Wafer detection system

Abstract

The invention relates to a wafer detection method comprising the following steps: 1, loading a wafer which passes an electrical property detection stage in advance, simultaneously loading a map file with a first file format output after the electrical property detection stage, wherein the map file with the first file format records the electrical property detection result of each grain crystal on the wafer; 2, positioning the wafer and the map file with the first file format; 3, viewing the appearance flaw of each grain crystal on the wafer; 4, if the viewing appearance is undesirable grain crystal, correspondingly recording the position of the grain crystal having the undesirable appearance and modifying the information of the map file; and 5, storing the modified map file. Thus the invention can directly modify and mark the map file, and effectively save the detection time interval.

Description

Technical field [0001] The invention relates to a wafer inspection method, in particular to a wafer inspection method that directly modifies a map file to improve inspection efficiency. Background technique [0002] With the gradual application of electronic concepts such as personal mobile information, e-commerce, global communications, and digital home in modern life, the semiconductor manufacturing industry is also rapidly growing in response to the needs of various applications. In contrast, the increase in production capacity in the semiconductor manufacturing process and the increase in yield also promote the development of the semiconductor industry. [0003] Generally speaking, in order to implement circuit functions on a semiconductor substrate, the semiconductor substrate must go through the following steps, such as deposition of a metal layer, patterning on each layer of material using a yellow light process, ion implantation and other related processes. In order to ens...

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