Electronic component mounting device and method

A technology for electronic component installation and electronic components, which is applied to printed circuit components, electrical components, electrical components, etc., and can solve problems such as unreliable electrical connection of lead wires and reduced installation accuracy of electronic components

Active Publication Date: 2008-07-16
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a possibility that the mounting accuracy of the electronic components may be lowered, and it may not be possible to reliably electrically connect the lead wires between the substrate and the electronic components.

Method used

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  • Electronic component mounting device and method
  • Electronic component mounting device and method
  • Electronic component mounting device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0021] FIG. 1 shows a supply device for electronic components and a mounting device for mounting electronic components supplied from the supply device on a substrate. The supply device includes a component supply table 1 . The component supply table 1 is provided with four mounting parts 2 (only three are shown) at intervals of 90 degrees in the circumferential direction, and is rotationally driven by the first driving source 3 so as to be different from each other by a predetermined angle, for example, 90 degrees. Electronic components 4 such as TCP are supplied to each of the loading sections 2 described above by a suction arm not shown in the figure or the like.

[0022] The electronic component 4 supplied and placed on the mounting portion 2 of the component supply table 1 is delivered to a mounting tool 5 constituting the mounting device. The mounting tools 5 ar...

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PUM

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Abstract

The installation device of the electronic component of the present invention comprises: holding table (12), holds substrate; X, Y and θ direction driving source (14,19,20), drives holding table along horizontal direction; Mounting tool (5), holds electronic Components (4) and electronic components are installed on the side upper surface of the substrate; the back support tool (22) is arranged in a manner that can be driven in the up and down direction, and the electronic components are installed on the side of the substrate by the mounting tool When on the surface, support the side lower surface of the substrate; camera (24), before electronic components are mounted on the substrate, the substrate and electronic components are photographed; After the electronic components are aligned, the backing tool is raised to support the side lower surface of the substrate. In this state, the substrate is imaged again by the camera. alignment between.

Description

technical field [0001] The present invention relates to an electronic component mounting device and a mounting method for surface mounting electronic components on a side portion of a substrate. Background technique [0002] For example, an electronic component such as a TCP (Tape Carrier Package: Tape Carrier Package) is press-packed on a substrate such as a liquid crystal cell through an anisotropic conductive member as an adhesive material. The above-mentioned substrate is constituted by bonding two glass plates at a predetermined interval through a sealant, sealing liquid crystal between these glass plates, and attaching polarizing plates to the outer surfaces of the glass plates. And, on the substrate of the above-mentioned structure, on the side of one glass plate, on the upper surface (inner surface when bonding) protruding outward from the side of the other glass plate, along the side of the The above-mentioned anisotropic conductive member with double-sided adhesiv...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K13/04H01L21/60H05K13/08
CPCH01L23/544H01L2224/75H01L2224/75745H01L2224/758H05K1/0269H05K3/361H05K2201/09918H05K2203/166H05K13/04
Inventor广濑圭刚
OwnerSHIBAURA MECHATRONICS CORP