substrate 3, the etchant 5 does not come into contact with the portion deflected by the spray pressure of the sprayed etchant 5 at a normal spray angle. , therefore, it becomes difficult to etch the miniaturized conductor pattern 3a with high precision.
[0010] The problem of the remaining solution of such etching solution 5 on the substrate 3 for flexible wiring and the spraying angle of the etching solution 5 to the substrate 3 for flexible wiring is: Figure 1C The portion of the fast etched conductor pattern 3a shown and Figure 1B The part of the conductive pattern 3a shown as slow etching, and further, the width and cross-sectional shape of the conductive pattern 3a are deviated
[0012] However, it is difficult to make the etching rate uniform over the entire surface of the flexible wiring substrate 3. For example, even if the flexible wiring substrate 3 does not bend, due to the characteristics of the spray nozzle 100, the spray etching The liquid 5 spreads into a fan shape or a cone shape, and the injection pressure on the flexible wiring substrate 3 is not uniform, and the deviation of the width and cross-sectional shape of the etched conductor pattern 3a cannot be fundamentally eliminated.
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[0031] The preferred embodiments of the etching apparatus and etching method of the present invention will be described below with reference to the accompanying drawings.
[0032] Such as image 3 and Figure 4 As shown, the etching device 1 of the present invention is a device in which a shower head 4 is arranged close to the flexible wiring substrate 3 wound on the outer peripheral surface of the drum 2, and the flexible wiring substrate 3 is sprayed from the shower head 4. The etchant 5 is sprayed in a straight line.
[0033] This etching device 1 is used for the etching process in each process of the metal surface etching method for forming a conductive pattern on the flexible wiring substrate 3, and is installed in an etching system configured by connecting processing chambers for performing each process. Room 6.
[0034] Such as image 3 and Figure 4 As shown, the etching device 1 has a drum 2, a container 10, a nozzle 4, a pump 11, and the like.
[0035] The drum 2...
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An etching device for forming a conductor pattern by applying etching to a wiring board. The etching device comprises a drum, a chamber, and nozzle heads. The drum is formed to be rotatingly run in such a state that a flexible wiring board is wrapped around the surface of the drum. The chamber is a room for storing an etching liquid under a specified pressure. The nozzle heads are disposed at the upper part of the chamber in proximity to the surface of the drum, and formed to linearly jet the etching liquid pressurized in the chamber from nozzle holes against the surface of the drum.
Description
technical field [0001] The present invention relates to an etching device for forming a conductive pattern by etching a flexible wiring substrate, and to performing wet etching on the wiring substrate when forming a conductive pattern on the wiring substrate etching method. Background technique [0002] In the past, such as Figure 1A As shown, in flexible wiring boards used in mounting methods such as COF and TAB, the pitch of conductors 3a is narrowed, and miniaturization of line / space ratio = 15 / 15 μm or less is required. Furthermore, as the frequency of signals increases, conductor resistance becomes an important factor, and not only the narrower pitch of the conductor pattern 3a is required, but also the cross-sectional shape of the conductor pattern 3a is required to be a perfect rectangle. [0003] Usually, when forming a flexible wiring board having a predetermined conductive pattern using the flexible wiring substrate 3, when the metal surface etching method is use...
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IPC IPC(8): H05K3/06
CPCH05K1/0393H05K2203/0746H05K3/068H05K3/0085H05K2203/1545
Inventor玉野博基
OwnerDEXERIALS CORP